TW201941960A - 用於顯示器的封裝結構 - Google Patents
用於顯示器的封裝結構 Download PDFInfo
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- TW201941960A TW201941960A TW107111087A TW107111087A TW201941960A TW 201941960 A TW201941960 A TW 201941960A TW 107111087 A TW107111087 A TW 107111087A TW 107111087 A TW107111087 A TW 107111087A TW 201941960 A TW201941960 A TW 201941960A
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Abstract
一種用於顯示器的封裝結構,其包括一軟性基膜、多個接墊、一發光元件陣列以及一圖案化線路層。軟性基膜包括多個導通孔、一第一表面以及相對於第一表面的一第二表面,導通孔連通第一表面以及第二表面,其中軟性基膜的材料包括聚醯亞胺及黑色填料。接墊設置於第一表面,導通孔連接接墊。發光元件陣列包括多個發光元件組,設置於接墊上並與接墊電性連接,其中各發光元件組包括顏色各不相同的多個發光元件。圖案化線路層設置於第二表面並電性連接導通孔。
Description
本發明是有關於一種封裝結構,且特別是有關於一種用於顯示器的封裝結構。
在智慧電子設備向薄型化、內部線路設計向高密度化發展趨勢的推動下,在電子 設備內部採用可靠的散熱設計成為保障設備穩定運行的基本需求。目前,由聚醯亞胺薄膜所製備的人工石墨膜,具有厚度薄、導熱率高以及柔韌易加工的特性,可滿足電子設備內部狹小空間的散熱設計要求,已成為各類智慧移動電子設備內部的散熱結構的重要散熱材料。
隨著航空航太技術、電子技術、電池領域等技術的發展,在某些特定的場合,人們對聚醯亞胺薄膜材料的特性有了更加多樣化、精細化的要求。現今,發展出了比較前沿的特色聚醯亞胺薄膜產品,諸如耐電暈聚醯亞胺薄膜、低介電聚醯亞胺薄膜、透明聚醯亞胺薄膜等。在一些特定領域,聚醯亞胺薄膜需要不透明、光透射率和反射係數低,並具有良好的遮光性、導熱性等特性,以廣泛用於顯示器、行動裝置、電腦等電子設備。
為了達到上述特性,已知方式是在一般的聚醯亞胺薄膜的單面或雙面上塗覆一層含有黑色顏料的膜層,以形成所謂雙層(dual-layered)聚醯亞胺薄膜。雖然此種方式可使聚醯亞胺薄膜呈現所希望的黑色,但是成膜設備複雜,製程要求較高,推廣難度大,且額外形成的黑色膜層會增加製作成本,並且,對薄膜性質也會造成不利的影響,使此雙層聚醯亞胺薄膜暴露於高溫環境時易發生劣化或黃化。
本發明提供一種用於顯示器的封裝結構,其軟性基膜具有低反射率且製作成本較低也較不易劣化或黃化。
本發明的一種用於顯示器的封裝結構,其包括一軟性基膜、多個接墊、一發光元件陣列以及一圖案化線路層。軟性基膜包括多個導通孔、一第一表面以及相對於第一表面的一第二表面,導通孔連通第一表面以及第二表面,其中軟性基膜的材料包括聚醯亞胺及黑色填料。接墊設置於第一表面,導通孔連接接墊。發光元件陣列包括多個發光元件組,設置於接墊上並與接墊電性連接,其中各發光元件組包括顏色各不相同的多個發光元件。圖案化線路層設置於第二表面並電性連接導通孔。
在本發明的一實施例中,上述的軟性基膜的顏色為黑色。
在本發明的一實施例中,上述的軟性基膜的反射率小於聚醯亞胺的反射率。
在本發明的一實施例中,上述的軟性基膜的反射率小於10%。
在本發明的一實施例中,上述的發光元件組包括具有紅色系發光色的一第一發光元件、具有綠色系發光色的一第二發光元件以及具有藍色系發光色一第三發光元件,分別設置於接墊上。
在本發明的一實施例中,上述的發光元件組更包括具有白色系發光色的一第四發光元件,設置於接墊上。
在本發明的一實施例中,上述的各導通孔的一直徑實質上介於10微米至50微米之間。
在本發明的一實施例中,上述的軟性基膜的一厚度實質上介於10微米至30微米之間。
在本發明的一實施例中,上述的用於顯示器的封裝結構更包括一覆蓋膜(coverlay),設置於第二表面並覆蓋圖案化線路層。
在本發明的一實施例中,上述的導通孔包括多個導電通孔以及多個導熱通孔,導電通孔的其中之一以及導熱通孔的其中之一皆連接至接墊的其中之一。
在本發明的一實施例中,上述的接墊在第一表面上彼此結構隔離(physically isolated)。
基於上述,本發明的用於顯示器的封裝結構將軟性基膜混合黑色填料,並將發光元件設置於此混有黑色填料的黑色(或明度非常接近黑色的深色)軟性基膜上,因而可使軟性基膜具有不透明、光透射率及反射係數低的特性,並可具有良好的遮光性、導熱性等,並可避免習知的黑色塗料容易龜裂且易與黃色聚醯亞胺分離的問題。此外,本發明實施例的混有黑色填料的軟性基膜可耐高溫而不易黃化、龜裂,更符合發光元件應用於顯示器時的耐高溫需求,可以大大提升封裝結構的品質及穩定性。
為讓本發明的上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。
有關本發明之前述及其他技術內容、特點與功效,在以下配合參考圖式之各實施例的詳細說明中,將可清楚的呈現。以下實施例中所提到的方向用語,例如:「上」、「下」、「前」、「後」、「左」、「右」等,僅是參考附加圖式的方向。因此,使用的方向用語是用來說明,而並非用來限制本發明。並且,在下列各實施例中,相同或相似的元件將採用相同或相似的標號。
圖1至圖5是依照本發明的一實施例的一種用於顯示器的封裝結構的製造流程的剖面示意圖。本實施例的封裝結構100適用於一顯示器,例如高分子有機發光二極體(Polymer Light-Emitting Diode, PLED)顯示器、有機發光二極體(Organic Light-Emitting Diode, OLED)顯示器以及液晶顯示器(liquid-crystal display, LCD)顯示器或其它基於像素的顯示器,本實施例並不侷限於此。本實施例的封裝結構100的製造方法包括下列結構。首先,請參照圖1,提供一軟性基膜110,其中,軟性基膜110包括一第一表面S1以及相對於第一表面S1的一第二表面S2,且軟性基膜110的材料包括聚醯亞胺(polyimide,PI)及黑色填料。也就是說,本實施例的軟性基膜110可以是由聚醯亞胺作為基底,再混以黑色填料而形成,如此,混有黑色填料的軟性基膜110的顏色實質上為黑色,或是明度非常接近黑色的深色軟性基膜110。
如此,在本實施例中,軟性基膜110的反射率實質上可小於聚醯亞胺的反射率,也就是說,混有黑色填料的軟性基膜110的反射率實質上小於未混有黑色填料的聚醯亞胺的反射率。舉例來說,軟性基膜110的反射率可至少小於或等於10%。因此,本實施例的混有黑色填料的軟性基膜110可具有不透明、光透射率及反射係數低的特性,並可具有良好的遮光性、導熱性等。當然,本實施例並不限制軟性基膜110的材料,在其他實施例中,軟性基膜110也可由其他具有可撓性的軟性基材混合黑色填料而形成。
在本實施例中,軟性基膜110更可包括分別設置於其上下兩表面的金屬箔層112。在本實施例中,金屬箔層112可例如為銅箔,其可透過壓合的方式設置於軟性基膜110上。也就是說,軟性基膜110可為黑色或明度非常接近黑色的深色的軟性銅箔基材(Flexible Copper Clad Laminate,FCCL)。在本實施例中,軟性基膜110的厚度T1實質上可介於10微米(μm)至30微米之間。
接著,請參照圖2,形成多個通孔114a於軟性基膜110,上述的通孔114a可貫穿軟性基膜110以連通第一表面S1以及第二表面S2。在本實施例中,通孔114a可透過雷射鑽孔的方式而形成,以形成孔徑較小的通孔114a尺寸,進而縮小封裝結構100中的導通孔114的間距,可符合封裝結構100在細間距(fine pitch)上的要求。在本實施例中,以雷射鑽孔所形成的通孔114a的直徑實質上介於10微米至50微米之間。或者,在其他實施例中,通孔114a也可透過蝕刻製程而形成,以於軟性基膜110上快速地批量形成多個通孔114a,可有效提升製程效率,節省生產成本。本實施例並不限制通孔114a的形成方式。
接著,請參照圖3,形成一金屬層120a於軟性基膜110上,且金屬層120a覆蓋通孔114a的內壁。舉例而言,形成金屬層120a的方法可包括下列步驟。首先,進行一化鍍製程以形成一種晶層(未繪示)於軟性基膜110上,其中,種晶層可全面覆蓋軟性基膜110的第一表面S1、第二表面S2以及通孔114a的內壁。化鍍製程是一種自催化氧化還原反應,其可例如利用化學鍍銅液,以在化學鍍銅過程中,使金屬離子得到電子而還原為金屬。在本實施例中,種晶層的材料可包括銅、鎳或其他適合的材料。
接著,以上述的種晶層作為導電路徑而進行一電鍍製程,以形成如圖所示的金屬層120a於軟性基膜110上。在本實施例中,金屬層120a的材料可包括銅或其他適合的材料。在本實施例中,金屬層120a可全面填滿通孔114a,以形成如圖3所示的連通第一表面S1以及第二表面S2的導通孔114,在本實施例中,導通孔114的直徑D1實質上介於10微米至50微米之間。
接著,請參照圖4,對金屬層120a進行一圖案化製程,以形成如圖4所示的圖案化金屬層120。在本實施例中,圖案化製程可包括下列步驟。首先,可例如形成一光阻層(未繪示)於金屬層120a上,其中,光阻層暴露部分的金屬層120a。接著,再對金屬層120a以及種晶層進行一圖案化製程,以移除被光阻層所暴露的部分金屬層120a以及種晶層,因而形成如圖4所示之圖案化金屬層120。當然,上述的線路製程僅用以舉例說明,本實施例並不限制形成圖案化金屬層120的方法,圖案化金屬層120除了透過半加成法來製作以外,亦可透過加成法、減成法等本領域具通常知識者所熟知的方式而形成。
請參照圖4,在本實施例中,圖案化金屬層120包括多個接墊122以及圖案化線路層124。接墊122設置於第一表面S1,並且,在本實施例中,導通孔114可分別設置於接墊122的正下方,以分別連接122接墊。圖案化線路層124設置於第二表面S2,並電性連接導通孔114。在本實施例中,接墊122在第一表面S1上彼此結構隔離(physically isolated),也就是說,在第一表面S1上,接墊122之間並未有其他線路連接,而是以孤島(island)的形式配置於第一表面S1上,接墊122之間可透過導通孔114將電性導通至第二表面S2並經由圖案化線路層124進行電性連接。在這樣的結構配置下,在軟性基膜110的第一表面S1上,除了接墊122以外可不具有任何其他線路,所有的線路皆設置於軟性基膜110的第二表面S2並透過導通孔114與接墊122形成電性連接,因此,第一表面S1省去了佈線空間,可進一步縮短接墊122之間的間距,提高接墊122的設置密度,進而可提升設置於接墊122上的元件的設置密度。並且,由於在軟性基膜110的第一表面S1上除了接墊122以外不具有任何其他線路,且軟性基膜110混合有黑色填料,因此,在軟性基膜110的第一表面S1上無須額外貼附一層黑色或明度非常接近黑色的深色覆蓋膜(coverlay)或油墨來覆蓋及保護第一表面S1上的線路。因此,本實施例的封裝結構100的整體厚度可有效降低(約可降低25微米至50微米)。
圖6是依照本發明的一實施例的一種用於顯示器的封裝結構的軟性基膜的上視示意圖。接著,請參照圖5及圖6,設置如圖6所示的一發光元件陣列於第一表面S1上,其中,發光元件陣列包括多個發光元件組130,而各個發光元件組130又可包括多個發光元件,其所發出的色光的顏色各不相同。舉例而言,發光元件組130可為三原色發光元件組130,也就是說,各個發光元件組130可包括一第一發光元件132、一第二發光元件134以及一第三發光元件136。發光元件組130中的發光元件132、134、136的發光色各不相同,其發光色分別為光的三原色(RGB),且彼此相鄰地設置於接墊122上,以共同組成顯示器中的一個像素。舉例而言,第一發光元件可具有紅色系發光色,第二發光元件具有綠色系發光色,而第三發光元件則可具有藍色系發光色,當然,本實施例並不以此為限。在其他實施例中,各個發光元件組130除了三原色的發光元件132、134、136以外,更可包括具有白色系發光色的第四發光元件,本實施例並不限定發光元件組130的發光元件的數量、種類及顏色。
在本實施例中,發光元件132、134、136可視為發光元件陣列中的一個子像素,藉此,同一原色的子像素發光元件(例如發光元件132、134或136)以條狀排列而形成一組子像素條(如圖6所示的紅像素條R1、綠像素條G1和藍像素條B1)於軟性基膜110的第一表面S1上。一般而言,LED顯示器通常具有大量這種子像素條組。在發光元件組130中的每個子像素(例如發光元件132、134、136)的亮度可以被加以控制以形成具有可察覺出的所要求色的顯示器像素。如此,發光元件132、134、136以陣列的形式配置於軟性基膜110的多個接墊122上,並使發光元件132、134、136與接墊122形成電性連接,以形成可編址的顯示器單元。須說明的是,圖1至圖5所繪示的製作流程剖面圖是僅針對第一發光元件132的局部剖面圖做舉例說明,本領域具通常知識者應了解,軟性基膜110上還可設置其他的發光元件(例如發光元件134、136)。
在本實施例中,發光元件132、134、136可為次毫米發光二極體(Mini LED)或微發光二極體(Micro LED)。一般而言,次毫米發光二極體意指發光元件130的尺寸約在100微米左右的發光二極體。當然,本實施例僅用以舉例說明而並不以此為限。發光元件130可例如以覆晶(flip chip)接合的方式透過多個焊球138而與位於軟性基膜110的第一表面S1上的接墊122接合。在本實施例中,多個發光元件130可以陣列的形式設置於軟性基膜110的第一表面S1上。接著,可設置一覆蓋膜(coverlay)140於軟性基膜110的第二表面S2,並使覆蓋膜140覆蓋第二表面S2上的圖案化線路層124,以保護圖案化線路層124免於受到氧化或是外界污染的影響。在本實施例中,覆蓋膜140可選擇性地設置,並且,覆蓋膜140可為透明覆蓋膜或不透明覆蓋膜。在其他實施例中,覆蓋膜也可設置於軟性基膜110的第一表面S1,並且,覆蓋第一表面S1的覆蓋膜為透明覆蓋膜。至此,本實施例的用於顯示器的封裝結構100的製作方法可大致完成。
在這樣的結構配置下,本實施例的用於顯示器的封裝結構100將軟性基膜110混合黑色填料,並將發光元件130設置於此混有黑色填料的黑色(或明度非常接近黑色的深色)軟性基膜110上,因此,本實施例的混有黑色填料的軟性基膜110可具有不透明、光透射率及反射係數低的特性,並可具有良好的遮光性、導熱性等。並且,相較於習知在一般黃色的聚醯亞胺(polyimide,PI)上額外塗佈一層黑色塗料的作法,本實施例的混有黑色填料的軟性基膜110可避免黑色塗料容易龜裂且易與黃色聚醯亞胺分離的問題且可降低軟性基膜110的整體厚度(約介於10微米至30微米之間)。並且,本實施例的混有黑色填料的軟性基膜110可耐高溫,即使暴露在數千小時的高溫之下,也不易黃化、龜裂,更符合封裝結構100應用於顯示器時所須的數千小時發亮的高溫需求,可以大大提升封裝結構100的品質及穩定性。
並且,本實施例的軟性基膜110更具有可彎折的特性,非常適合標榜可撓性的有機發光二極體(Organic Light-Emitting Diode,OLED)使用,可以應用在可撓性顯示器上。此外,在本實施例中,在第一表面S1上,接墊122之間是透過導通孔114將電性導通至第二表面S2的圖案化線路層124來進行電性連接。因此,軟性基膜110的第一表面S1可省去佈線空間,因而可縮短接墊122之間的間距,提高接墊122的設置密度,進而可提升設置於接墊122上的發光元件132、134、136的元件設置密度,進而提升使用此封裝結構100的顯示器的解析度。因此,本實施例的封裝結構100可應用於對間距須求更精細的高清的顯示器。並且,由於在軟性基膜110的第一表面S1上除了接墊122以外不具有任何其他線路,且軟性基膜110混合有黑色填料,因此,在軟性基膜110的第一表面S1上無須額外貼附一層黑色或明度非常接近黑色的深色覆蓋膜(coverlay)或油墨來覆蓋及保護第一表面S1上的線路。因此,使用本實施例的封裝結構100的顯示器可具有更薄的厚度(厚度約可降低25微米至50微米左右)。
圖7是依照本發明的一實施例的一種用於顯示器的封裝結構的剖面示意圖。在此必須說明的是,本實施例之封裝結構100a與圖5之封裝結構100相似,因此,本實施例沿用前述實施例的元件標號與部分內容,其中採用相同的標號來表示相同或近似的元件,並且省略了相同技術內容的說明。關於省略部分的說明可參考前述實施例,本實施例不再重複贅述。請參照圖7,以下將針對本實施例的封裝結構100a與圖5之封裝結構100的差異做說明。
請參照圖7,在本實施例中,前述的導通孔114可包括多個導電通孔115以及多個導熱通孔116,並且,導電通孔115的其中之一以及導熱通孔116的其中之一皆連接至接墊122的其中之一。換句話說,每個接墊122可同時連接一個導電通孔115以及一個導熱通孔116。導電通孔115可透過接墊122而與發光元件130電性連接,而導熱通孔116則可與接墊122形成熱耦接,使發光元件130所產生的熱可經由接墊122與導熱通孔116所形成的導熱路徑而傳導至第二表面S2的圖案化線路層124,以進行散熱。並且,在本實施例中,封裝結構100a的第二表面S2更可貼附一散熱片,以幫助將傳導至第二表面S2的熱散逸至外界。
當然,本實施例僅用以舉例說明,本實施例並不限制封裝結構100、100a的散熱方式。在其他實施例中,也可以是連接至發光元件132的前述多個導通孔114中的至少其中之一可為導熱通孔,其與接墊122形成熱耦接,而其他的導通孔114則為導電通孔,其與發光元件132電性連接。也就是說每個接墊122仍是如圖5所示之連接至一個導通孔114,但有些接墊122是連接至用以導熱的導熱通孔,有些接墊122則是連接至用以導電的導電通孔。或者,每個導通孔114都可同時作為導熱以及導電之用,以便將發光元件132電性連接至第二表面S2的圖案化線路層124,並同時將發光元件132所產生的熱傳導至第二表面S2的圖案化線路層124,以進行散熱。
綜上所述,本發明的用於顯示器的封裝結構將軟性基膜混合黑色填料,並將發光元件設置於此混有黑色填料的黑色(或明度非常接近黑色的深色)軟性基膜上,因此,本發明實施例的混有黑色填料的軟性基膜可具有不透明、光透射率及反射係數低的特性,並可具有良好的遮光性、導熱性等,非常適合顯示器的應用。並且,可避免習知的黑色塗料容易龜裂且易與黃色聚醯亞胺分離的問題,更可降低軟性基膜的厚度。因此,本實施例的封裝結構具有較佳的生產良率及穩定性。
此外,在某些實施例中,接墊之間是透過導通孔將電性導通至第二表面的圖案化線路層來進行電性連接。因此,軟性基膜的第一表面可省去佈線空間,因而可縮短接墊之間的間距,進而可提升設置於接墊上的發光元件的元件設置密度,進而提升使用此封裝結構的顯示器的解析度。並且,由於在軟性基膜的第一表面上除了接墊以外不具有任何其他線路,且軟性基膜混合有黑色填料,因此,在軟性基膜的第一表面上無須額外貼附一層黑色或深色覆蓋膜或油墨來覆蓋與保護第一表面上的線路,因而可有效降低封裝結構100的整體厚度。因此,本發明的封裝結構可應用於對間距須求更精細且體積更輕薄的顯示器上。
雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明的精神和範圍內,當可作些許的更動與潤飾,故本發明的保護範圍當視後附的申請專利範圍所界定者為準。
100、100a‧‧‧封裝結構
110‧‧‧軟性基膜
112‧‧‧金屬箔層
114‧‧‧導通孔
114a‧‧‧通孔
115‧‧‧導電通孔
116‧‧‧導熱通孔
120‧‧‧圖案化金屬層
120a‧‧‧金屬層
122‧‧‧接墊
124‧‧‧圖案化線路層
130‧‧‧發光元件組
132‧‧‧第一發光元件、發光元件
134‧‧‧第二發光元件、發光元件
136‧‧‧第三發光元件、發光元件
138‧‧‧焊球
140‧‧‧覆蓋膜
B1‧‧‧藍像素條
D1‧‧‧直徑
G1‧‧‧綠像素條
R1‧‧‧紅像素條
S1‧‧‧第一表面
S2‧‧‧第二表面
圖1至圖5是依照本發明的一實施例的一種用於顯示器的封裝結構的製造流程的剖面示意圖。 圖6是依照本發明的一實施例的一種用於顯示器的封裝結構的軟性基膜的上視示意圖。 圖7是依照本發明的一實施例的一種用於顯示器的封裝結構的剖面示意圖。
Claims (11)
- 一種用於顯示器的封裝結構,包括: 一軟性基膜,包括多個導通孔、一第一表面以及相對於該第一表面的一第二表面,該些導通孔連通該第一表面以及該第二表面,其中該軟性基膜的材料包括聚醯亞胺及黑色填料; 多個接墊,設置於該第一表面,該些導通孔連接該些接墊; 一發光元件陣列,包括多個發光元件組,設置於該些接墊上並與該些接墊電性連接,其中各該發光元件組包括顏色各不相同的多個發光元件;以及 一圖案化線路層,設置於該第二表面並電性連接該些導通孔。
- 如申請專利範圍第1項所述的用於顯示器的封裝結構,其中該軟性基膜的顏色為黑色。
- 如申請專利範圍第1項所述的用於顯示器的封裝結構,其中該軟性基膜的反射率小於聚醯亞胺的反射率。
- 如申請專利範圍第1項所述的用於顯示器的封裝結構,其中該軟性基膜的反射率小於10%。
- 如申請專利範圍第1項所述的用於顯示器的封裝結構,其中各該發光元件組包括具有紅色系發光色的一第一發光元件、具有綠色系發光色的一第二發光元件以及具有藍色系發光色一第三發光元件,分別設置於該些接墊上。
- 如申請專利範圍第5項所述的用於顯示器的封裝結構,其中各該發光元件組更包括具有白色系發光色的一第四發光元件,設置於該些接墊上。
- 如申請專利範圍第1項所述的用於顯示器的封裝結構,其中各該導通孔的一直徑實質上介於10微米至50微米之間。
- 如申請專利範圍第1項所述的用於顯示器的封裝結構,其中該軟性基膜的一厚度實質上介於10微米至30微米之間。
- 如申請專利範圍第1項所述的用於顯示器的封裝結構,更包括一覆蓋膜(coverlay),設置於該第二表面並覆蓋該圖案化線路層。
- 如申請專利範圍第1項所述的用於顯示器的封裝結構,其中該些導通孔包括多個導電通孔以及多個導熱通孔,該些導電通孔的其中之一以及該些導熱通孔的其中之一皆連接至該些接墊的其中之一。
- 如申請專利範圍第1項所述的用於顯示器的封裝結構,其中該些接墊在該第一表面上彼此結構隔離(physically isolated)。
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