TWM578383U - Microscope collision avoidance architecture - Google Patents
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Abstract
Description
本創作係有關於一種防撞架構,詳而言之,係關於一種用於顯微鏡的防撞架構。 This creation is about an anti-collision architecture, in detail, about an anti-collision architecture for a microscope.
按,顯微鏡(microscope)的主要功能是放大影像及解析影像,可將微小不可觀察或難以觀察的待觀察物的物像放大,以供肉眼或其他成像儀器顯微觀察而進行解析。顯微鏡操作時,需要調整物鏡與待觀察物的相對距離,上下調整焦距而使目鏡中待觀察物的物像清析。然,物鏡與待觀察物相對距離的調整過程中,經常會因人為的誤操作而發生物鏡與待觀察物的碰撞,使得物鏡或待觀察物發生毀損而造成損失。 Press, the main function of the microscope is to enlarge the image and analyze the image, and the object image of the object to be observed which is not observable or difficult to observe can be enlarged for microscopic observation by the naked eye or other imaging instruments. When the microscope is operated, it is necessary to adjust the relative distance between the objective lens and the object to be observed, and adjust the focal length up and down to clear the object image of the object to be observed in the eyepiece. However, during the adjustment of the relative distance between the objective lens and the object to be observed, collisions between the objective lens and the object to be observed often occur due to human error, causing damage to the objective lens or the object to be observed.
因此,如何避免物鏡與待觀察物之間發生碰撞,而確保顯微鏡的正常操作,目前已經成為現在業界亟欲挑戰克服的技術議題。 Therefore, how to avoid collision between the objective lens and the object to be observed, and to ensure the normal operation of the microscope, has become a technical issue that the industry is currently trying to overcome.
鑒於上述先前技術之缺點,本創作係提供一種用於顯微鏡的顯微鏡防撞架構,顯微鏡可將待觀察物的物像放大而供顯微觀察待觀察物,顯微鏡具有在取像區域內擷取待觀察物物像的物鏡。本創作的顯微鏡防撞架構係包 括:測距儀、操作模組與處理模組。測距儀係設置於取像區域的外圍,係於取像區域內的測量點測量物鏡與待觀察物的距離,而測量點與該物鏡係隔開有一安全距離。操作模組係可執行上升操作或下降操作,以令物鏡與測距儀同步進行升降移動,俾調整物鏡與待觀察物的距離,使待觀察物進入取像區域讓待觀察物的物像清楚而供顯微觀察。處理模組係連接該測距儀,以接收測距儀的測量結果,並據以判斷物鏡與待觀察物的距離是否小於安全距離,當操作模組執行下降操作,且物鏡與待觀察物的距離小於安全距離時,處理模組係連接該測距儀,以令操作模組停止執行下降操作,俾防止物鏡與待觀察物因過於接近而發生碰撞。 In view of the above-mentioned shortcomings of the prior art, the present invention provides a microscope anti-collision structure for a microscope, which can magnify an object image of an object to be observed for microscopic observation of an object to be observed, and the microscope has a view in the image capturing area. Observe the objective lens of the object image. Microscope anti-collision architecture package Including: range finder, operation module and processing module. The range finder is disposed on the periphery of the image capturing area, and the measuring point in the image capturing area measures the distance between the objective lens and the object to be observed, and the measuring point is separated from the objective lens by a safe distance. The operation module can perform the ascending operation or the descending operation to make the objective lens and the range finder move up and down in synchronization, and adjust the distance between the objective lens and the object to be observed, so that the object to be observed enters the image capturing area to make the object image of the object to be observed clear. For microscopic observation. The processing module is connected to the range finder to receive the measurement result of the range finder, and according to whether the distance between the objective lens and the object to be observed is less than a safety distance, when the operation module performs the lowering operation, and the objective lens and the object to be observed When the distance is less than the safety distance, the processing module is connected to the range finder to stop the operation module from performing the lowering operation, and to prevent the objective lens from colliding with the object to be observed because it is too close.
可選擇性地,於本創作的一實施例中,物鏡的焦距係大於或等於安全距離。 Alternatively, in an embodiment of the present creation, the focal length of the objective lens is greater than or equal to the safety distance.
可選擇性地,於本創作的一實施例中,測距儀係為雷射測距儀或紅外線測距儀;測距儀係傾斜設置於該取像區域的外圍側邊,而測距儀的傾斜角度係與安全距離相關。 Optionally, in an embodiment of the present invention, the range finder is a laser range finder or an infrared range finder; the range finder is obliquely disposed on a peripheral side of the image capturing area, and the range finder The angle of inclination is related to the safety distance.
可選擇性地,於本創作的一實施例中,還包括升降機構,升降機構係用於升降物鏡,測距儀係設置於升降機構,俾能跟隨物鏡同步地進行升降移動;操作模組係藉由升降機構,使物鏡與測距儀同步進行升降移動。 Optionally, in an embodiment of the present invention, the lifting mechanism is further configured to be used for lifting and lowering the objective lens, and the distance measuring device is disposed on the lifting mechanism, and the lifting device can be moved up and down in synchronization with the objective lens; By means of the lifting mechanism, the objective lens and the range finder are moved up and down in synchronization.
可選擇性地,於本創作的一實施例中,還包括載台、X軸移動機構與Y軸移動機構,載台係設置於物鏡的下方用於承載待觀察物,X、Y軸移動機構係令載台分別在X軸與Y軸上移動,使待觀察物進入取像區域。 Optionally, in an embodiment of the present invention, the platform further includes a stage, an X-axis moving mechanism and a Y-axis moving mechanism. The stage is disposed under the objective lens for carrying the object to be observed, and the X and Y axis moving mechanisms. The stage is moved on the X-axis and the Y-axis, respectively, so that the object to be observed enters the image capturing area.
可選擇性地,於本創作的一實施例中,還包括蜂鳴器,該蜂鳴器係設置於該顯微鏡,當物鏡與待觀察物的距離小於安全距離時,處理模組還令蜂鳴器鳴叫以藉由聲響提示物鏡與待觀察物彼此接近而可能發生碰撞。 Optionally, in an embodiment of the present invention, a buzzer is further disposed on the microscope, and when the distance between the objective lens and the object to be observed is less than a safe distance, the processing module also makes a buzzer The device screams to cause collision by the sound indicating that the objective lens and the object to be observed are close to each other.
可選擇性地,於本創作的一實施例中,操作模組係由電力或人力提供動能。 Alternatively, in an embodiment of the present creation, the operating module provides kinetic energy from electricity or manpower.
可選擇性地,於本創作的一實施例中,待觀察物係為測試晶圓上各晶片電性功能是否正常的探針卡。 Alternatively, in an embodiment of the present invention, the object to be observed is a probe card that tests whether the electrical function of each wafer on the wafer is normal.
可選擇性地,於本創作的一實施例中,當物鏡與待觀察物的距離小於安全距離時,處理模組係令操作模組執行上升操作,使物鏡上升而朝背離待觀察物的方向移動,俾防止物鏡與待觀察物因過於接近而發生碰撞。 Optionally, in an embodiment of the present invention, when the distance between the objective lens and the object to be observed is less than a safe distance, the processing module causes the operation module to perform a rising operation to raise the objective lens away from the object to be observed. Move, 俾 prevent the objective lens from colliding with the object to be observed because it is too close.
可選擇性地,於本創作的一實施例中,物鏡與測量點係可連成第一直線,測距儀與測量點係可連成第二直線,第一、第二直線係相交且交角小於九十度。 Optionally, in an embodiment of the present invention, the objective lens and the measuring point system may be connected to a first straight line, and the distance measuring instrument and the measuring point system may be connected to a second straight line, and the first and second straight lines intersect and the angle of intersection is less than Ninety degrees.
相較於先前技術,本創作的顯微鏡防撞架構,可於顯微鏡操作而調整物鏡與待觀察物(例如、探針卡)的距離時,判斷物鏡與待觀察物的距離是否過於接近,而於物鏡過於接近待觀察物時主動停止物鏡的下降,從而防止物鏡與待觀察物因過於接近而彼此發生碰撞,以降低物鏡或待觀察物發生碰撞毀損而造成損失的機會,因此,本創作的防撞顯微鏡應用於觀察探針卡時,可有效避免物鏡與造價昂貴的探針卡因過於接近而發生碰撞,使得物鏡或探針卡發生毀損而蒙受重大損失。 Compared with the prior art, the microscope anti-collision architecture of the present invention can determine whether the distance between the objective lens and the object to be observed is too close when the distance between the objective lens and the object to be observed (for example, the probe card) is adjusted by the microscope operation. When the objective lens is too close to the object to be observed, the objective lens is actively stopped to prevent the objective lens from colliding with each other due to the proximity of the object to be observed, so as to reduce the chance of loss of the objective lens or the object to be observed, thereby preventing the loss of the objective lens. When the microscope is used to observe the probe card, it can effectively prevent the objective lens from colliding with the expensive probe card because it is too close, which causes the objective lens or the probe card to be damaged and suffers a great loss.
1‧‧‧顯微鏡 1‧‧‧Microscope
11‧‧‧物鏡 11‧‧‧ Objective lens
12‧‧‧載台 12‧‧‧ stage
13‧‧‧測距儀 13‧‧‧ Rangefinder
14‧‧‧操作模組 14‧‧‧Operating module
15‧‧‧處理模組 15‧‧‧Processing module
16‧‧‧升降機構 16‧‧‧ Lifting mechanism
171‧‧‧X軸移動機構 171‧‧‧X-axis moving mechanism
172‧‧‧Y軸移動機構 172‧‧‧Y-axis moving mechanism
18‧‧‧蜂鳴器 18‧‧‧ buzzer
2‧‧‧待觀察物 2‧‧‧Sensitives
Z‧‧‧取像區域 Z‧‧‧ image capture area
MP‧‧‧測量點 MP‧‧‧measuring point
SD‧‧‧安全距離 SD‧‧‧Safe distance
θ 1‧‧‧交角 θ 1‧‧‧
θ 2‧‧‧傾斜角度 θ 2‧‧‧ tilt angle
D1‧‧‧焦距 D1‧‧•focal length
D2‧‧‧焦距 D2‧‧•focal length
圖1,係為本創作的顯微鏡防撞架構的構件示意圖。 Figure 1 is a schematic diagram of the components of the microscope collision avoidance architecture of the present invention.
圖2,係為本創作的顯微鏡防撞架構的第一操作狀態示意圖。 Figure 2 is a schematic view of the first operational state of the microscope collision avoidance architecture of the present invention.
圖3,係為本創作的顯微鏡防撞架構的第二操作狀態示意圖。 Figure 3 is a schematic view of the second operational state of the microscope collision avoidance architecture of the present invention.
以下內容將搭配圖式,藉由特定的具體實施例說明本創作之技術內容,熟悉此技術之人士可由本說明書所揭示之內容輕易地了解本創作之其他優點與功效。本創作亦可藉由其他不同的具體實施例加以施行或應用。本說明書中的各項細節亦可基於不同觀點與應用,在不背離本創作之精神下,進行各種修飾與變更。尤其是,於圖式中各個元件的比例關係及相對位置僅具示範性用途,並非代表本創作實施的實際狀況。 The following content will be described in conjunction with the drawings, and the technical contents of the present invention will be described by a specific embodiment. Those skilled in the art can easily understand other advantages and effects of the present invention by the contents disclosed in the present specification. This creation can also be implemented or applied by other different embodiments. The details of the present specification can also be modified and changed without departing from the spirit of the present invention. In particular, the proportional relationship and relative position of the various elements in the drawings are for exemplary purposes only and are not representative of actual implementation of the present invention.
為使揭露內容更為簡潔而容易明瞭,以下針對相同或近似功能的元件將採用相同的符號進行說明,且省略相同或均等特徵的描述。 In the following, the same or similar functions will be described with the same reference numerals, and the description of the same or equivalent features will be omitted.
本創作係提供一種顯微鏡防撞架構,可於顯微鏡操作而調整物鏡與待觀察物的距離時,判斷物鏡與待觀察物的距離是否過於接近,而於物鏡過於接近待觀察物時主動停止物鏡的下降,而防止物鏡與待觀察物因過於接近而彼此發生碰撞,以降低物鏡或待觀察物發生碰撞毀損而造成損失的機會。 The present invention provides a microscope anti-collision structure, which can determine whether the distance between the objective lens and the object to be observed is too close when the microscope is operated to adjust the distance between the objective lens and the object to be observed, and actively stop the objective lens when the objective lens is too close to the object to be observed. Decrease, and prevent the objective lens from colliding with each other due to the proximity of the object to be observed, so as to reduce the chance of loss caused by the collision of the objective lens or the object to be observed.
另外,本創作的顯微鏡防撞架構還可以應用於半導體產業的顯微鏡,所述顯微鏡係用於顯微觀察例如為探針卡(Probe Card)的待觀察物。 In addition, the microscope collision avoidance architecture of the present invention can also be applied to a microscope of the semiconductor industry for microscopic observation of an object to be observed such as a probe card.
針對探針卡而言,在晶圓的製造過程中,往往會在晶圓測試機台上透過探針卡上的探針接觸晶圓上的各晶片,以對晶圓上的各晶片傳送測試訊號,藉以測試晶圓上各晶片的積體電路的電性功能是否正常,俾在晶圓上各晶 片封裝前汰除電性功能不良的不良品,以減少對不良品投入不必要的封裝成本,並增加成品的良率。 For the probe card, in the manufacturing process of the wafer, the probes on the probe card are often contacted on the wafer testing machine to contact each wafer on the wafer to test the wafers on the wafer. Signal to test whether the electrical function of the integrated circuit of each wafer on the wafer is normal, and the crystal on the wafer Eliminate defective products with poor electrical function before packaging, to reduce unnecessary packaging costs for defective products, and increase the yield of finished products.
由於晶圓上各晶片的積體電路的密集度,會隨著積體電路製程技術的進步而增加,為確保探針卡的探針能夠順利接觸晶圓上各晶片的積體電路,使得探針卡上的探針有愈來愈細的趨勢,導致探針卡的造價昂貴。此外,探針卡的探針在經過多次使用後其針頭會有磨耗或污染的情況發生,探針卡的探針針頭若存在磨耗及污染後容易跟晶圓上各晶片的積體電路接觸不良,而讓探針卡處於不堪使用的狀態,以使檢測結果的可靠度大幅降低,如此,可知探針卡之檢測性能會隨著使用的次數而逐漸降低。 Due to the intensive circuit of each wafer on the wafer, it will increase with the advancement of integrated circuit processing technology. In order to ensure that the probe of the probe card can smoothly contact the integrated circuit of each wafer on the wafer, The probe on the needle card has a tendency to become thinner and thinner, resulting in an expensive probe card. In addition, the probe of the probe card may wear or contaminate the needle after repeated use, and the probe needle of the probe card may be in contact with the integrated circuit of each wafer on the wafer if it is worn and contaminated. Poor, and the probe card is in an unusable state, so that the reliability of the detection result is greatly reduced. Thus, it can be seen that the detection performance of the probe card gradually decreases with the number of uses.
對此,係可利用顯微鏡來觀察探針卡的探針針頭的外形,而判斷探針針頭受到磨耗及污染的程度,以供掌握探針卡是否處於堪於使用的狀態,俾提升探針卡檢測結果的可靠度。然,顯微鏡的操作,經常會因人員的誤操作讓物鏡與待觀察物過於接近而發生碰撞,而本創作的顯微鏡防撞架構用於顯微鏡上時,可有效避免人員對於顯微鏡的誤操作,而防止顯微鏡的物鏡與待觀察物發生碰撞,故本創作應用於觀察探針卡的顯微鏡時,還可避免物鏡與造價昂貴的探針卡因過於接近而發生碰撞,使得物鏡或探針卡發生毀損而蒙受重大損失。 In this regard, the microscope can be used to observe the shape of the probe needle of the probe card, and the probe needle is judged to be worn and contaminated, so as to grasp whether the probe card is in a state of being used, and the probe card is lifted. The reliability of the test results. However, the operation of the microscope often causes the objective lens to collide too close to the object to be observed due to the erroneous operation of the person, and the microscope collision avoidance structure of the present invention can effectively prevent the operator from mishandling the microscope while preventing the microscope from being used on the microscope. The objective lens collides with the object to be observed. Therefore, when the microscope is used to observe the microscope of the probe card, it is also possible to avoid collision between the objective lens and the expensive probe card due to the proximity of the probe card, which causes the objective lens or the probe card to be damaged and suffers. huge loss.
針對本創作顯微鏡防撞架構的技術思想,請一併參考本案圖式中各圖的揭露以及下文的說明:如圖1所示,本創作的顯微鏡防撞架構,係用於顯微鏡1,所述顯微鏡1可將待觀察物2的物像放大而供顯微觀察待觀察物2,其中,顯微鏡1具有物鏡11與載台12。物鏡11係由光學元件(包含透鏡)所構成,而可在取像區域Z 內擷取待觀察物2(例如為探針卡)的物像,以將微小不可觀察或難以觀察的待觀察物2的物像放大,俾供肉眼或其他成像儀器顯微觀察待觀察物2,進而判斷待觀察物2的狀態。載台12係設置於物鏡11的下方用於承載待觀察物2,以對待觀察物2提供支撐。 For the technical idea of the collision avoidance architecture of the present invention, please refer to the disclosure of each figure in the drawing of the present invention and the following description: as shown in FIG. 1, the microscope collision avoidance architecture of the present invention is used for the microscope 1, The microscope 1 can magnify the object image of the object to be observed 2 for microscopic observation of the object to be observed 2, wherein the microscope 1 has an objective lens 11 and a stage 12. The objective lens 11 is composed of an optical element (including a lens) and can be in the image capturing area Z. The object image of the object to be observed 2 (for example, a probe card) is taken internally to enlarge the object image of the object to be observed 2 which is slightly unobservable or difficult to observe, and is used for microscopic observation of the object to be observed by the naked eye or other imaging instruments. Then, the state of the object 2 to be observed is determined. The stage 12 is disposed below the objective lens 11 for carrying the object to be observed 2 to provide support for the object 2 to be observed.
於本創作中,可選擇性地,顯微鏡1還具有X軸移動機構171與Y軸移動機構172,X、Y軸移動機構171、172係可受驅動而令載台12分別在X軸與Y軸上移動,以帶動待觀察物2分別在X軸與Y軸上移動而進入取像區域Z,而供物鏡11由上而下擷取待觀察物2的物像。 In the present creation, optionally, the microscope 1 further has an X-axis moving mechanism 171 and a Y-axis moving mechanism 172, and the X and Y-axis moving mechanisms 171 and 172 are driven to cause the stage 12 to be respectively on the X-axis and the Y-axis. The shaft moves to drive the object to be observed 2 to move on the X-axis and the Y-axis to enter the image-taking area Z, and the objective lens 11 captures the object image of the object to be observed 2 from top to bottom.
本創作的顯微鏡防撞架構係至少包括有:測距儀13、操作模組14與處理模組15。另外,於本創作中,還可於顯微鏡1中增設升降機構16,測距儀13係設置於升降機構16。升降機購16係可用於提供物鏡11與測距儀13的同步升降。 The microscope collision avoidance architecture of the present invention includes at least a range finder 13, an operation module 14 and a processing module 15. Further, in the present creation, an elevating mechanism 16 may be additionally provided in the microscope 1, and the range finder 13 is provided in the elevating mechanism 16. The lift 16 series can be used to provide synchronous lifting of the objective lens 11 and the range finder 13.
測距儀13係例如為雷射測距儀或紅外線測距儀,乃設置於取像區域Z的外圍,以避免於取像區域Z內對待觀察物2的物像產生遮擋。於本創作中,如圖2至圖3所示,測距儀13係於取像區域Z內的測量點MP測量物鏡11與待觀察物2的距離。較佳地,測距儀13係傾斜設置而於取像區域Z的外圍側邊執行測量作業,因此,物鏡11與測量點MP係可連成第一直線L1,而測距儀13與測量點MP係可連成第二直線L2,其中,第一、第二直線L1、L2係相交且交角θ 1係小於九十度,而測距儀13的傾斜角度θ 2係與第一、第二直線L1、L2的交角θ 1互餘(即θ 1加上θ 2等於九十度)。如圖2所示,測量點MP與物鏡11係經設計而保持隔開有安全距離SD,且測距儀13的傾斜角度θ 2會與安全距離SD的長度相 關,傾斜角度θ 2愈大則安全距離SD愈長,反之,傾斜角度θ 2愈小則安全距離SD愈短,是以,於本創作中,可藉由調整傾斜角度θ 2來調整安全距離SD。 The range finder 13 is, for example, a laser range finder or an infrared range finder, and is disposed at the periphery of the image capturing area Z to prevent occlusion of the object image of the object 2 to be observed in the image capturing area Z. In the present creation, as shown in FIGS. 2 to 3, the range finder 13 measures the distance between the objective lens 11 and the object to be observed 2 at the measurement point MP in the image capturing area Z. Preferably, the range finder 13 is tilted to perform a measurement operation on the peripheral side of the image capturing area Z. Therefore, the objective lens 11 and the measuring point MP can be connected to the first straight line L1, and the range finder 13 and the measuring point MP The first and second straight lines L1 and L2 intersect and the angle of intersection θ 1 is less than ninety degrees, and the tilt angle θ 2 of the range finder 13 is connected to the first and second straight lines. The angle of intersection θ 1 of L1 and L2 is mutually exclusive (i.e., θ 1 plus θ 2 is equal to ninety degrees). As shown in FIG. 2, the measuring point MP and the objective lens 11 are designed to be separated by a safety distance SD, and the inclination angle θ 2 of the range finder 13 is proportional to the length of the safety distance SD. Off, the larger the inclination angle θ 2 is, the longer the safety distance SD is. On the contrary, the smaller the inclination angle θ 2 is, the shorter the safety distance SD is. Therefore, in the present creation, the safety distance can be adjusted by adjusting the inclination angle θ 2 . SD.
再者,如圖2所示,物鏡11的焦距D1係大於安全距離SD,亦即,物鏡11與待觀察物2的距離係大於安全距離SD而不易發生碰撞。如圖3所示,物鏡11的焦距D1係等於安全距離SD,亦即,測量點MP已隨物鏡11的移動而到達待觀察物2,使物鏡11與待觀察物2的距離仍等於安全距離SD,而仍不會讓物鏡11與待觀察物2發生碰撞的情況,不過,物鏡11與待觀察物2的距離若小於安全距離SD則彼此之間則容易發生碰撞。 Furthermore, as shown in FIG. 2, the focal length D1 of the objective lens 11 is greater than the safety distance SD, that is, the distance between the objective lens 11 and the object to be observed 2 is greater than the safety distance SD and is less likely to collide. As shown in FIG. 3, the focal length D1 of the objective lens 11 is equal to the safety distance SD, that is, the measurement point MP has reached the object 2 to be observed with the movement of the objective lens 11, so that the distance between the objective lens 11 and the object to be observed 2 is still equal to the safety distance. SD, and the objective lens 11 does not collide with the object to be observed 2, but if the distance between the objective lens 11 and the object to be observed 2 is smaller than the safety distance SD, collision is likely to occur between them.
操作模組14係可由電力或人力提供動能,而執行上升操作或下降操作,以令物鏡11與測距儀13(測量點MP)同步進行升降移動,俾調整物鏡11與待觀察物2的距離,使待觀察物2進入取像區域Z,而讓待觀察物2的物像清楚而供顯微觀察。於本創作中,操作模組14可藉由升降機構16,使測距儀13(測量點MP)可跟隨物鏡11同步地進行升降,使測量點MP與物鏡11之間至少保持隔開有安全距離SD。 The operation module 14 can provide kinetic energy by electric power or human power, and perform a rising operation or a lowering operation to move the objective lens 11 and the range finder 13 (measuring point MP) to move up and down, and adjust the distance between the objective lens 11 and the object to be observed 2 , the object to be observed 2 enters the image capturing area Z, and the object image of the object to be observed 2 is made clear for microscopic observation. In the present invention, the operation module 14 can cause the range finder 13 (measurement point MP) to be raised and lowered synchronously following the objective lens 11 by the lifting mechanism 16, so that the measurement point MP and the objective lens 11 are at least separated from each other. Distance SD.
處理模組15係連接該測距儀,以接收測距儀13的測量結果,並據以判斷物鏡11與待觀察物2的距離是否小於安全距離SD,當操作模組14執行下降操作,且物鏡11與待觀察物2的距離小於安全距離SD時,代表物鏡11執行下降且物鏡11與待觀察物2過於接近,則處理模組15係連接該測距儀,以主動令操作模組14停止執行下降操作,俾防止物鏡11持續下降而與待觀察物2因過於接近而發生碰撞。更甚者,本創作的處理模組15還可於物鏡11與待觀察物2的距離小於安全距離SD時,令操作模組14執行上升操作,使物鏡11上升而朝背離待觀察物2 的方向移動,俾防止因人為的誤操作,讓物鏡11與待觀察物2因過於接近而發生碰撞。 The processing module 15 is connected to the range finder to receive the measurement result of the range finder 13 and determine whether the distance between the objective lens 11 and the object to be observed 2 is less than the safety distance SD, and when the operation module 14 performs the lowering operation, and When the distance between the objective lens 11 and the object to be observed 2 is less than the safety distance SD, the objective lens 11 is lowered and the objective lens 11 is too close to the object to be observed 2, and the processing module 15 is connected to the range finder to actively operate the operation module 14 The lowering operation is stopped, and the objective lens 11 is prevented from continuing to fall and collides with the object 2 to be observed too close. Moreover, the processing module 15 of the present invention can also cause the operation module 14 to perform a rising operation when the distance between the objective lens 11 and the object to be observed 2 is less than the safety distance SD, so that the objective lens 11 rises and faces away from the object to be observed 2 The direction of movement prevents the objective lens 11 from colliding with the object to be observed 2 due to human error.
較佳地,本創作的顯微鏡防撞架構還可包括設置於顯微鏡1上的蜂鳴器18,當物鏡11與待觀察物2的距離小於安全距離SD時,處理模組15還可令蜂鳴器18鳴叫發出聲響,以提示物鏡11與待觀察物2彼此接近而可能發生碰撞。 Preferably, the microscope collision avoidance structure of the present invention may further include a buzzer 18 disposed on the microscope 1. When the distance between the objective lens 11 and the object to be observed 2 is less than the safety distance SD, the processing module 15 may also beep. The sound of the sound is sounded to indicate that the objective lens 11 and the object to be observed 2 are close to each other and a collision may occur.
綜上所述,本創作係提供一種顯微鏡防撞架構,係可於顯微鏡操作而調整物鏡與待觀察物(例如、探針卡)的距離時,判斷物鏡與待觀察物的距離是否過於接近,而於物鏡過於接近待觀察物時主動停止物鏡的下降,俾防止人員的誤操作讓物鏡與待觀察物因過於接近而發生碰撞,以減少物鏡或待觀察物發生碰撞毀損而造成損失的機會。 In summary, the present invention provides a microscope anti-collision structure, which can determine whether the distance between the objective lens and the object to be observed is too close when the distance between the objective lens and the object to be observed (for example, the probe card) is adjusted by the microscope operation. When the objective lens is too close to the object to be observed, the objective lens is actively stopped, and the erroneous operation of the object is prevented from colliding with the object to be observed, so as to reduce the chance of loss of the objective lens or the object to be observed.
上述實施例僅例示性說明本創作之原理及功效,而非用於限制本創作。任何熟習此項技術之人士均可在不違背本創作之精神及範疇下,對上述實施例進行修飾與改變。因此,本創作之權利保護範圍,應如本創作申請專利範圍所列。 The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the present invention. Any person skilled in the art can modify and change the above embodiments without departing from the spirit and scope of the present invention. Therefore, the scope of protection of this creation should be as listed in the scope of patent application for this creation.
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TWI674437B (en) * | 2018-03-28 | 2019-10-11 | 浮雕精密有限公司 | Microscope collision avoidance architecture |
CN110441336A (en) * | 2019-08-27 | 2019-11-12 | 江苏金恒信息科技股份有限公司 | A kind of alloy analysis instrument flexible contact device |
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TWI674437B (en) * | 2018-03-28 | 2019-10-11 | 浮雕精密有限公司 | Microscope collision avoidance architecture |
CN110441336A (en) * | 2019-08-27 | 2019-11-12 | 江苏金恒信息科技股份有限公司 | A kind of alloy analysis instrument flexible contact device |
CN110441336B (en) * | 2019-08-27 | 2024-01-02 | 江苏金恒信息科技股份有限公司 | Flexible contact device of alloy analyzer |
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