CN209182450U - A kind of burn-in board - Google Patents
A kind of burn-in board Download PDFInfo
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- CN209182450U CN209182450U CN201821756791.0U CN201821756791U CN209182450U CN 209182450 U CN209182450 U CN 209182450U CN 201821756791 U CN201821756791 U CN 201821756791U CN 209182450 U CN209182450 U CN 209182450U
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Abstract
The utility model embodiment provides a kind of burn-in board, is related to technical field of electronic equipment.The utility model passes through the setting control module on burn-in board and at least one test bench connecting with control module, temperature collecting module and temperature adjustment module are provided on test bench, test bench is for placing chip to be tested, temperature collecting module acquires the temperature signal of chip to be tested, control module is by control temperature adjustment module, the chip to be tested in test bench is heated up or be cooled down.The temperature signal of chip to be tested is acquired by temperature collecting module, control module control temperature adjustment module is heated up or is cooled down to the chip to be tested in test bench, so that the temperature of each chip to be tested can be adjusted individually, guarantee that all chips to be tested are attained by required aging test temperature, improve the accuracy of ageing test result, and burn-in test is carried out it is not necessary that burn-in board to be placed in ageing oven, save space and cost.
Description
Technical field
The utility model relates to technical field of electronic equipment, more particularly to a kind of burn-in board.
Background technique
Burn-in test is the important link that service life and reliability assessment are carried out to IC chip, is carrying out burn-in test
When, it needs for chip to be tested to be put on burn-in board, and provide simulation chip operation state to be tested for burn-in board
Required power supply and test signal, makes chip to be tested run a period of time at high temperature, accelerates its ageing process, allow to be tested
The failure of chip can expose within the shorter time, take out chip to be tested after the completion of burn-in test, and test core to be tested
The failure rate of piece obtains the reliability information of product.
Currently, burn-in test can be carried out to chip to be tested by two ways, as shown in Figure 1, the first is by aging
Test board is divided into control panel and test board, and test board includes n test bench, such as test bench 1 to test bench n, in each test bench
Chip to be tested can be placed, the test board for being placed with chip to be tested is put into ageing oven, the temperature of ageing oven is set
To the aging test temperature of requirement, and control panel is located at outside ageing oven, and control panel includes power supply and control module, respectively surveys
Data-signal needed for test plate (panel) provides power supply and chip to be tested；As shown in Fig. 2, second of burn-in board includes n test
Seat can place chip to be tested in each test bench, will be placed with the aging of chip to be tested such as test bench 1 to test bench n
Test board is put into dedicated ageing oven, and burn-in board side connects ageing oven by dedicated socket (such as golden finger), will be old
The temperature for changing case is set to the aging test temperature of requirement, and provides power supply and to be measured by dedicated ageing oven for burn-in board
Data-signal needed for trying chip.
But for both burn-in test modes, the degree of heat after being powered due to chip to be tested is different, and aging
Temperature in case at different location is also different, so that the aging test temperature of chip to be tested has certain difference, influences
The accuracy of the ageing test result of chip to be tested；In addition, for second of burn-in test mode, due to needing dedicated socket
It is connect with burn-in board, required data-signal is provided for chip to be tested, when the type difference of chip to be tested, needed
Data-signal type it is also different, then the quantity for the dedicated socket that burn-in board is connected from ageing oven also can be different, thus
Cause the burn-in board for a ageing oven that can not use in the ageing oven of other specifications.
Utility model content
In view of the above problems, it proposes the utility model embodiment and overcomes the above problem or at least portion in order to provide one kind
A kind of point burn-in board for solving the above problems of ground, by solve to need in a manner of existing burn-in test ageing oven or it is dedicated always
Changing case influences the accuracy of the ageing test result of chip to be tested so that the aging test temperature of chip to be tested is variant
The problem of.
To solve the above-mentioned problems, the utility model embodiment discloses a kind of burn-in board, comprising: control module and
At least one test bench is provided with temperature collecting module and temperature adjustment module, the control module point on each test bench
Not at least one described test bench and at least one described test bench temperature collecting module and temperature adjustment module connect
It connects；
The test bench, for placing chip to be tested；
The temperature collecting module, for acquiring the temperature signal of the chip to be tested；
The control module, for controlling the temperature adjustment module according to the temperature signal of the chip to be tested, with
Chip to be tested in the test bench is heated up or cooled down.
Optionally, the burn-in board further includes signal processing module；
The signal processing module, respectively with the temperature acquisition mould in the control module and at least one described test bench
Block connection, is handled, and be sent to the control module for the temperature signal to the collected chip to be tested.
Optionally, the signal processing module includes signal amplifier and analog-digital converter；
The signal amplifier is connect with the temperature collecting module at least one described test bench, for collecting
The temperature signal of the chip to be tested amplify processing, obtain temperature amplified signal；
The analog-digital converter is connect with the signal amplifier and the control module respectively, is used for the temperature
Amplified signal is converted to voltage value, and the voltage value is sent to the control module.
Optionally, the burn-in board further includes voltage transformation module；
The voltage conversion module, respectively with external power module and the control module and it is described at least one
Test bench connection, the voltage for providing the power module are converted at least one described test bench and the control module
Required voltage.
Optionally, the burn-in board further includes and the one-to-one indicator light of the test bench；
The indicator light, for showing the working condition of the chip to be tested in the test bench.
Optionally, the burn-in board further includes circuit board, and the control module and at least one described test bench are equal
It is arranged on the circuit board.
Optionally, the temperature adjustment module includes heating device and cooling device；
The test bench includes the accommodating chamber for placing the chip to be tested, and the open area of the covering accommodating chamber
Cooling fin, the heating device is embedded in the cooling fin, in the cooling fin close to the one of the chip to be tested
Side is provided with temperature collecting module, and the side of the chip to be tested is provided with the cooling device in the cooling fin.
Optionally, the temperature collecting module is thermistor or thermocouple.
Optionally, the heating device is heating wire, and the cooling device is fan.
The utility model embodiment includes following advantages:
By at least one test bench that control module is arranged on burn-in board and is connect with control module, surveying
The temperature collecting module and temperature adjustment module connecting respectively with control module are provided on examination seat, test bench is to be measured for placing
Chip is tried, temperature collecting module acquires the temperature signal of chip to be tested, and control module is according to the temperature signal of chip to be tested
Temperature adjustment module is controlled, the chip to be tested in test bench is heated up or be cooled down.Pass through the temperature being arranged on test bench
Degree acquisition module acquires the temperature signal of chip to be tested, by control module control temperature adjustment module in test bench to
Test chip is heated up or is cooled down, so that the temperature of each chip to be tested can be adjusted individually, is guaranteed all to be measured
Examination chip can reach required aging test temperature, improve the accuracy of the ageing test result of chip to be tested, and nothing
Burn-in board need to be placed in ageing oven, it is therefore not necessary to which ageing oven or dedicated ageing oven carry out burn-in test, save sky
Between and cost.
Detailed description of the invention
Fig. 1 shows a kind of structural schematic diagram of existing burn-in board；
Fig. 2 shows the structural schematic diagrams of existing another burn-in board；
Fig. 3 shows a kind of structural schematic diagram of burn-in board of the utility model；
Fig. 4 shows the structural schematic diagram of another burn-in board of the utility model；
Fig. 5 shows the structural schematic diagram of the test bench of the utility model in the open state；
Fig. 6 shows the structural schematic diagram of the test bench of the utility model in the closure state.
Specific embodiment
To keep the above objects, features, and advantages of the utility model more obvious and easy to understand, with reference to the accompanying drawing and have
Body embodiment is described in further detail the utility model.
Referring to Fig. 3, a kind of structural schematic diagram of burn-in board of the utility model is shown.
The utility model provides a kind of burn-in board 30, comprising: control module 31 and at least one test bench 32, often
Be provided with temperature collecting module 321 and temperature adjustment module 322 on a test bench 32, control module 31 respectively at least one
Test bench 32 and temperature collecting module 321 and the connection of temperature adjustment module 322 at least one test bench 32.
Test bench 32, for placing chip to be tested；Temperature collecting module 321, for acquiring the temperature of chip to be tested
Signal；Control module 31, for controlling temperature adjustment module 322 according to the temperature signal of chip to be tested, to test bench 32
Interior chip to be tested is heated up or is cooled down.
At least one test bench 32 is provided on burn-in board 30, such as test bench 1 to test bench n, n is greater than 0
Positive integer indicates to be provided with 3 test benches altogether on burn-in board 30 when n is 3；Chip to be tested is placed on test bench
In 32, each test bench 32 is connect with control module 31, and control module 31 is used to provide core to be tested to each test bench 32
Data-signal needed for piece.
It should be noted that 31 inside programming of control module has control program, by controlling program to each test bench 32
Data-signal needed for providing chip to be tested, in practical applications, control module 31 can be a control chip, control core
Type the utility model embodiment of piece is without limitation, can be FPGA (Field Programmable Gate
Array, field programmable gate array) chip, such as the fpga chip of model XC6SLX75, can also for singlechip chip or
Other kinds of chip etc..
When needing to carry out burn-in test to the chip to be tested for not having to type, corresponding control program is different, can
To be programmed with one or more control programs in a control module 31, if being programmed with a kind of control in a control module 31
Processing procedure sequence chooses corresponding control module 31 when needing to carry out burn-in test to chip to be tested, if controlling at one
It is programmed with various control program in module 31, when needing to carry out burn-in test to chip to be tested, is selected in control module 31
Take the corresponding control program of the chip to be tested.Wherein, the control program programmed in control module 31 can use existing
Control program.
Further, since control module 31 will also control temperature adjustment module 322 according to the temperature signal of chip to be tested, with
Chip to be tested in test bench 32 is heated up or is cooled down, specifically, control module 31 also respectively with each test bench 32
On temperature collecting module 321 and temperature adjustment module 322 connect.
Temperature collecting module 321 acquires the temperature signal of chip to be tested in real time, by the temperature of collected chip to be tested
Degree signal is sent to control module 31, and control module 31 is according to the corresponding temperature of temperature signal of collected chip to be tested
Value, compares with preset aging test temperature, when the corresponding temperature value of collected temperature signal is greater than preset aging
When test temperature, indicate that the temperature value for the chip to be tested placed in test bench 32 is higher, control module 31 generates the first control
Signal is simultaneously sent to temperature adjustment module 322, so that temperature adjustment module 322 is according to first control signal in test bench 32
Chip to be tested cools down；When the corresponding temperature value of collected temperature signal is less than preset aging test temperature, table
Show that the temperature value for the chip to be tested placed in test bench 32 is lower, control module 31 generates second control signal and is sent to temperature
Adjustment module 322 is spent, so that temperature adjustment module 322 carries out the chip to be tested in test bench 32 according to second control signal
Heating；When the corresponding temperature value of collected temperature signal is equal with preset aging test temperature, indicate in test bench 32
Chip to be tested be in aging test temperature, then no longer need to that the chip to be tested in test bench 32 is heated up or cooled down.
The temperature signal of chip to be tested is acquired by temperature collecting module 321, and passes through the liter of temperature adjustment module 322
Temperature or cooling, dynamically adjust the temperature of chip to be tested, so that the temperature of each chip to be tested can be adjusted individually, guarantee
All chips to be tested can reach required aging test temperature, improve the standard of the ageing test result of chip to be tested
True property；And temperature adjustment module 322 can make chip to be tested reach aging test temperature, it is therefore not necessary to by burn-in test
Plate 30 is placed in ageing oven, and burn-in board 30 is placed at room temperature, is carried out without ageing oven or dedicated ageing oven old
Change test, saves space and cost.
When the type for the chip to be tested placed at least one test bench 32 being arranged on burn-in board 30 is identical,
Aging test temperature needed for it is also identical, and the temperature value of chip to be tested is adjusted to one by temperature controllable adjustment module 322
It causes；When the type difference for the chip to be tested placed at least one test bench 32 being arranged on burn-in board 30, institute
The aging test temperature needed may be different, control corresponding temperature adjustment module 322 respectively for the temperature value tune of chip to be tested
Respectively required temperature value is saved into, burn-in test is carried out to different types of chip to be tested to realize.
Referring to Fig. 4, the structural schematic diagram of another burn-in board of the utility model is shown.
On the basis of Fig. 3, burn-in board 30 further includes signal processing module 33；Signal processing module 33, respectively with
Temperature collecting module 321 in control module 31 and at least one test bench 32 connects, for collected chip to be tested
Temperature signal handled, and be sent to control module 31.
Wherein, signal processing module 33 includes signal amplifier and analog-digital converter；Signal amplifier, at least one survey
The temperature collecting module 321 tried on seat 32 connects, and amplifies processing for the temperature signal to collected chip to be tested,
Obtain temperature amplified signal；Analog-digital converter is connect with signal amplifier and control module 31 respectively, is believed for amplifying temperature
Number it is converted to voltage value, and voltage value is sent to control module 31.
After the temperature signal that temperature collecting module 321 collects chip to be tested, it is sent to signal processing module 33
It is handled, specifically, being the signal amplifier being first sent in signal processing module 33, signal amplifier is to chip to be tested
Temperature signal amplify processing, obtain temperature amplified signal, and temperature amplified signal is sent to signal processing module 33
In analog-digital converter, temperature amplified signal is converted to voltage value by analog-digital converter, and voltage value is sent to control module
31, control module 31 reads the voltage value of chip to be tested, according to the corresponding relationship of voltage value and temperature value, is calculated to be measured
Try the temperature value at chip current time.
In fact, the temperature signal of the collected chip to be tested of temperature collecting module 321 is analog signal, put through signal
The temperature amplified signal obtained after big device enhanced processing is also analog signal, and analog-digital converter needs to convert number for analog signal
Word signal, that is, be converted into voltage value, so that control module 31 can be calculated according to the corresponding relationship of voltage value and temperature value
The temperature value at chip current time to be tested.
It is, of course, understood that analog-digital converter can only be arranged in signal processing module 33, by temperature collecting module
The temperature signal of 321 collected chips to be tested is directly changed into voltage value, and is sent to control module 31, still, is believing
Setting signal amplifier and the analog-digital converter connecting with signal amplifier simultaneously in number processing module 33, can adopt temperature
The temperature signal of the collection collected chip to be tested of module 321 amplifies processing, avoids collecting because of temperature collecting module 321
Chip to be tested temperature signal it is faint, cause the temperature value being calculated inaccurate, temperature adopted by signal amplifier
The temperature signal of the collection collected chip to be tested of module 321 amplifies processing, improves the intensity of temperature signal, in terms of improving
The accuracy of obtained temperature value.In addition, when being integrated with analog-digital converter in control module 31, in signal processing module 33
It can also be not provided with analog-digital converter.
As shown in figure 4, burn-in board 30 further includes voltage transformation module 34；Voltage conversion module 34, respectively with outside
Power module and control module 31 and at least one test bench 32 connect, the voltage conversion for providing power module
At voltage needed at least one test bench 32 and control module 31.
In the utility model embodiment, the voltage as needed for control module 31 and test bench 32 may be with power module
The voltage of offer is different, therefore, needed for external power module cannot be provided directly to control module 31 and test bench 32
Voltage, need the voltage for providing power module by voltage transformation module 34 to be converted to 31 institute of test bench 32 and control module
The voltage needed, so that test bench 32 and control module 31 can work normally.
When burn-in board 30 further includes signal processing module 33, voltage transformation module 34 also needs to provide power module
Voltage be converted to signal processing module 33 needed for voltage.
As shown in figure 4, burn-in board 30 further includes and the one-to-one indicator light 35 of test bench 32；Indicator light 35 is used
In the working condition of the chip to be tested in display test bench 32.
Specifically, to be tested chip of the control module 31 into each test bench 32 sends detection a signal, such as square wave
Signal or clock signal, detection signal enters chip interior to be tested from a pin of chip to be tested, by core to be tested
It after all routes inside piece, comes out, and enters in control module 31, control module from another pin of chip to be tested
The 31 detection signal and the detection signal received according to transmission determines the working condition of the chip to be tested in test bench 32,
And show the working condition of the chip to be tested in each test bench 32 by control instructions lamp 35, so that user is timely
Understand the working condition of the chip to be tested in each test bench 32.
For example, burn-in board 30 includes 4 test benches 32, respectively test bench 1, test bench 2, test bench 3 and test
Seat 4, corresponding indicator light are respectively indicator light 1, indicator light 2, indicator light 3 and indicator light 4, when test bench 1, test bench 2 and are surveyed
When the working condition for the chip to be tested placed in examination seat 3 is normal, indicator light 1, indicator light 2 and indicator light 3 show green,
When the working condition for the chip to be tested placed in test bench 4 is abnormal, such as the wafer damage to be tested placed in test bench 4
When, indicator light 4 is displayed in red.
In the utility model embodiment, burn-in board 30 further includes circuit board, control module 31 and at least one survey
Examination seat 32 is respectively provided on circuit boards.
In addition, signal processing module 33, voltage transformation module 34 and indicator light 35 are also provided on circuit boards, circuit board can
PCB (Printed Circuit Board, printed circuit board) is thought, by control module 31, at least one test bench 32, signal
Processing module 33, voltage transformation module 34 and indicator light 35 are fixed on circuit boards by welding.
In this way, device needed for burn-in board 30 is all integrated on one piece of circuit board, use process can be reduced
In the work such as line, improve the reliability and stability of burn-in board 30.
Referring to Fig. 5, the structural schematic diagram of the test bench of the utility model in the open state is shown, Fig. 6 is shown
The structural schematic diagram of the test bench of the utility model in the closure state.
Temperature adjustment module 322 includes heating device 3221 and cooling device 3222；Test bench 32 includes that placement is to be tested
The accommodating chamber 323 of chip, and the cooling fin 324 of the open area of accommodating chamber 323 is covered, liter is embedded in cooling fin 324
Warm device 3221 is provided with temperature collecting module 321 close to the side of chip to be tested in cooling fin 324, remote in cooling fin 324
Side from chip to be tested is provided with cooling device 3222.
As shown in figure 5, test bench 32 in the open state, chip to be tested can be placed on to the receiving of test bench 32
In chamber 323, then cooling fin 324 and accommodating chamber 323 be closed, obtain structure as shown in FIG. 6, then again to chip to be tested into
Row burn-in test.
Wherein, temperature collecting module 321 is thermistor or thermocouple, it is, of course, also possible to be other devices；Heat up device
3221 be heating wire, and cooling device 3222 is fan.Temperature collecting module 321 and cooling device 3222 can be fixed by screws in
On cooling fin 324, heating device 3221 is embedded in cooling fin 324.
In the utility model embodiment, by the way that control module is arranged on burn-in board and is connect with control module
At least one test bench, the temperature collecting module connecting respectively with control module and temperature are provided on test bench and adjusts mould
Block, for test bench for placing chip to be tested, temperature collecting module acquires the temperature signal of chip to be tested, control module according to
The temperature signal of chip to be tested controls temperature adjustment module, the chip to be tested in test bench is heated up or be cooled down.
The temperature signal that chip to be tested is acquired by the temperature collecting module being arranged on test bench controls temperature tune by control module
Section module is heated up or is cooled down to the chip to be tested in test bench, so that the temperature of each chip to be tested can be independent
It adjusts, guarantees that all chips to be tested can reach required aging test temperature, the aging for improving chip to be tested is surveyed
The accuracy of test result, and it is not necessary that burn-in board to be placed in ageing oven, it is therefore not necessary to ageing oven or dedicated ageing oven into
Row burn-in test, saves space and cost.
It above to a kind of burn-in board provided by the utility model, is described in detail, tool used herein
Body example is expounded the principles of the present invention and embodiment, and the above embodiments are only used to help understand
The method and its core concept of the utility model；At the same time, for those skilled in the art, the think of according to the utility model
Think, there will be changes in the specific implementation manner and application range, in conclusion the content of the present specification should not be construed as pair
The limitation of the utility model.
Claims (9)
1. a kind of burn-in board characterized by comprising control module and at least one test bench, on each test bench
Be provided with temperature collecting module and temperature adjustment module, the control module respectively at least one described test bench, Yi Jisuo
The temperature collecting module stated at least one test bench is connected with temperature adjustment module；
The test bench, for placing chip to be tested；
The temperature collecting module, for acquiring the temperature signal of the chip to be tested；
The control module, for controlling the temperature adjustment module according to the temperature signal of the chip to be tested, to institute
The chip to be tested stated in test bench is heated up or is cooled down.
2. burn-in board according to claim 1, which is characterized in that the burn-in board further includes signal processing mould
Block；
The signal processing module connects with the temperature collecting module in the control module and at least one described test bench respectively
It connects, is handled for the temperature signal to the collected chip to be tested, and be sent to the control module.
3. burn-in board according to claim 2, which is characterized in that the signal processing module includes signal amplifier
And analog-digital converter；
The signal amplifier is connect with the temperature collecting module at least one described test bench, for collected institute
The temperature signal for stating chip to be tested amplifies processing, obtains temperature amplified signal；
The analog-digital converter is connect with the signal amplifier and the control module respectively, for amplifying the temperature
Signal is converted to voltage value, and the voltage value is sent to the control module.
4. burn-in board according to claim 1, which is characterized in that the burn-in board further includes voltage modulus of conversion
Block；
The voltage conversion module, respectively with external power module and the control module and at least one described test
Seat connection, the voltage for providing the power module are converted to needed at least one described test bench and the control module
Voltage.
5. burn-in board according to claim 1, which is characterized in that the burn-in board further includes and the test
The one-to-one indicator light of seat；
The indicator light, for showing the working condition of the chip to be tested in the test bench.
6. burn-in board according to any one of claim 1 to 5, which is characterized in that the burn-in board also wraps
Circuit board is included, the control module and at least one described test bench are arranged on the circuit board.
7. burn-in board according to claim 1, which is characterized in that the temperature adjustment module include heating device and
Cool down device；
The test bench includes the accommodating chamber for placing the chip to be tested, and the open area of the covering accommodating chamber dissipates
Backing is embedded with the heating device in the cooling fin, sets in the cooling fin close to the side of the chip to be tested
It is equipped with temperature collecting module, the side of the chip to be tested is provided with the cooling device in the cooling fin.
8. burn-in board according to claim 1, which is characterized in that the temperature collecting module is thermistor or heat
Galvanic couple.
9. burn-in board according to claim 7, which is characterized in that the heating device is heating wire, the cooling
Device is fan.
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| CN201821756791.0U CN209182450U (en) | 2018-10-26 | 2018-10-26 | A kind of burn-in board |
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