CN208798266U - Circuit board and electrical appliance - Google Patents
Circuit board and electrical appliance Download PDFInfo
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- CN208798266U CN208798266U CN201821296734.9U CN201821296734U CN208798266U CN 208798266 U CN208798266 U CN 208798266U CN 201821296734 U CN201821296734 U CN 201821296734U CN 208798266 U CN208798266 U CN 208798266U
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- radiator
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- circuit board
- chip
- connect
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Abstract
It includes: substrate, chip and radiator that the utility model, which provides a kind of circuit board and electrical appliance, the circuit board,；Chip is installed on substrate；Radiator is plate-like, and radiator filler cap is located at the outside of chip, and the bottom edge of radiator towards substrate is connect by annular seal with substrate, and annular seal is disposed around around chip；What is be spaced on the top surface of radiator is provided with multiple cooling fins；What is be spaced on the top surface of radiator is provided with multiple cooling fins；Metal cap is not provided between radiator and substrate, structure is simple and reduces costs.
Description
Technical field
The utility model relates to electronic technology more particularly to a kind of circuit boards and electrical appliance.
Background technique
With the gradually development of electronic technology, the quantity of electrical appliance chips on circuit boards gradually increases；Electrical appliance is working
When can generate electromagnetic signal, electromagnetic signal is easy to influence chip operation, and then leads to electrical appliance cisco unity malfunction；Therefore how
It avoids electromagnetic signal from impacting chip, has become a hot topic of research.
In the prior art, electromagnetic signal is often avoided to influence electronic device work by electromagnetic screen.Electromagnetic shielding
Device includes metal cap, bracket and radiator；Bracket is made of metal material, and bracket connects with circuit board by welding
It connects, bracket is in frame shape and is disposed around the outside of chip, and metal cap is located at the top of bracket to close cantilever tip, metal cap
It is connect by way of clamping with bracket；Radiator is plate-like, and radiator is mainly made of aluminium alloy, and radiator passes through double-sided adhesive
It is connect with the top of metal cap；The top of radiator is provided with multiple heat bulges, and radiator generates when can be by chip operation
Heat be discharged into outside air, in order to avoid chip overheating.Chip is located at bracket and metal cap encloses in the cavity being set as, bracket and
Metal cap can prevent electromagnetic signal from entering in cavity, and then electromagnetic signal is avoided to influence chip operation.
However, in the prior art, metal cap being provided between radiator and bracket made of metal, causes to be electromagnetically shielded
Structure is complicated for device, the high production cost of circuit board.
Utility model content
The utility model provides a kind of circuit board and electrical appliance, to solve to set between radiator and bracket made of metal
Metal cap is set, the technical issues of leading to electromagnetic screen, structure is complicated, the high production cost of circuit board.
The utility model provides a kind of circuit board, comprising: substrate, chip and radiator；The chip is mounted on described
On substrate；The radiator is plate-like, and the radiator filler cap is located at the outside of the chip, and the radiator is towards the substrate
Bottom edge connect with the substrate by annular seal, the annular seal is disposed around around the chip；Institute
State be spaced on the top surface of radiator be provided with multiple cooling fins.
Circuit board as described above, it is preferable that the annular seal includes metallic support in the shape of a frame；The metal branch
The bottom end of frame is connect with the substrate, and the top of the metallic support is connect with the bottom surface of the radiator.
Circuit board as described above, it is preferable that first annular slot is provided on the radiator bottom surface, it is described first annular
The first adhesive tape is equipped in slot, the top of the metallic support is connect with first adhesive tape.
Circuit board as described above, it is preferable that first adhesive tape is internally provided with along the first adhesive tape length direction
The fabrication hole of extension.
Circuit board as described above, it is preferable that first adhesive tape is conductive adhesive tape.
Circuit board as described above, it is preferable that the annular seal includes that the radiator bottom surface is downwardly extending
Flange connector；The flange connector is connect with the substrate.
Circuit board as described above, it is preferable that the flange connector is connect by the second adhesive tape with the substrate.
Circuit board as described above, it is preferable that the bottom end of the flange connector is provided with the second annular groove, second glue
Item is threaded through in the annular groove.
Circuit board as described above, it is preferable that the bottom end of the flange connector is connected by elastic sheet metal and the substrate
It connects；In a ring, one end of the elastic sheet metal is connect the elastic sheet metal with the flange connector, the elastic sheet metal
The other end connect with the substrate.
The utility model also provides a kind of electrical appliance, comprising: circuit board as described above.
Circuit board and electrical appliance provided by the utility model, by making radiator filler cap be located at the outside of chip, radiator bottom
The edge in face is connect by annular seal with substrate, and annular seal is disposed around around chip；Radiator and substrate it
Between be not provided with metal cap, structure is simple and reduces costs.
Detailed description of the invention
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is
Some embodiments of the utility model, for those of ordinary skill in the art, without creative efforts,
It is also possible to obtain other drawings based on these drawings.
Fig. 1 is the structural schematic diagram for the circuit board that an embodiment of the present invention provides；
The connection schematic diagram of metallic support in the circuit board that Fig. 2 provides for an embodiment of the present invention；
Connection schematic diagram in the circuit board that Fig. 3 provides for an embodiment of the present invention between flange connector and substrate；
Connection signal in the circuit board that Fig. 4 provides for another embodiment of the utility model between flange connector and substrate
Figure；
Connection signal in the circuit board that Fig. 5 provides for the utility model another embodiment between flange connector and substrate
Figure；
The connection schematic diagram of elastic sheet metal in the circuit board that Fig. 6 provides for an embodiment of the present invention.
Description of symbols:
10, radiator；
20, substrate；
30, chip；
40, metallic support；
50, the first adhesive tape；
60, the second adhesive tape；
70, elastic sheet metal；
101, cooling fin；
102, flange connector.
Specific embodiment
It is practical new below in conjunction with this to keep the objectives, technical solutions, and advantages of the embodiments of the present invention clearer
Attached drawing in type embodiment, the technical scheme in the utility model embodiment is clearly and completely described, it is clear that is retouched
The embodiment stated is the utility model a part of the embodiment, instead of all the embodiments.Based on the implementation in the utility model
Example, every other embodiment obtained by those of ordinary skill in the art without making creative efforts belong to
The range of the utility model protection.In the absence of conflict, the feature in following embodiment and embodiment can be mutual group
It closes.
Fig. 1 is the structural schematic diagram for the circuit board that an embodiment of the present invention provides；Fig. 2 is the implementation of the utility model one
The connection schematic diagram of metallic support in the circuit board that example provides；Connect in the circuit board that Fig. 3 provides for an embodiment of the present invention
Connect the connection schematic diagram between flange and substrate；Flange connector in the circuit board that Fig. 4 provides for another embodiment of the utility model
Connection schematic diagram between substrate；Flange connector and substrate in the circuit board that Fig. 5 provides for the utility model another embodiment
Between connection schematic diagram；The connection schematic diagram of elastic sheet metal in the circuit board that Fig. 6 provides for an embodiment of the present invention.
Please refer to Fig. 1-Fig. 6.The present embodiment provides a kind of circuit boards, comprising: substrate 20, chip 30 and radiator 10；
Chip 30 is installed on the base plate 20；Radiator 10 is plate-like, and radiator 10, which covers, is located at the outside of chip 30, and radiator 10 is towards base
The bottom edge of plate 20 is connect by annular seal with substrate 20, and annular seal is disposed around around the chip 30；It dissipates
What is be spaced on the top surface of hot device 10 is provided with multiple cooling fins 101.
Specifically, substrate 20 can be the insulation boards such as resin plate, be pasted on the side of substrate 20 with certain circuit diagram
The copper sheet of shape, it is preferable that copper sheet can be formed on the side of substrate 20 by way of plating.
Specifically, chip 30 is the silicon wafer containing integrated circuit, and what is be spaced on chip 30 is provided with multiple pins, each pin
Be electrically connected with integrated circuit, pin is connect with substrate 20 by welding, and pin also with the copper sheet on substrate 20
Connection, to realize that chip 30 is electrically connected with circuit on substrate 20.
It specifically, can be able to be that organosilicon is thermally conductive by thermally conductive glue connection, heat-conducting glue between radiator 10 and chip 30
Glue, epoxide-resin glue, polyurethane adhesive etc.；Heat-conducting glue can will improve the transmission speed of heat between chip 30 and radiator 10,
It with the heat transfer that quickly generates chip 30 to radiator 10, and then is discharged into air by radiator 10, to realize pair
The cooling of chip 30.Alternatively, radiator 10 can also be abutted with chip 30, the heat transfer that chip 30 is generated to radiator
In 10；10 bottom surface of certain radiator can also be spaced setting between the top surface of chip 30.
Preferably, radiator 10 can be mainly made of aluminium alloy, and the thermal conductivity of aluminium alloy is good and density is small, can be subtracted
The quality of small radiator 10, in case the quality of circuit board is excessive.
Further, radiator 10 can be plate-like, and wherein radiator 10 can be with rounded plate, rectangular slab, triangular plate
Deng the plate of rule；Certainly, radiator 10 can also be in other irregular plates.
Specifically, cooling fin 101 can be connect by welding or bolted mode with radiator 10；The present embodiment
Preferably, cooling fin 101 is integrally formed by way of casting with radiator 10.Preferably, multiple cooling fins 101 are parallel sets
It sets.
It should be noted that radiator and cooling fin consist of metal in the present embodiment.
Specifically, the edge of 10 bottom surface of radiator is connect by annular seal with substrate 20, and chip 30 is accommodated in
It is enclosed in the accommodating chamber being set as by annular seal and 10 bottom surface of radiator, radiator 10 and annular seal can prevent electromagnetism from believing
It number enters in accommodating chamber, in case extraneous electromagnetic signal influences chip 30 and works.
Preferably, annular seal may include metal mesh, and metal mesh is bent in a ring, and metal mesh is wound around chip 30
Outside；Metal mesh can be copper mesh, iron net, aluminium net etc..Metal mesh is on the basis of preventing electromagnetic signal from entering accommodating chamber, also
The particulate matters such as extraneous dust can be prevented to enter in accommodating chamber, and then avoid particulate matter from influencing chip 30 and work.
Preferably, annular seal may include ring shaped conductive glue, and radiator 10 is connected by ring shaped conductive glue and substrate 20
It connects, on the basis of preventing electromagnetic signal from entering accommodating chamber, the leakproofness between radiator 10 and substrate 20 can also be improved,
And then extraneous air is prevented to enter in accommodating chamber, avoid the gases affects such as vapor in air chip 30 from working.It is conductive
Glue includes colloid matrix and the conductive material that is applied on gum base outside, and conductive material may include copper, iron, aluminium etc.
Metal powder or conductive material are other non-metal powders such as graphite.Conductive material can also be distributed in the interior of colloid matrix
Portion.
It should be noted that the first connecting hole is also provided on radiator 10, correspondingly, offering on the base plate 20
Two connecting holes, fastening bolt are threaded through in the first connecting hole and the second connecting hole, on the base plate 20 by the installation of radiator 10, in order to avoid
Radiator 10 is separated with substrate 20 when in use.Preferably, what is be spaced on radiator 10 is provided with the first positioning column and second
Positioning column, correspondingly, first positioning hole and second location hole are provided on the base plate 20, when installing radiator 10, first by
One positioning column is threaded through in first positioning hole, and the second positioning column is threaded through in second location hole, in order to avoid fastened in installation
Radiator 10 is mobile when bolt, and the position between radiator 10 and substrate 20 is caused to change.
The process of circuit board provided in this embodiment are as follows: first on the base plate 20 by the installation of chip 30, later in core
Annular seal is arranged in the outside of piece 30, then radiator 10 is covered and is located at chip 30 on the bottom surface of substrate 20, and is radiated
The bottom surface of device 10 is connected on the top surface of chip 30, at the same time, the underrun annular seal and substrate 20 of radiator 10
Connection；Radiator 10 and substrate 20 are linked together finally by fastening bolt.
Circuit board provided in this embodiment, by connecting the bottom surface of radiator 10 with chip 30,10 bottom surface of radiator
Edge is connect by annular seal with substrate 20, and annular seal is disposed around the outside of chip 30；In radiator 10 and substrate
Metal cap is not provided between 20, structure is simple and reduces costs.
Specifically, annular seal includes metallic support 40 in the shape of a frame；The bottom end of metallic support 40 is connect with substrate 20,
The top of metallic support 40 is connect with the bottom surface of radiator 10.Radiator 10 is connect by metallic support 40 with substrate 20, metal
Bracket 40 can support radiator 10, in order to avoid metallic support 40 is mobile to substrate 20 when radiator 10 is squeezed, and then keep away
It is excessive and damage to exempt from pressure that chip 30 is subject to.
Preferably, metallic support 40 can be connect with substrate 20 by welding or metallic support 40 passes through spiral shell
It tethers and the modes such as connects, is clamped and connect with substrate 20.
Specifically, it is provided with first annular slot on 10 bottom surface of radiator, the first adhesive tape 50 is equipped in first annular slot, gold
The top for belonging to bracket 40 is connect with the first adhesive tape 50.First adhesive tape 50 can be improved close between metallic support 40 and radiator 10
Feng Xing.
It should be noted that the size of first annular slot or the size of the first adhesive tape 50 is reasonably arranged, can make
When the first adhesive tape 50 to be threaded through in first annular slot, the first adhesive tape of part 50 can be protruded by the bottom surface of radiator 10, with
Just when being connected radiator 10 on the base plate 20 by fastening bolt, the top of metallic support 40 is supported in the first adhesive tape 50
So that elastic deformation occurs for the first adhesive tape 50, metallic support 40 and radiator can be improved under the action of the first 50 elasticity of adhesive tape
Leakproofness between 10.
Specifically, the top of metallic support 40 has internally been bent to form interconnecting piece, and interconnecting piece is supported in the first adhesive tape 50
On；The contact area of metallic support 40 and the first adhesive tape 50 can be increased, to further increase metallic support 40 and radiator 10
Between leakproofness.
Specifically, the first adhesive tape 50 is internally provided with the fabrication hole extended along 50 length direction of the first adhesive tape.In radiator
10 and metallic support 40 when compressing the first adhesive tape 50 technique pore volume reduce, in order to avoid the first adhesive tape 50 is crushed.
Specifically, the first adhesive tape 50 is conductive adhesive tape.Conductive adhesive tape can prevent electromagnetism from believing under the premise of guaranteeing sealing
Number through being entered in accommodating chamber between radiator 10 and metallic support 40.
Preferably, the first adhesive tape 50 can for mainly by carbon nanotube, aluminium is silver-plated, glass is silver-colored, carbon nickel plating etc. is constituted leads
Electric glue.
Specifically, annular seal includes the flange connector 102 that 10 bottom surface of radiator is downwardly extending；Flange connector
102 connect with substrate 20.Radiator 10 is directly connect with substrate 20, is further simplified the structure of circuit board, is reduced circuit board
Production cost.
Specifically, flange connector 102 and radiator 10 are enclosed and are set as in accommodating chamber, are installed on the base plate 20 by radiator 10
When, chip 30 accommodates in accommodating chamber.
Preferably, flange connector 102 can be connect by welding or bolted mode with substrate 20.
Specifically, flange connector 102 is connect by the second adhesive tape 60 with substrate 20.Flange connector 102 passes through the second adhesive tape
60 connect with substrate 20, and the leakproofness between flange connector 102 and substrate 20 can be improved.
Preferably, the second adhesive tape 60 can be mainly to be led by conductive cloth bag foam, all-directional conductive foam etc. to the present embodiment
Electric material is constituted.Or second adhesive tape 60 be mainly made of metal mesh.
Specifically, the bottom end of flange connector 102 is provided with the second annular groove, and the second adhesive tape 60 is worn in a ring groove.The
Two adhesive tape 60 are accommodated in the second annular groove, and first the second adhesive tape 60 can be threaded through in the second annular groove, be easily installed.
Preferably, the second adhesive tape 60 can be threaded through completely in the second annular groove；Alternatively, 60 part of the second adhesive tape is threaded through
In second annular groove, i.e. the top of the second adhesive tape 60 is formed with lug boss, and lug boss is threaded through in the second annular groove, the second adhesive tape
60 bottom end is formed with joint face, and joint face abuts on the base plate 20.
Specifically, the bottom end of flange connector 102 is connect by elastic sheet metal 70 with substrate 20；Elastic sheet metal 70 is in ring
One end of shape, elastic sheet metal 70 is connect with flange connector 102, and the other end of elastic sheet metal 70 is connect with substrate 20.It is dissipating
When hot device 10 is compressed, elastic deformation occurs for elastic sheet metal 70, is adjusted with the elastic deformation by elastic sheet metal 70
The distance between radiator 10 and substrate 20.
Preferably, the top of elastic sheet metal 70 can be connect with radiator 10 by welding, elastic sheet metal
70 bottom end is connect with substrate 20 by welding.
In other embodiments, the bottom end of flange connector 102 can also be connect by molding flange gasket with substrate 20.
With continued reference to Fig. 1-Fig. 6.A kind of electrical appliance, including circuit board as described above are also provided in other embodiments.
Wherein circuit board, comprising: substrate 20, chip 30 and radiator 10；Chip 30 is installed on the base plate 20；Radiator
10 is plate-like, and radiator 10 covers the outside for being located at chip 30, and the bottom edge of radiator 10 towards substrate 20 passes through ring packing
Portion is connect with substrate 20, and annular seal is disposed around around the chip 30；What is be spaced on the top surface of radiator 10 is provided with
Multiple cooling fins 101.
Specifically, substrate 20 can be the insulation boards such as resin plate, be pasted on the side of substrate 20 with certain circuit diagram
The copper sheet of shape, it is preferable that copper sheet can be formed on the side of substrate 20 by way of plating.
Specifically, chip 30 is the silicon wafer containing integrated circuit, and what is be spaced on chip 30 is provided with multiple pins, each pin
Be electrically connected with integrated circuit, pin is connect with substrate 20 by welding, and pin also with the copper sheet on substrate 20
Connection, to realize that chip 30 is electrically connected with circuit on substrate 20.
It specifically, can be able to be that organosilicon is thermally conductive by thermally conductive glue connection, heat-conducting glue between radiator 10 and chip 30
Glue, epoxide-resin glue, polyurethane adhesive etc.；Heat-conducting glue can will improve the transmission speed of heat between chip 30 and radiator 10,
It with the heat transfer that quickly generates chip 30 to radiator 10, and then is discharged into air by radiator 10, to realize pair
The cooling of chip 30.Alternatively, radiator 10 can also be abutted with chip 30, the heat transfer that chip 30 is generated to radiator
In 10；10 bottom surface of certain radiator can also be spaced setting between the top surface of chip 30.
The process of circuit board provided in this embodiment are as follows: first on the base plate 20 by the installation of chip 30, later in core
Annular seal is arranged in the outside of piece 30, then radiator 10 is covered and is located at chip 30 on the bottom surface of substrate 20, and is radiated
The bottom surface of device 10 is connected on the top surface of chip 30, at the same time, the underrun annular seal and substrate 20 of radiator 10
Connection；Radiator 10 and substrate 20 are linked together finally by fastening bolt.
Circuit board provided in this embodiment, by connecting the bottom surface of radiator 10 with chip 30,10 bottom surface of radiator
Edge is connect by annular seal with substrate 20, and annular seal is disposed around the outside of chip 30；In radiator 10 and substrate
Metal cap is not provided between 20, structure is simple and reduces costs.
In the present invention, unless otherwise specific regulation, the arts such as term " installation ", " connected ", " connection ", " fixation "
Language shall be understood in a broad sense, for example, it may be being fixedly connected, be also possible to removably connect, or be integrally formed, and can be machinery
Connection is also possible to be electrically connected or can communicate each other；It can be directly connected, can also be indirectly connected with by intermediate medium,
It can be the connection inside two elements or the interaction relationship of two elements, unless otherwise restricted clearly.For this
For the those of ordinary skill in field, the concrete meaning of above-mentioned term in the present invention can be understood as the case may be.
Finally, it should be noted that the above various embodiments is only to illustrate the technical solution of the utility model, rather than it is limited
System；Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should
Understand: it is still possible to modify the technical solutions described in the foregoing embodiments, or to some or all of
Technical characteristic is equivalently replaced；And these are modified or replaceed, it does not separate the essence of the corresponding technical solution, and this is practical new
The range of each embodiment technical solution of type.
Claims (10)
1. a kind of circuit board characterized by comprising substrate, chip and radiator；The chip is mounted on the substrate
On；The radiator is plate-like, and the radiator filler cap is located at the outside of the chip, and the radiator is towards the bottom of the substrate
Face edge is connect by annular seal with the substrate, and the annular seal is disposed around around the chip；It is described to dissipate
What is be spaced on the top surface of hot device is provided with multiple cooling fins.
2. circuit board according to claim 1, which is characterized in that the annular seal includes metal branch in the shape of a frame
Frame；The bottom end of the metallic support is connect with the substrate, and the top of the metallic support is connect with the bottom surface of the radiator.
3. circuit board according to claim 2, which is characterized in that it is provided with first annular slot on the radiator bottom surface,
The first adhesive tape is equipped in the first annular slot, the top of the metallic support is connect with first adhesive tape.
4. circuit board according to claim 3, which is characterized in that first adhesive tape is internally provided with along first glue
The fabrication hole that length direction extends.
5. circuit board according to claim 3 or 4, which is characterized in that first adhesive tape is conductive adhesive tape.
6. circuit board according to claim 1, which is characterized in that the annular seal include the radiator bottom surface to
Under the flange connector that extends to form；The flange connector is connect with the substrate.
7. circuit board according to claim 6, which is characterized in that the flange connector passes through the second adhesive tape and the substrate
Connection.
8. circuit board according to claim 7, which is characterized in that the bottom end of the flange connector is provided with the second annular
Slot, second adhesive tape are threaded through in the annular groove.
9. circuit board according to claim 6, which is characterized in that the bottom end of the flange connector by elastic sheet metal with
The substrate connection；In a ring, the side of the elastic sheet metal is connect the elastic sheet metal with the flange connector, described
The other side of elastic sheet metal is connect with the substrate.
10. a kind of electrical appliance characterized by comprising the described in any item circuit boards of claim 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821296734.9U CN208798266U (en) | 2018-08-13 | 2018-08-13 | Circuit board and electrical appliance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821296734.9U CN208798266U (en) | 2018-08-13 | 2018-08-13 | Circuit board and electrical appliance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208798266U true CN208798266U (en) | 2019-04-26 |
Family
ID=66205330
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821296734.9U Active CN208798266U (en) | 2018-08-13 | 2018-08-13 | Circuit board and electrical appliance |
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| Country | Link |
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| CN (1) | CN208798266U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112040718A (en) * | 2020-07-28 | 2020-12-04 | 湖北清江水电开发有限责任公司 | Glue-pouring waterproof fire detector terminal box |
| CN112366188A (en) * | 2020-08-24 | 2021-02-12 | 杰群电子科技（东莞）有限公司 | Semiconductor device packaging structure with radiating tooth sheet and packaging method |
| CN112781734A (en) * | 2020-12-18 | 2021-05-11 | 杭州麦乐克科技股份有限公司 | Pyroelectric sensor and packaging method thereof |
| CN112864108A (en) * | 2019-11-12 | 2021-05-28 | 健策精密工业股份有限公司 | Heat sink |
| WO2022089366A1 (en) * | 2020-10-26 | 2022-05-05 | 华为技术有限公司 | Heat dissipation assembly reducing electromagnetic noise of chip, chip packaging assembly, and electronic device |
| WO2023098503A1 (en) * | 2021-11-30 | 2023-06-08 | 华为技术有限公司 | Shielding structure, package body, board-level architecture, radiator, and electronic device |
-
2018
- 2018-08-13 CN CN201821296734.9U patent/CN208798266U/en active Active
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112864108A (en) * | 2019-11-12 | 2021-05-28 | 健策精密工业股份有限公司 | Heat sink |
| CN112864108B (en) * | 2019-11-12 | 2024-04-02 | 健策精密工业股份有限公司 | Heat sink |
| CN112040718A (en) * | 2020-07-28 | 2020-12-04 | 湖北清江水电开发有限责任公司 | Glue-pouring waterproof fire detector terminal box |
| CN112366188A (en) * | 2020-08-24 | 2021-02-12 | 杰群电子科技（东莞）有限公司 | Semiconductor device packaging structure with radiating tooth sheet and packaging method |
| WO2022089366A1 (en) * | 2020-10-26 | 2022-05-05 | 华为技术有限公司 | Heat dissipation assembly reducing electromagnetic noise of chip, chip packaging assembly, and electronic device |
| CN112781734A (en) * | 2020-12-18 | 2021-05-11 | 杭州麦乐克科技股份有限公司 | Pyroelectric sensor and packaging method thereof |
| WO2023098503A1 (en) * | 2021-11-30 | 2023-06-08 | 华为技术有限公司 | Shielding structure, package body, board-level architecture, radiator, and electronic device |
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