CN107488831B - A kind of continuous evaporating-plating system - Google Patents
A kind of continuous evaporating-plating system Download PDFInfo
- Publication number
- CN107488831B CN107488831B CN201710718862.1A CN201710718862A CN107488831B CN 107488831 B CN107488831 B CN 107488831B CN 201710718862 A CN201710718862 A CN 201710718862A CN 107488831 B CN107488831 B CN 107488831B
- Authority
- CN
- China
- Prior art keywords
- crucible
- vapor deposition
- transfer tube
- storage
- evaporation material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/246—Replenishment of source material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/26—Vacuum evaporation by resistance or inductive heating of the source
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The invention discloses a kind of continuous evaporating-plating system, which includes: vapor deposition crucible, and evaporation material is stored in the vapor deposition crucible, and the vapor deposition crucible top is equipped with vapor deposition outlet；Crucible is stored, stores evaporation material in the storage crucible；Transfer tube, one end of the transfer tube connect the storage crucible, and the other end connects the vapor deposition crucible；Valve, the valve are arranged on the pipeline of the transfer tube；Temperature control equipment, the temperature control equipment are connect with the vapor deposition crucible, storage crucible and transfer tube, the temperature for controlling the vapor deposition crucible, storing crucible and transfer tube.Continuous evaporating-plating system of the invention avoids traditional cooling filling heating process, reduces the possibility that substrate pollutes, also improves production efficiency, reduce production cost.
Description
Technical field
The present invention relates to evaporation coating technique fields, more particularly to a kind of continuous evaporating-plating system.
Background technique
OLED (Organic Light-Emitting Diode, Organic Light Emitting Diode, abbreviation OLED) display screen due to
With thin, light, wide viewing angle, active shine, luminescent color is continuously adjustable, fast response time, energy consumption is small, driving voltage is low, work
Temperature range is wide, simple production process, luminous efficiency are high and can Flexible Displays the advantages that, have been cited as under great development prospect
Generation display technology.
OLED device is prepared it is usually necessary to use small molecule vapor deposition, small molecule vapor deposition mainly heats under high vacuum environment
Organic material vaporizes the organic material of subliming type or fusion at high operating temperatures, after evaporation material distillation or vaporization
The vapor deposition of atom, molecule or atomic group composition forms a film in substrate surface.
But since the capacity of vapor deposition crucible is limited, it is often necessary to begin to speak to add evaporation material, and be deposited from addition is cooled to
The foundation that material arrives high vacuum environment again takes a long time, and which greatly limits the production capacities of evaporator, increases OLED display
Cost of manufacture, in addition, addition evaporation material also easily causes dust to enter into vapor deposition cavity, to cause substrate contamination.
Summary of the invention
The invention mainly solves the technical problem of providing a kind of continuous evaporating-plating systems, can be realized continuous evaporating-plating.
In order to solve the above technical problems, the technical solution adopted by the present invention is that a kind of continuous evaporating-plating system, comprising: vapor deposition earthenware
Crucible, the vapor deposition crucible is interior to store evaporation material, and the vapor deposition crucible top is equipped with vapor deposition outlet；Store crucible, the storage
Evaporation material is stored in crucible；Transfer tube, one end of the transfer tube connect the storage crucible, and the other end connects the vapor deposition
Crucible；Valve, the valve are arranged on the pipeline of the transfer tube；Temperature control equipment, the temperature control equipment and institute
State vapor deposition crucible, storage crucible is connected with transfer tube, the temperature for controlling the vapor deposition crucible, storing crucible and transfer tube.
Further, the evaporation material is fusion material；
Further, one end of the transfer tube connects the bottom of the storage crucible, and the other end connects the vapor deposition earthenware
The middle and upper part of crucible；
Further, the valve is electrically operated valve；
Further, the quantity of the temperature control equipment is three, respectively with the vapor deposition crucible, store crucible and biography
Defeated pipe connection, the temperature for controlling the vapor deposition crucible, storing crucible and transfer tube；
Further, the temperature control equipment includes heater strip, and the heater strip is wrapped in the vapor deposition crucible, storage
The outer surface of crucible and transfer tube, the temperature for controlling the vapor deposition crucible, storing crucible and transfer tube；
Further, the vapor deposition crucible and storage crucible further include evaporation material detector, the evaporation material detection
Device is located inside the vapor deposition crucible and storage crucible；
Further, the temperature control equipment further includes temperature indicator；
Further, the shape of the storage crucible and vapor deposition crucible is cylindrical body or cuboid；
It further, further include baffle, the baffle plate setting is in the top of the vapor deposition outlet.
The beneficial effects of the present invention are: being in contrast to the prior art, the present invention can be in the vapor deposition in vapor deposition crucible
Material consumption totally when, make store crucible in evaporation material by transfer tube be supplemented to vapor deposition crucible in, thus realize continuously
Vapor deposition.Continuous evaporating-plating system of the invention avoids traditional cooling filling heating process and therefore reduces substrate and pollute
Possibility, also improve production efficiency, reduce production cost.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of one embodiment of continuous evaporating-plating system of the present invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment belongs to the scope of protection of the invention.
Fig. 1 is the structural schematic diagram of one embodiment of continuous evaporating-plating system of the present invention.The continuous steaming that present embodiment provides
Plating system, comprising: vapor deposition cavity 101, the vacuum plant 102 being connect with vapor deposition cavity.It is deposited on the side wall of cavity 101 and is provided with
Cavity door 103, cavity door 103 are located at the side or top of vapor deposition cavity 101, and specific location does not limit.The interior of cavity 101 is deposited
Portion is equipped with substrate 104 to be deposited, vapor deposition crucible 106, storage crucible 107, transfer tube 108.The top of vapor deposition crucible 106 is set
There is vapor deposition outlet 114,114 top of vapor deposition outlet is equipped with baffle 105, storage evaporation material and is equipped with the in vapor deposition crucible 106
One evaporation material detector 112, the evaporation material are fusion material.It is stored with and is deposited in crucible 106 in storage crucible 107
Identical evaporation material, and the second evaporation material detector 113 is installed.One end connection storage crucible 107 of transfer tube 108,
Other end connection vapor deposition crucible 106.In the present embodiment, vapor deposition crucible 106 and the shape for storing crucible 107 are cylindrical body or rectangular
Body, herein without limitation.Further, in the present embodiment, the bottom of one end connection storage crucible 107 of transfer tube 108,
The middle and upper part of other end connection vapor deposition crucible 106.In other embodiments, transfer tube 108 and storage crucible 107, vapor deposition crucible
106 link position can do the adjustment of adaptability according to the actual situation, herein without limitation.It is set on the pipeline of transfer tube 108
There is valve 115.In the present embodiment, valve 115 is electrically operated valve, and in other embodiments, the type of valve 115 is according to reality
Situation does the adjustment of adaptability, herein without limitation.
The continuous evaporating-plating system of the present embodiment further includes the first temperature control equipment, second temperature control device and third temperature
Control device is spent, temperature control equipment is connect with the vapor deposition crucible 106, storage crucible 107 and transfer tube 108, for controlling
The vapor deposition crucible 106, the temperature for storing crucible 107 and transfer tube 108.In the present embodiment, the first temperature control equipment,
Two temperature control equipments and third temperature control equipment respectively include the first heater strip 109, the second heater strip 110 and third heating
Silk 111 is connect with vapor deposition crucible 106, storage crucible 107 and transfer tube 108 respectively, for controlling vapor deposition crucible 106, storage earthenware
The temperature of crucible 107 and transfer tube 108.Further, the first temperature control equipment, second temperature control device and third temperature control
Device processed respectively further comprises temperature indicator (not shown), for understanding vapor deposition crucible 106, storage 107 and of crucible in real time
Temperature value in transfer tube 108.First heater strip 109, the second heater strip 110 and third heater strip 111, are respectively wound around vapor deposition
Crucible 106, the outer surface for storing crucible 107 and transfer tube 108.
Hereinafter, its course of work is described in detail in the structure in conjunction with this continuous evaporating-plating system.
Vacuumize process first is carried out to vapor deposition cavity 101.In the present embodiment, vacuum plant 102 is to entire vapor deposition cavity 101
Carry out vacuum pumping, common vacuum plant 102 be mechanical pump, molecular pump, condenser pump, herein without limitation.Before vapor deposition,
It needs to carry out vacuumizing to vapor deposition cavity 101, since the volume of vapor deposition cavity 101 is bigger, by vapor deposition cavity 101 by normal pressure
Being extracted into high vacuum state, time-consuming, selects several vacuum plants 102 while carrying out vacuumizing to can be reduced duration, specifically selects several
A vacuum plant 102 is herein without limitation.102 pairs of vapor deposition cavitys 101 of vacuum plant carry out vacuumizing and reach scheduled Gao Zhen
After reciprocal of duty cycle, is heated by 109 pairs of vapor deposition crucibles 106 of the first heater strip, start to be deposited when temperature reaches preset temperature.
Vapor deposition outlet 114 is provided at the top of vapor deposition crucible 106, the shape of vapor deposition outlet 114 is round or rectangle, herein not
It limits, is round shown in the present embodiment.The top of vapor deposition crucible 106 is also disposed with baffle 105 and to be deposited
Substrate 104, when evaporation material reaches preset temperature in vapor deposition crucible 106, evaporation material evaporation, atom, molecule after evaporation
Or the steam of atomic group composition exports 114 in 104 surface filming of substrate by vapor deposition.Due to just starting evaporation rate when vapor deposition
It is unstable, it is bad to will cause the film quality of vapor deposition on the substrate 104, so moving stop 105 makes its screening when just starting vapor deposition
Firmly vapor deposition outlet 114, as shown in Figure 1.Baffle 105 is removed again after evaporation rate is stablized, and can obtain matter on the substrate 104 at this time
Measure good film.
When the first evaporation material detector 112 detects that the evaporation material in vapor deposition crucible 106 will be finished, the is opened
Two temperature control equipments, second temperature control device heat storage crucible 107, make to store the vapor deposition material in crucible 107
Material reaches molten condition.The valve 115 on 108 pipeline of transfer tube is opened, the evaporation material stored in crucible 107 can automatically flow into
Into vapor deposition crucible 106, when the evaporation material flowed into vapor deposition crucible 106 reaches predetermined amount, valve 115 is closed.As it can be seen that will
Evaporation material is by easy to operate in the addition vapor deposition crucible 106 of storage crucible 107, without cooling and vacuum breaker, realization continuous steaming
Plating reduces number of beginning to speak, and reduces the pollution level of substrate 104, improves the production capacity of evaporator, reduce production cost.
When the evaporation material stored in crucible 107 is added to vapor deposition crucible 106, Open valve 115, crucible will be stored
Evaporation material in 107 is heated to molten condition, and the evaporation material being deposited in crucible 106 is heated to vapor state.Setting the
The temperature of one temperature control equipment is higher than second temperature control device, and in present embodiment, the fever of the first heater strip 109 is arranged
Value is higher than the calorific capacity of the second heater strip 110.When the evaporation material being deposited in crucible 106 reaches predetermined amount, valve is closed
115, and stop heating storage crucible 107.
It is in contrast to the prior art, the present invention can make to deposit when the evaporation material being deposited in crucible is depleted
Evaporation material in storage crucible is supplemented in vapor deposition crucible by transfer tube, to realize continuous evaporating-plating.Continuous steaming of the invention
Plating system avoids traditional cooling filling heating process, therefore, reduces the possibility that substrate pollutes, also improves production
Efficiency reduces production cost.
Obviously, various changes and modifications can be made to the invention without departing from essence of the invention by those skilled in the art
Mind and range.In this way, if these modifications and changes of the present invention belongs to the range of the claims in the present invention and its equivalent technologies
Within, then the present invention is also intended to include these modifications and variations.
Claims (3)
1. a kind of continuous evaporating-plating system characterized by comprising
Crucible is deposited, evaporation material is stored in the vapor deposition crucible, the vapor deposition crucible top is equipped with vapor deposition outlet；
Crucible is stored, stores evaporation material in the storage crucible；Wherein, the evaporation material is fusion material；
Transfer tube, one end of the transfer tube connect the bottom of the storage crucible, and the other end connects in the vapor deposition crucible
Top；
Valve, the valve are arranged on the pipeline of the transfer tube；
Temperature control equipment, the temperature control equipment is connect with the vapor deposition crucible, storage crucible and transfer tube, for controlling
The vapor deposition crucible, the temperature for storing crucible and transfer tube；The quantity of the temperature control equipment be 3, including heater strip with
Temperature indicator, the outer surface that the heater strip is wrapped in the vapor deposition crucible, stores crucible and transfer tube；Wherein, entirely connect
Continuous vapor deposition process is without cooling；
Baffle, the baffle plate setting are in the top of the vapor deposition outlet；
The vapor deposition crucible and storage crucible further include evaporation material detector, and the evaporation material detector is located at the vapor deposition
Inside crucible and storage crucible.
2. a kind of continuous evaporating-plating system according to claim 1, which is characterized in that the valve is electrically operated valve.
3. a kind of continuous evaporating-plating system according to claim 1, which is characterized in that the storage crucible and vapor deposition crucible
Shape is cylindrical body or cuboid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710718862.1A CN107488831B (en) | 2017-08-21 | 2017-08-21 | A kind of continuous evaporating-plating system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710718862.1A CN107488831B (en) | 2017-08-21 | 2017-08-21 | A kind of continuous evaporating-plating system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107488831A CN107488831A (en) | 2017-12-19 |
| CN107488831B true CN107488831B (en) | 2019-11-26 |
Family
ID=60646104
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710718862.1A Active CN107488831B (en) | 2017-08-21 | 2017-08-21 | A kind of continuous evaporating-plating system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107488831B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109321884A (en) * | 2018-10-17 | 2019-02-12 | 武汉华星光电半导体显示技术有限公司 | Evaporation coating device |
| CN110724911B (en) * | 2019-11-06 | 2021-11-02 | 深圳市华星光电半导体显示技术有限公司 | Evaporation crucible, evaporation system and method for evaporating OLED |
| CN112011763A (en) * | 2020-08-05 | 2020-12-01 | Tcl华星光电技术有限公司 | Evaporation plating equipment and material supplementing method thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007141235A1 (en) * | 2006-06-06 | 2007-12-13 | Aixtron Ag | Apparatus and method for vapour depositing a powdered organic starting material |
| KR20150049685A (en) * | 2013-10-30 | 2015-05-08 | 주식회사 선익시스템 | Apparatus for supplying evaporation material and evaporator source including the same |
| CN105088144A (en) * | 2015-08-07 | 2015-11-25 | 京东方科技集团股份有限公司 | Crucible replacing device |
| CN205420530U (en) * | 2016-03-17 | 2016-08-03 | 合肥鑫晟光电科技有限公司 | Evaporation plating equipment |
| KR101713112B1 (en) * | 2016-07-26 | 2017-03-08 | 에스엔유 프리시젼 주식회사 | Deposition material supply apparatus which can continuously charged |
| CN106947941A (en) * | 2017-04-13 | 2017-07-14 | 合肥鑫晟光电科技有限公司 | Deposition system |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102111020B1 (en) * | 2013-05-02 | 2020-05-15 | 삼성디스플레이 주식회사 | Deposition apparatus |
-
2017
- 2017-08-21 CN CN201710718862.1A patent/CN107488831B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007141235A1 (en) * | 2006-06-06 | 2007-12-13 | Aixtron Ag | Apparatus and method for vapour depositing a powdered organic starting material |
| KR20150049685A (en) * | 2013-10-30 | 2015-05-08 | 주식회사 선익시스템 | Apparatus for supplying evaporation material and evaporator source including the same |
| CN105088144A (en) * | 2015-08-07 | 2015-11-25 | 京东方科技集团股份有限公司 | Crucible replacing device |
| CN205420530U (en) * | 2016-03-17 | 2016-08-03 | 合肥鑫晟光电科技有限公司 | Evaporation plating equipment |
| KR101713112B1 (en) * | 2016-07-26 | 2017-03-08 | 에스엔유 프리시젼 주식회사 | Deposition material supply apparatus which can continuously charged |
| CN106947941A (en) * | 2017-04-13 | 2017-07-14 | 合肥鑫晟光电科技有限公司 | Deposition system |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107488831A (en) | 2017-12-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107488831B (en) | A kind of continuous evaporating-plating system | |
| CN103526164B (en) | A kind of evaporated device | |
| KR100936378B1 (en) | Unit for supplying source and apparatus for depositioning thin film and method for depositioning thin film | |
| CN109487216A (en) | Source application and OLED evaporator | |
| CN105177507A (en) | Evaporation crucible and evaporation equipment | |
| JP5766720B2 (en) | Heating system for vapor deposition sources | |
| CN104313538B (en) | Evaporated device and evaporation coating method | |
| JP2009084674A (en) | Vapor deposition source and vapor deposition apparatus | |
| CN101275218A (en) | Film preparation device and observation method for film growth | |
| CN104278239A (en) | Evaporation crucible device | |
| CN102732843A (en) | High-capacity deposition device for forming a thin film | |
| CN104593729A (en) | Crucible capable of preventing evaporation material from splashing and plugging holes | |
| CN102732842A (en) | Depositing apparatus for forming thin film | |
| CN201305624Y (en) | Film preparation device | |
| CN104325149B (en) | Applying electronic reaction bundle makes the device and method of submicron metal | |
| CN108570644A (en) | A kind of high-isolation film and its manufacturing method of plating aluminium oxide | |
| CN104498889B (en) | Automatic continuous antifouling film coating device | |
| CN106967951B (en) | A kind of film formation device, film build method and film deposition source | |
| CN103695848B (en) | Evaporated device and evaporation coating method thereof | |
| CN104962864A (en) | Crucible device and vapor deposition apparatus | |
| CN106567043A (en) | An evaporation deposition device and method | |
| CN205590783U (en) | Multi -purpose coating machine | |
| CN206069992U (en) | Evaporation coating device | |
| CN205170963U (en) | Evaporate device and evaporating device group | |
| JP2005179764A (en) | Vapor deposition apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |