CN104713463B - Probe height adjusting method and probe position monitoring method - Google Patents

Abstract

The invention discloses a method for adjusting the height of a probe, which includes the following steps: raising a lifting platform to a point measurement position, and the lifting platform is used to carry an object to be measured. Adjust the two probes of the two probe devices so that the two probes contact the object to be measured, and use the two deformation sensing loops to make the two sensing elements on the two force arms of the two probe devices respond to the two forces. The deformation amount of the arm produces a first observation value change and a second observation value change respectively, so as to provide two probe target values respectively. The two probes have approximate target values when they contact the object to be measured. Therefore, the probe height adjustment method of the present invention can be used to provide the probe target value (needle pressure gram weight) according to the deformation amount of the force arm, which can be used as a basis for adjusting the probe height. Therefore, the probe height adjustment method can improve the accuracy of measuring needle pressure and has high sensitivity, which can prevent the probe on the probe device from damaging the object to be measured and reduce probe wear. The invention also discloses a probe position monitoring method.

Description

Probe height adjustment method and probe position monitoring method

technical field

The invention relates to a probe height adjustment method and a probe position monitoring method.

Background technique

The traditional edge sensor (edge sensor) must manually adjust the tightness of the elastic element (such as a spring), and then adjust the needle pressure of the probe. When the stage carrying the wafer rises up to touch the probe of the edge finder, the probe will be supported by the wafer and move upward. If the probe does not have enough needle pressure, the contact with the wafer will be poorly contacted, and the measurement data of the wafer will be inaccurate. In addition, if the needle pressure of the probe is too large, it is easy to damage the probe or cause damage to the wafer surface.

It takes a period of time (for example, 20 ms) to confirm whether the probes are actually in contact with the wafer when the probes of the traditional edge finder touch the wafer, so it is difficult to shorten the detection time. In addition, when some of the probes on the existing edge finder are not on the same level, some of the probes are in contact with the wafer, but the other part of the probes are still suspended above the wafer. The user cannot know how to adjust the vertical height of the probe from the existing edge finder.

When the probes of the existing edge finder are all at the same vertical height, the user cannot know the height of the pad of a single wafer or the thickness difference between multiple wafers during the measurement of the edge finder. For incoming materials Wafer anomalies are also difficult to spot.

Contents of the invention

In order to solve the problems in the prior art, the present invention provides a probe measuring system comprising a lifting platform, at least one probe device, at least one deformation sensing loop, a contact sensing loop, a testing loop, a first switch and a second switch. The lifting platform is used to carry the object to be tested. The probe device is located above the lifting platform, and the probe device includes a force arm, a probe and at least one sensing element. The probe is attached to one end of the arm. The sensing element is located on the force arm, and when the force arm is deformed by force, the sensing element changes the observed value according to the deformation of the force arm. The deformation sensing loop is electrically connected to the sensing element to receive the change of the observed value. The touch sensing loop includes a power supply and a needle pressure sensing unit. The needle pressure sensing unit is electrically connected to the power supply, and has a booster element and a connection circuit for the probe. The probe connection line is connected in parallel with the boost element. The test circuit is used to input current to the object under test through the probe device. The first switch and the second switch are electrically connected with the probe device. When the probe touches the object under test, the first switch and the second switch are selectively electrically connected to the probe connection line or the test loop.

Therefore, the main purpose of the present invention is to provide a point measuring system for probes. The point measuring system for probes of the present invention can shorten the time for detecting the object to be tested through the contact induction circuit, and ensure that the probes are detected by the predetermined shape through the deformation induction circuit. The needle pressure does abut against the object to be tested.

In addition, the secondary purpose of the present invention is to provide a probe point measurement system, the probe point measurement system of the present invention can improve the accuracy of measuring needle pressure (probe force), and has high sensitivity, and can avoid The probe damages the object to be measured, reducing the wear of the probe.

Moreover, another secondary purpose of the present invention is to provide a probe point testing system. In the probe point testing system of the present invention, after the contact induction circuit confirms that the probe device is in electrical contact with the object under test, the test circuit can input Current is sent to the object under test to detect the electrical and optical properties of the object under test. While detecting the object to be tested, the sensing element can produce changes in observed values according to the deformation of the force arm, and the deformation sensing circuit continuously monitors the changes in observed values. In this way, not only can the state of the object under test be monitored, but also the stability of the machine can be monitored, for example, the thickness of the pad joint of the object under test can be monitored, and whether the spot measurement position of the lifting platform is shifted.

The present invention also provides a method for adjusting the height of the probe, which includes the following steps: raising and lowering the platform to the spot measurement position, and the lifting and lowering platform is used to carry the object to be tested. Adjust the two probes of the two probe devices so that the two probes touch the object to be tested, and use two deformation sensing circuits to make the two sensing elements on the two force arms of the two probe devices respond to the two forces The amount of deformation of the arm produces a change in the first observed value and a change in the second observed value respectively, so as to provide two target values of the probe respectively. Bring both probes into contact with the analyte to have approximate target values. Therefore, the probe height adjustment method of the present invention can provide the probe target value (needle pressure grammage) according to the deformation of the force arm as the basis for adjusting the probe height. Therefore, the method of adjusting the height of the probe can improve the accuracy of measuring the probe force and has high sensitivity, which can prevent the probe on the probe device from damaging the object under test and reduce the wear of the probe.

The present invention also provides a probe position monitoring method, which includes the following steps: raising and lowering the platform, making the object to be measured on the lifting platform contact at least one probe device, and the force arm of the probe device deforms under force. Use the contact sensing circuit to confirm the electrical contact between the probe device and the object to be tested, and stop the lifting platform. Use the test circuit to input current to the object under test to detect the electrical and optical properties of the object under test. While detecting the electrical and optical properties of the object to be tested, the deformation sensing circuit is used to electrically connect the sensing elements on the force arm, and the observed value changes according to the deformation of the force arm. While detecting the electrical and optical properties of the analyte, continuously monitor the changes in the observed values. Therefore, using the probe position monitoring method of the present invention, while detecting the object to be tested, the sensing element can produce changes in observed values according to the deformation of the force arm, and the deformation sensing loop continuously monitors the changes in observed values. In this way, not only can the state of the object under test be monitored, but also the stability of the machine can be monitored, for example, the thickness of the pad joint of the object under test can be monitored, and whether the spot measurement position of the lifting platform is shifted.

Description of drawings

FIG. 1 is a flowchart of a probe height adjustment method according to an embodiment of the present invention.

FIG. 2 is a schematic diagram of a probe point measurement system according to an embodiment of the present invention.

FIG. 3 is a partially enlarged view of the probe device and the lifting platform of FIG. 2 .

FIG. 4 is a schematic diagram of the lifting platform of FIG. 3 after it is raised.

FIG. 5 is a flow chart of a probe position monitoring method according to an embodiment of the present invention.

FIG. 6 is a schematic diagram of the first switch and the second switch in FIG. 4 being electrically connected to a test loop.

FIG. 7 is a schematic diagram of different contact thicknesses of the object to be tested in FIG. 4 .

FIG. 8 is a graph of force versus time for the two probe devices of FIG. 7 .

FIG. 9 is a schematic diagram of a probe detection system according to another embodiment of the present invention.

FIG. 10 is a partially enlarged view of the probe device and the lifting platform of FIG. 9 .

FIG. 11 is a schematic diagram of the lifting platform of FIG. 10 after it is raised.

FIG. 12 is a schematic diagram of the first switch and the second switch in FIG. 11 being electrically connected to a test loop.

FIG. 13 is a diagram showing the relationship between the position and time of the probe device in FIG. 11 after it touches the object to be tested.

detailed description

A number of implementations of the present invention will be disclosed below with the accompanying drawings, and many specific details will be described together in the following description for the sake of clarity. It should be understood, however, that these specific details should not be used to limit the invention. That is, in some embodiments of the invention, these specific details are not necessary. In addition, for the sake of simplification of the drawings, some conventional structures and elements will be shown in a simple and schematic manner in the drawings.

FIG. 1 is a flowchart of a probe height adjustment method according to an embodiment of the present invention. Firstly, in step S11 , the lift platform is raised to the spot measurement position, and the lift platform is used to carry the object to be tested. Then in step S12, adjust the two probes of the two probe devices so that the two probes contact the object to be tested, and use the two deformation sensing loops to make the two probes on the two force arms of the two probe devices The sensing element respectively generates a first observed value change and a second observed value change according to the deformation amounts of the two force arms, so as to provide two probe target values respectively. Then in step S13 , when the two probes are brought into contact with the object to be tested, they have approximate target values.

In the following description, the above-mentioned steps will be described using the probing system 100 of FIG. 2 .

FIG. 2 is a schematic diagram of a probe detection system 100 according to an embodiment of the present invention. FIG. 3 is a partially enlarged view of the probe devices 120, 120' and the lifting platform 110 in FIG. 2 . Referring to FIG. 2 and FIG. 3 at the same time, the probe point measurement system 100 includes a lifting platform 110, two probe devices 120, 120', two deformation sensing loops 130, a contact sensing loop 140, a test loop 150, and a first switch 160. with the second switch 160'. In this embodiment, the number of probe devices is two (that is, probe devices 120, 120'), the probe measuring system 100 has two deformation sensing loops 130, and the first switch 160 and the second switch 160 ' have the same electrical connection relationship.

The lifting stage 110 can carry the object under test 210, and the lifting stage 110 can rise in the direction D under the probe devices 120, 120', so that the probe devices 120, 120' can electrically contact the contacts of the object under test 210 respectively. 212, 214. The object under test 210 may be a wafer with multiple chips, an LED chip, an LED packaging module, etc., but is not limited to the above components. The probe devices 120, 120' are located above the lifting platform 110. Since the structure of the probe device 120' is the same as that of the probe device 120, only the structure of the probe device 120 will be described below. The probe device 120 includes a force arm 122 , a probe 124 and a sensing element 126 . The probe 124 is connected to one end of the arm 122 . The sensing element 126 is located on the force arm 122 , and when the force arm 122 is deformed by force, the sensing element 126 can produce changes in observed values according to the deformation of the force arm 122 . The deformation sensing loop 130 is electrically connected to the sensing element 126 for receiving the change of the observed value generated by the sensing element 126 .

In this embodiment, the force arm 122 has a hollowed-out area 123 penetrating through it, and the length direction of the hollow area 123 and the length direction of the force arm 122 may be the same or substantially the same, and the same is preferred. The sensing element 126 can be a strain gauge or a piezoelectric material. The strain gauge can produce a resistance value change with the deformation of the force arm 122 , and the piezoelectric material can produce a voltage value change with the force arm 122 deformation. That is to say, the change of the observed value generated by the sensing element 126 may be a change of resistance value or a change of voltage value, depending on the type of the sensing element 126 . Wherein, the number of the sensing elements 126 is not limited to the present invention, and can be determined according to the requirements of the designer.

The contact sensing circuit 140 includes a power source 142 and a needle pressure sensing unit 144 . The acupressure sensing unit 144 is electrically connected to the power supply 142 and has a boost element R1 and a probe connection circuit 145 . The probe connection line 145 is connected in parallel with the boost element R1. In addition, the touch sensing loop 140 may further include a voltage dividing element R2. The voltage dividing element R2 is electrically connected to the power source 142 and connected in series with the needle pressure sensing unit 144 . The first switch 160 is electrically connected to the probe device 120 . The second switch 160' is electrically connected to the probe device 120'. In FIG. 3 , the probe 124 and the probe 124' have not touched the object under test 210, and the first switch 160 and the second switch 160' are electrically connected to the probe connection line 145.

In this embodiment, the probe detection system 100 further includes controllers 172 , 174 and an acupressure setting device 176 . The controller 172 can be a point testing machine, and the controller 174 can be a testing machine, and there is an electrical connection between the point testing machine and the testing machine, but the types of the controllers 172 and 174 do not limit the present invention. The controller 172 is electrically connected to the lifting platform 110 and the contact sensing circuit 140 . The acupressure setting device 176 is electrically connected to the deformation sensing circuit 130 and the controller 172 , so that the controller 172 can be electrically connected to the deformation sensing circuit 130 through the acupressure setting device 176 . The controller 174 is electrically connected to the test circuit 150. When the probe 124 and the probe 124' are confirmed to be in electrical contact with the object under test 210, the first switch 160 and the second switch 160' can be electrically connected to the test circuit 150, so that the control The device 174 is electrically connected to the first switch 160 and the second switch 160' and conducts with the probe devices 120 and 120'. Wherein, the deformation sensing loop 130 , the contact sensing loop 140 and the testing loop 150 are all independent loops.

FIG. 4 is a schematic diagram of the lifting platform 110 in FIG. 3 after it is raised. Referring to FIG. 1 and FIG. 4 at the same time, in step S11 , the lifting platform 110 is raised to the spot measurement position, and the lifting platform 110 is used to carry the object 210 to be tested. When the lifting platform 110 rises to the spot measurement position in the direction D, the probe devices 120, 120' may not all touch the object under test 210, even if they have touched the object under test 210, the object under test 210 will have a relatively large impact on the probe devices 120, 120. 'The pressures applied are not necessarily the same, so a follow-up adjustment of the needle height is required to ensure that the probes 124, 124' are in contact with the object under test 210 at the same or approximately vertical position (needle height) to avoid the probe 124 , 124 ′ damage the object under test 210 and reduce wear of the probes 124 , 124 ′.

Then in step S12, the two probes 124, 124' of the two probe devices 120, 120' are adjusted so that the two probes 124, 124' contact the object 210 to be tested, and the two deformation sensing loops 130 are used to make The two sensing elements 126, 126' on the two force arms 122, 122' of the two probe devices 120, 120' respectively produce the first observation value change and the second The observed values vary to provide target values for the two probes 124, 124', respectively. That is to say, after lifting and lowering the carrier platform 110 to the surveying position, the vertical positions of the probes 124, 124' of the probe devices 120, 120' can be adjusted respectively. Further description is as follows, the force arms 122, 122' of the probe devices 120, 120' will be deformed due to the pressure of the probes 124, 124' being pressed by the object 210 to be tested, and the sensing elements 126, 126' will be deformed according to the force arms 122 The deformation amounts of , 122' produce the first observed value change and the second observed value change respectively. The acupressure setting device 176 (see FIG. 2 ) can receive the change of the first observed value and the change of the second observed value through the deformation sensing circuit 130, and through the change of the first observed value and the change of the second observed value, thereby confirming and adjusting whether The same or similar target values have been provided for the probes 124 , 124 ′, for example, the target value is the probe force, and the approximate target value is the probe force within plus or minus 1 gram.

Then in step S13, when the two probes 124, 124' are brought into contact with the object under test 210, they have approximate target values. That is to say, for example, in step S12, the user has preset a target weight/needle height target value of about 5 grams for the two probes 124, 124' to be provided respectively. At this time, the user can watch the needle pressure The change of the first observed value and the second observed value displayed by the setting device 176 are adjusted while adjusting the needle height of the probes 124, 124' so that the probes 124, 124' have an approximate target value when they touch the object under test 210, that is, The grammage/needle height of about 5 grams, so that the needle tips of the probes 124, 124' are roughly located on the same horizontal plane, and then in step S13, the probes 124, 124' can have similar targets when they contact the object to be tested 210 value. In addition, since the force arms 122, 122' of the probe devices 120, 120' of the present invention with the hollow areas 123, 123' can produce a large amount of deformation, the deformation sensitivity of the force arms 122, 122' can be improved when the force is applied. , so that the sensing elements 126, 126' generate sensitive changes in the first observed value and the second observed value, thereby improving the accuracy of the height adjustment of the probes 124, 124'.

Referring to Fig. 2 and Fig. 4 at the same time, after the needle heights of the probe devices 120, 120' are adjusted (i.e. after step S13), the contact sensing circuit 140 can be used to confirm whether the probe devices 120, 120' are respectively in line with the ones to be tested. The contacts 212, 214 of the object 210 are in electrical contact. The probe point testing system 100 of the present invention confirms whether the probe devices 120, 120' are in electrical contact with the contacts 212, 214 of the object under test 210 through the contact induction circuit 140, so the time for detecting the object under test 210 can be shortened. When the object under test 210 is indeed in contact with the probes 124, 124' and is electrically connected, because the probe connection line 145 is turned on and connected in parallel with the boost element R1, the voltage across the needle pressure sensing unit 144 measured by the controller 172 will drop significantly. When it is judged that the aforementioned trans-voltage drops to a critical value, the controller 172 may immediately stop the lifting platform 110 from rising. Since the controller 172 is also electrically connected to the acupressure setting device 176, it can ensure that the probes 124, 124' can abut against the object 210 under test with a predetermined acupressure.

In addition, it should be further explained that if it is judged that the value of the transvoltage has not yet reached the set critical value, it will be further judged whether the lifting platform 110 has reached the set limit value (that is, the maximum position of the lifting platform 110). setting value), so as to prevent the lifting platform 110 from continuing to rise, so that the needle pressure of the object under test 210 may be overloaded, and damage to the object under test 210 and the probes 124 and 124 ′ can also be avoided. That is to say, if the lifting platform 110 has not reached the limit value, the lifting platform 110 will continue to rise, which will make the needle pressure exerted by the probes 124, 124' on the contacts 212, 214 continue to increase. If the lifting platform 110 has reached the limit value, although the measured transvoltage has not yet reached the set critical value, the movement of the lifting platform 110 will be stopped immediately to avoid damage to the probes 124, 124' and the object under test 210. Wherein, the reason why the lifting stage 110 rises to the limit value may be that the chip in the object under test 210 is damaged badly, such as NG LED, so the value of the cross-voltage has not reached the set critical value. In addition, the acupressure setting device 176 of the present invention can also be used to determine whether the acupressure exceeds the set target value. If the acupressure exceeds the set target value, the acupressure setting device 176 can also pass The controller 172 stops the lifting platform 110 from rising.

In the following description, the probe position monitoring method will be described. It should be noted that the probe position monitoring method of the present invention only needs at least one probe device for monitoring. Since the content of step S21 and step S22 in FIG. 5 has been described above, it will not be repeated. Therefore, the probe position monitoring method described below is continued with two probe devices, and the present invention is not limited thereto.

FIG. 5 is a flow chart of a probe position monitoring method according to an embodiment of the present invention. Firstly, in step S21 , the elevating stage is raised, so that the object to be tested on the elevating stage contacts at least one probe device, and the force arm of the probe device is deformed by force. Then in step S22 , the contact sensing circuit is used to confirm that the probe device is in electrical contact with the object to be tested, and the lifting platform is stopped. Then in step S23 , the test circuit is used to input current to the object under test, so as to detect the electrical and optical properties of the object under test. In step S24, at least one deformation sensing loop is used to electrically connect at least one sensing element on the force arm while detecting the electrical and optical properties of the object under test, and at least one observed value change is generated according to the deformation of the force arm. In step S25, while detecting the electrical property and the optical property of the object to be tested, the change of at least one observed value is continuously monitored.

In the following description, the above step S23 to step S25 will be described using the probe detection system 100 of FIG. 2 and FIG. 6 .

FIG. 6 is a schematic diagram after the first switch 160 and the second switch 160' of FIG. 4 are electrically connected to the test circuit 150. Referring to FIG. Referring to FIG. 5 and FIG. 6 at the same time, in step S23 , the test loop 150 is used to input current to the object under test 210 to detect the electrical and optical properties of the object under test 210 . When the probes 124, 124' do electrically contact the object under test 210, the first switch 160 and the second switch 160' can be switched from the state of FIG. 4 to the state of FIG. 6, that is, the first switch 160 is far away from the probe device 120 One end of the second switch 160' can be switched from the contact point P1 to the contact point P2, and the end of the second switch 160' away from the probe device 120' can be switched from the contact point P1' to the contact point P2', so that the controller 174 (see FIG. 2) is electrically connected to the first switch 160, The second switch 160' is also connected to the probe devices 120, 120'. In this way, the controller 174 can input current to the object under test 210 through the test loop 150 .

In step S24, while detecting the electrical and optical properties of the object under test 210, two deformation sensing circuits 130 are used to electrically connect the sensing elements 126, 126' on the arm 122, 122', according to the arm 122, A deformation of 122' produces two observed changes. When detecting the object under test 210, since the deformation sensing circuit 130 is electrically connected with the sensing elements 126, 126', the probes 124, 124' are pressed against the object under test 210, causing the force arms 122, 122' to deform. Therefore, the sensing elements 126, 126' on the force arms 122, 122' can generate the first observed value change and the second observed value change respectively according to the deformation of the force arms 122, 122'.

In step S25, while detecting the electrical and optical properties of the object to be tested, the changes of the two observed values are continuously monitored. Since the deformation sensing loop 130 is electrically connected to the sensing elements 126, 126', when detecting the object 210 to be measured, the observed value changes generated by the sensing elements 126, 126' on the force arms 122, 122' respectively can also be detected by the needle. Pressure setting device 176 (see FIG. 2 ) is continuously monitored by deformation sensing loop 130. In this way, not only can the state of the object under test 210 be monitored, but also the stability of the machine can be monitored. Figure 2) Whether the survey position is offset.

Referring to FIG. 2 and FIG. 6 at the same time, in this embodiment, the probe detection system 100 may further include a warning element 178 . The acupressure setting means 176 has a target value for changes in observed values. The warning element 178 is electrically connected to the acupressure setting device 176, and when the changes of the first observed value and the second observed value generated by the sensing elements 126, 126' respectively exceed the target values, the warning element 178 can send out a warning signal. For example, when the position of the probes 124, 124' deviates, when the difference in thickness of the bonding pads 212, 214 of the object under test 210 is too large, when the spot measurement position of the lifting platform 110 deviates, etc. The warning signal, for example, uses numbers on a 7-segment display to indicate the value, or lights with different chromaticity and brightness to indicate the value, or different audio tones to indicate the value, which is not intended to limit the present invention.

Therefore, the user can not only know that the vertical position of the probe device 120, 120' or the vertical position of the lifting platform 110 may be offset, know the stability of the machine, but also know the detected object 210 Whether it is a good product, for example, the surface of the defective object under test 210 may be uneven, or the difference in thickness of the pad joints 212 and 214 is too large. In addition, when the deformation sensing circuit 130 continuously monitors the change of the first observed value and the change of the second observed value, if the difference between the change of the first observed value and the change of the second observed value is greater than the target value of the needle pressure setting device 176, it can execute The corresponding processing procedures, such as shutting down for inspection and maintenance, readjusting the needle height, or replacing another DUT, are not intended to limit the present invention. In addition, since the deformation sensing circuit 130 of the present invention continuously monitors the changes of the first observed value and the second observed value, the present invention can further store these changed observed values for product analysis and the like.

FIG. 7 is a schematic diagram of different thicknesses of the joints 212 and 214 of the object under test 210 in FIG. 4 . FIG. 8 is a force versus time diagram for the two probe devices 120, 120' of FIG. 7 . Referring to FIG. 7 and FIG. 8 at the same time, the contact 212 has a thickness T1, and the contact 214 has a thickness T2, and the thickness T2 is greater than the thickness T1. If the probe height adjustment method of the present invention is used, the probes 124, 124' of the probe devices 120, 120' can be adjusted to have the same needle height and be located on the same horizontal plane. However, since the joints 212 and 214 of the object under test 210 have different thicknesses, when the probe devices 120 and 120 ′ are in contact with the object under test 210, the force on the probe device 120 ′ will be greater than the force on the probe device 120 , so the deformation of the moment arm 122 ′ is greater than that of the moment arm 122 . The deformation sensing loop 130 receives the change of the first observed value of the sensing element 126 to draw a straight line L1, and the deformation sensing loop 130 receives the change of the second observed value of the sensing element 126' to draw a straight line L2. The straight lines L1, L2 can be displayed on the controller 172, the acupressure setting device 176 or other display devices in FIG.

Compared with the prior art, the probe point measuring system of the present invention can shorten the time for detecting the object to be measured through the contact induction circuit. When the object under test is actually in contact with the probe and is electrically connected, the measured cross voltage of the needle pressure sensing unit will drop obviously because the connection line of the probe is conducted and connected in parallel with the boosting element. When it is judged that the transvoltage has dropped to a critical value, the lifting stage can be stopped immediately, and the probe height adjustment method of the present invention can be used to ensure that the probe is in contact with the object under test with a predetermined needle pressure.

In addition, in the probe height adjustment method of the present invention, when the probe of the probe device touches the object to be tested, the sensing element can be used to provide the probe target value (needle pressure grammage) according to the deformation of the force arm, as an adjustment probe The basis of the height can improve the accuracy of measuring the probe force, and the sensitivity is high, which can prevent the probe on the probe device from damaging the object to be measured and reduce the wear of the probe. Furthermore, in the probe position monitoring method of the present invention, after the contact sensing circuit confirms that the probe device is in electrical contact with the object under test, the test circuit can input current to the object under test to detect the electrical and optical properties of the object under test. While detecting the object to be tested, the sensing element can produce changes in observed values according to the deformation of the force arm, and the deformation sensing circuit continuously monitors the changes in observed values. In this way, not only can the state of the object under test be monitored, but also the stability of the machine can be monitored, for example, the thickness of the pad joint of the object under test can be monitored, and whether the spot measurement position of the lifting platform is shifted.

It should be understood that in the above description, the connection relationship and functions of the components that have been described will not be repeated, and will be described first.

FIG. 9 is a schematic diagram of a probe detection system 100a according to another embodiment of the present invention. FIG. 10 is a partially enlarged view of the probe device 120 and the lifting platform 110 of FIG. 9 . 9 and 10 at the same time, the probe measuring system 100a includes a lifting platform 110, a probe device 120, a deformation sensing circuit 130, a contact sensing circuit 140, a testing circuit 150, a first switch 160 and a second switch 160'. The difference from the embodiment shown in FIG. 2 is that the probe point measurement system 100a only has one probe device 120, one deformation sensing circuit 130, and the contact point 214a where the lifting platform 110 electrically contacts the bottom surface of the object 210 to be tested. When the needle 124 touches the object under test 210 , the lifting platform 110 is selectively electrically connected to the probe connection line 145 or the test circuit 150 through the second switch 160 ′. It should be further explained that when the probe point measurement system 100a has only one probe device 120, the first switch 160 is directly electrically connected to the probe device 120, while the second switch 160' is connected to the probe through the wire 145. Or the test loop 150 is electrically connected to the probe device 120 . The first switch 160 is selectively electrically connected to the probe connection line 145 or the test loop 150 through the contacts P1 and P2 . The second switch 160' can be selectively electrically connected to the probe connection line 145 or the test circuit 150 through the contacts P1', P2'. The probe 124 of the probe device 120 can be used to contact the surface of the object under test 210 opposite to the lifting platform 110 . When the lifting platform 110 rises in the direction D, the probe 124 can abut against the contact point 212 on the top surface of the object 210 to be tested.

FIG. 11 is a schematic diagram of the lifting platform 110 in FIG. 10 after it is raised. Referring to FIG. 9 and FIG. 11 at the same time, when the lifting platform 110 rises in the direction D, the contact point 212 of the object to be tested 210 on the lifting platform 110 can contact the probe 124, so that the force arm 122 of the probe device 120 is stressed and out of shape. Then, the contact sensing circuit 140 can be used to confirm the electrical contact between the probe device 120 and the contact point 212 of the object under test 210 .

The controller 172 can collect the change of the voltage across the needle pressure sensing unit 144 of the contact sensing circuit 140 , and confirm that the probe device 120 is in electrical contact with the object under test 210 according to the change of the across voltage. When the cross-voltage change reaches a critical value, the lifting platform 110 stops rising, and the probe device 120 is in electrical contact with the contact point 212 of the object under test 210 . As for other implementations of the lifting platform 110 , they are as disclosed above, and will not be repeated here.

FIG. 12 is a schematic diagram after the first switch 160 and the second switch 160' of FIG. 11 are electrically connected to the test circuit 150. Referring to FIG. 9 and FIG. 12 at the same time, when the contact sensing circuit 140 confirms that the probe device 120 is in electrical contact with the object under test 210, the first switch 160 is switched from the contact point P1 to the contact point P2, and the second switch 160' is switched from the contact point P1' to contact P2'. Next, the test loop 150 can input current to the object under test 210 from the controller 174 to detect the electrical and optical properties of the object under test 210 , as shown in step S23 of the probe position monitoring method in FIG. 5 .

When the test circuit 150 inputs current to the object under test 210 to detect the electrical and optical properties of the object under test 210, the deformation sensing circuit 130 is used to electrically connect the sensing element 126 on the force arm 122, according to the amount of deformation of the force arm 122 A change in the observed value is generated, as shown in step S24 of the probe position monitoring method in FIG. 5 .

In addition, while detecting the electrical properties and optical properties of the object under test 210 , the changes of the above-mentioned observed values are continuously monitored. That is to say, while detecting the object 210 to be tested, the change in the observed value generated by the sensing element 126 on the force arm 122 can be continuously monitored by the needle pressure setting device 176 through the deformation sensing circuit 130, as shown in the steps of the probe position monitoring method in Figure 5 Shown in S25. In this way, it is not only possible to monitor whether the state of the object under test 210 is normal, but also to monitor the stability of the machine. Whether the measuring position is shifted. Of course, as disclosed above, the present invention can further store these changed observed values.

FIG. 13 is a diagram showing the relationship between position and time after the probe device 120 of FIG. 11 touches the object 210 to be tested. Referring to Figure 11 and Figure 13 at the same time, when the object under test 210 touches the probe device 120, the probe device 120 will be in an unstable state due to impact, such as a slight vibration, and then it will be confirmed by the contact induction circuit 140 (see Figure 9). After the probe device 120 is in electrical contact with the object under test 210 , the lifting platform 110 stops rising, so that the position of the probe device 120 does not change any more, so the curve L3 can be obtained. The curve L3 can be displayed on the controller 172 of FIG. 9 , the acupressure setting device 176 or other display devices for the user to judge whether the stability of the machine and the state of the object under test 210 are normal.

Although the present invention has been disclosed above in terms of implementation, it is not intended to limit the present invention. Any person skilled in the art may make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the present invention The scope of protection shall prevail as defined in the claims.

Claims (4)

1. A probe height adjustment method, is characterized in that, comprises the following steps: (a) raising an elevating platform to a one-point measurement position, and an object to be measured is carried on the elevating platform; (b) Adjust the two probes of the two probe devices so that the two probes contact the object to be tested, and use two deformation induction loops to make the two force arms of the two probe devices The two sensing elements respectively generate a change in a first observed value and a change in a second observed value according to the deformation amounts of the two force arms, so as to respectively provide a target value for the two probes; (c) causing said two probes to have approximately said target value when contacting said analyte; (d) confirming that the two probe devices are in electrical contact with the object under test using a contact sensing loop; (e) using a test loop to input a current to the object under test to detect the electrical and optical properties of the object under test; and (f) At the same time of step (e), using the two deformation sensing loops to continuously monitor the change of the first observed value and the change of the second observed value. 2. probe height adjustment method as claimed in claim 1, is characterized in that, utilizes the monitoring method that described probe height adjustment method is done, wherein in step (f), further comprises: (g) When the difference between the change in the first observed value and the change in the second observed value is greater than the target value, execute a corresponding processing program. 3. A probe position monitoring method, characterized in that, comprising the following steps: (a) raising an elevating platform so that an object to be measured on the elevating platform contacts at least one probe device, and a moment arm of the at least one probe device is deformed under force; (b) confirming that the at least one probe device is in electrical contact with the object under test by using a contact sensing circuit, so as to stop the lifting platform; (c) using a test circuit to input a current to the object under test to detect the electrical and optical properties of the object under test; (d) While detecting the electrical and optical properties of the object under test, use at least one deformation sensing loop to electrically connect at least one sensing element on the arm, and generate at least one sensor element according to the deformation of the arm Observation changes; and (e) Using the at least one deformation sensing loop to continuously monitor the change of the at least one observed value while detecting the electrical and optical properties of the object to be tested. 4. The probe position monitoring method as claimed in claim 3, wherein after step (e), further comprising: (f) When the difference in the change of the observed value is greater than a target value, execute a corresponding processing program.