TW201405152A - Pneumatic testing apparatus and testing equipment implementing the same - Google Patents

Abstract

Disclosed is a pneumatic testing apparatus and testing equipment implementing the same. The testing apparatus is provided with a support that may be installed on a machine bed. A testing mechanism, at least one support carrier and a pressure generation mechanism are arranged on the support. The testing mechanism is installed below the support carrier, and is provided with at least one probe set and a testing circuit board for testing an electronic member. The at least one support carrier bears the electronic member thereabove, and when the support carrier or the testing mechanism displaces in an axial direction, the probe set of the testing mechanism is caused to electrically contact the electronic member. The pressure generation mechanism is provided with at least one pressure cover and pressure supplying set above the support carrier, for introducing appropriate pressure to press down the electronic member, so as to maintain the electronic member to electrically contact the probe set of the testing mechanism for implementing a testing process in a contactless and pneumatic pressing manner, such that highly practical benefits of preventing the electronic member from damages and improving the testing quality may be achieved.

Description

Pneumatic test device and test equipment for its application

In particular, the present invention provides a test apparatus for positioning an electronic component in a non-contact air pressure pressing manner and performing a test operation by electrically contacting the electronic component with the probe set to prevent damage of the electronic component and improve test quality. .

Nowadays, electronic components such as memory cards and ICs are packaged on the back-end packaging process by placing a plurality of well-tested wafers on a circuit board or lead frame for die bonding, soldering and packaging, and cutting/forming. In the final test and packaging, in order to ensure the quality of the electronic components, the manufacturer performs separate testing operations after the wire bonding operation and the sealing operation to screen out defective products. Taking the memory card 10 as an example, please refer to Figure 1. The wire bonding operation of the back-end packaging process carries a plurality of wafers 12 on the strip-shaped circuit board 11, and a bonding wire is placed between the circuit board 11 and each of the wafers 12, so that the circuit of the circuit board 11 can be electrically connected to the wafer 12. The connection is made to transmit the signal. Therefore, each of the wafers 12 and the bonding wires are exposed on the circuit board 11. The packaging operation is performed on the outer surface of the wafer 12 to cover the colloid 13 to prevent the wafer 12 from being damaged, and then cut/formed into individual singles. The memory card 10 is finished.

However, the current memory card testing machine tests the memory card of the completed colloidal package; please refer to Figures 2 and 3, the test machine is equipped with a plurality of testing devices 20 on the machine table, and each testing device 20 is attached to the machine. A test circuit board 21 of a plurality of test sockets 22 is provided on the stage for testing the memory card 10 with a gel package. Each test socket 22 has a plurality of probes 221 and is respectively connected to a card reader 23 for Read the data of the memory card 10 to be tested, and each card reader 23 is connected to a controller 24 (the controller can be a computer with a detection program, a control program, etc.) for detecting whether the memory card 10 is damaged or not, and The contact point of the memory card 10 is electrically connected to the probe 221 of the test seat 22, and a crimping mechanism is respectively disposed above each test device 20. Each crimping mechanism is provided with a Z-axis driven by the lifting drive source 25. The pressure rod 26 is displaced downward, and the lower pressing head 27 is assembled at the end of the lower pressing rod 26, and the memory card 10 to be tested is pressed by the following; therefore, when the test socket 22 is built into the memory card 10 to be tested, The crimping mechanism controls the lifting drive source 25 The lower pressing rod 26 is driven to be displaced downward in the Z-axis, so that the lower pressing rod 26 drives the lower pressing head 27 to perform Z-axis displacement and presses the memory card 10 to be tested, so that the contact of the memory card 10 to be tested is indeed tested. The probe 22 of the seat 22 is in contact with the test operation; however, since the packaged memory card 10 is coated with a colloid on the outside to protect the internal wafer and the bonding wire, when the test device 20 is pressed by the crimping mechanism When the memory card 10 is pressed down by the first head 27, it is pressed against the colloid of the memory card 10, and the wafer and the bonding wire of the memory card 10 are not damaged, but for the unpackaged semi-finished memory card, the wafer and the soldering on the circuit board. The line is exposed and there is no colloid protection. If the test device 20 directly presses the unpackaged semi-finished memory card with the indenter 27 under the crimping mechanism, it will be pressed against the wafer and the bonding wire, causing the wafer and the bonding wire. The damage is missing, so the test device 20 cannot test the unpackaged semi-finished memory card.

Therefore, how to design a test device that can position the unpackaged semi-finished electronic components and contact the test socket to prevent damage to the electronic components and improve the test quality is the standard designed by the manufacturer.

An object of the present invention is to provide a pneumatic testing device, which is provided with a socket that can be disposed on a machine table, and is equipped with a testing mechanism, at least one carrier and a pneumatic generating mechanism on the socket. The testing mechanism is provided with at least one probe set and a test circuit board for testing electronic components, the at least one carrier is for carrying electronic components, and the probe set can be made when the carrier or the test mechanism is axially displaced. Contacting the electronic component, the air pressure generating mechanism is provided with at least one pressure cover and a gas pressure supply group above the carrier to press the electronic component under a suitable air pressure; thereby, the non-contact air pressure pressing method can be used. The electronic component maintains electrical contact with the probe set of the test mechanism to perform test operations, thereby achieving practical benefits of preventing damage to the electronic component and improving test quality.

A second object of the present invention is to provide a testing device using a pneumatic testing device, which is provided with a feeding device, a receiving device, a testing device, a conveying device and a central control device, which are used in the feeding device. The receiving device is configured to accommodate at least one electronic component to be tested, and the receiving device is configured to transfer between the feeding device, the receiving device and the testing device to be tested/completed. Measured The electronic control unit is configured to control and integrate the operation of each device to perform an automated operation. The test device is mounted on the socket with a test mechanism, a carrier and a pneumatic generating mechanism, and the testing mechanism is provided with at least one a probe set and a test circuit board for testing electronic components, the carrier is used to carry electronic components, and can be axially displaced relative to the probe set of the test mechanism, so that the electrical contact of the electronic components is tested. The testing operation is performed by the probe of the mechanism, and the air pressure generating mechanism presses the electronic component on the carrier in a non-contact air pressure pressing manner, thereby achieving the practical benefit of preventing the electronic component from being damaged and improving the test quality.

For a better understanding of the present invention by the reviewing committee, a preferred embodiment and a drawing will be described in detail as follows: Please refer to Figures 4 and 5, which are the first embodiment of the testing device of the present invention. The testing device 30 of the embodiment includes a socket 31, a testing mechanism 32, at least one carrier 33 and a gas pressure generating mechanism 34. The carrier 33 is placed at a position above the socket 31, and the carrier 33 is opposite to the electronic component. A through hole 331 is formed in the position of the electrical contact. In order to increase the bearing strength of the carrier 33, the present embodiment is provided with a plurality of reinforcing ribs 332 at a position where the carrier 33 does not have the through hole 331, and Ensure that the top surface and the bottom surface of the electronic component to be tested have a pressure difference. At the position where the carrier 33 does not have the through hole 331, a plurality of air passages 333 communicating with the outside are additionally provided. In this embodiment, the plurality of air passages are provided. The 333 series is spaced apart from the reinforcing ribs 332. The test mechanism 32 is disposed in the accommodating space between the socket 31 and the carrier 33, and is provided with at least one test circuit board 321 and a probe set 322 for testing electronic components. The probe set 322 is stretched. In the through hole 331 of the carrier 33, in order to make the probe set 322 protrude from the through hole 331 to contact the electrical contacts of the electronic component, the test mechanism 32 can be axially displaced relative to the carrier 33. In this embodiment, the testing mechanism 32 is disposed on the first lifter 323, and can be lifted by the first lifter 323, so that the probe set 322 protrudes from the through hole 331 to contact the electrical contact of the electronic component. . The air pressure generating mechanism 34 is provided with at least one pressure cover 341 and a pneumatic pressure supply group 342. The pressure cover 341 is driven by the second lifter 343 to lift and lower the cover. In the upper position of the belt 33, the air supply unit 342 is provided with a through inlet 344 on the pressure cover 341, and the inlet 344 is connected to a pneumatic source via a line 345 and a pressure regulating valve 346 which can be a mechanical or electronic type. After the pressure cover 341 is overlaid on the upper position of the carrier 33, an appropriate air pressure is input; in order to stably input the appropriate air pressure and prevent direct dust from contaminating the electronic component, in the present embodiment, the access opening 344 is provided in The lateral position of the pressure cover 341. In addition, in order to enable the electronic component to be stably placed on the carrier 33 in the initial stage, in the embodiment, an auxiliary positioning mechanism 35 is provided, and the auxiliary positioning mechanism 35 is provided with a transparent type that is driven by the lifter. In the present embodiment, the permeable frame 351 is vacant, and only the frame 351 is provided at the bottom to press against the outer frame of the electronic component, so that the frame is not pressed. In the present embodiment, the frame 351 is erected in the pressure cover 341 by the elastic member 352 and the guiding member 353, and is simultaneously lifted and lowered by the second lifter 343.

Referring to FIG. 6 , when the circuit board 100 with the chip 101 (such as an unpackaged semi-finished memory card) is to be tested, the circuit board 100 with the wafer 101 can be first placed on the corresponding position of the carrier 33 by using a robot arm, and The electrical contact is made to correspond to the through hole 331 of the carrier 33, and then the second cover 343 is used to drive the pressure cover 341 and the transparent frame 351 to descend, and the circuit board 100 with the chip 101 is covered in the pressure cover 341. And the vacant frame 351 is used to assist the outer frame of the circuit board 100. At this time, since the circuit board 100 is placed above the carrier 33, the through hole 331 of the carrier 33 and the air passage 333 are closed, so When the inlet port 344 is input with an appropriate gas pressure (at least greater than 1 atm) by the air pressure source, since the bottom surface of the circuit board 100 is closed to the outside and has the same 1 atm through hole 331 and the air passage 333 as the outside, the top of the circuit board 100 is caused. A pressure difference is generated between the surface and the bottom surface, and the space of the pressure cover 341 is pressed against the top surface of the circuit board 100 with a large pressure, so that the bottom surface of the circuit board 100 is surely attached to the carrier 33.

Referring to FIG. 7, when the electrical contact of the circuit board 100 is pressed by the upper air pressure, the test mechanism 32 is then driven up by the first lifter 323. The probe set 322 protrudes from the through hole 331 and contacts the electrical contact of the circuit board 100. Since the upper portion of the circuit board 100 is pressed by a relatively large air pressure, when the probe set 322 of the test mechanism 32 rises and contacts the circuit board. At the electrical contact of 100, the circuit board 100 can still maintain stable positioning, and the electrical contact maintains stable contact with the probe set 322 to perform a test operation, and then in a non-contact air pressure pressing manner. The unpackaged circuit board 100 is pressed to prevent the circuit board 100 from being damaged, thereby achieving the practical benefit of improving the test quality.

Referring to FIG. 8, a second embodiment of the testing device of the present invention includes a socket 31A, a testing mechanism 32A, at least one carrier 33A, and a pneumatic generating mechanism 34A; The carrier 33A is disposed at a position above the socket 31A, and the carrier 33A is provided with a through hole 331A at a position of the electrical contact of the electronic component. In order to increase the bearing strength of the carrier 33A, the embodiment does not support the carrier 33A. A plurality of reinforcing ribs 332A are disposed at the position of the through hole 331A. In addition, in order to assist in ensuring a pressure difference between the top surface and the bottom surface of the electronic component to be tested, a plurality of additional positions are provided at the position where the carrier 33A does not have the through hole 331A. In the present embodiment, the plurality of air passages 333A are spaced apart from the reinforcing ribs 332A. The test mechanism 32A is fixed in the accommodating space between the socket 31A and the carrier 33A, and is provided with at least one test circuit board 321A and a probe set 322A for testing electronic components, because the probe of the test mechanism 32A The group 322A is inserted into the through hole 331A of the carrier 33A. In order to make the probe set 322A protrude from the through hole 331A to contact the electrical contacts of the electronic component, the test mechanism 32A and the carrier 33A can be made. In the present embodiment, the carrier 33A is coupled to the first lifter 334A, and can be driven down by the first lifter 334A, so that the probe set 322A protrudes out of the through hole 331A to contact the electronic component. Electrical contacts. The air pressure generating mechanism 34A is provided with at least one pressure cover 341A and a pneumatic pressure supply group 342A. The pressure cover 341A is lifted and lowered by the second lifter 343A, and covers the upper position of the carrier 33A, and the air pressure supply group 342A is attached to The pressure cover 341A is provided with a through inlet 344A, and the inlet 344A is via a conduit 345A and can be a mechanical or electronic pressure regulating valve 346. A is connected to a pressure source, and after the pressure cover 341A is overlaid on the upper position of the carrier 33A, the appropriate air pressure is input, in order to stably input the appropriate air pressure and avoid direct dust pollution to the electronic component, in this embodiment, The through port 344A is provided at a lateral position of the pressure cover 341A. In this embodiment, in order to enable the electronic component to be stably placed on the carrier 33A in the initial stage, in the embodiment, an auxiliary positioning mechanism 35A is further provided, and the auxiliary positioning mechanism 35A is provided with a lifting device to drive the lifting and lowering. In the present embodiment, the permeable frame 351A is vacant, and only the frame 351A is provided at the bottom to press against the outer frame of the electronic component, so that the pressure is not pressed. In the present embodiment, the frame 351A is erected in the pressure cover 341A by the elastic member 352A and the guiding member 353A, and is simultaneously provided by the second. The lifter 343A drives the lift.

Referring to FIG. 9, when the circuit board 100 with the chip 101 (such as an unpackaged semi-finished memory card) is to be tested, the circuit board 100 with the chip 101 can be placed first in the corresponding position of the carrier 33A by using a robot arm. The electrical contact is made to correspond to the through hole 331A of the carrier 33, and then the pressure cover 341A and the transparent frame 351A are lowered by the second lifter 343A, and the circuit board 100 with the chip 101 is covered on the pressure cover 341A. And the outer frame of the circuit board 100 is assisted by the permeable frame 351A. At this time, since the circuit board 100 is placed above the carrier 33A, the through hole 331A and the air passage 333A of the carrier 33A are closed. Then, when the inlet port 344A is input with an appropriate gas pressure (at least greater than 1 atm) by the air pressure source, the bottom surface of the circuit board 100 is closed to the outside and has the same 1 atm through hole 331A and the air passage 333A, resulting in the circuit board 100. A pressure difference is generated between the top surface and the bottom surface, and the top surface of the circuit board 100 is pressed with a large pressure in the space of the pressure cover 341A, so that the bottom surface of the circuit board 100 is surely attached to the carrier 33A.

Referring to FIG. 10, after the electrical contact of the circuit board 100 is pressed by the upper air pressure, the first lifter 334A drives the carrier 33A to descend, and the second lifter 343A simultaneously drives the pressure cover 341A to descend. The needle set 322A can protrude from the through hole 331A to contact the electrical contact of the electronic component, The upper portion of the circuit board 100 is pressed by a relatively large air pressure. Therefore, when the probe set 322A of the test mechanism 32A contacts the electrical contacts of the circuit board 100, the circuit board 100 can still maintain stable contact with the probe set 322A. In order to perform the test operation, the unpackaged circuit board 100 is pressed in a non-contact air pressure pressing manner to prevent the circuit board 100 from being damaged, thereby achieving the practical benefit of improving the test quality.

Referring to FIG. 11, a third embodiment of the testing device of the present invention includes a socket 31B, a testing mechanism 32B, at least one carrier 33B, and a gas pressure generating mechanism 34B. A guiding member 311B and an elastic member 312B are disposed on the seat 31B, and the bearing member 33B is sleeved on the guiding member 311B and pressed against the elastic member 312B, so that the carrier 33B is placed above the bearing seat 31B, and the carrier 33B A through hole 331B is formed in the position of the electrical contact of the electronic component. In order to increase the bearing strength of the carrier 33B, the present embodiment is provided with a plurality of reinforcing ribs 332B at a position where the carrier 33B does not have the through hole 331B. In addition, in order to ensure that the top surface and the bottom surface of the electronic component to be tested have a pressure difference, a plurality of air passages 333B communicating with the outside are additionally disposed at a position where the carrier 33B does not have the through hole 331B. In this embodiment, A plurality of air passages 333B are spaced apart from the reinforcing ribs 332B. The test mechanism 32B is fixed in the accommodating space between the socket 31B and the carrier 33B, and is provided with at least one test circuit board 321B and a probe set 322B for testing electronic components, due to the probe of the test mechanism 32B. The group 322B is inserted into the through hole 331B of the carrier 33B. In order to make the probe set 322B protrude from the through hole 331B to contact the electrical contacts of the electronic component, the test mechanism 32B and the carrier 33B can be made. The air pressure generating mechanism 34B is provided with at least one pressure cover 341B and a pneumatic pressure supply group 342B. The pressure cover 341B is lifted and lowered by the lifter 343B, and covers the upper position of the carrier 33B, and the air pressure is supplied. The group 342B is provided with a through inlet 344B on the pressure cover 341B, and the inlet 344B is connected to a pneumatic source via a line 345B and a mechanical or electronic pressure regulating valve 346B for covering the pressure cover 341B. After the upper position of the carrier 33B, the appropriate air pressure is input, in order to stably input the appropriate air pressure and to avoid direct dust pollution of the electronic component, in the present embodiment, the access port 34 4B is provided at a side position of the pressure cover 341B. In this embodiment, in order to enable the electronic component to be stably placed on the carrier 33B in the initial stage, in the embodiment, an auxiliary positioning mechanism 35B is further provided, and the auxiliary positioning mechanism 35B is provided with a lifting device for lifting and lowering. In the present embodiment, the permeable frame 351B is vacant, and only the frame 351B is provided at the bottom to press against the outer frame of the electronic component, so that the pressure is not pressed. In the present embodiment, the frame 351B is erected in the pressure cover 341B by the elastic member 352B and the guiding member 353B, and is simultaneously lifted by the lifter. 343B drives the lift.

Referring to FIG. 12, when the circuit board 100 with the chip 101 (such as an unpackaged semi-finished memory card) is to be tested, the circuit board 100 with the chip 101 can be first placed on the corresponding position of the carrier 33B by using a robot arm. The electrical contact is made to correspond to the through hole 331B of the carrier 33, and then the pressure cover 341B and the transparent frame 351B are lowered by the lifter 343B, and the circuit board 100 with the chip 101 is covered in the pressure cover 341B. And the vacant frame 351B is used to assist the outer frame of the circuit board 100. At this time, since the circuit board 100 is placed above the carrier 33B, the through hole 331B and the air passage 333B of the carrier 33B are closed, so After the inlet 344B is input to the appropriate gas pressure (at least greater than 1 atm) by the air pressure source, the top surface of the circuit board 100 is caused by the bottom surface of the circuit board 100 being closed to the outside and having the same 1 atm through hole 331B and the air passage 333B. A pressure difference is generated from the bottom surface, and the top surface of the circuit board 100 is pressed with a large pressure in the space of the pressure cover 341B, so that the bottom surface of the circuit board 100 is surely attached to the carrier 33B.

Referring to FIG. 13 , after the electrical contact of the circuit board 100 is pressed by the upper air pressure, the lifter 343B continues to drive the pressure cover 341B to descend, and the carrier 33B is pressed down, and the probe set 322B can be protruded. The through hole 331B contacts the electrical contact of the electronic component, and since the upper portion of the circuit board 100 is pressed by the relatively large air pressure, when the probe set 322B of the test mechanism 32B contacts the electrical contact of the circuit board 100, the circuit The plate 100 can still maintain stable contact with the probe set 322B to perform a test operation, thereby pressing the non-contact air pressure The unpackaged circuit board 100 is pressed down to prevent the circuit board 100 from being damaged, thereby achieving the practical benefit of improving the test quality.

14 is a fourth embodiment of the testing device of the present invention. The testing device 30C of the fourth embodiment includes a socket 31C, a testing mechanism 32C, at least one carrier 33C, and a pneumatic generating mechanism 34C. The 33C frame is placed at a position above the socket 31C, and the carrier 33C is provided with a through hole 331C at a position of the electrical contact of the electronic component. In order to increase the bearing strength of the carrier 33C, the embodiment is provided on the carrier 33C. A plurality of reinforcing ribs 332C are disposed at positions where the through holes 331C are not provided, and in order to assist in ensuring a pressure difference between the top surface and the bottom surface of the electronic component to be tested, a plurality of additional positions are provided at the position where the carrier 33 does not have the through holes 331C. In the present embodiment, the plurality of air passages 333C are spaced apart from the reinforcing ribs 332C. The test mechanism 32C is disposed in the accommodating space between the socket 31C and the carrier 33C, and is provided with at least one test circuit board 321C and a probe set 322C for testing electronic components. The probe set 322C is protruding. The through hole 331C is formed to contact the electrical contact of the electronic component. The air pressure generating mechanism 34C is provided with at least one pressure cover 341C and a pneumatic pressure supply group 342C. The pressure cover 341C is moved in three directions by the transfer 343C, and the air pressure supply group 342C is connected to the pressure cover 341C. The inlet 344C is connected to a pneumatic source via a line 345C and a mechanical or electronic pressure regulating valve 346C, wherein the air pressure source is switchable to make the pressure cover 341C negative or positive. In the pressure state, when the pressure cover 341C is in a negative pressure state, it can be used as an adsorption transfer electronic component. When the pressure cover 341C is in a positive pressure state, the pressure cover 341C is overlaid on the upper position of the carrier 33C, and then input. Press the unpacked circuit board with the appropriate air pressure.

Referring to FIG. 15 , when testing the circuit board 100 with the chip 101 (such as an unpackaged semi-finished memory card), the air pressure source can be switched first to make the pressure cover 341C under negative pressure, and the pressure cover 341C is used to carry the wafer. The circuit board 100 of 101 is first adsorbed and transferred over the corresponding position of the carrier 33C, and the electrical contact corresponds to the probe set 322C in the through hole 331C of the carrier 33C.

Referring to FIG. 16, the pressure mask 341C places the circuit board 100 at a corresponding position of the carrier 33C and switches the selected air pressure source to make the pressure cover 341C in a positive pressure state. At this time, since the circuit board 100 is placed above the carrier 33C. The through hole 331C and the air passage 333C of the carrier 33C are closed, so that when the inlet 344C is input with an appropriate air pressure (at least greater than 1 atm) by the air pressure source, since the bottom surface of the circuit board 100 is closed to the outside, it is the same as the outside. The through hole 331C of the 1 atm and the air passage 333C cause a pressure difference between the top surface and the bottom surface of the circuit board 100C, and the space of the pressure cover 341C is pressed against the top surface of the circuit board 100 with a large pressure, so that the bottom surface of the circuit board 100 It is indeed attached to the carrier 33C, and the electrical contacts of the circuit board 100 are in contact with the probe set 322C of the test mechanism 32C to perform a test operation, and then the unpackaged circuit is pressed in a non-contact air pressure manner. The board 100 prevents the circuit board 100 from being damaged and achieves the practical benefit of improving the test quality.

Please refer to FIGS. 17 and 18 , which are test classifiers for applying the test device of the first embodiment, and the test sorter includes an organic table 40 , a feeding device 50 , a receiving device 60 , a testing device 30 , a conveying device 70 , and The central control device, further, the feeding device 50 is disposed on the machine table 40 for accommodating at least one electronic component to be tested. In the embodiment, the feeding device 50 is provided with the first bearing on the upper layer. The mechanism 51 and the second carrier mechanism 52 at the lower layer are provided with a transporting member that can be driven by a driving source. In this embodiment, the driving source can be a first motor 511 for driving The conveying member of the first pulley set 512 causes the first pulley set 512 to transport a plurality of magazines 80 for Y-axis displacement, and each of the magazines 80 holds a plurality of circuit boards of the chip to be tested, and the second carrier mechanism 52 is provided. There is a transporting member that can be driven by the driving source. In this embodiment, the driving source can be a second motor 521 for driving a conveying member of the second pulley set 522, so that the second pulley set 522 transports a plurality of empty ones. Material 匣80 for Y axial displacement; The device 60 is disposed on the machine 40 for accommodating at least one electronic component that is inspected. In the embodiment, the receiving device 60 is provided with a third carrier mechanism 61 located at the upper layer and a fourth carrier mechanism at the lower layer. 62, its third The carrying mechanism 61 is provided with a conveying member that can be driven by a driving source. In the embodiment, the driving source can be a third motor 611 for driving a conveying member of the third pulley set 612 to make the third pulley set 612. The plurality of empty magazines 81 are transported for Y-axis displacement for holding a plurality of circuit boards for measuring the test chip, and the fourth carrier mechanism 62 is provided with a transport member that can be driven by the driving source. In this embodiment, the The driving source may be a fourth motor 621 for driving a conveying member of the fourth pulley set 622, so that the fourth pulley set 622 transports a plurality of magazines 81 for Y-axis displacement, and each material 匣 81 is loaded with a plurality of ends. a test board of the test chip; the test device 30 is the same as the test device of the first embodiment described above (please refer to FIGS. 4 and 5), and is disposed on the machine 40 for testing at least one electronic component and The tester (not shown) transmits the test result to a central control device (not shown), and the central control device controls each device to operate; in the embodiment, the test device 30 is used to test the circuit with the chip. a plate; the conveying device 70 is disposed on the machine 40 The electronic component to be tested/completed is transferred between the feeding device 50, the testing device 30 and the receiving device 60, and further, the conveying device 70 is provided with at least one transfer mechanism, the transfer mechanism having at least A transfer device driven by the driving source for at least one axial displacement causes the transfer device to transfer the electronic component to be tested/completed between the feeding device 50, the testing device 30 and the receiving device 60. In this embodiment, A first transfer mechanism 71 is disposed in front of the feeding device 50, and the first transfer mechanism 71 is provided with a first transfer device 712 that can be driven by the first drive source 711 for YZ axial displacement, the first drive source 711 can use the motor to drive the frame of the first transfer device 712 to perform Y-axis displacement through the pulley set, and then drive the first transfer device 712 to perform Z-axis displacement by using the pressure cylinder, and the first transfer device 712 can be a clamp. The pick-up device is configured to take out the magazine 80 with the circuit board to be tested at the first bearing mechanism 51 of the feeding device 50, and transfer the empty magazine 80 to the second bearing mechanism 52 for assembly. The second transfer mechanism 72 on the side of the first transfer mechanism 71, and the second transfer mechanism 72 are provided with a second drive A source driver 721 for axial displacement of the second transfer X 722, a second driving source 721 may drive the second transfer 722 for axial displacement of the X group by a motor via a pulley, the second transfer 722 may ejector, The board to be tested in the magazine 80 on the first transfer mechanism 71 is moved to the first temporary area, a third transfer mechanism 73 in the first temporary area, and the third transfer mechanism 73 The third transfer device 732 is configured to be driven by the third driving source 731 for X-axis displacement. The third driving source 731 can drive the third transfer device 732 to perform X-axis displacement by the motor through the pulley set. The third transfer device 732 The utility model can be a gripper for holding the circuit board of the chip to be tested at the first temporary area, and transferring the circuit board to the testing device 30, the conveying device 70 is disposed on the other side of the testing device There is a second temporary storage area, and a fourth transfer mechanism 74 is disposed in the second temporary storage area, and the fourth transfer mechanism 74 is provided with a fourth transfer device 742 that can be driven by the fourth driving source 741 for X-axis displacement. The fourth driving source 741 can drive the fourth transfer device 742 to perform X-axis displacement by the motor through the pulley set, and the fourth transfer device 742 can be a gripper for clamping the test tool chip at the testing device 30. a circuit board, and the circuit board is transferred to the second temporary storage area, a fifth transfer mechanism 75 disposed in front of the receiving device 60, The transfer mechanism 75 is provided with a fifth transfer device 752 that can be driven by the fifth drive source 751 for YZ axial displacement, and the fifth drive source 751 can drive the frame of the fifth transfer device 752 via the pulley set by the motor. The Y-axis displacement is performed, and the fifth transfer 752 is driven by the cylinder to perform Z-axis displacement. The fifth transfer 752 can be a gripper for taking out the empty position at the third bearing mechanism 61 of the receiving device 60. The magazine 81 transfers the magazine 81 containing the circuit board to the fourth bearing mechanism 62, and a sixth transfer mechanism 76 located on the side of the fifth transfer mechanism 75. The sixth transfer mechanism 76 The sixth transfer device 762 is driven by the sixth driving source 761 for X-axis displacement, and the sixth driving source 761 can drive the sixth transfer device 762 to perform X-axis displacement by the motor through the pulley set. The sixth transfer device The 762 can be an ejector for displacing the circuit board of the test fixture chip in the second temporary area to the material 匣 81 clamped by the fifth transfer mechanism 75, and further, for visual test operation. An image capturing device 90 is disposed at the conveying device 70 for detecting whether there is a missing wafer on the circuit board to be tested. In the embodiment, the image capturing device 90 is disposed above the first temporary holding area, and the image capturing device 90 is provided with at least one image capturing device for the CCD 91 for capturing the image of the circuit board. The material is transferred to the central control unit.

Referring to FIG. 19, the conveying device 70 controls the first driving source 711 of the first transfer mechanism 71 to drive the first transfer device 712 for YZ axial displacement to be taken out at the first bearing mechanism 51 of the feeding device 50. The magazine 80 of the circuit board 100 of the wafer 101 to be tested is mounted, and then the second driving source 721 of the second transfer mechanism 72 is controlled to drive the second conveyor 722 for X-axis displacement, and the first transfer mechanism 71 is mounted. The circuit board 100 in the magazine 80 is moved to the first temporary area, and the image capturing device 90 captures the image of the circuit board 100 by using the CCD 91, and transmits the image data to the central control device to detect the circuit board 100. Is there a missing wafer; please refer to Figures 20 and 21 (and with reference to Figures 6 and 7), the third transfer mechanism 73 drives the third transfer 732 to the X-axis displacement by the third drive source 731. The circuit board 100 to be tested is clamped at the first temporary area, and the circuit board 100 is transferred to the carrier 33 of the testing device 30. When the carrier 33 of the testing device 30 carries the circuit board 100 of the chip 101 to be tested. The second lifter 343 can be controlled to drive the pressure cover 341 and the transparent frame 351 to descend, and the circuit with the chip 101 100 is covered in the pressure cover 341, and is pressed against the outer frame of the circuit board 100 by the transparent frame 351. Then, after the inlet 344 is input with an appropriate air pressure (at least greater than 1 atm) by the air pressure source, the pressure cover 341 The space is pressed against the top surface of the circuit board 100 with a large pressure, so that the bottom surface of the circuit board 100 is fixedly attached to the carrier 33 without damaging the wafer 101 and the bonding wires on the circuit board 100. In turn, the damage rate of the component can be reduced. After the electrical contact of the circuit board 100 is pressed against the upper air pressure, the test mechanism 32 is then driven up by the first lifter 323, so that the probe set 322 protrudes out of the through hole 331 and contacts the circuit board 100. The electrical contact is stable because the probe set 322 of the test mechanism 32 rises into contact with the electrical contacts of the circuit board 100. The electrical contact is kept in stable contact with the probe set 322 to perform a test operation, and then the unpackaged circuit board 100 is pressed in a non-contact air pressure pressing manner to prevent the circuit board 100 from being damaged. Improve the practical benefits of test quality.

Referring to FIG. 22, after the test is completed, the conveying device 70 can control the fourth driving source 741 of the fourth transfer mechanism 74 to drive the fourth transfer device 742 for X-axis displacement to be clamped at the testing device 30. The circuit board 100 of the test tool chip 101 is transferred to the second temporary area. At this time, the fifth transfer mechanism 75 drives the fifth transfer unit 752 to the YZ axis by the fifth driving source 751. Displacement, the empty magazine 81 is taken out at the third bearing mechanism 61 of the receiving device 60; referring to Fig. 23, the sixth driving source 761 of the sixth transfer mechanism 76 drives the sixth conveyor 762 as the X-axis. To the displacement, the circuit board 100 in which the test piece wafer 101 is completed in the second temporary stage is moved to the magazine 81 held by the fifth transfer mechanism 75.

Accordingly, the present invention is a practical and progressive design, but it has not been disclosed that the same products and publications are disclosed, thereby permitting the invention patent application requirements, and applying in accordance with the law.

Conventional part:

10‧‧‧ memory card

11‧‧‧ boards

12‧‧‧ wafer

13‧‧‧ colloid

20‧‧‧Testing device

21‧‧‧Test circuit board

22‧‧‧ test seat

221‧‧‧ probe

23‧‧‧Card Reader

24‧‧‧ Controller

25‧‧‧ Lifting drive source

26‧‧‧lower bar

27‧‧‧Under the indenter

Part of the invention:

30‧‧‧Testing device

31‧‧‧ 承座

32‧‧‧Test institutions

321‧‧‧Test circuit board

322‧‧‧ probe set

323‧‧‧First lifter

33‧‧‧Carriage

331‧‧‧through hole

332‧‧‧ reinforcing ribs

333‧‧‧Airway

34‧‧‧Pneumatic generating mechanism

341‧‧‧ Pressure hood

342‧‧‧Pneumatic Supply Group

343‧‧‧Second lifter

344‧‧‧ entrance

345‧‧‧pipe

346‧‧‧pressure regulator

35‧‧‧Auxiliary positioning mechanism

351‧‧‧ framed

352‧‧‧Flexible parts

353‧‧‧Guide

30A‧‧‧Testing device

31A‧‧‧ Seat

32A‧‧‧Test institutions

321A‧‧‧ test board

322A‧‧‧ probe set

33A‧‧‧Carrier

331A‧‧‧through hole

332A‧‧‧ reinforcing ribs

333A‧‧ Airway

334A‧‧‧First lifter

34A‧‧‧Pneumatic generating mechanism

341A‧‧‧ Pressure hood

342A‧‧‧Pneumatic Supply Group

343A‧‧‧Second lifter

344A‧‧‧ entrance

345A‧‧‧pipe

346A‧‧‧pressure regulator

35A‧‧‧Auxiliary positioning mechanism

351A‧‧‧ framed

352A‧‧‧Flexible parts

353A‧‧‧Guide

30B‧‧‧Testing device

31B‧‧‧ Seat

311B‧‧‧Guide

312B‧‧‧Flexible parts

32B‧‧‧Test institutions

321B‧‧‧ test circuit board

322B‧‧‧ probe set

33B‧‧‧Carrier

331B‧‧‧through hole

332B‧‧‧ reinforcing ribs

333B‧‧ Airway

34B‧‧‧Pneumatic generating mechanism

341B‧‧‧ Pressure hood

342B‧‧‧Pneumatic Supply Group

343B‧‧‧ Lifter

344B‧‧‧ entrance

345B‧‧‧pipe

346B‧‧‧pressure regulator

35B‧‧‧Auxiliary positioning mechanism

351B‧‧‧ framed

352B‧‧‧Flexible parts

353B‧‧‧Guide

30C‧‧‧Testing device

31C‧‧‧ Seat

32C‧‧‧Test institutions

321C‧‧‧ test circuit board

322C‧‧‧ probe set

33C‧‧‧Carrier

331C‧‧‧through hole

332C‧‧‧ reinforcing ribs

333C‧‧‧Airway

34C‧‧‧Pneumatic generating mechanism

341C‧‧‧ Pressure hood

342C‧‧‧Pneumatic Supply Group

343C‧‧‧Transporter

344C‧‧‧ entrance

345C‧‧‧ pipeline

346C‧‧‧pressure regulator

40‧‧‧ machine

50‧‧‧Feeding device

51‧‧‧First carrying mechanism

511‧‧‧First motor

512‧‧‧First pulley set

52‧‧‧Second bearing mechanism

521‧‧‧second motor

522‧‧‧Second pulley set

60‧‧‧ receiving device

61‧‧‧ Third bearing mechanism

611‧‧‧third motor

612‧‧‧The third pulley set

62‧‧‧fourth bearing mechanism

621‧‧‧fourth motor

622‧‧‧Fourth pulley set

70‧‧‧Conveyor

71‧‧‧First transfer mechanism

711‧‧‧First drive source

712‧‧‧First Transferr

72‧‧‧Second transfer mechanism

721‧‧‧second drive source

722‧‧‧Second transfer

73‧‧‧ Third transfer mechanism

731‧‧‧ Third drive source

732‧‧‧ Third Transfer

74‧‧‧fourth transfer mechanism

741‧‧‧fourth drive source

742‧‧‧fourth transfer

75‧‧‧ fifth transfer mechanism

751‧‧‧ fifth drive source

752‧‧‧ fifth transfer device

76‧‧‧ sixth transfer mechanism

761‧‧‧ sixth drive source

762‧‧‧ sixth transfer

80‧‧‧materials

81‧‧‧materials

90‧‧‧Image capture device

91‧‧‧CCD

100‧‧‧ boards

101‧‧‧ wafer

Figure 1: Schematic diagram of the memory card and the memory card of the package.

Figure 2: Schematic diagram of a conventional test device.

Figure 3: Schematic diagram of the use of a conventional test device.

Figure 4 is a schematic view showing a first embodiment of the test apparatus of the present invention.

Figure 5 is a plan view of a first embodiment of the test device of the present invention.

Figure 6 is a schematic view showing the use of the first embodiment of the test apparatus of the present invention (I).

Figure 7 is a schematic view showing the use of the first embodiment of the test apparatus of the present invention (2).

Figure 8 is a schematic view showing a second embodiment of the test apparatus of the present invention.

Figure 9 is a schematic view showing the use of the second embodiment of the test apparatus of the present invention (I).

Figure 10 is a schematic view showing the use of the second embodiment of the test apparatus of the present invention (2).

Figure 11 is a schematic view showing a third embodiment of the test apparatus of the present invention.

Figure 12 is a schematic view showing the use of the third embodiment of the test apparatus of the present invention (I).

Figure 13 is a schematic view showing the use of the third embodiment of the test apparatus of the present invention (2).

Figure 14 is a schematic view showing a fourth embodiment of the test apparatus of the present invention.

Figure 15 is a schematic view showing the use of the fourth embodiment of the test apparatus of the present invention (I).

Figure 16 is a schematic view showing the use of the fourth embodiment of the test apparatus of the present invention (2).

Figure 17: Schematic diagram of the test device of the present invention applied to a test sorter.

Figure 18 is a schematic view of the supply and receiving device of the present invention.

Figure 19: Schematic diagram of the use of the test sorter of the present invention (1).

Figure 20: Schematic diagram of the use of the test sorter of the present invention (2).

Figure 21: Schematic diagram of the use of the test sorter of the present invention (3).

Figure 22: Schematic diagram of the use of the test sorter of the present invention (4).

Figure 23: Schematic diagram of the use of the test sorter of the present invention (5).

30‧‧‧Testing device

31‧‧‧ 承座

32‧‧‧Test institutions

321‧‧‧Test circuit board

322‧‧‧ probe set

323‧‧‧First lifter

33‧‧‧Carriage

331‧‧‧through hole

332‧‧‧ reinforcing ribs

333‧‧‧Airway

34‧‧‧Pneumatic generating mechanism

341‧‧‧ Pressure hood

342‧‧‧Pneumatic Supply Group

343‧‧‧Second lifter

344‧‧‧ entrance

345‧‧‧pipe

346‧‧‧pressure regulator

35‧‧‧Auxiliary positioning mechanism

351‧‧‧ framed

352‧‧‧Flexible parts

353‧‧‧Guide

Claims (10)

A pneumatic testing device includes: a bearing; at least one carrier: a frame is placed on the socket for carrying electronic components; and the testing mechanism is provided with at least one test circuit board and a probe set, the probe The needle set is an electrical contact test electronic component; the air pressure generating mechanism is provided with at least one pressure cover and a pneumatic supply group, the pressure cover cover is placed above the carrier, and the air pressure supply group is connected to an air pressure source and input Appropriate air pressure is applied to the pressure hood, and the circuit board is pressed down by a non-contact air pressure. The pneumatic testing device according to claim 1, wherein the carrier is provided with a through hole at a position of an electrical contact of the electronic component, and the probe set of the testing device extends through the carrier. Through holes for electrical contact and testing of electronic components. The pneumatic testing device according to claim 2, wherein the testing mechanism is axially displaced relative to the carrier to electrically contact the probe set and test the electronic component. The pneumatic testing device according to claim 3, wherein the testing mechanism is disposed on the lifter, and the lifter drives the ascending relative axial displacement of the carrier to cause the probe set to protrude. The through hole of the carrier is electrically connected to the electrical contact of the electronic component. The pneumatic testing device according to claim 3, wherein the carrier is provided with a lifter, and the lifter drives the relative axial displacement of the test mechanism to cause the probe set to protrude. A through hole for electrically contacting an electrical contact of the electronic component. According to the pneumatic testing device of claim 1, wherein the pressure generating device of the air pressure generating mechanism is lifted and lowered by a lifter, and covers the upper position of the carrier, and the air pressure supply group is disposed under the pressure cover. There is a pass to enter the appropriate pressure in the pressure hood. The pneumatic testing device according to item 1 of the patent application scope further includes The auxiliary positioning mechanism is provided with a lifting device to drive the through-space frame to descend to press against the outer frame of the electronic component. According to the pneumatic testing device of claim 1, wherein the air pressure source of the air pressure generating mechanism can be switched to make the pressure cover negative or positive pressure, and when the pressure cover is in a negative pressure state, it is used for adsorption. When the electronic component is transferred and the pressure hood is in a positive pressure state, the unsealed circuit board is used. A testing device for applying a pneumatic testing device includes: a machine; a feeding device: configured on the machine to accommodate at least one electronic component to be tested; and a receiving device: configured on the machine For accommodating at least one electronic component to be tested; the pneumatic testing device according to claim 1 of the patent application; the conveying device is disposed on the machine platform for feeding device, testing device and receiving device Transfer electronic components to be tested/tested; central control device: used to control and integrate the operation of each device to perform automated operations. A test apparatus for applying a pneumatic testing device according to claim 9 wherein the conveying device is disposed in front of the feeding device with a first transfer mechanism for taking out electronic components at the feeding device. a second transfer mechanism mounted on the side of the first transfer mechanism for moving the electronic component on the first transfer mechanism to the first temporary storage zone, and a third transfer mechanism located in the first temporary storage zone The electronic component at the first temporary area is transferred to the testing device, and the second temporary setting area is disposed on the other side of the testing device, and the fourth transfer mechanism is disposed in the second temporary setting area. The utility model is configured to transfer the electronic component at the test device to the second temporary storage zone, and a fifth transfer mechanism disposed in front of the receiving device for taking out the empty material at the receiving device, and the fifth moving The sixth transfer mechanism on the side of the carrier mechanism is configured to move the electronic components at the second temporary storage area into the magazine clamped by the fifth transfer mechanism.