CN209119161U - A kind of LED encapsulation structure - Google Patents
A kind of LED encapsulation structure Download PDFInfo
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- CN209119161U CN209119161U CN201822173975.0U CN201822173975U CN209119161U CN 209119161 U CN209119161 U CN 209119161U CN 201822173975 U CN201822173975 U CN 201822173975U CN 209119161 U CN209119161 U CN 209119161U
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- bracket
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- led chips
- encapsulation structure
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Abstract
The utility model discloses a kind of LED encapsulation structure, including bracket and flip LED chips.The utility model is suitable for CSP LED or flip LED chips encapsulate, wherein bracket includes positive bracket and negative bracket, the both ends of the specifically flip LED chips pass through metal crystal-bonding adhesive respectively or tin cream is fixed in positive bracket and negative bracket, be combined with each other with bracket, to be formed into a loop.The utility model eliminates bonding wire process compared to tradition, significantly improves production efficiency and lowers production cost, it is worth mentioning that, the utility model applies also for CSP LED, multicolor luminous to realize, fills up flip LED chips and is unable to reach multicolor luminous defect.It in addition is that both to LED chip, generated heat has good effect at work the reason of carrying out die bond using metal crystal-bonding adhesive or tin cream.Certainly, user can also select color and the size of LED chip more according to actual needs to meet the requirement of different capacity and photoelectric parameter.
Description
Technical field
The utility model relates to LED lamp bead technical field, specially a kind of LED encapsulation structure.
Background technique
LED light have many advantages, such as energy conversion efficiency is high, on-off effect speed is fast, the service life is long, it is radiationless and it is low in energy consumption and
It is widely used.Existing LED structure completes LED encapsulation by die bond, bonding wire, packaging process, and this LED requires to pass through weldering
It connects gold thread to connect with positive and negative electrode, wherein the technical quality of the process of bonding wire will have a direct impact on product quality, give birth on this basis
While producing inefficient, wire rod is also a kind of objective production cost.
Summary of the invention
In order to solve problem above, purpose of the utility model is realized as follows: a kind of LED encapsulation structure, feature
It is, including bracket and flip LED chips, totally two, the bracket, i.e. positive bracket and negative bracket, upper surface is designed with
One groove, the groove are located at the inner side of positive bracket and negative bracket；The flip LED chips pass through crystal-bonding adhesive or tin
Cream is installed in the groove on bracket；A shape covering is provided with above the flip LED chips.
Preferably, two grooves on the bracket, the overall dimensions after merging need to be equal to or more than flip LED chips
Size.
Preferably, a kind of LED encapsulation structure is suitable for flip LED chips and CSP LED.
Preferably, the shape of the shape covering changes according to actual needs, can be cylindrical body, spherical surface or any shape of cube
Shape.
Preferably, by than there are spacing between the positive bracket and negative bracket of the bracket.
Preferably, the flip LED chips according in it LED core plate electrode confirm rack-mount side
To correspond to positive bracket and negative bracket.
The utility model has the following beneficial effects:
The utility model is suitable for doing CSP or flip LED chips encapsulation on dedicated bracket, and wherein bracket includes anode
The both ends of bracket and negative bracket, the specifically flip LED chips pass through metal crystal-bonding adhesive respectively or tin cream is fixed on just
On pole bracket and negative bracket, it be combined with each other with bracket, to be formed into a loop.The utility model eliminates weldering compared to tradition
Line process significantly improves production efficiency and lowers production cost, it is worth mentioning at this point that, the utility model applies also for CSP
LED, it is multicolor luminous to realize, it fills up flip LED chips and is unable to reach multicolor luminous defect.In addition using metal crystal-bonding adhesive or
Tin cream come be the reason of carrying out die bond both to LED chip at work caused by heat have good effect.Certainly,
User can also select color and the size of LED chip more according to actual needs to meet the use of different capacity and photoelectric parameter
It is required that.
Detailed description of the invention
The utility model is described in further detail in the following with reference to the drawings and specific embodiments.
Fig. 1 is the main view perspective view of the utility model.
Fig. 2 is the top view of the utility model.
Fig. 3 is the signal three-view diagram of the utility model covering shape.
Specific embodiment
In order to be easy to understand the technical means, creative features, achievable purpose and effectiveness of the utility model, tie below
Specific embodiment is closed, utility model is further described.
Referring to Fig.1, present embodiment uses a kind of following technical scheme: LED encapsulation structure, which is characterized in that packet
Bracket (1) and flip LED chips (2) are included, the bracket (1) totally two, i.e. positive bracket and negative bracket, upper surface is designed
There is a groove, the groove is located at the inner side of positive bracket and negative bracket；The flip LED chips (2) pass through die bond
Glue or tin cream are installed in the groove on bracket (1)；A shape covering is provided with above the flip LED chips (2).
Wherein, two grooves on the bracket (1), the overall dimensions after merging need to be equal to or more than flip LED core
The size of piece (2).
Wherein, a kind of LED encapsulation structure is suitable for flip LED chips (2) and CSP LED.
Wherein, the shape of the shape covering changes according to actual needs, can be cylindrical body, spherical surface or any shape of cube
Shape.
Wherein, by than there are spacing between the positive bracket and negative bracket of the bracket (1).
Wherein, the flip LED chips (2) according in it LED core plate electrode be mounted on bracket (1) to confirm
Direction, to correspond to positive bracket and negative bracket.
This specific embodiment referring to Figures 1 and 2, a kind of LED encapsulation structure.
The utility model is suitable for doing CSP or flip LED chips encapsulation on dedicated bracket, and wherein bracket includes anode
The both ends of bracket and negative bracket, the specifically flip LED chips pass through metal crystal-bonding adhesive respectively or tin cream is fixed on just
On pole bracket and negative bracket, it be combined with each other with bracket, to be formed into a loop.The utility model eliminates weldering compared to tradition
Line process significantly improves production efficiency and lowers production cost, it is worth mentioning at this point that, the utility model applies also for CSP
LED, it is multicolor luminous to realize, it fills up flip LED chips and is unable to reach multicolor luminous defect.In addition using metal crystal-bonding adhesive or
Tin cream come be the reason of carrying out die bond both to LED chip at work caused by heat have good effect.
With reference to Fig. 3, user can also select the color of LED chip, size and shape covering to meet according to actual needs
The requirement of different capacity, photoelectric parameter and installation annular etc., wherein shape covering include but is not limited to cylindrical body, spherical surface or
Cube etc..
The basic principles and main features of the present invention and the advantages of the present invention have been shown and described above.This reality
It is not restricted to the described embodiments with novel, the original of the utility model is only illustrated described in the specification of above-described embodiment
Reason, on the premise of not departing from the spirit and scope of the utility model, the utility model also has various changes and improvements, these changes
Change and improvement is fallen within the scope of the claimed invention.The utility model requires protection scope is wanted by appended right
Ask book and its equivalent thereof.
Claims (6)
1. a kind of LED encapsulation structure, which is characterized in that including bracket (1) and flip LED chips (2), the bracket (1) totally two
A, i.e. positive bracket and negative bracket, upper surface are designed with a groove, and the groove is located at positive bracket and negative bracket
Inner side；The flip LED chips (2) are installed in the groove on bracket (1) by crystal-bonding adhesive or tin cream；The upside-down mounting
A shape covering is provided with above LED chip (2).
2. a kind of LED encapsulation structure according to claim 1, which is characterized in that two grooves on the bracket (1),
Its overall dimensions after merging need to be equal to or more than the size of flip LED chips (2).
3. a kind of LED encapsulation structure according to claim 1, which is characterized in that a kind of LED encapsulation structure is suitable for
Flip LED chips (2) and CSP LED.
4. a kind of LED encapsulation structure according to claim 1, which is characterized in that the shape of the shape covering is according to reality
Border demand changes, and can be cylindrical body, spherical surface or cube any shape.
5. a kind of LED encapsulation structure according to claim 1, which is characterized in that the positive bracket of the bracket (1) and negative
By than there are spacing between the bracket of pole.
6. a kind of LED encapsulation structure according to claim 1, which is characterized in that the flip LED chips (2) are according to it
Inherent LED core plate electrode confirms the direction being mounted on bracket (1), to correspond to positive bracket and negative bracket.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822173975.0U CN209119161U (en) | 2018-12-24 | 2018-12-24 | A kind of LED encapsulation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822173975.0U CN209119161U (en) | 2018-12-24 | 2018-12-24 | A kind of LED encapsulation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209119161U true CN209119161U (en) | 2019-07-16 |
Family
ID=67208519
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822173975.0U Active CN209119161U (en) | 2018-12-24 | 2018-12-24 | A kind of LED encapsulation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209119161U (en) |
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2018
- 2018-12-24 CN CN201822173975.0U patent/CN209119161U/en active Active
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