CN110824339A - Constant temperature control device and method for aging screening test of switch chip - Google Patents
Constant temperature control device and method for aging screening test of switch chip Download PDFInfo
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- CN110824339A CN110824339A CN201911003691.XA CN201911003691A CN110824339A CN 110824339 A CN110824339 A CN 110824339A CN 201911003691 A CN201911003691 A CN 201911003691A CN 110824339 A CN110824339 A CN 110824339A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
- G01R31/2817—Environmental-, stress-, or burn-in tests
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/20—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature
- G05D23/22—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature the sensing element being a thermocouple
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- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention discloses a constant temperature control device and a method for an aging screening test of a switch chip, wherein the device comprises: the chip testing seat is integrated with a thermocouple collecting head; the temperature collector is connected with the thermocouple collecting head and used for obtaining the temperature of the chip testing seat; and the temperature control device is respectively connected with the temperature collector and the chip test seat and is used for controlling the chip test seat to heat or radiate the chip according to the temperature obtained by the temperature collector. The invention can accurately control the working temperature range of each exchange chip in the aging screening process and ensure the temperature consistency of each chip in the whole aging screening process.
Description
Technical Field
The invention relates to a technology for aging screening test of an exchange chip, in particular to a constant temperature control device and a method for aging screening test of the exchange chip.
Background
The aging screening test of the exchange chip is an important step in the production test process of the exchange chip, the chip is placed in a test seat, and after a period of specific high-temperature work, the chip can expose the problem as early as possible, and the defective chip can be effectively screened. In order to ensure a strict and reasonable result, the working temperature of each chip needs to be ensured to be basically consistent in the batch test process, but in the actual operation process, the power of the switching chips of various types is different due to different using scenes, some switching chips have lower power, and some switching chips with complex functions have higher power consumption. If the case temperature for operating the switching chip is maintained at a high temperature, for example, 125 ℃, a heating operation is required for the switching chip with small power consumption, whereas a heat dissipation operation is required for the switching chip with high power.
In addition, due to the influence of aging environment of the exchange chips, air duct design and the like, the working temperature of each chip is difficult to be consistent.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a constant temperature control device and a constant temperature control method for an aging screening test of a switch chip.
In order to achieve the purpose, the invention provides the following technical scheme: a thermostatic control device for a switch chip burn-in screening test, the device comprising:
the chip testing seat is internally fixed with an exchange chip to be tested, and a thermocouple collecting head is integrated on the chip testing seat;
the temperature collector is connected with the thermocouple collecting head and used for obtaining the temperature of the chip testing seat;
and the temperature control device is respectively connected with the temperature collector and the chip test seat and is used for controlling the chip test seat to heat or radiate the chip according to the temperature acquired by the temperature collector.
Preferably, the temperature collector is in communication connection with the temperature control device through an RS232 interface.
Preferably, the temperature control device comprises a main processor, the main processor is connected with the temperature collector through a level conversion chip, and the main processor is connected with the level conversion chip through a UART interface; the level conversion chip is connected with the temperature collector through an RS232 interface and is used for converting the UART interface into the RS232 interface.
Preferably, the temperature control device further comprises a heat dissipation control chip connected with the main processor, the chip test socket is further integrated with a heat dissipation fan connected with the heat dissipation control chip, and the heat dissipation control chip generates PWM signals with different frequency duty ratios under the control of the main processor to perform speed regulation control on the heat dissipation fan.
Preferably, the main processor is connected with the heat dissipation control chip through an I2C interface.
Preferably, the temperature control device further comprises a transistor connected with the main processor, a heating rod connected with the transistor is further integrated on the chip test socket, and the transistor controls whether the heating rod works or not under the control of the main processor.
Preferably, the main processor is connected to the transistor through a GPIO pin.
The invention also discloses another technical scheme: a constant temperature control method for a switch chip aging screening test comprises the following steps:
s1, the temperature collector obtains the temperature of the chip test seat through the thermocouple collecting head;
and S2, controlling the chip testing seat to heat or radiate the chip by the temperature control device according to the temperature acquired by the temperature acquisition device.
Preferably, the temperature control device includes a main processor and a heat dissipation control chip connected to the main processor, and a heat dissipation fan connected to the heat dissipation control chip is further integrated on the chip test socket, in S2, the heat dissipation operation includes: the heat dissipation control chip generates PWM signals with different frequency duty ratios under the control of the main processor to carry out speed regulation control on the heat dissipation fan.
Preferably, the temperature control device includes a main processor and a transistor connected to the main processor, and a heater bar connected to the transistor is further integrated on the chip test socket, in S2, the heating operation includes: the transistor controls whether the heating rod works or not under the control of the main processor.
Preferably, the temperature control device comprises a main processor and a level conversion chip connected with the main processor through an RS232 interface, the level conversion chip converts the UART interface into the RS232 interface, and the level conversion chip communicates with the temperature collector through the RS232 interface to acquire the temperature collected by the temperature collector.
The invention has the beneficial effects that: the method can accurately control the working temperature range of each exchange chip in the aging screening process, and ensure the temperature consistency of each chip in the whole aging screening process.
Drawings
FIG. 1 is a block diagram of the apparatus of the present invention;
FIG. 2 is a schematic circuit diagram of the temperature control apparatus of the present invention;
FIG. 3 is a circuit diagram of a level shift chip according to the present invention;
FIG. 4 is a circuit diagram of a fan control chip according to the present invention;
fig. 5 is a circuit schematic of the transistor of the present invention.
Detailed Description
The technical solution of the embodiment of the present invention will be clearly and completely described below with reference to the accompanying drawings of the present invention.
The constant temperature control device and the method for the aging screening test of the exchange chip disclosed by the invention are applied to temperature control in the aging screening test process of the exchange chip, and the consistency control of the working temperature of each chip in the aging screening test is realized.
As shown in fig. 1, the thermostatic control device for the exchange chip aging screening test disclosed by the invention comprises a chip test seat, a temperature collector and a temperature control device, wherein the temperature collector is connected with the chip test seat and used for acquiring the temperature of the chip test seat and then communicating with the temperature control device through an RS232 interface, and the temperature control device judges whether heat dissipation or heating operation needs to be performed on a chip in the chip test seat according to the acquired temperature.
Specifically, the chip test socket can place the exchange chip in and fix the exchange chip, and the exchange chip is subjected to aging screening test. In this embodiment, a K-type thermocouple collecting head (not shown), a cooling fan (not shown) and a heating rod (not shown) are integrated on the chip testing socket, wherein the K-type thermocouple collecting head is used for collecting the temperature of the chip testing socket during the burn-in screening test of the exchange chip, the cooling fan is used for cooling the chip in the chip testing socket, and the heating rod is used for heating the chip in the chip testing socket.
The temperature collector is in butt joint (such as through socket butt joint) with a K-type thermocouple collecting head of the chip testing seat, and is used for timely obtaining the temperature of the chip testing seat. And the temperature collector is also in communication connection with the temperature control device through a communication interface and is used for transmitting the acquired temperature to the temperature control device. In this embodiment, the temperature collector is in communication connection with the temperature control device through an RS232 interface. Preferably, the temperature collector can support multiple paths of temperature collection, each path of temperature collection corresponds to one chip test socket, that is, the multiple paths of temperature collection correspond to multiple chip test sockets, so that the temperatures of the multiple chip test sockets are collected at the same time, and the collected multiple paths of temperatures are all transmitted to the temperature control device through the communication interface (such as the RS232 interface in this embodiment).
The temperature control device is respectively connected with the temperature collector and the chip test seat and used for controlling the chip test seat to heat or radiate the chip according to the temperature acquired by the temperature collector, so that the working temperature of each chip in the chip test seat is ensured to be consistent. Specifically, in this embodiment, as shown in fig. 2, the temperature control device includes a main processor, a level conversion chip, a heat dissipation control chip, and a transistor, wherein the main processor may employ an SAMD20G16A chip from ATMEL corporation, and the chip may be configured flexibly, as shown in fig. 2. The main processor comprises a UART interface, an I2C interface and GPIO pins, wherein the UART interface of the main processor is connected with a level conversion chip, the level conversion chip is connected with a temperature collector through an RS232 interface and used for converting the UART interface into the RS232 interface, so that the main processor is communicated with the temperature collector to obtain the temperature collected by the temperature collector. In practice, the level shift chip may be implemented by a level shift chip UM3232EEAE of an english semiconductor, and a hardware design circuit of the level shift chip UM3232EEAE is shown in fig. 3.
The I2C interface of the main processor is connected with a heat dissipation control chip, the heat dissipation control chip is connected with a heat dissipation fan on the chip test socket, and the heat dissipation control chip controls whether the heat dissipation fan works or not under the control of the main processor. Specifically, when implemented, the heat dissipation control chip may employ a fan control chip ADT7470, the hardware design circuit of which is shown in fig. 4. The main processor accesses the fan control chip ADT7470 through the I2C interface, and controls the fan control chip ADT7470 to generate PWM (Pulse Width Modulation) signals with different frequency duty ratios, such as PWM1, PWM2, PWM3, and PWM4 … …, for adjusting the speed of the cooling fan, thereby adjusting the cooling capacity of the cooling fan.
And a GPIO pin of the main processor is connected with a transistor, the transistor is connected with a heating rod on the chip test seat, and the transistor controls whether the heating rod works or not under the control of the main processor. Specifically, in practice, the heating rod may be implemented by using a PMOS tube BLM2305 of Berkeley electronics, the hardware design circuit of which is shown in FIG. 5. The main processor drives the PMOS tube BLM2305 through the GPIO pin to control whether the heater of the chip test socket works or not. Alternatively, the transistor may be an NMOS transistor or another transistor.
Based on the constant temperature control device for the switch chip aging screening test, the constant temperature control method for the switch chip aging screening test disclosed by the invention comprises the following steps:
and S1, the temperature collector obtains the temperature of the chip test seat through the thermocouple collecting head.
And S2, controlling the chip testing seat to heat or radiate the chip by the temperature control device according to the temperature acquired by the temperature acquisition device.
The above description is referred to for the process and principle of how the temperature collector obtains the temperature of the chip test socket and how the temperature control device heats or dissipates the heat of the chip, and is not repeated here.
Therefore, the scope of the present invention should not be limited to the disclosure of the embodiments, but includes various alternatives and modifications without departing from the scope of the present invention, which is defined by the claims of the present patent application.
Claims (10)
1. A thermostatic control device for a switch chip burn-in screening test, the device comprising:
the chip testing seat is internally fixed with an exchange chip to be tested, and a thermocouple collecting head is integrated on the chip testing seat;
the temperature collector is connected with the thermocouple collecting head and used for obtaining the temperature of the chip testing seat;
and the temperature control device is respectively connected with the temperature collector and the chip test seat and is used for controlling the chip test seat to heat or radiate the chip according to the temperature acquired by the temperature collector.
2. The thermostatic control device for the switch chip aging screening test according to claim 1, wherein the temperature control device is in communication connection with the temperature collector through an RS232 interface.
3. The thermostatic control device for the switch chip aging screening test according to claim 2, wherein the temperature control device comprises a main processor, the main processor is connected with the temperature collector through a level conversion chip, and the main processor is connected with the level conversion chip through a UART interface; the level conversion chip is connected with the temperature collector through an RS232 interface and is used for converting the UART interface into the RS232 interface.
4. The thermostatic control device for the switch chip aging screening test according to claim 3, wherein the temperature control device further comprises a heat dissipation control chip connected to the main processor, and a heat dissipation fan connected to the heat dissipation control chip is further integrated on the chip test socket, and the heat dissipation control chip generates PWM signals with different frequency duty ratios under the control of the main processor to control the speed of the heat dissipation fan.
5. The thermostatic control device for the switch chip burn-in screening test of claim 4, wherein said main processor is connected to said heat dissipation control chip through an I2C interface.
6. The thermostatic control device for the switch chip aging screening test according to claim 3, wherein the temperature control device further comprises a transistor connected with the main processor, a heating rod connected with the transistor is further integrated on the chip test seat, and the transistor controls whether the heating rod works or not under the control of the main processor.
7. The thermostat device for switch chip burn-in screening test of claim 6, wherein said main processor is connected to said transistor through a GPIO pin.
8. A constant temperature control method of a constant temperature control device based on the switch chip burn-in screening test of any one of claims 1 to 7, the method comprising:
s1, the temperature collector obtains the temperature of the chip test seat through the thermocouple collecting head;
and S2, controlling the chip testing seat to heat or radiate the chip by the temperature control device according to the temperature acquired by the temperature acquisition device.
9. The method according to claim 8, wherein the temperature control device comprises a main processor and a heat dissipation control chip connected to the main processor, and a heat dissipation fan connected to the heat dissipation control chip is further integrated on the chip test socket, and in S2, the heat dissipation operation comprises: the heat dissipation control chip generates PWM signals with different frequency duty ratios under the control of the main processor to carry out speed regulation control on the heat dissipation fan.
10. The thermostat control method of claim 8, wherein the temperature control device comprises a main processor and a transistor connected to the main processor, and the chip test socket further integrates a heater bar connected to the transistor, in S2, the heating operation comprises: the transistor controls whether the heating rod works or not under the control of the main processor.
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| CN201911003691.XA CN110824339A (en) | 2019-10-22 | 2019-10-22 | Constant temperature control device and method for aging screening test of switch chip |
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| CN201911003691.XA CN110824339A (en) | 2019-10-22 | 2019-10-22 | Constant temperature control device and method for aging screening test of switch chip |
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Citations (6)
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| JPS5928347A (en) * | 1982-08-09 | 1984-02-15 | Nec Corp | Screening device for semiconductor device |
| US20130285684A1 (en) * | 2012-04-26 | 2013-10-31 | Akira Okada | Inspection apparatus |
| CN105548761A (en) * | 2015-12-23 | 2016-05-04 | 苏州创瑞机电科技有限公司 | High and low temperature aging test equipment based on semiconductor chilling plates |
| CN107664652A (en) * | 2017-08-01 | 2018-02-06 | 哈尔滨哈普电气技术有限责任公司 | A kind of dynamic aging tester device and method of work |
| CN208207164U (en) * | 2018-04-09 | 2018-12-07 | 河南工程学院 | Thermoelectric generator low-temperature characteristics experimental provision |
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2019
- 2019-10-22 CN CN201911003691.XA patent/CN110824339A/en active Pending
Patent Citations (6)
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| JPS5928347A (en) * | 1982-08-09 | 1984-02-15 | Nec Corp | Screening device for semiconductor device |
| US20130285684A1 (en) * | 2012-04-26 | 2013-10-31 | Akira Okada | Inspection apparatus |
| CN105548761A (en) * | 2015-12-23 | 2016-05-04 | 苏州创瑞机电科技有限公司 | High and low temperature aging test equipment based on semiconductor chilling plates |
| CN107664652A (en) * | 2017-08-01 | 2018-02-06 | 哈尔滨哈普电气技术有限责任公司 | A kind of dynamic aging tester device and method of work |
| CN208207164U (en) * | 2018-04-09 | 2018-12-07 | 河南工程学院 | Thermoelectric generator low-temperature characteristics experimental provision |
| CN209182450U (en) * | 2018-10-26 | 2019-07-30 | 龙芯中科技术有限公司 | A kind of burn-in board |
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| 任德齐 等: "《单片机与上位机软件设计》", 30 September 2013, 重庆大学出版社 * |
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