CN115728624A - Laser chip aging unit module and laser chip testing device - Google Patents
Laser chip aging unit module and laser chip testing device Download PDFInfo
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- CN115728624A CN115728624A CN202211475321.8A CN202211475321A CN115728624A CN 115728624 A CN115728624 A CN 115728624A CN 202211475321 A CN202211475321 A CN 202211475321A CN 115728624 A CN115728624 A CN 115728624A
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- 230000032683 aging Effects 0.000 title claims abstract description 131
- 238000012360 testing method Methods 0.000 title claims abstract description 19
- 238000010438 heat treatment Methods 0.000 claims description 23
- 238000001816 cooling Methods 0.000 claims description 16
- 239000000523 sample Substances 0.000 claims description 9
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- 238000013461 design Methods 0.000 abstract description 37
- 238000000926 separation method Methods 0.000 abstract description 3
- 230000017525 heat dissipation Effects 0.000 description 22
- 238000010586 diagram Methods 0.000 description 8
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- 230000002349 favourable effect Effects 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
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- 238000012423 maintenance Methods 0.000 description 2
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Abstract
The application relates to a laser chip aging unit module and a laser chip testing device.A pre-loaded laser chip is loaded on an aging drawer; the back panel connector is respectively and electrically connected with the aging drawer and the chip power supply, the single chip microcomputer control system is respectively and electrically connected with the back panel connector and the chip power supply, the single chip microcomputer control system supplies power to the back panel connector through the control chip power supply to control the back panel connector to supply power to the aging drawer and the laser chip therein, and the state information of the laser chip is acquired through the aging drawer and the back panel connector. Through the bearing design of pre-loading laser chip cooperation drawer type, greatly promoted the efficiency of loading the laser chip of treating ageing treatment, and the design of solitary backplane connector cooperation chip power supply, formed the modularized design, only need when breaking down simply change solitary structure can, single chip microcomputer control system can be integrated to set up also the separation and set up, has more addd the flexibility that realizes whole ageing function.
Description
Technical Field
The application relates to the field of chip testing, in particular to a laser chip aging unit module and a laser chip testing device.
Background
The reliability of the laser chip, also called as a laser chip, is a very critical index, and whether a low-power laser transmitter or a laser communication chip with higher requirements needs to carry out aging and reliability tests of the chip, so that the aging is an important process for screening laser products, and the products with possibly short service life are screened, so that the remaining large number of lasers have satisfactory acceptable reliability.
However, the aging equipment of the traditional laser chip has a complex structure, the number of chips which can be aged by a single machine is small, the time for assembling the chips is spent, the aging efficiency is low, and the maintenance is long due to the lack of a modular design.
Disclosure of Invention
In view of the foregoing, it is desirable to provide a laser chip burn-in unit module and a laser chip testing apparatus.
A laser chip aging unit module comprises an aging drawer, a backplane connector, a chip power supply and a single chip microcomputer control system;
the aging drawer is used for bearing the preloaded laser chip;
the backplane connector and the aging drawer are detachably in conductive splicing through the pin header, and the chip power supply is electrically connected with the backplane connector;
the single chip microcomputer control system is respectively electrically connected with the backplane connector and the chip power supply, and is used for controlling the chip power supply to supply power to the backplane connector so as to control the backplane connector to supply power to the aging drawer and the laser chip, and the aging drawer and the backplane connector acquire the state information of the laser chip.
Above-mentioned ageing unit module of laser chip through the design of bearing of pre-loading laser chip cooperation drawer type, has greatly promoted the efficiency of loading the laser chip of treating ageing treatment, and the design of solitary backplane connector cooperation chip power supply, formed the modularized design, only need when breaking down simply change solitary structure can, single chip microcomputer control system can be integrated to set up and also separate the setting, has more addd the flexibility that realizes whole ageing function.
In one embodiment, the aging drawer comprises a heating base, a product clamp and a cover plate;
the heating base is used for providing a heating environment in a controlled manner;
the product clamp is fixed on the heating base and used for pre-loading the laser chip and enabling the laser chip to be in the temperature rising environment;
the cover plate is covered on the product clamp and is electrically connected with the laser chip through a probe so as to supply power to the laser chip and acquire state information of the laser chip;
the heating base or the cover plate and the backboard connector are detachably in conductive splicing through the pin header.
Further, in one embodiment, the cover plate is in sensing contact with the laser chip through a sensing device, and is used for acquiring temperature information of the laser chip.
In one embodiment, the backplane connector comprises a fixing bracket, a backplane PCB and a connector seat;
the back plate PCB is arranged on the fixed support, and the connector seat is arranged on the back plate PCB and is electrically connected with the back plate PCB;
the aging drawer is detachably connected to the connector seat in an electric conduction and insertion mode through the pin header so as to be electrically connected with the back plate PCB;
the back plate PCB is respectively and electrically connected with the chip power supply and the single chip microcomputer control system.
In one embodiment, the chip power supply comprises a connecting board, a power board and a socket;
the connecting plate is electrically connected with the singlechip control system and the backboard connector through the socket part;
the connecting plate is fixedly installed and electrically connected with the at least two power panels, and each power panel is used for controlling the backplane connector to supply power for at least one laser chip in the aging drawer.
Further, in one embodiment, the chip power supply further includes a heat sink fixed to the connection board.
In one embodiment, the laser chip burn-in unit module further comprises a mounting base;
the backplane connector, the chip power supply and the single chip microcomputer control system are all fixed on the mounting seat;
the aging drawer is detachably arranged on the mounting seat in a sliding mode, and is detachably connected with the backplane connector in a conductive inserting mode through the pin header at a preset position.
In one embodiment, the laser chip aging unit module further comprises an air cooling system fixed on the mounting seat.
In one embodiment, the number of the aging drawers is at least two, each aging drawer corresponds to one backplane connector, and each backplane connector corresponds to at least two chip power supplies;
the mounting seat is provided with the compartments with the same number as the aging drawers so as to correspond to the chip power supply sources corresponding to the backplane connectors.
In one embodiment, the mounting seat is provided with a heat dissipation device at each compartment.
In one embodiment, the laser chip aging unit module further includes at least two integrated adapter plates fixed on the mounting base, each integrated adapter plate is fixedly installed and electrically connected to at least two chip power supplies, each backplane connector is electrically connected to at least two chip power supplies through at least one integrated adapter plate, and a compartment is formed between at least two integrated adapter plates; or,
the laser chip aging unit module further comprises at least one pair of integrated adapter plates fixed on the mounting base, each integrated adapter plate is fixedly installed and electrically connected with at least one chip power supply, each backplane connector is electrically connected with at least two chip power supplies through a pair of integrated adapter plates, and one partition is formed between each pair of integrated adapter plates.
In one embodiment, a laser chip testing apparatus comprises any one of the laser chip burn-in unit modules.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments or the conventional technologies of the present application, the drawings used in the description of the embodiments or the conventional technologies will be briefly introduced below, it is obvious that the drawings in the description below are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an embodiment of a laser chip aging unit module according to the present application.
Fig. 2 is a partial structural schematic diagram of the embodiment shown in fig. 1.
Fig. 3 is an enlarged schematic view of the embodiment shown in fig. 2 at a.
Fig. 4 is a schematic structural diagram of an aging drawer according to an embodiment of the laser chip aging unit module.
Fig. 5 is a partial structural schematic diagram of the embodiment shown in fig. 4.
Fig. 6 is a schematic structural diagram of the heating base of the embodiment shown in fig. 4.
Fig. 7 is a schematic structural view of the product clamp of the embodiment shown in fig. 4.
Fig. 8 is a schematic structural diagram of the cover plate of the embodiment shown in fig. 4.
Fig. 9 is a schematic structural diagram of a chip power supply according to an embodiment of the aging unit module of a laser chip.
Fig. 10 is an enlarged schematic view of the embodiment shown in fig. 9 at B.
Fig. 11 is a schematic structural diagram of a backplane connector according to an embodiment of the aging unit module of the laser chip.
Fig. 12 is an enlarged schematic view of the embodiment shown in fig. 11 at C.
Reference numerals are as follows:
the aging drawer 100, the backplane connector 200, the chip power supply 300, the single chip microcomputer control system 400, the compartment 500, the air cooling system 600, the mounting seat 700 and the integrated adapter plate 800;
Detailed Description
In order to make the aforementioned objects, features and advantages of the present application more comprehensible, embodiments accompanying the present application are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. This application is capable of embodiments in many different forms than those described herein and that modifications may be made by one skilled in the art without departing from the spirit and scope of the application and it is therefore not intended to be limited to the specific embodiments disclosed below.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When a component is referred to as being "connected" to another component, it can be directly connected to the other component or intervening components may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used in the description of the present application are for illustrative purposes only and do not represent the only embodiments.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may mean that the first feature is in direct contact with the second feature, or that the first feature and the second feature are in indirect contact via an intermediate. Also, a first feature "on," "above," and "over" a second feature may be directly on or obliquely above the second feature, or may simply mean that the first feature is at a higher level than the second feature. A first feature "under," "beneath," and "under" a second feature may be directly under or obliquely under the second feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in the description of this application, the term "and/or" includes any and all combinations of one or more of the associated listed items.
The application discloses a laser chip aging unit module and a laser chip testing device, which comprise a part of or the whole structure of the following embodiment; that is, the laser chip burn-in unit module and the laser chip test apparatus include some or all of the following technical features. In one embodiment of the application, the laser chip aging unit module comprises an aging drawer, a backplane connector, a chip power supply and a singlechip control system; the aging drawer is used for bearing the preloaded laser chip; the backplane connector and the aging drawer are detachably in conductive splicing through the pin header, and the chip power supply is electrically connected with the backplane connector; the single chip microcomputer control system is respectively and electrically connected with the backplane connector and the chip power supply, and is used for controlling the chip power supply to supply power to the backplane connector so as to control the backplane connector to supply power to the aging drawer and the laser chip therein, and the aging drawer and the backplane connector acquire the state information of the laser chip. Above-mentioned ageing unit module of laser chip through the design of bearing of pre-loading laser chip cooperation drawer type, has greatly promoted the efficiency of loading the laser chip of treating ageing treatment, and solitary backplane connector cooperation chip power supply's design has formed the modularized design, only need when breaking down simply change solitary structure can, single chip microcomputer control system can integrate to set up and also the separation setting, has more addd the flexibility that realizes whole ageing function.
In one embodiment, a laser chip burn-in unit module is shown in fig. 1, which includes a burn-in drawer 100, a backplane connector 200, a chip power supply 300, and a single chip control system 400; the burn-in drawer 100 is used for carrying the preloaded laser chips; the backplane connector 200 is detachably electrically connected to the burn-in drawer 100 by pins, and the burn-in drawer 100 is shown separated from the backplane connector 200. The backplane connector 200 is used to power up the laser chip carried by the aging drawer 100, and may also be used to detect status information of the laser chip, such as current information, voltage information, and temperature information. The chip power supply 300 is configured to supply power to the laser chip carried by the aging drawer 100 through the backplane connector 200, and the single chip microcomputer control system 400 controls the chip power supply 300 and the backplane connector 200 respectively, or the single chip microcomputer control system 400 only controls the backplane connector 200 and controls the chip power supply 300 through the backplane connector 200. In each embodiment, the number of the aging drawers 100 is at least two, each aging drawer 100 corresponds to one backplane connector 200, and each backplane connector 200 corresponds to at least two chip power supplies 300.
The chip power supply 300 is electrically connected to the backplane connector 200, i.e. the two are electrically connected; the single chip microcomputer control system 400 is electrically connected to the backplane connector 200 and the chip power supply 300, and the single chip microcomputer control system 400 may be electrically connected to the backplane connector 200 only and the chip power supply 300 through the backplane connector 200, or may be electrically connected to the backplane connector 200 and the chip power supply 300 separately. The single chip microcomputer control system 400 is configured to control the chip power supply 300 to supply power to the backplane connector 200, so as to control the backplane connector 200 to supply power to the aging drawer 100 and the laser chips therein, and obtain status information of the laser chips through the aging drawer 100 and the backplane connector 200.
For the problem of how to realize the overall design of the laser chip aging unit module, in this embodiment, the laser chip aging unit module further includes a mounting base 700; the backplane connector 200, the chip power supply 300 and the single chip microcomputer control system 400 are all fixed on the mounting seat 700; the aging drawer 100 is detachably slidably disposed on the mounting base 700, and detachably electrically connected to the backplane connector 200 at a predetermined position by pins, that is, electrically connected to the end position by pins. The burn-in drawer 100 may be completely detached from the backplane connector 200 and removed from the mounting block 700 to carry or replace the laser chip. Due to the design, the laser chip clamping process can be completed in the previous process flow in a pre-loading manner, and a large number of laser chips which are completed in the pre-loading manner only need to be loaded in the aging drawer 100, so that the high-efficiency large-scale aging treatment of the laser chips is facilitated, and more than 400 and even up to 1000 laser chips can be processed at one time. For example, one product clamp 120 in the aging drawer 100 symmetrically clamps two rows of laser chips, each row of laser chips is 32, one product clamp 120 clamps 64 laser chips, and two product clamps 120 are arranged in the aging drawer 100, that is, the aging drawer 100 once bears 128 preloaded laser chips, that is, when four aging drawers 100 are processed simultaneously, the laser chip aging unit module can perform aging processing on 512 laser chips at one time, thereby forming a chip aging system with a unit module total capacity of 512 aging channels; and the 512 laser chips are pre-loaded in other process flows, so that the efficiency of loading the laser chips to be aged is greatly improved, and the rest of embodiments are repeated and are not repeated.
For the problem of how to implement the overall design of the laser chip aging unit module, in other embodiments, the laser chip aging unit module further includes a cover body covering the mounting seat 700, the cover body and the mounting seat 700 integrally form the appearance of a complete laser chip aging unit module, an installation cavity is formed between the cover body and the mounting seat 700, the aging drawer 100, the backplane connector 200, the chip power supply 300 and the single chip microcomputer control system 400 are all disposed in the installation cavity, and the aging drawer 100 can be pulled out from the installation cavity to carry or replace the laser chip. Due to the design, the aging unit module of the whole laser chip can be used together with other test structures or power modules, and due to the design of the aging drawer in the drawing mode, the aging treatment of accurate temperature control can be realized, and the test process is controlled.
As to how to solve the problem of heat dissipation of the laser chip aging unit module, in one embodiment, with reference to fig. 2, the laser chip aging unit module further includes an air cooling system 600 fixed on the mounting base 700, because the fine structural design realizes an intensive laser chip aging processing environment, it is necessary to dissipate heat energy in the mounting base 700 so as not to affect the service life of the laser chip aging unit module and its structural components. In this embodiment, the air cooling system 600 includes, but is not limited to, a fan.
As to how to solve the problem of modular design, in this embodiment, the number of the aging drawers 100 is four, each aging drawer 100 corresponds to one backplane connector 200, and each backplane connector 200 corresponds to a plurality of chip power supplies 300; in one embodiment, the mounting seat 700 is provided with the same number of compartments 500 as the aging drawers 100, so as to correspond to the chip power supplies 300 corresponding to each backplane connector 200. That is, the aging unit module of the laser chip further includes a compartment 500 disposed in the mounting base 700 to form mutually spaced independent areas, further embodying the idea of modular design. Further, the laser chip aging unit module is provided with one air cooling system 600 corresponding to each compartment 500. This is because large scale integration can result in large heat build-up, requiring a heat dissipation system that provides greater efficiency.
As to how to solve the problem of modular design, in this embodiment, the laser chip aging unit module further includes at least two integrated adapter plates 800 fixed on the mounting base 700, each integrated adapter plate 800 is fixedly installed and electrically connected to at least two chip power supplies 300, each backplane connector 200 is electrically connected to at least two chip power supplies 300 through at least one integrated adapter plate 800, and a compartment 500 is formed between at least two integrated adapter plates 800; or, the laser chip aging unit module further includes at least one pair of integrated adapter plates 800 fixed on the mounting base 700, each integrated adapter plate 800 is fixedly installed and electrically connected to at least one chip power supply 300, each backplane connector 200 is electrically connected to at least two chip power supplies 300 through a pair of integrated adapter plates 800, and one partition 500 is formed between each pair of integrated adapter plates 800. Due to the design, a modular design is further formed, and the air cooling system 600 is favorably matched to realize a separate heat dissipation module for the backplane connector 200, so that the laser chip aging unit module forms a unit modular chip aging system and a modular fully-functional chip aging system.
As to how to solve the problem of heat dissipation of the compartments 500, in one embodiment, referring to fig. 3, the mounting base 700 is provided with a heat dissipation device 610 on each of the compartments 500, and the heat dissipation device 610 includes, but is not limited to, an air-cooling heat dissipation system and a water-cooling heat dissipation system, such as a fan. The design is beneficial to matching and realizing the overall structure control of modular design, and further embodies the design purpose of independent control.
As to how to solve the problems of heating control and quick plugging, in one embodiment, as shown in fig. 4 and 5, the aging drawer 100 includes a heating base 110, a product clamp 120 and a cover 130; the heating base 110 is used for providing a heating environment in a controlled manner; the product clamp 120 is fixed on the heating base 110, and the product clamp 120 is used for pre-loading the laser chip and enabling the laser chip to be in the temperature rising environment; the cover plate 130 covers the product clamp 120, and the cover plate 130 is electrically connected with the laser chip through a probe to supply power to the laser chip and acquire state information of the laser chip; the heating base 110 or the cover plate 130 is detachably electrically connected to the backplane connector 200 through pin headers. Further, in one embodiment, the cover plate 130 is also in sensing contact with the laser chip through a sensing device for acquiring temperature information of the laser chip. Further, in one embodiment, the cover plate 130 includes a charging plate, a spring pressing head, a probe, a positioning column, and a pressing bottom plate; the lower base plate abuts against the product holder 120 or each of the laser chips loaded on the product holder 120; the probe is arranged to penetrate through the power adding plate, or the probe is arranged to penetrate through the power adding plate and the lower pressing bottom plate, or the probe is arranged below the power adding plate; the power-on board is fixed on the lower pressing bottom board and is electrically connected with a lead so as to transmit a test signal and a test current; the spring pressure head reaches the reference column is fixed in respectively add under the electroplax, the spring pressure head is used for protecting the laser instrument chip, the reference column is used for fixing a position the laser instrument chip. In other embodiments, the cover plate 130 may also be designed to have other structures, including only the power feeding plate and the probes. Such design, on the one hand be favorable to through the bearing design of pre-loading laser instrument chip cooperation drawer type, greatly promoted the efficiency of loading the laser instrument chip of treating ageing treatment, on the other hand has realized the ageing unit module of simple modular design's laser instrument chip, be favorable to fast, accurately obtain the state information of ageing treatment in-process laser instrument chip, ensure that ageing treatment's process is controlled, on the other hand be favorable to guaranteeing ageing test power on the other hand again, and have advantages such as structure is ingenious, rationally distributed and stable crimping.
As to how to solve the problem of quick assembly of the aging drawer 100 relative to the backplane connector 200, further, in one embodiment, as shown in fig. 4, the heating base 110 is provided with a base body 111, a panel 112 and a force application member 113; the panel 112 is fixed at one end of the base body 111 far away from the backplane connector 200, and the force application member 113 is fixed at one end of the panel 112 far away from the backplane connector 200; the base body 111 is used for providing a controlled heating environment, and the base body 111 has a conductive heat dissipation structure, for example, the base body 111 includes a metal heat transfer structure for heat dissipation; in this embodiment, the product clamp 120 is fixed on the base body 111, the cover plate 130 is detachably mounted on the base body 111, and the product clamp 120 is positioned and clamped between the cover plate 130 and the base body 111. In this embodiment, the force applying member 113 is a handle, and in other embodiments, the force applying member 113 may be a pull groove or a screw. Further, for the embodiment having the mounting seat 700, the base body 111 is detachably slidably disposed on the mounting seat 700, and detachably electrically and conductively connected to the backplane connector 200 through pin headers at a predetermined position, and the panel 112 and the force application member 113 are located outside the mounting seat 700.
For solving the problem of heat accumulation caused by aging a large number of laser chips simultaneously, further, in one embodiment, with reference to fig. 6, a heat dissipation port 114 for ventilation is formed in the panel 112, and for an embodiment having an air cooling system 600, a linear air duct is further formed between the heat dissipation port 114 and the air cooling system 600 to cooperate with the aging drawer 100, the backplane connector 200 corresponding thereto, and the plurality of chip power supplies 300 corresponding to the backplane connector 200 to present a modular air cooling convection system; the design is favorable for realizing the overall structure control of modular design, only an independent structural part needs to be simply replaced when a fault occurs, the single chip microcomputer control system can be arranged in an integrated mode or in a separated mode, and the flexibility of realizing the overall aging function is increased.
With respect to how to solve the problem of quickly loading the product holders 120 so that the aging drawer 100 can efficiently carry the laser chips, further, in one embodiment, as shown in fig. 6, the base body 111 is provided with at least one holder mounting position 115, and in combination with fig. 7, one product holder 120 is detachably fixed on each holder mounting position 115. In this embodiment, the fixture mounting positions 115 are a pair and are arranged side by side. Further, the product clamp 120 is inserted into the guiding post of the clamp mounting position 115, and referring to fig. 8, the product clamp 120 is positioned and clamped between the cover plate 130 and the base body 111. Such a design facilitates quick installation and replacement of the product clamp 120; in practical use, at least three or more laser chips are preloaded on the product clamp 120, the heating base 110 is pulled open, the cover plate 130 is removed, and the product clamp 120 preloaded with the laser chips can be quickly installed and replaced, so that the laser chips can be massively and quickly loaded on the aging drawer 100 for aging treatment, and the efficiency of loading the laser chips to be aged is greatly improved.
In one embodiment of specific application, the aging drawer 100 includes a heating base 110, product holders 120 and a cover plate 130, wherein four product holders 120 are disposed on each aging drawer 100, the heating base 110 is used for applying temperature to the chip product, i.e. the laser chip, to simulate the working state of the chip product at a certain temperature, and the product holders 120 are used for storing and fixing the chip product. The cover plate 130 is provided with probes for applying a specific power to the chip product and monitoring the operation of the chip product in a certain current and voltage state. Each drawer can burn in 128 chip products at the same time, which is the largest unit capacity in the industry at present. The drawer is provided with a push-pull force application structure such as a labor-saving lever, so that the problem of overlarge plugging force of the connector caused by a large number of chips is solved.
In one embodiment, as shown in fig. 9, the chip power supply 300 includes a connection board 310, a power board 320, and a socket 330; the connecting plate 310 is electrically connected to the single chip microcomputer control system 400 and the backplane connector 200 through the socket 330; the connection board 310 is fixedly installed and electrically connected to at least two power boards 320, each power board 320 is used for controlling the backplane connector 200 to supply power to at least one laser chip in the aging drawer 100, that is, one power board 320 may supply power to one, two or more laser chips through one backplane connector 200. Further, in one embodiment, referring to fig. 10, the chip power supply 300 further includes a heat dissipation member 340, and the heat dissipation member 340 is fixed on the connection plate 310. In this embodiment, the heat dissipation member 340 includes at least one row of regularly arranged cylindrical heat dissipation members. In an embodiment of specific application, the chip power supply 300 further includes an ac-dc converter, an MOS transistor, a single chip, and other devices, and the devices are mounted on a power board 320, such as a PCB board, by a chip mounter for packaging, so as to accurately output a required power-on current and a required power-on voltage; the chip power supply 300 is installed at the rear section of each unit module, an independent compartment 500 is used for storing the chip power supply, an air cooling system 600 is designed for cooling, and the power supply compartment is provided with an efficient air cooling channel, so that the power supply can effectively dissipate heat. Such a design is advantageous for quickly assembling the connection board 310 of the chip power supply 300 during installation and maintenance, and for providing a high-efficiency heat dissipation environment for a large number of densely arranged power supply boards 320 in cooperation with the embodiment having the air cooling system 600, the compartment 500 and the heat dissipation device 610.
In one embodiment, as shown in fig. 11, the backplane connector 200 includes a fixing bracket 210, a backplane PCB220, and a connector receptacle 230; backplane PCB220 is also known as a PCB backplane or may simply be a PCB board. Referring to fig. 12, the back plate PCB220 is disposed on the fixing bracket 210, and the connector holder 230 is disposed on the back plate PCB220 and electrically connected to the back plate PCB 220; the aging drawer 100 is detachably and electrically connected to the connector holder 230 through a pin header to be electrically connected to the back PCB 220; the back board PCB220 is electrically connected to the chip power supply 300 and the mcu 400, respectively. For the embodiment with the cover plate 130, the cover plate 130 is detachably electrically connected to the connector holder 230 through pin headers to be electrically connected to the backplane PCB220, and is electrically connected to the chip power supply 300 and the mcu 400 through the backplane PCB 220. Such a design is advantageous for a fast and stable insertion of the aging drawer 100, and for a modular design in which, in the event of a fault, only a simple replacement of individual components is necessary.
In one embodiment of a specific application, backplane connector 200 includes backplane PCB220, connector receptacle 230, and mounting bracket 210, mounting bracket 210 may also be referred to as a connector mounting bracket. The backplane connector 200 is responsible for interconnecting the chip power supply 300 and the aging drawer 100, and has a quick plugging function, which facilitates the access of the drawer and the replacement of products.
In one embodiment for a particular application, the single chip microcomputer control system 400 is mounted in a compartment above the burn-in drawer 100. The single chip microcomputer control system 400 is a central processing system of the whole aging unit, and the single chip microcomputer is responsible for calculating instructions, and monitors and controls the aging system formed by the whole laser chip aging unit module through implanting special control instructions. The single chip microcomputer monitoring and controlling contents comprise: the current and voltage output of each power supply channel is controlled, and relevant information is fed back by an output signal. The specific control mode can be realized by referring to a control system.
In one embodiment, a laser chip testing apparatus includes the laser chip burn-in unit module of any embodiment. In one embodiment, the laser chip testing device comprises a power supply module, and the power supply module is electrically connected with the chip power supply 300 of the laser chip aging unit module including the aging drawer 100 and/or the single chip microcomputer control system 400 respectively; the laser chip aging unit module comprises an aging drawer 100, a backplane connector 200, a chip power supply 300 and a single chip microcomputer control system 400; the burn-in drawer 100 is used to carry the preloaded laser chips; the backplane connector 200 and the aging drawer 100 are detachably connected in a conductive manner through pins, and the chip power supply 300 is electrically connected with the backplane connector 200; the single chip microcomputer control system 400 is electrically connected with the backplane connector 200 and the chip power supply 300 respectively, the single chip microcomputer control system 400 is used for controlling the chip power supply 300 to supply power to the backplane connector 200 so as to control the backplane connector 200 to supply power to the aging drawer 100 and the laser chip therein, and the state information of the laser chip is acquired through the aging drawer 100 and the backplane connector 200. Such design, through the bearing design of pre-loading laser instrument chip cooperation drawer type, greatly promoted the efficiency of loading the laser instrument chip of treating ageing treatment, and solitary backplane connector cooperation chip power supply's design has formed the modularized design, when breaking down only need simply change solitary structure can, single chip microcomputer control system can integrated the setting also the separation setting, more increased the flexibility that realizes whole ageing function.
In addition, other embodiments of the present application further include a laser chip burn-in unit module and a laser chip testing apparatus, which are formed by combining technical features of the above embodiments.
All possible combinations of the technical features of the above embodiments may not be described for the sake of brevity, but should be considered as within the scope of the present disclosure as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the claims. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, and these are all within the scope of protection of the present application. Therefore, the protection scope of the present application shall be subject to the appended claims.
Claims (10)
1. A laser chip aging unit module is characterized by comprising an aging drawer (100), a backplane connector (200), a chip power supply (300) and a single chip microcomputer control system (400);
the aging drawer (100) is used for carrying the preloaded laser chip;
the backplane connector (200) and the aging drawer (100) are detachably connected in a conductive manner through pins, and the chip power supply (300) is electrically connected with the backplane connector (200);
singlechip control system (400) electricity respectively connect backplate connector (200) and chip power supply (300), singlechip control system (400) are used for through control chip power supply (300) do backplate connector (200) power supply, in order to control backplate connector (200) do ageing drawer (100) and wherein the laser instrument chip power supply, and pass through ageing drawer (100) and backplate connector (200) acquire the status information of laser instrument chip.
2. The laser chip burn-in unit module of claim 1, wherein the burn-in drawer (100) comprises a heating base (110), a product clamp (120), and a cover plate (130);
the heating base (110) is used for providing a heating environment in a controlled manner;
the product clamp (120) is fixed on the heating base (110), and the product clamp (120) is used for pre-loading the laser chip and enabling the laser chip to be in the temperature-rising environment;
the cover plate (130) is covered on the product clamp (120), and the cover plate (130) is electrically connected with the laser chip through a probe to supply power to the laser chip and acquire the state information of the laser chip;
the heating base (110) or the cover plate (130) is detachably connected with the backplane connector (200) in an electric conduction mode through the pin headers.
3. The laser chip burn-in unit module according to claim 1, wherein the backplane connector (200) comprises a fixing bracket (210), a backplane PCB (220), and a connector holder (230);
the back plate PCB (220) is arranged on the fixing bracket (210), and the connector seat (230) is arranged on the back plate PCB (220) and is electrically connected with the back plate PCB (220);
the aging drawer (100) is detachably and electrically connected to the connector seat (230) through a pin header to be electrically connected with the back PCB (220);
the backboard PCB (220) is electrically connected with the chip power supply (300) and the single chip microcomputer control system (400) respectively.
4. The module of claim 1, wherein the chip power supply (300) comprises a connection board (310), a power board (320) and an extension socket (330);
the connecting plate (310) is electrically connected with the single chip microcomputer control system (400) and the backplane connector (200) through the socket part (330);
the connecting board (310) is fixedly installed and electrically connected with at least two power supply boards (320), and each power supply board (320) is used for controlling the backplane connector (200) to supply power for at least one laser chip in the aging drawer (100).
5. The laser chip burn-in unit module according to any of claims 1 to 4, further comprising a mounting base (700);
the backplane connector (200), the chip power supply (300) and the singlechip control system (400) are all fixed on the mounting seat (700);
the aging drawer (100) is detachably arranged on the mounting base (700) in a sliding mode, and is detachably connected with the backplane connector (200) in a conductive inserting mode through the pin header at a preset position.
6. The module of claim 5, further comprising an air cooling system (600) fixed on the mounting base (700).
7. The laser chip burn-in unit module according to claim 5, wherein the number of the burn-in drawers (100) is at least two, each burn-in drawer (100) corresponds to one backplane connector (200), and each backplane connector (200) corresponds to at least two chip power supplies (300);
the installation seat (700) is provided with the compartments (500) with the same number as the aging drawers (100) so as to correspond to the chip power supply sources (300) corresponding to each backplane connector (200).
8. The module of claim 7, wherein the mounting base (700) is provided with a heat sink (610) at each of the compartments (500).
9. The laser chip burn-in unit module according to claim 7, further comprising at least two integrated adapter plates (800) fixed on said mounting base (700), each of said integrated adapter plates (800) being fixedly mounted on and electrically connected to at least two of said chip power supplies (300), each of said backplane connectors (200) being electrically connected to at least two of said chip power supplies (300) through at least one of said integrated adapter plates (800), and at least two of said integrated adapter plates (800) forming one of said compartments (500) therebetween; or,
the laser chip aging unit module further comprises at least one pair of integrated adapter plates (800) fixed on the mounting base (700), each integrated adapter plate (800) is fixedly installed and electrically connected with at least one chip power supply (300), each backplane connector (200) is electrically connected with at least two chip power supplies (300) through a pair of integrated adapter plates (800), and a compartment (500) is formed between each pair of integrated adapter plates (800).
10. A laser chip testing apparatus comprising the laser chip burn-in unit module of any one of claims 1 to 9.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211475321.8A CN115728624A (en) | 2022-11-23 | 2022-11-23 | Laser chip aging unit module and laser chip testing device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202211475321.8A CN115728624A (en) | 2022-11-23 | 2022-11-23 | Laser chip aging unit module and laser chip testing device |
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| CN115728624A true CN115728624A (en) | 2023-03-03 |
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| CN202211475321.8A Pending CN115728624A (en) | 2022-11-23 | 2022-11-23 | Laser chip aging unit module and laser chip testing device |
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Application publication date: 20230303 |