CN209167331U - Manipulator and chip test system - Google Patents
Manipulator and chip test system Download PDFInfo
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- CN209167331U CN209167331U CN201821629828.3U CN201821629828U CN209167331U CN 209167331 U CN209167331 U CN 209167331U CN 201821629828 U CN201821629828 U CN 201821629828U CN 209167331 U CN209167331 U CN 209167331U
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Abstract
The utility model proposes a kind of manipulators, chip test system, are related to semiconductor fabrication techniques field, the chip test system includes: testing base, for testing chip；Sensor is set to the top of the testing base, for detecting the positional relationship of the testing base Yu the chip；Manipulator, positioned at the top of the testing base, for the chip being placed and being moved away from the testing base, and the manipulator is not located in the investigative range of the sensor；Warning device, the warning device connect the sensor, and the chip alert process corresponding with the progress of the positional relationship of the testing base detected according to sensor.The utility model by the way that sensor is arranged in the top of testing base, can in chip testing process detection chip and testing base positional relationship, reduce the quality risk that occurs and yield loss in test process.
Description
Technical field
The utility model relates to semiconductor fabrication techniques field more particularly to a kind of manipulators and chip test system.
Background technique
In the test process after the encapsulation of chip back segment, as shown in Figure 1, the particle chip 130 after encapsulation is by manipulator 121
Suction nozzle 122 draw after be put into test bench 110, realize and the connection of test machine and test.After the completion of test, test machine is sent
Instruction siphons away manipulator chip again.
Chip is drawn and discharged to suction nozzle according to the variation of vacuum tube air pressure connected to it.There is little damage in suction nozzle,
Perhaps have on chip the foul air pressure that perhaps chip is stuck on test bench or suction nozzle provides it is too low when, it may appear that chip is not
The case where capable of being drawn, causes if fruit chip cannot be drawn as shown in Fig. 2, can suck again chip when testing next time
Stack retest.
It falls after being drawn such as fruit chip in the air, as shown in figure 3, will lead to the offset of chip position skew, surveys again
Suction nozzle will appear crushing chip after examination, or even cause the case where damaging to test bench.It in test chamber is close in the high and low temperature test
Envelope state, maintenance personal are difficult to observe the situation in test bench.
In this case, the wafer damage rate that most chip companies can be arranged in test process to testing vendor limits,
But it cannot tackle the problem at its root in this way.
Future, the chip manufacturing chamber of commerce increasingly focus on the yield and quality of non-chip factor, huge for chip manufacturing scale
Extremely low yield loss will also result in biggish cost waste for big company.
Therefore, how the chip position occurred in chip testing process is found in time improper situation is to need to solve at present
Certainly the problem of.
It should be noted that the information in above-mentioned background technology part utility model is only used for reinforcing to the utility model
The understanding of background, therefore may include the information not constituted to the prior art known to persons of ordinary skill in the art.
Utility model content
The purpose of this utility model is to provide a kind of manipulators, chip test system, overcome at least to a certain extent
The problem of cannot finding the improper situation of the chip position occurred in chip testing process in time.
Other characteristics and advantages of the utility model will be apparent from by the following detailed description, or partially by this
The practice of utility model and acquistion.
It is according to the present utility model in a first aspect, providing a kind of chip test system, comprising: testing base, for testing
Chip；Sensor is set to the top of the testing base, and the position for detecting the testing base and the chip is closed
System；Manipulator, positioned at the top of the testing base, for the chip being placed and being moved away from the testing base, and institute
Manipulator is stated not to be located in the investigative range of the sensor；Warning device, the warning device connect the sensor, and root
The chip alert process corresponding with the progress of the positional relationship of the testing base detected according to sensor.
In above scheme, the sensor is fixedly connected with the manipulator.
In above scheme, the sensor is fixedly installed on the testing base vertical direction.
It further include test chamber in above scheme；Wherein, the testing base, the manipulator and sensor setting
Inside the test chamber, the sensor is fixed at the top of the test chamber.
In above scheme, the sensor includes distance measuring sensor.
In above scheme, the distance measuring sensor includes laser displacement sensor.
Second aspect according to the present utility model provides a kind of manipulator for grab chips, comprising: manipulator sheet
Body；The sensor being fixedly connected with the manipulator ontology, the sensor are used to detect the test bottom for testing chip
The positional relationship of seat and the chip, wherein the manipulator ontology is not located in the investigative range of the sensor.
In above scheme, the sensor includes distance measuring sensor.
In above scheme, the distance measuring sensor includes laser displacement sensor.
In above scheme, the manipulator further includes warning device, the warning device connection sensor, and according to
The chip alert process corresponding with the progress of the positional relationship of the testing base of sensor detection.
Technical solution provided by the embodiment of the utility model can include the following benefits:
In technical solution provided by a kind of exemplary embodiment of the utility model, by being arranged in the top of testing base
Sensor, can in chip testing process detection chip and testing base positional relationship, reduce and occur in test process
Quality risk and yield loss.
It should be understood that above general description and following detailed description be only it is exemplary and explanatory, not
The utility model can be limited.
Detailed description of the invention
The drawings herein are incorporated into the specification and forms part of this specification, and shows and meets the utility model
Embodiment, and be used to explain the principles of the present invention together with specification.It should be evident that the accompanying drawings in the following description is only
It is some embodiments of the utility model, for those of ordinary skill in the art, in the premise not made the creative labor
Under, it is also possible to obtain other drawings based on these drawings.
Fig. 1 diagrammatically illustrates chip in the prior art and is normally placed on the schematic diagram in testing base；
Fig. 2 diagrammatically illustrates chip in the prior art and is overlapped the schematic diagram being placed in testing base；
Fig. 3 diagrammatically illustrates chip skew in the prior art and is placed on the schematic diagram in testing base；
Fig. 4 shows the test schematic diagram of the chip test system of embodiment according to the present utility model.
Specific embodiment
Illustrative embodiments are described more fully with reference to the drawings.However, illustrative embodiments can be with more
Kind form is implemented, and is not understood as limited to example set forth herein；On the contrary, thesing embodiments are provided so that the utility model
Will be more full and complete, and the design of illustrative embodiments is comprehensively communicated to those skilled in the art.Phase in figure
Same appended drawing reference indicates same or similar structure, thus the detailed description that will omit them.
Although the term of relativity, such as "upper" "lower" is used to describe a component of icon for another in this specification
The relativeness of one component, but these terms are in this manual merely for convenient, for example, with reference to the accompanying drawings described in show
The direction of example.It is appreciated that, if making it turn upside down the module overturning of icon, the component described in "upper" will
As the component in "lower".Term of other relativities, such as "high" " low " "top" "bottom" " left side " " right side " etc. are also made to have similar
Meaning.When certain structure is at other structures "upper", it is possible to refer to that certain structural integrity is formed in other structures, or refer to certain structure
It is " direct " to be arranged in other structures, or refer to that certain structure is arranged in other structures by the way that another structure is " indirect ".
Term "one", " one ", " described " to indicate there are one or more elements/component part/etc.；Term " packet
Include " and " having " to indicate the open meaning being included and refer to that the element/component part/in addition to listing waits it
Outside also may be present other element/component part/etc..
Fig. 4 diagrammatically illustrates the test schematic diagram of the chip test system of the illustrative embodiments of the disclosure.Such as Fig. 4
Shown, the chip test system that the exemplary embodiment of the disclosure provides includes: testing base 110, for testing chip 130；
Sensor 140 is set to the top of testing base 110, the positional relationship for probing test pedestal 110 and chip 130；It is mechanical
Hand 121, positioned at the top of testing base 110, for chip 130 being placed and being moved away from testing base 110, and manipulator 121
Not in the investigative range of sensor 140；Warning device (not shown), warning device connection sensor 140, and according to
The alert process corresponding with the progress of the positional relationship of testing base 110 of chip 130 that sensor 140 detects.
Here, the top of testing base 110 is arranged in sensor 140, passes through 140 detection chip 130 of sensor and test
The positional relationship of pedestal 110, it can judge whether there are position improperly chip 130 in testing base 110.Sensor 140 can
Think distance measuring sensor.As shown in figure 4, after chip 130 is displaced from testing base 110, measured value that distance measuring sensor measures
For distance i.e. the first height value H1 of distance measuring sensor to the bottom of testing base 110.It is in chip 130 and is displaced from test bottom
It is not displaced from during seat 110 or testing base 110, the measured value that distance measuring sensor measures is the distance measuring sensor
The distance of the nearest object of distance ranging sensor, the distance are different from the first height value H1 below to distance measuring sensor.For example,
As shown in figure 4, chip 130 is not displaced from testing base 110 when measured value is the second height value H2.Using the principle, pass through
Distance measuring sensor, which carries out ranging, can judge the positional relationship of chip 130 Yu testing base 110.
As it can be seen that can intuitively reflect chip 130 and test in chip testing process by the measurement data of range sensor
The positional relationship of pedestal 110, and then may determine that whether chip 130 is successfully moved away from, reduce the quality occurred in test process
Risk and yield loss.
In the exemplary embodiment of the disclosure, the time of measuring of distance measuring sensor is in 1 millisecond, several to the chip testing time
Family does not influence, and practicability is stronger.In addition, distance measuring sensor also has size small, it is easily installed, needs supply voltage lower,
Lesser advantage is loaded, is applied to influence less original system structure in original chip testing scheme, but increase and be
The accuracy rate of system.
In disclosure exemplary embodiment, distance measuring sensor 140 can be fixedly connected with manipulator 121.In manipulator
When being moved to setting position, the lowermost distance of distance measuring sensor distance test pedestal 110 is fixed height value.In this way,
Compare the measured value of distance measuring sensor and the height value of the setting, it can judge that the position of chip 130 and testing base 110 is closed
System.
In an exemplary embodiment of the disclosure, chip test system further includes test chamber；Wherein, testing base 110, machine
Tool hand and distance measuring sensor are arranged inside test chamber, and distance measuring sensor is fixed at the top of test chamber, specifically, distance measuring sensor
Positioned at 110 vertical direction of testing base.
This is the case where a kind of distance measuring sensor is not fixedly connected with manipulator.At this moment, distance measuring sensor distance test bottom
The lowermost distance of seat 110 is also fixed.Thus again may be by distance measuring sensor carry out ranging judge chip 130 and
The positional relationship of testing base 110.
In an exemplary embodiment of the disclosure, distance measuring sensor can be laser displacement sensor.Specifically, can make
With the positive and negative emitting sensor of CD33-L, which provides RS422 communication, and can the convenient communication realized with Mitsubishi PLC.
As shown in figure 3, testing base 110 is including horizontal part 111 and positioned at the upward relative to horizontal part of horizontal part edge
The edge part 112 of protrusion, horizontal part 111 and edge part 112 collectively form the accommodating chamber for placing chip to be tested.Such as figure
Shown in 3, when chip skew is placed, one end of chip is located on edge part 112.
Manipulator 121 includes suction nozzle 122 and the mobile mechanism's (not shown) for controlling manipulator movement, wherein suction nozzle
Chip is grabbed and discharged by the variation of the vacuum tube (not shown) air pressure of connection.
Chip test system provided by the utility model exemplary embodiment is passed by being arranged in the top of testing base
The positional relationship of chip and testing base in sensor detection chip test process, can reduce the quality wind occurred in test process
Danger and yield loss.
The exemplary embodiment of the disclosure also provides a kind of manipulator for grab chips, including manipulator ontology and with
The sensor that manipulator ontology is fixedly connected, the sensor are used to detect the position of testing base and chip for testing chip
Relationship, wherein manipulator ontology is not located in the investigative range of sensor.
The sensor can be distance measuring sensor, and the manipulator which provides includes distance measuring sensor, thus machine
Tool hand can be detected by distance measuring sensor for testing the testing base 110 of chip and the positional relationship of chip 130, pass through survey
Whether the measurement data away from sensor may determine that in testing base position improperly chip.
Manipulator further includes the mobile mechanism of suction nozzle and control manipulator movement；Wherein, the vacuum tube that suction nozzle passes through connection
The variation of air pressure grabs and discharges chip.
Distance measuring sensor can be laser displacement sensor, and however, it is not limited to this.
In addition, manipulator further includes warning device, warning device connects sensor, and according to the chip of sensor detection with
The positional relationship of testing base carries out corresponding alert process.
Manipulator provided by the utility model exemplary embodiment, by being fixedly connected with sensor on manipulator ontology,
The quality risk occurred in test process can be reduced with the positional relationship in detection chip test process between chip and testing base
And yield loss.
When testing chip, chip is put into testing base and tests by manipulator.It is mechanical after the completion of test
Hand carries out the movement for being moved away from testing base to chip, and triggering is located at the sensor above testing base simultaneously.Later, sensor
The positional relationship of detection chip and testing base.Sensor connects warning device, the chip that warning device is detected according to sensor
Alert process corresponding with the progress of the positional relationship of testing base.Wherein: the positional relationship of chip and testing base is by sensor
The distance values detected indicate, when distance values are equal to the first numerical value of setting, indicate that chip is completely removed from test bottom
Seat；When distance values are equal to the second value of setting, indicate chip and testing base still in test position；Work as distance values
Less than setting the first numerical value and when being not equal to second value, indicate that chip and testing base are in and be partially removed from state；First
Distance values of the numerical value between sensor and testing base；Second value is sensor and carries out proper testing in testing base
When chip chamber distance values.
Here, the first numerical value of setting is the first height value H1 as shown in Figure 4, and the second value of setting is as schemed
Second height value H2 shown in 4.Sensor 140 can be distance measuring sensor.
The top of testing base is arranged in sensor 140, passes through 140 detection chip 130 of sensor and testing base 110
Positional relationship, it can judge whether there is position improperly chip in testing base.As shown in figure 4, chip 130 is displaced from test
After pedestal 110, the measured value that distance measuring sensor measures is first height value H1 of the distance measuring sensor to the bottom of testing base.
And be not displaced from during chip is in and is displaced from testing base or testing base, distance measuring sensor measurement it is above-mentioned away from
From measured value it is just different from the first height value H1.For example, as shown in figure 4, being distance measuring sensor to testing base in measured value
On chip upper surface distance i.e. the second height value H2 when, can be confirmed that chip is not displaced from testing base；In measurement numerical value
When less than the first height value H1 and being not equal to the second height value H2, indicates that chip and testing base are in and be partially removed from state.It adopts
With the principle, the positional relationship of chip and testing base can be judged by carrying out ranging by distance measuring sensor.
As it can be seen that can intuitively reflect the position of chip and testing base in chip testing process by the measurement data of sensor
Relationship is set, and then may determine that whether chip is successfully moved away from, reduces the quality risk occurred in test process and yield loss.
Further, within the period of setting, when distance values are equal to the second value of setting, warning device is carried out not
Remove alert process；Within the period of setting, when distance values are less than the first numerical value of setting and are not equal to second value, report
Alarm device carries out heeling condition alarm.
Specifically, when the measured value of distance measuring sensor is second value within the period set, detect chip not by
It is moved away from testing base, at this point, chip is lain against in testing base, if taken no action to, in fact it could happen that chip overlapping, chip quilt
The case where retest, therefore, warning device, are not removed alert process.
Within the period of setting, the measured value of distance measuring sensor is less than the first numerical value of setting and is not equal to second value
When, illustrating to be detained in testing base has the chip not being displaced from, but the chip is not at laid-flat status, but in skew
State.If taken no action to, in fact it could happen that the case where chip is damaged by pressure by suction nozzle, therefore, warning device carry out heeling condition report
Alert processing.
Therefore, whether using above technical scheme, carrying out ranging by distance measuring sensor can judge chip by success
When being moved away from, and may determine that the chip in testing base is not moved away from successfully, the chip being detained in testing base, which is in, to be laid flat
State or skew state.
Warning device can remind staff to have abnormal conditions appearance, so that staff is checked whether out in time
Situations such as existing suction nozzle damage or insufficient air pressure.Warning device can also notify manipulator is taken away to lead to abnormal delay chip, with
Continue test job.
In technical solution provided by a kind of exemplary embodiment of the utility model, by being arranged in the top of testing base
Sensor, can in chip testing process detection chip and testing base positional relationship, reduce and occur in test process
Quality risk and yield loss.
Those skilled in the art are considering specification and after practicing utility model disclosed herein, will readily occur to practical
Novel other embodiments.This application is intended to cover any variations, uses, or adaptations of the utility model, these
Variations, uses, or adaptations follow the general principle of the utility model and including undocumented skills of the utility model
Common knowledge or conventional techniques in art field.The description and examples are only to be considered as illustrative, the utility model
True scope and spirit are indicated by the following claims.
It should be understood that the utility model is not limited to the accurate knot for being described above and being shown in the accompanying drawings
Structure, and various modifications and changes may be made without departing from the scope thereof.The scope of the utility model is only wanted by appended right
It asks to limit.
Claims (10)
1. a kind of chip test system characterized by comprising
Testing base, for testing chip；
Sensor is set to the top of the testing base, for detecting the positional relationship of the testing base Yu the chip；
Manipulator, positioned at the top of the testing base, for the chip being placed and being moved away from the testing base, and institute
Manipulator is stated not to be located in the investigative range of the sensor；
Warning device, the warning device connect the sensor, and according to the chip of sensor detection and the test
The positional relationship of pedestal carries out corresponding alert process.
2. system according to claim 1, which is characterized in that the sensor is fixedly connected with the manipulator.
3. system according to claim 1, which is characterized in that it is vertical that the sensor is fixedly installed on the testing base
Top.
4. system according to claim 3, which is characterized in that further include test chamber；
Wherein, the testing base, the manipulator and the sensor are arranged inside the test chamber, and the sensor is solid
At the top of the test chamber.
5. system as claimed in any of claims 1 to 4, which is characterized in that the sensor includes ranging sensing
Device.
6. system according to claim 5, which is characterized in that the distance measuring sensor includes laser displacement sensor.
7. a kind of manipulator for grab chips characterized by comprising
Manipulator ontology；With
The sensor being fixedly connected with the manipulator ontology, the sensor are used to detect the testing base for testing chip
With the positional relationship of the chip；
Wherein, the manipulator ontology is not located in the investigative range of the sensor.
8. manipulator according to claim 7, which is characterized in that the sensor includes distance measuring sensor.
9. manipulator according to claim 8, which is characterized in that the distance measuring sensor includes laser displacement sensor.
10. manipulator according to any one of claims 7 to 9, which is characterized in that the manipulator further includes alarm dress
It sets, the warning device connects the sensor, and according to the position of the chip of sensor detection and the testing base
Relationship carries out corresponding alert process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821629828.3U CN209167331U (en) | 2018-10-08 | 2018-10-08 | Manipulator and chip test system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821629828.3U CN209167331U (en) | 2018-10-08 | 2018-10-08 | Manipulator and chip test system |
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| Publication Number | Publication Date |
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| CN209167331U true CN209167331U (en) | 2019-07-26 |
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| CN201821629828.3U Active CN209167331U (en) | 2018-10-08 | 2018-10-08 | Manipulator and chip test system |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113281634A (en) * | 2021-05-26 | 2021-08-20 | 普冉半导体(上海)股份有限公司 | Chip testing equipment and chip testing process stacking or blocking inspection method thereof |
| WO2022160645A1 (en) * | 2021-01-26 | 2022-08-04 | 长鑫存储技术有限公司 | Mechanical arm and assembly thereof, testing system and method, storage medium and electronic apparatus |
-
2018
- 2018-10-08 CN CN201821629828.3U patent/CN209167331U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022160645A1 (en) * | 2021-01-26 | 2022-08-04 | 长鑫存储技术有限公司 | Mechanical arm and assembly thereof, testing system and method, storage medium and electronic apparatus |
| CN113281634A (en) * | 2021-05-26 | 2021-08-20 | 普冉半导体(上海)股份有限公司 | Chip testing equipment and chip testing process stacking or blocking inspection method thereof |
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