CN208889657U - 用于显示器的封装结构 - Google Patents
用于显示器的封装结构 Download PDFInfo
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- CN208889657U CN208889657U CN201821111096.9U CN201821111096U CN208889657U CN 208889657 U CN208889657 U CN 208889657U CN 201821111096 U CN201821111096 U CN 201821111096U CN 208889657 U CN208889657 U CN 208889657U
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Classifications
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
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- H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
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Abstract
本实用新型提供一种用于显示器的封装结构,其包括柔性基膜、多个接垫、发光元件阵列以及图案化线路层。柔性基膜包括多个导通孔、第一表面以及相对于第一表面的第二表面,导通孔连通第一表面以及第二表面,其中所述柔性基膜为黑色的柔性基膜。接垫设置于第一表面,导通孔连接接垫。发光元件阵列包括多个发光元件组,设置于接垫上并与接垫电连接,其中各发光元件组包括颜色各不相同的多个发光元件。图案化线路层设置于第二表面并电连接导通孔。
Description
技术领域
本实用新型涉及一种封装结构,尤其涉及一种用于显示器的封装结构。
背景技术
在智能电子设备向薄型化、内部线路设计向高密度化发展趋势的推动下,在电子设备内部采用可靠的散热设计成为保障设备稳定运行的基本需求。目前,由聚酰亚胺薄膜所制备的人工石墨膜,具有厚度薄、导热率高以及柔韧易加工的特性,可满足电子设备内部狭小空间的散热设计要求,已成为各类智能移动电子设备内部的散热结构的重要散热材料。
随着航空航天技术、电子技术、电池领域等技术的发展,在某些特定的场合,人们对聚酰亚胺薄膜材料的特性有了更加多样化、精细化的要求。现今,发展出了比较前沿的特色聚酰亚胺薄膜产品,诸如耐电晕聚酰亚胺薄膜、低介电聚酰亚胺薄膜、透明聚酰亚胺薄膜等。在一些特定领域,聚酰亚胺薄膜需要不透明、光透射率和反射系数低,并具有良好的遮光性、导热性等特性,以广泛用于显示器、行动装置、电脑等电子设备。
为了达到上述特性,已知方式是在一般的聚酰亚胺薄膜的单面或双面上涂覆一层含有黑色颜料的膜层,以形成所谓双层(dual-layered)聚酰亚胺薄膜。虽然此种方式可使聚酰亚胺薄膜呈现所希望的黑色,但是成膜设备复杂,工艺要求较高,推广难度大,且额外形成的黑色膜层会增加制作成本,并且,对薄膜性质也会造成不利的影响,使此双层聚酰亚胺薄膜暴露于高温环境时易发生劣化或黄化。
实用新型内容
本实用新型提供一种用于显示器的封装结构,其柔性基膜具有低反射率且制作成本较低也较不易劣化或黄化。
本实用新型的一种用于显示器的封装结构,其包括柔性基膜、多个接垫、发光元件阵列以及图案化线路层。柔性基膜包括多个导通孔、第一表面以及相对于第一表面的第二表面,导通孔连通第一表面以及第二表面,其中柔性基膜为黑色的柔性基膜。接垫设置于第一表面,导通孔连接接垫。发光元件阵列包括多个发光元件组,设置于接垫上并与接垫电连接,其中各发光元件组包括颜色各不相同的多个发光元件。图案化线路层设置于第二表面并电连接导通孔。
在本实用新型的一实施例中,上述的柔性基膜为不透明的柔性基膜。
在本实用新型的一实施例中,上述的柔性基膜的反射率小于聚酰亚胺的反射率。
在本实用新型的一实施例中,上述的柔性基膜的反射率小于10%。
在本实用新型的一实施例中,上述的发光元件组包括具有红色系发光色的第一发光元件、具有绿色系发光色的第二发光元件以及具有蓝色系发光色第三发光元件,分别设置于接垫上。
在本实用新型的一实施例中,上述的发光元件组还包括具有白色系发光色的第四发光元件,设置于接垫上。
在本实用新型的一实施例中,上述的各导通孔的直径大体上介于10微米至50微米之间。
在本实用新型的一实施例中,上述的柔性基膜的厚度大体上介于10微米至30微米之间。
在本实用新型的一实施例中,上述的用于显示器的封装结构还包括覆盖膜(coverlay),设置于第二表面并覆盖图案化线路层。
在本实用新型的一实施例中,上述的导通孔包括多个导电通孔以及多个导热通孔,导电通孔的其中之一以及导热通孔的其中之一皆连接至接垫的其中之一。
在本实用新型的一实施例中,上述的接垫在第一表面上彼此结构隔离(physically isolated)。
基于上述,本实用新型的用于显示器的封装结构将柔性基膜混合黑色填料,并将发光元件设置于此混有黑色填料的黑色(或明度非常接近黑色的深色)柔性基膜上,因而可使柔性基膜具有不透明、光透射率及反射系数低的特性,并可具有良好的遮光性、导热性等,并可避免现有的黑色涂料容易龟裂且易与黄色聚酰亚胺分离的问题。此外,本实用新型实施例的混有黑色填料的柔性基膜可耐高温而不易黄化、龟裂,还符合发光元件应用于显示器时的耐高温需求,可以大大提升封装结构的品质及稳定性。
为让本实用新型的上述特征和优点能更明显易懂,下文特举实施例,并配合附图作详细说明如下。
附图说明
图1至图5是依照本实用新型的一实施例的一种用于显示器的封装结构的制造流程的剖面示意图。
图6是依照本实用新型的一实施例的一种用于显示器的封装结构的柔性基膜的上视示意图。
图7是依照本实用新型的一实施例的一种用于显示器的封装结构的剖面示意图。
符号说明:
100、100a:封装结构
110:柔性基膜
112:金属箔层
114:导通孔
114a:通孔
115:导电通孔
116:导热通孔
120:图案化金属层
120a:金属层
122:接垫
124:图案化线路层
130:发光元件组
132:第一发光元件、发光元件
134:第二发光元件、发光元件
136:第三发光元件、发光元件
138:焊球
140:覆盖膜
B1:蓝像素条
D1:直径
G1:绿像素条
R1:红像素条
S1:第一表面
S2:第二表面
具体实施方式
有关本实用新型的前述及其他技术内容、特点与功效,在以下配合参考附图的各实施例的详细说明中,将可清楚的呈现。以下实施例中所提到的方向用语,例如:“上”、“下”、“前”、“后”、“左”、“右”等,仅是参考附图的方向。因此,使用的方向用语是用来说明,而并非用来限制本实用新型。并且,在下列各实施例中,相同或相似的元件将采用相同或相似的标号。
图1至图5是依照本实用新型的一实施例的一种用于显示器的封装结构的制造流程的剖面示意图。本实施例的封装结构100适用于显示器,例如高分子有机发光二极管(Polymer Light-Emitting Diode,PLED)显示器、有机发光二极管(Organic Light-Emitting Diode,OLED)显示器以及液晶显示器 (liquid-crystal display,LCD)显示器或其它基于像素的显示器,本实施例并不局限于此。本实施例的封装结构100的制造方法包括下列结构。首先,请参照图1,提供柔性基膜110,其中,柔性基膜110包括第一表面S1以及相对于第一表面S1的第二表面S2,且柔性基膜110的材料包括聚酰亚胺 (polyimide,PI)及黑色填料。也就是说,本实施例的柔性基膜110可以是由聚酰亚胺作为基底,再混以黑色填料而形成,如此,混有黑色填料的柔性基膜110的颜色大体上为黑色,或是明度非常接近黑色的深色柔性基膜110。
如此,在本实施例中,柔性基膜110的反射率大体上可小于聚酰亚胺的反射率,也就是说,混有黑色填料的柔性基膜110的反射率大体上小于未混有黑色填料的聚酰亚胺的反射率。举例来说,柔性基膜110的反射率可至少小于或等于10%。因此,本实施例的混有黑色填料的柔性基膜110可具有不透明、光透射率及反射系数低的特性,并可具有良好的遮光性、导热性等。当然,本实施例并不限制柔性基膜110的材料,在其他实施例中,柔性基膜110也可由其他具有可挠性的柔性基材混合黑色填料而形成。
在本实施例中,柔性基膜110还可包括分别设置于其上下两表面的金属箔层112。在本实施例中,金属箔层112可例如为铜箔,其可通过压合的方式设置于柔性基膜110上。也就是说,柔性基膜110可为黑色或明度非常接近黑色的深色的柔性铜箔基材(FlexibleCopper Clad Laminate,FCCL)。在本实施例中,柔性基膜110的厚度T1大体上可介于10微米(μm)至30微米之间。
接着,请参照图2,形成多个通孔114a于柔性基膜110,上述的通孔114a 可贯穿柔性基膜110以连通第一表面S1以及第二表面S2。在本实施例中,通孔114a可通过激光钻孔的方式而形成,以形成孔径较小的通孔114a尺寸,进而缩小封装结构100中的导通孔114的间距,可符合封装结构100在细间距(fine pitch)上的要求。在本实施例中,以激光钻孔所形成的通孔114a的直径大体上介于10微米至50微米之间。或者,在其他实施例中,通孔114a也可通过蚀刻工艺而形成,以于柔性基膜110上快速地批量形成多个通孔 114a,可有效提升工艺效率,节省生产成本。本实施例并不限制通孔114a的形成方式。
接着,请参照图3,形成金属层120a于柔性基膜110上,且金属层120a 覆盖通孔114a的内壁。举例而言,形成金属层120a的方法可包括下列步骤。首先,进行化镀工艺以形成一种晶层(未示出)于柔性基膜110上,其中,种晶层可全面覆盖柔性基膜110的第一表面S1、第二表面S2以及通孔114a 的内壁。化镀工艺是一种自催化氧化还原反应,其可例如利用化学镀铜液,以在化学镀铜过程中,使金属离子得到电子而还原为金属。在本实施例中,种晶层的材料可包括铜、镍或其他适合的材料。
接着,以上述的种晶层作为导电路径而进行电镀工艺,以形成如图所示的金属层120a于柔性基膜110上。在本实施例中,金属层120a的材料可包括铜或其他适合的材料。在本实施例中,金属层120a可全面填满通孔114a,以形成如图3所示的连通第一表面S1以及第二表面S2的导通孔114,在本实施例中,导通孔114的直径D1大体上介于10微米至50微米之间。
接着,请参照图4,对金属层120a进行图案化工艺,以形成如图4所示的图案化金属层120。在本实施例中,图案化工艺可包括下列步骤。首先,可例如形成光刻胶(未示出)于金属层120a上,其中,光刻胶暴露部分的金属层120a。接着,再对金属层120a以及种晶层进行图案化工艺,以移除被光刻胶所暴露的部分金属层120a以及种晶层,因而形成如图4所示的图案化金属层120。当然,上述的线路工艺仅用以举例说明,本实施例并不限制形成图案化金属层120的方法,图案化金属层120除了通过半加成法来制作以外,也可通过加成法、减成法等本领域技术人员所熟知的方式而形成。
请参照图4,在本实施例中,图案化金属层120包括多个接垫122以及图案化线路层124。接垫122设置于第一表面S1,并且,在本实施例中,导通孔114可分别设置于接垫122的正下方,以分别连接接垫122。图案化线路层124设置于第二表面S2,并电连接导通孔114。在本实施例中,接垫122 在第一表面S1上彼此结构隔离(physically isolated),也就是说,在第一表面S1上,接垫122之间并未有其他线路连接,而是以孤岛(island)的形式配置于第一表面S1上,接垫122之间可通过导通孔114将电性导通至第二表面S2并经由图案化线路层124进行电连接。在这样的结构配置下,在柔性基膜110的第一表面S1上,除了接垫122以外可不具有任何其他线路,所有的线路皆设置于柔性基膜110的第二表面S2并通过导通孔114与接垫122形成电连接,因此,第一表面S1省去了布线空间,可进一步缩短接垫122之间的间距,提高接垫122的设置密度,进而可提升设置于接垫122上的元件的设置密度。并且,由于在柔性基膜110的第一表面S1上除了接垫122以外不具有任何其他线路,且柔性基膜110混合有黑色填料,因此,在柔性基膜110 的第一表面S1上无须额外贴附一层黑色或明度非常接近黑色的深色覆盖膜 (coverlay)或油墨来覆盖及保护第一表面S1上的线路。因此,本实施例的封装结构100的整体厚度可有效降低(约可降低25微米至50微米)。
图6是依照本实用新型的一实施例的一种用于显示器的封装结构的柔性基膜的上视示意图。接着,请参照图5及图6,设置如图6所示的发光元件阵列于第一表面S1上,其中,发光元件阵列包括多个发光元件组130,而各个发光元件组130又可包括多个发光元件,其所发出的色光的颜色各不相同。举例而言,发光元件组130可为三原色发光元件组130,也就是说,各个发光元件组130可包括第一发光元件132、第二发光元件134以及第三发光元件136。发光元件组130中的发光元件132、134、136的发光色各不相同,其发光色分别为光的三原色(RGB),且彼此相邻地设置于接垫122上,以共同组成显示器中的一个像素。举例而言,第一发光元件可具有红色系发光色,第二发光元件具有绿色系发光色,而第三发光元件则可具有蓝色系发光色,当然,本实施例并不以此为限。在其他实施例中,各个发光元件组130除了三原色的发光元件132、134、136以外,还可包括具有白色系发光色的第四发光元件,本实施例并不限定发光元件组130的发光元件的数量、种类及颜色。
在本实施例中,发光元件132、134、136可视为发光元件阵列中的一个子像素,藉此,同一原色的子像素发光元件(例如发光元件132、134或136) 以条状排列而形成一组子像素条(如图6所示的红像素条R1、绿像素条G1 和蓝像素条B1)于柔性基膜110的第一表面S1上。一般而言,LED显示器通常具有大量这种子像素条组。在发光元件组130中的每个子像素(例如发光元件132、134、136)的亮度可以被加以控制以形成具有可察觉出的所要求色的显示器像素。如此,发光元件132、134、136以阵列的形式配置于柔性基膜110的多个接垫122上,并使发光元件132、134、136与接垫122形成电连接,以形成可编址的显示器单元。须说明的是,图1至图5所示出的制作流程剖面图是仅针对第一发光元件132的局部剖面图做举例说明,本领域技术人员应了解,柔性基膜110上还可设置其他的发光元件(例如发光元件134、136)。
在本实施例中,发光元件132、134、136可为次毫米发光二极管(Mini LED) 或微发光二极管(Micro LED)。一般而言,次毫米发光二极管意指发光元件 132、134、136的尺寸约在100微米左右的发光二极管。当然,本实施例仅用以举例说明而并不以此为限。发光元件132、134、136可例如以覆晶(flip chip)接合的方式通过多个焊球138而与位于柔性基膜110的第一表面S1上的接垫122接合。在本实施例中,多个发光元件132、134、136可以阵列的形式设置于柔性基膜110的第一表面S1上。接着,可设置覆盖膜(coverlay) 140于柔性基膜110的第二表面S2,并使覆盖膜140覆盖第二表面S2上的图案化线路层124,以保护图案化线路层124免于受到氧化或是外界污染的影响。在本实施例中,覆盖膜140可选择性地设置,并且,覆盖膜140可为透明覆盖膜或不透明覆盖膜。在其他实施例中,覆盖膜也可设置于柔性基膜110 的第一表面S1,并且,覆盖第一表面S1的覆盖膜为透明覆盖膜。至此,本实施例的用于显示器的封装结构100的制作方法可大致完成。
在这样的结构配置下,本实施例的用于显示器的封装结构100将柔性基膜110混合黑色填料,并将发光元件132、134、136设置于此混有黑色填料的黑色(或明度非常接近黑色的深色)柔性基膜110上,因此,本实施例的混有黑色填料的柔性基膜110可具有不透明、光透射率及反射系数低的特性,并可具有良好的遮光性、导热性等。并且,相较于现有在一般黄色的聚酰亚胺(polyimide,PI)上额外涂布一层黑色涂料的作法,本实施例的混有黑色填料的柔性基膜110可避免黑色涂料容易龟裂且易与黄色聚酰亚胺分离的问题且可降低柔性基膜110的整体厚度(约介于10微米至30微米之间)。并且,本实施例的混有黑色填料的柔性基膜110可耐高温,即使暴露在数千小时的高温之下,也不易黄化、龟裂,还符合封装结构100应用于显示器时所须的数千小时发亮的高温需求,可以大大提升封装结构100的品质及稳定性。
并且,本实施例的柔性基膜110还具有可弯折的特性,非常适合标榜可挠性的有机发光二极管(Organic Light-Emitting Diode,OLED)使用,可以应用在可挠性显示器上。此外,在本实施例中,在第一表面S1上,接垫122 之间是通过导通孔114将电性导通至第二表面S2的图案化线路层124来进行电连接。因此,柔性基膜110的第一表面S1可省去布线空间,因而可缩短接垫122之间的间距,提高接垫122的设置密度,进而可提升设置于接垫122 上的发光元件132、134、136的元件设置密度,进而提升使用此封装结构100 的显示器的解析度。因此,本实施例的封装结构100可应用于对间距须求更精细的高清的显示器。并且,由于在柔性基膜110的第一表面S1上除了接垫 122以外不具有任何其他线路,且柔性基膜110混合有黑色填料,因此,在柔性基膜110的第一表面S1上无须额外贴附一层黑色或明度非常接近黑色的深色覆盖膜(coverlay)或油墨来覆盖及保护第一表面S1上的线路。因此,使用本实施例的封装结构100的显示器可具有更薄的厚度(厚度约可降低25 微米至50微米左右)。
图7是依照本实用新型的一实施例的一种用于显示器的封装结构的剖面示意图。在此必须说明的是,本实施例的封装结构100a与图5的封装结构100 相似,因此,本实施例沿用前述实施例的元件标号与部分内容,其中采用相同的标号来表示相同或近似的元件,并且省略了相同技术内容的说明。关于省略部分的说明可参考前述实施例,本实施例不再重复赘述。请参照图7,以下将针对本实施例的封装结构100a与图5的封装结构100的差异做说明。
请参照图7,在本实施例中,前述的导通孔114可包括多个导电通孔115 以及多个导热通孔116,并且,导电通孔115的其中之一以及导热通孔116 的其中之一皆连接至接垫122的其中之一。换句话说,每个接垫122可同时连接一个导电通孔115以及一个导热通孔116。导电通孔115可通过接垫122 而与发光元件132、134、136电连接,而导热通孔116则可与接垫122形成热耦接,使发光元件132、134、136所产生的热可经由接垫122与导热通孔116所形成的导热路径而传导至第二表面S2的图案化线路层124,以进行散热。并且,在本实施例中,封装结构100a的第二表面S2还可贴附散热片,以帮助将传导至第二表面S2的热散逸至外界。
当然,本实施例仅用以举例说明,本实施例并不限制封装结构100、100a 的散热方式。在其他实施例中,也可以是连接至发光元件132的前述多个导通孔114中的至少其中之一可为导热通孔,其与接垫122形成热耦接,而其他的导通孔114则为导电通孔,其与发光元件132电连接。也就是说每个接垫122仍是如图5所示的连接至一个导通孔114,但有些接垫122是连接至用以导热的导热通孔,有些接垫122则是连接至用以导电的导电通孔。或者,每个导通孔114都可同时作为导热以及导电之用,以便将发光元件132电连接至第二表面S2的图案化线路层124,并同时将发光元件132所产生的热传导至第二表面S2的图案化线路层124,以进行散热。
综上所述,本实用新型的用于显示器的封装结构将柔性基膜混合黑色填料,并将发光元件设置于此混有黑色填料的黑色(或明度非常接近黑色的深色)柔性基膜上,因此,本实用新型实施例的混有黑色填料的柔性基膜可具有不透明、光透射率及反射系数低的特性,并可具有良好的遮光性、导热性等,非常适合显示器的应用。并且,可避免现有的黑色涂料容易龟裂且易与黄色聚酰亚胺分离的问题,还可降低柔性基膜的厚度。因此,本实施例的封装结构具有较佳的生产良率及稳定性。
此外,在某些实施例中,接垫之间是通过导通孔将电性导通至第二表面的图案化线路层来进行电连接。因此,柔性基膜的第一表面可省去布线空间,因而可缩短接垫之间的间距,进而可提升设置于接垫上的发光元件的元件设置密度,进而提升使用此封装结构的显示器的解析度。并且,由于在柔性基膜的第一表面上除了接垫以外不具有任何其他线路,且柔性基膜混合有黑色填料,因此,在柔性基膜的第一表面上无须额外贴附一层黑色或深色覆盖膜或油墨来覆盖与保护第一表面上的线路,因而可有效降低封装结构100的整体厚度。因此,本实用新型的封装结构可应用于对间距须求更精细且体积更轻薄的显示器上。
虽然本实用新型已以实施例揭示如上,然其并非用以限定本实用新型,任何所属技术领域中技术人员,在不脱离本实用新型的精神和范围内,当可作些许的更改与润饰,故本实用新型的保护范围当视所附的权利要求所界定者为准。
Claims (11)
1.一种用于显示器的封装结构,其特征在于,包括:
柔性基膜,包括多个导通孔、第一表面以及相对于所述第一表面的第二表面,所述多个导通孔连通所述第一表面以及所述第二表面,其中所述柔性基膜为黑色的柔性基膜;
多个接垫,设置于所述第一表面,所述多个导通孔连接所述多个接垫;
发光元件阵列,包括多个发光元件组,设置于所述多个接垫上并与所述多个接垫电连接,其中各所述发光元件组包括颜色各不相同的多个发光元件;以及
图案化线路层,设置于所述第二表面并电连接所述多个导通孔。
2.根据权利要求1所述的用于显示器的封装结构,其中所述柔性基膜为不透明的柔性基膜。
3.根据权利要求1所述的用于显示器的封装结构,其中所述柔性基膜的反射率小于聚酰亚胺的反射率。
4.根据权利要求1所述的用于显示器的封装结构,其中所述柔性基膜的反射率小于10%。
5.根据权利要求1所述的用于显示器的封装结构,其中各所述发光元件组包括具有红色系发光色的第一发光元件、具有绿色系发光色的第二发光元件以及具有蓝色系发光色第三发光元件,分别设置于所述多个接垫上。
6.根据权利要求5所述的用于显示器的封装结构,其中各所述发光元件组还包括具有白色系发光色的第四发光元件,设置于所述多个接垫上。
7.根据权利要求1所述的用于显示器的封装结构,其中各所述导通孔的直径介于10微米至50微米之间。
8.根据权利要求1所述的用于显示器的封装结构,其中所述柔性基膜的厚度介于10微米至30微米之间。
9.根据权利要求1所述的用于显示器的封装结构,还包括覆盖膜,设置于所述第二表面并覆盖所述图案化线路层。
10.根据权利要求1所述的用于显示器的封装结构,其中所述多个导通孔包括多个导电通孔以及多个导热通孔,所述多个导电通孔的其中之一以及所述多个导热通孔的其中之一皆连接至所述多个接垫的其中之一。
11.根据权利要求1所述的用于显示器的封装结构,其中所述多个接垫在所述第一表面上彼此结构隔离。
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