CN209307478U - A kind of Full In-Cell high resistance film coating apparatus - Google Patents
A kind of Full In-Cell high resistance film coating apparatus Download PDFInfo
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- CN209307478U CN209307478U CN201821497067.0U CN201821497067U CN209307478U CN 209307478 U CN209307478 U CN 209307478U CN 201821497067 U CN201821497067 U CN 201821497067U CN 209307478 U CN209307478 U CN 209307478U
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Abstract
The utility model relates to a kind of Full In-Cell high resistance film coating apparatus, including sputtering chamber and shake cathode assembly, the shake cathode assembly is mounted in the sputtering chamber, the shake cathode assembly includes plated film target, magnet, tracks and driving device, the tracks are set to the side of the plated film target, the driving device drives the magnet to do reciprocating swing along the tracks and moves, it is moved due to doing reciprocating swing along the tracks using driving device driving magnet, it is in magnetic field caused by magnet in variation, it is deposited on the target material sputtered on substrate, effectively prevent the waste of target, improve target utilization rate.
Description
Technical field
The utility model relates to sputter coating fields, and in particular to a kind of Full In-Cell high resistance film coating apparatus.
Background technique
High resistance film refers generally to indium and tin oxide film, is a kind of n-type semiconductor crystal film, have good electric conductivity,
Other than visible light transmittance and infrared reflection rate, good mechanical strength and chemical stability are combined, in liquid
There is extensive practical application in crystal display field.It is general in the prior art that indium and tin oxide film is plated using magnetron sputtering,
The position that the magnet in magnetic field is generated in coating process is generally fixed, and part target is not splashed to substrate and returns to after target as sputter goes out
Target generates bloom and dross, leads to the reduction of target utilization rate.
Utility model content
The utility model provides a kind of Full In-Cell high resistance film coating apparatus, solves techniques discussed above and asks
Topic.
The scheme that the utility model solves above-mentioned technical problem is as follows: a kind of Full In-Cell high resistance film coating apparatus,
It is characterised in that it includes sputtering chamber and shake cathode assembly, the shake cathode assembly is mounted in the sputtering chamber, described to shake
Dynamic cathode assembly includes plated film target, magnet, tracks and driving device, and the tracks are set to the plated film target
Side, the driving device drives the magnet to do reciprocating swing along the tracks and moves.
In the utility model, moves, make due to doing reciprocating swing along the tracks using driving device driving magnet
Magnetic field caused by magnet is in variation, is deposited on the target material sputtered on substrate, is effectively prevented the wave of target
Take, improves target utilization rate.
The above description is merely an outline of the technical solution of the present invention, in order to better understand the skill of the utility model
Art means, and can be implemented in accordance with the contents of the specification, below on the preferred embodiment of the present invention and the accompanying drawings in detail
It describes in detail bright as after.Specific embodiment of the present utility model is shown in detail by following embodiment and its attached drawing.
Detailed description of the invention
Attached drawing described herein is used to provide a further understanding of the present invention, and is constituted part of this application,
The exemplary embodiment of the utility model and the description thereof are used to explain the utility model, does not constitute to the improper of the utility model
It limits.In the accompanying drawings:
Fig. 1 is the vertical view block schematic diagram of the utility model；
Fig. 2 is structure diagram in sputtering chamber in the utility model；
Fig. 3 is heating component structural schematic diagram in the utility model；
Fig. 4 is cold-trap structure schematic diagram in the utility model.
Specific embodiment
The principles of the present invention and feature are described below in conjunction with attached drawing, example is served only for explaining that this is practical
It is novel, it is not intended to limit the scope of the utility model.It is more specifically described by way of example in the following passage referring to attached drawing
The utility model.According to following explanation and claims, will be become apparent from feature the advantages of the utility model.It should be noted
It is that attached drawing is all made of very simplified form and using non-accurate ratio, only to facilitate, lucidly aid in illustrating this reality
With the purpose of new embodiment.
As shown in Figures 1 to 4, the utility model provides a kind of Full In-Cell high resistance film coating apparatus, including successively
The feed space 1 of connection, the first evacuated chamber 2, cavity heat room 3, the first surge chamber 4, First Transition room 5, sputtering chamber 6, second
Transition chamber 7, the second surge chamber 8, cooling chamber 9, the second evacuated chamber 10 and discharge chamber 11.
Specifically, feed space is used for the entrance of substrate.
First evacuated chamber and the second evacuated chamber guarantee the vacuum of sputtering process for switching atmosphere and vacuum state
Degree.
Cavity heats room and is used for heating cavity, removes inside cavity steam.
First surge chamber and First Transition room, which persistently buffer substrate before plated film, heats, and continues to remove substrate before plated film
And subsidiary moisture and gaseous impurity in substrate frame, guarantee the balance of the neighbouring process gas of target, make film layer generate in condition
To best.
Sputtering chamber is for making target material (i.e. ATO target) be splashed to formation high resistance film film layer on substrate.
Second transition chamber and the second surge chamber are located at sputtering chamber and heat about buffering, guarantee temperature equalization in sputtering chamber, no
Coating quality is influenced as because sputtering chamber temperature difference is excessive.
Cooling chamber is for making the substrate cooling down after plated film.
Discharge chamber is transported for substrate.
Wherein, it is equipped in the sputtering chamber 6 and shakes cathode assembly 61, the shake cathode assembly 61 includes plated film target
611, magnet 612, tracks 613 and driving device 614, the tracks 613 are set to the plated film target 611
Side, the driving device 614 drive the magnet 612 to do reciprocating swing along the tracks 613 and move.
It is moved due to doing reciprocating swing along the tracks using driving device driving magnet, makes magnetic caused by magnet
Field is deposited on the target material sputtered on substrate, effectively prevents the waste of target, improving target makes in variation
With rate.
Preferably, the Full In-Cell high resistance film coating apparatus further includes substrate frame pipeline A, substrate frame pipeline
A sequentially passes through the feed space 1, first evacuated chamber 2, cavity heating room 3, first surge chamber 4, described the
One transition chamber 5, the sputtering chamber 6, second transition chamber 7, second surge chamber 8, the cooling chamber 90, described second are taken out
Vacuum chamber 10 and the discharge chamber 11.
Substrate frame pipeline main function is will to be mounted with the substrate frame of substrate from feed space and be transported to the process of discharge chamber
The middle overall process for realizing sputter coating.
Specifically, the Full In-Cell high resistance film coating apparatus includes vacuumizing assembly, the vacuumizing assembly packet
It includes and room 3, first surge chamber 4, the First Transition room 5, institute is heated to first evacuated chamber 2, the cavity respectively
Sputtering chamber 6, second transition chamber 7, second surge chamber 8, the cooling chamber 90 and second evacuated chamber 10 is stated to take out
Multiple vacuum pumps of vacuum, specifically, in the present embodiment, to cavity heating room 3, first surge chamber 4, described the
One transition chamber 5, the sputtering chamber 6, second transition chamber 7, second surge chamber 8, the cooling chamber 90 and described second
The vacuum pump that evacuated chamber 10 vacuumizes is respectively the first vacuum pump 21, and the second vacuum pump 31, third vacuum pump the 41, the 4th are true
The 51, the 5th vacuum pump 71 of sky pump, the 6th vacuum pump 81, the 7th vacuum pump 91 and the 8th vacuum pump 101, wherein the first vacuum pump 21
It is lobe pump, third vacuum pump 41, the 4th vacuum pump 51, the 5th vacuum pump 71, the 6th vacuum pump 81 with the 8th vacuum pump 101
It is molecular pump with the 7th vacuum pump 91.
Specifically, the Full In-Cell high resistance film coating apparatus includes multiple heating components 12, the heating component
12 heat room 3, the first surge chamber 4, First Transition room 5, sputtering chamber 6, the second transition chamber 7 and the second surge chamber 8 with the cavity
Be arranged in a one-to-one correspondence, each heating component 12 includes at least one heating plate 121, in the heating plate 121 on be provided with
Heating element.
Preferably, the Full In-Cell high resistance film coating apparatus further includes cold-trap 13, and the cold-trap 13 is installed on institute
It states in First Transition room 5, and distinguishes including compressor 131, refrigerant, refrigerant pipe 132, the outlet of the compressor 131 and entrance
Setting is connected to the both ends of the refrigerant pipe 132, the refrigerant flows back and forth in the compressor and the refrigerant pipe.
Cold-trap can trap the indoor water vapour of First Transition and oil vapour, and condense the steam into liquid, to reduce its work
Property, the damage caused by vacuum pump of water vapour and oil vapour can be prevented.
More there is choosing, the refrigerant is liquid nitrogen, but also can greatly improve the working efficiency for taking out true component, shortens and takes out very
The empty time improves production efficiency.
Preferably, for convenience of the reflux of substrate frame, the Full In-Cell high resistance film coating apparatus further includes substrate frame
Return wire B, both ends of the both ends of the substrate frame return wire B respectively with the substrate frame pipeline A are connected to form closed annular.
The above, the only preferred embodiment of the utility model not make in any form the utility model
Limitation；The those of ordinary skill of all industry can be shown in by specification attached drawing and described above and swimmingly to implement this practical
It is novel；But all those skilled in the art are not departing within the scope of technical solutions of the utility model, using being taken off above
The technology contents shown and the equivalent variations of a little variation, modification and evolution made, are the equivalent embodiment of the utility model；
Meanwhile it the change of all substantial technological any equivalent variationss to the above embodiments according to the utility model, modifying and drilling
Become etc., within the protection scope for still falling within the technical solution of the utility model.
Claims (7)
1. a kind of Full In-Cell high resistance film coating apparatus, which is characterized in that including sputtering chamber and cathode assembly is shaken, it is described
It shakes cathode assembly to be mounted in the sputtering chamber, the shake cathode assembly includes plated film target, magnet, tracks and drive
Dynamic device, the tracks are set to the side of the plated film target, and the driving device drives the magnet along the fortune
Do reciprocating swing movement in dynamic rail road.
2. a kind of Full In-Cell high resistance film coating apparatus according to claim 1, which is characterized in that the Full
In-Cell high resistance film coating apparatus further includes feed space, the first evacuated chamber, cavity heating room, the first surge chamber, First Transition
Room, the second transition chamber, the second surge chamber, cooling chamber, the second evacuated chamber, discharge chamber and substrate frame pipeline, the feed space,
It is first evacuated chamber, cavity heating room, first surge chamber, the First Transition room, the sputtering chamber, described
Second transition chamber, second surge chamber, the cooling chamber, second evacuated chamber and the discharge chamber are sequentially communicated, institute
It states substrate frame pipeline and sequentially passes through the feed space, first evacuated chamber, cavity heating room, first buffering
Room, the First Transition room, the sputtering chamber, second transition chamber, second surge chamber, the cooling chamber, described
Two evacuated chamber and the discharge chamber.
3. a kind of Full In-Cell high resistance film coating apparatus according to claim 2, which is characterized in that the Full
In-Cell high resistance film coating apparatus further includes vacuumizing assembly, and the vacuumizing assembly includes vacuumizing respectively to described first
Room, cavity heating room, first surge chamber, the First Transition room, second transition chamber, second buffering
Multiple vacuum pumps that room, the cooling chamber and the second evacuated chamber vacuumize.
4. a kind of Full In-Cell high resistance film coating apparatus according to claim 2, which is characterized in that the Full
In-Cell high resistance film coating apparatus further includes multiple heating components, the heating component and cavity heating room, the first buffering
Room, First Transition room, sputtering chamber, the second transition chamber and the second surge chamber are arranged in a one-to-one correspondence, and each heating component includes
At least one heating plate, in the heating plate on be provided with heating element.
5. a kind of Full In-Cell high resistance film coating apparatus according to claim 2, which is characterized in that the Full
In-Cell high resistance film coating apparatus further includes cold-trap, and the cold-trap is installed in the First Transition room, and including compressor,
The outlet of refrigerant, refrigerant pipe, the compressor is connected to setting with entrance with the both ends of the refrigerant pipe respectively, and the refrigerant is in institute
It states and is flowed back and forth in compressor and the refrigerant pipe.
6. a kind of Full In-Cell high resistance film coating apparatus according to claim 5, which is characterized in that the refrigerant is
Liquid nitrogen.
7. a kind of Full In-Cell high resistance film coating apparatus according to claim 2, which is characterized in that the Full
In-Cell high resistance film coating apparatus further includes substrate frame return wire, the both ends of the substrate frame return wire respectively with the substrate
The both ends of frame pipeline are connected to form closed annular.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821497067.0U CN209307478U (en) | 2018-09-13 | 2018-09-13 | A kind of Full In-Cell high resistance film coating apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821497067.0U CN209307478U (en) | 2018-09-13 | 2018-09-13 | A kind of Full In-Cell high resistance film coating apparatus |
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| CN209307478U true CN209307478U (en) | 2019-08-27 |
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| CN201821497067.0U Active CN209307478U (en) | 2018-09-13 | 2018-09-13 | A kind of Full In-Cell high resistance film coating apparatus |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110670039A (en) * | 2019-11-19 | 2020-01-10 | 广东腾胜科技创新有限公司 | Magnetic material coating production line with moving magnetic plate plane cathode |
-
2018
- 2018-09-13 CN CN201821497067.0U patent/CN209307478U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110670039A (en) * | 2019-11-19 | 2020-01-10 | 广东腾胜科技创新有限公司 | Magnetic material coating production line with moving magnetic plate plane cathode |
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