JPS5928347A - Screening device for semiconductor device - Google Patents
Screening device for semiconductor deviceInfo
- Publication number
- JPS5928347A JPS5928347A JP57138312A JP13831282A JPS5928347A JP S5928347 A JPS5928347 A JP S5928347A JP 57138312 A JP57138312 A JP 57138312A JP 13831282 A JP13831282 A JP 13831282A JP S5928347 A JPS5928347 A JP S5928347A
- Authority
- JP
- Japan
- Prior art keywords
- bath
- temperature
- screening
- timer
- intake
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2642—Testing semiconductor operation lifetime or reliability, e.g. by accelerated life tests
Abstract
Description
【発明の詳細な説明】
木兄ツ１は半導体装置とくに半導体ＩＣのスクリーニン
グ装置、に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a screening device for semiconductor devices, particularly semiconductor ICs.
半導体ＩＣは、製造技術の進歩と共に、高集積化高速化
を指向しており、一般にはＩＣの消費電力の増大を伴っ
ている。Semiconductor ICs are becoming more highly integrated and faster as manufacturing technology advances, which generally results in an increase in the power consumption of the IC.
かかるＩＣは、一定の温度環境の中で、バイアス電圧を
印加又は規定の動作を実行させながら一定時間放置する
小によって、脆弱製品の破壊を加速し初期不良を除去す
る為のスクリーニング試験実施例
試験環境実現の為には、恒温槽を利用するのが一般的で
あり、槽内温度環境は、外部と耐熱隔離された構造とな
っている。Such ICs are subjected to screening tests in order to accelerate the destruction of fragile products and remove initial defects by leaving them for a certain period of time while applying a bias voltage or performing prescribed operations in a constant temperature environment. To achieve this, it is common to use a constant temperature bath, and the temperature environment inside the bath is heat-resistant isolated from the outside.
電力消費の大きなｉＣを、かかる環境でスクリーニング
する場合、ＩＣの発熱によって、槽内温度制御が不可能
となり熱暴走を来し、製品破壊に到り重大な損失を発生
ずる場合もあり、槽内ＩＣの総発熱Ｍ、を小さくする為
に、ＩＣ実装数を減すか、大型恒温槽を利用する事が必
要となる。When screening ICs that consume a large amount of power in such an environment, the temperature inside the tank cannot be controlled due to the heat generated by the IC, resulting in thermal runaway, which may lead to product destruction and serious losses. In order to reduce the total heat generation M of the IC, it is necessary to reduce the number of ICs mounted or to use a large thermostatic oven.
本発明の目的は、かかる問題を解消し、且つスクリーニ
ング時間完了後、自動的に槽内ヒータを切断すると共に
、熱したＩＣを加速空冷する事によって次作朶の待ち時
間を低減する装置を提供するものである。It is an object of the present invention to provide a device that eliminates such problems and reduces the waiting time for the next production by automatically cutting off the heater in the tank after the screening time is completed and accelerating air cooling of the heated IC. It is something to do.
本発明の特徴は、たとえば耐熱隔離材に吸気。A feature of the present invention is, for example, when air is inhaled into a heat-resistant isolation material.
排気孔を設け、ザーボ機構によりその孔をアナログ的に
開閉し、構内温度の過熱上昇を防止する手段と、プリセ
ット可能なタイマーによりスクリ・−ニング時間完了を
検出し、自動的に槽内温度を下降ぜしめる手段とを具備
した点にある。An exhaust hole is provided, and a servo mechanism opens and closes the hole in an analog manner to prevent the temperature inside the plant from overheating.A presettable timer detects the completion of the screening time and automatically adjusts the temperature inside the tank. The point is that it is equipped with a means for lowering it.
次に図を参照して装置の機能を説明Ｊる。第１図は従来
の恒ｖ１Ａ槽である。１は攪拌用ファンであり、槽内温
度分布を均一にする為槽内空気の攪拌をモータ動力によ
り実現し“Ｃいる。２は耐熱且つ熱伝導率の低い旧料で
外気を遮断している。３は槽内温度を高める為のヒータ
ーで、その１１ｆ、力は温度コントローラにＪ：り規定
された温度を維持すべく制御される。５は槽内温度検出
の為の熱電対である。１２は槽内発熱と放出する為の孔
であり、この放出熱量と槽内ＩＣの発熱量は、この孔に
よる放出熱量を越えると温度制御が不ｕＪ能となる。Next, the functions of the device will be explained with reference to the figures. FIG. 1 shows a conventional constant v1A tank. 1 is a stirring fan, which uses motor power to stir the air inside the tank to make the temperature distribution uniform in the tank. 2 is an old material that is heat resistant and has low thermal conductivity to block outside air. 3 is a heater for raising the temperature inside the tank, and its power is controlled by a temperature controller to maintain a specified temperature.5 is a thermocouple for detecting the temperature inside the tank. Reference numeral 12 denotes a hole for releasing heat inside the tank, and if the amount of heat released and the amount of heat generated by the IC inside the tank exceed the amount of heat released by this hole, temperature control becomes impossible.
又この孔は徒らに太きくするとエネルギーのロスとなる
１ツ１係から、適当な大きさに止めざるを１Ｇない。Also, if this hole is made too thick, it will result in a loss of energy, so it has to be kept at an appropriate size (1 G).
第２図は本発明の実施例の装置であり、７は温度コント
ローラ４で制御不能な温度を検出する為の熱雷、対であ
る。この熱起電力はサーボモータ制御部Ｆ３の駆ＩＩＩ
信号となり、サーボモータを作動し吸気、排気用スライ
ドブタを左右に移動する事によって、吸気Ｍ１．排気岱
の制御が行われる。もらろん吸気ファン、排気ファンを
伺加すればその効率は強化される。この吸排気機４′１
ｑにより、構内発熱が比較的大きな場合でも、槽内温度
を期待の制御領域にコントロール出来る事は明白であり
、第１図に比較し数倍のＩＣ実装を可能とＪるものであ
る。又１１はプリセットタイマーであり、スクリーニン
グ時間を設定しておけばスタートからの時間計数Ｋにす
、スクリーニング完了と同時に温度コントローラ４のヒ
ータ電力を零とし、且つ、サーボモータ制御部への駆動
信号として作動し吸気、排気孔を満開し、槽内温度を急
速に低下さぜるものである。FIG. 2 shows a device according to an embodiment of the present invention, and 7 is a pair of thermal lightnings for detecting a temperature that cannot be controlled by the temperature controller 4. This thermoelectromotive force drives the servo motor control section F3.
This signal activates the servo motor and moves the intake/exhaust slide tabs left and right, thereby increasing the intake M1. Exhaust air is controlled. Its efficiency can be enhanced by adding intake and exhaust fans. This intake and exhaust machine 4'1
It is clear that by using q, the temperature inside the tank can be controlled within the expected control range even when the internal heat generation is relatively large, and it is possible to mount several times as many ICs as in FIG. 1. Reference numeral 11 is a preset timer which, if the screening time is set, will count the time from the start to K, and at the same time the screening is completed, the heater power of the temperature controller 4 will be set to zero, and as a drive signal to the servo motor control section. When activated, the intake and exhaust holes are fully opened and the temperature inside the tank is rapidly lowered.
このように本発明によるスクリーニング装置によればＩ
Ｃスクリーニング個数を増大し且つ、スクリーニング
完了後の製品出炉作業が迅速に実施可能となり生産性向
上に太゛きな効果が期待されるものである。As described above, according to the screening device according to the present invention, I
It is expected that the number of C-screened items will be increased and that product unloading work can be carried out quickly after the screening is completed, which will have a significant effect on improving productivity.
第１図は従来のスクリーニング装置の恒温槽本体の概略
図であり、第２図は本発明の実施例による恒温槽の概略
図を示すものである。
尚、図に於いて、１・・・・・・槽内攪拌用フ′ｒン、
２・・・・・・耐熱隔離劇、３・・・・・・ヒータブロ
ック、４・・・・・・温度コントローラ、５・・・・・
・熱電対、６・・・・・・攪拌用モータ、７・・・・・
・吸排温度検出熱電対、８・・・・・・→ノ°−ボモー
タ制御部、９・・・・・・サーボモータ、１０・・・・
・・吸気、排気用スライドブタ、１１・・・・・・タイ
マー、１２・・・・・・排気孔である。
Ｗｌし１
芽・２−ソ１FIG. 1 is a schematic diagram of a thermostatic chamber main body of a conventional screening apparatus, and FIG. 2 is a schematic diagram of a thermostatic chamber according to an embodiment of the present invention. In addition, in the figure, 1......tank stirring fan,
2...Heat-resistant isolation device, 3...Heater block, 4...Temperature controller, 5...
・Thermocouple, 6... Stirring motor, 7...
・Suction/exhaust temperature detection thermocouple, 8...→Novo motor control section, 9...Servo motor, 10...
...Intake and exhaust slide lids, 11...Timer, 12...Exhaust holes. Wlshi1 Bud・2-So1
Claims (1)
し槽内温度を所定の値とする手段と、時間計によって強
制空冷を作動する機能とを具備したことを特徴とする半
導体装置のスクリーニング装ｊＭ０Screening of a semiconductor device, characterized in that a thermostatic chamber is provided with an intake/exhaust hole, and is equipped with a means for opening and closing the hole diameter in an analog manner to bring the temperature inside the chamber to a predetermined value, and a function for operating forced air cooling using a time meter. Installation jM0
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57138312A JPS5928347A (en) | 1982-08-09 | 1982-08-09 | Screening device for semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57138312A JPS5928347A (en) | 1982-08-09 | 1982-08-09 | Screening device for semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5928347A true JPS5928347A (en) | 1984-02-15 |
| JPS637628B2 JPS637628B2 (en) | 1988-02-17 |
Family
ID=15218941
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57138312A Granted JPS5928347A (en) | 1982-08-09 | 1982-08-09 | Screening device for semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5928347A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6157875U (en) * | 1984-09-20 | 1986-04-18 | ||
| JPS6341782U (en) * | 1986-09-03 | 1988-03-18 | ||
| CN110824339A (en) * | 2019-10-22 | 2020-02-21 | 苏州盛科科技有限公司 | Constant temperature control device and method for aging screening test of switch chip |
-
1982
- 1982-08-09 JP JP57138312A patent/JPS5928347A/en active Granted
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6157875U (en) * | 1984-09-20 | 1986-04-18 | ||
| JPH0127106Y2 (en) * | 1984-09-20 | 1989-08-14 | ||
| JPS6341782U (en) * | 1986-09-03 | 1988-03-18 | ||
| CN110824339A (en) * | 2019-10-22 | 2020-02-21 | 苏州盛科科技有限公司 | Constant temperature control device and method for aging screening test of switch chip |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS637628B2 (en) | 1988-02-17 |
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