CN204045588U - A kind of high heat conduction COB die set light source with terminal - Google Patents

A kind of high heat conduction COB die set light source with terminal Download PDF

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Publication number
CN204045588U
CN204045588U CN201420489695.XU CN201420489695U CN204045588U CN 204045588 U CN204045588 U CN 204045588U CN 201420489695 U CN201420489695 U CN 201420489695U CN 204045588 U CN204045588 U CN 204045588U
Authority
CN
China
Prior art keywords
terminal
light source
heat conduction
high heat
die set
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201420489695.XU
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Chinese (zh)
Inventor
廖昆
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jiangxi Top Quantum Lighting Tech Co Ltd
Original Assignee
Jiangxi Top Quantum Lighting Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jiangxi Top Quantum Lighting Tech Co Ltd filed Critical Jiangxi Top Quantum Lighting Tech Co Ltd
Priority to CN201420489695.XU priority Critical patent/CN204045588U/en
Application granted granted Critical
Publication of CN204045588U publication Critical patent/CN204045588U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001Core members of the connector
    • H01L2224/45099Material
    • H01L2224/451Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144Gold (Au) as principal constituent
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48135Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate

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  • Led Device Packages (AREA)

Abstract

The utility model discloses a kind of high heat conduction COB die set light source with terminal, comprise substrate, framework, support pad, gold thread, LED, terminal, described LED is fixed on the die bond block in framework, be electrically connected by gold thread between some LED, be electrically connected with support pad by gold thread, "+", "-" pole of terminal is electrically connected with "+", "-" of support pad is extremely corresponding respectively again.The high heat conduction COB die set light source of band terminal of the present utility model, greatly improves the efficiency that COB welds circumscripted power line, reduces cost of labor, goodlooking, is the trend of COB mass.

Description

A kind of high heat conduction COB die set light source with terminal
Technical field
The utility model relates to field of LED illumination, specifically a kind of high heat conduction COB die set light source with terminal.
Background technology
LED light source belongs to a kind of typical environmental protection lighting source, has the advantages such as height is energy-conservation, the life-span is long.Current LED light source is more and more used in production, life by people.At least there is following problem in existing technology: when COB welds external connection at present, adopt manual flatiron to weld, efficiency is low, and cost of labor is high, and outward appearance unsightly.
Summary of the invention
The utility model is mainly and solves the welding of existing manual flatiron, and efficiency is low, and cost of labor is high, the outward appearance problem such as unsightly; A kind of high heat conduction COB die set light source with terminal is provided.
The technical solution adopted in the utility model is: a kind of high heat conduction COB die set light source with terminal, comprise substrate, framework, support pad, gold thread, LED, terminal, described LED is fixed on the die bond block in framework, be electrically connected by gold thread between some LED, be electrically connected with support pad by gold thread, "+", "-" pole of terminal is electrically connected with "+", "-" of support pad is extremely corresponding respectively again.
It is connection by substrate inside that support pad is electrically connected with terminal.Described terminal is fixed on substrate.Described LED is coated with layer of fluorescent powder layer.Described framework is one-shot forming PPA plastic material, and is seamless bonding with substrate.Described substrate is copper plate, aluminum bronze plate or ceramic substrate.Described LED is square piece LED.Terminal is plastics.
The utility model beneficial effect: the high heat conduction COB die set light source of band terminal of the present utility model, greatly improves the efficiency that COB welds circumscripted power line, reduces cost of labor, goodlooking, is the trend of COB mass.
Accompanying drawing explanation
Fig. 1 is the utility model structural representation.
In figure: 1, substrate, 2, framework, 3, support pad, 4, gold thread, 5LED lamp, 6, terminal.
Embodiment
Below by embodiment, and by reference to the accompanying drawings, the technical solution of the utility model is described in further detail.
See Fig. 1, a kind of high heat conduction COB die set light source with terminal, comprise substrate 1, framework 2, support pad 3, gold thread 4, LED 5, terminal 6, described LED 5 is fixed on the die bond block in framework 2, be electrically connected by gold thread between some LED 5, be electrically connected with support pad 3 by gold thread 4, "+", "-" pole of terminal 6 is electrically connected with "+", "-" of support pad 3 is extremely corresponding respectively again.
The present embodiment has four groups of LED, and often group is formed by being electrically connected by gold thread between several LED, often organizes afterwards and is electrically connected with support pad respectively.
It is connection by substrate inside that support pad 3 is electrically connected with terminal 6.Described terminal 6 is fixing on substrate 1.Described LED 5 is coated with layer of fluorescent powder layer.Described framework 2 is one-shot forming PPA plastic material, and is seamless bonding with substrate 1.Described substrate is copper plate, aluminum bronze plate or ceramic substrate.Described LED is square piece LED.Terminal 6 is plastics.
It should be pointed out that above embodiment is only the more representational example of the utility model.Obviously, the utility model is not limited to above-described embodiment, can also have many distortion.Every above embodiment is done according to technical spirit of the present utility model any simple modification, equivalent variations and modification, all should think and belong to protection range of the present utility model.

Claims (7)

1. the high heat conduction COB die set light source with terminal, comprise substrate (1), framework (2), support pad (3), gold thread (4), LED (5), terminal (6), it is characterized in that: described LED (5) is fixed on the die bond block in framework (2), some LED are electrically connected by gold thread between (5), be electrically connected with support pad (3) by gold thread (4), "+", "-" pole of terminal (6) is electrically connected with "+", "-" of support pad (3) is extremely corresponding respectively again.
2. a kind of high heat conduction COB die set light source with terminal according to claim 1, is characterized in that, it is connection by substrate inside that support pad (3) is electrically connected with terminal (6).
3. a kind of high heat conduction COB die set light source with terminal according to claim 1, it is characterized in that, described terminal (6) is fixed on substrate (1).
4. a kind of high heat conduction COB die set light source with terminal according to claim 1, it is characterized in that, (5) are coated with layer of fluorescent powder layer to described LED.
5. a kind of high heat conduction COB die set light source with terminal according to claim 1, it is characterized in that, described framework (2) is one-shot forming PPA plastic material, and is seamless bonding with substrate (1).
6. a kind of high heat conduction COB die set light source with terminal according to claim 1, is characterized in that, described substrate (1) is copper plate, aluminum bronze plate or ceramic substrate.
7. a kind of high heat conduction COB die set light source with terminal according to claim 1, it is characterized in that, described LED (5) is square piece LED, and terminal (6) is plastics.
CN201420489695.XU 2014-08-28 2014-08-28 A kind of high heat conduction COB die set light source with terminal Expired - Fee Related CN204045588U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201420489695.XU CN204045588U (en) 2014-08-28 2014-08-28 A kind of high heat conduction COB die set light source with terminal

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201420489695.XU CN204045588U (en) 2014-08-28 2014-08-28 A kind of high heat conduction COB die set light source with terminal

Publications (1)

Publication Number Publication Date
CN204045588U true CN204045588U (en) 2014-12-24

Family

ID=52246225

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201420489695.XU Expired - Fee Related CN204045588U (en) 2014-08-28 2014-08-28 A kind of high heat conduction COB die set light source with terminal

Country Status (1)

Country Link
CN (1) CN204045588U (en)

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20141224

Termination date: 20150828

EXPY Termination of patent right or utility model