CN208767333U - A kind of COB light source - Google Patents
A kind of COB light source Download PDFInfo
- Publication number
- CN208767333U CN208767333U CN201820464516.5U CN201820464516U CN208767333U CN 208767333 U CN208767333 U CN 208767333U CN 201820464516 U CN201820464516 U CN 201820464516U CN 208767333 U CN208767333 U CN 208767333U
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- China
- Prior art keywords
- substrate
- grid
- light source
- cob light
- led chip
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- 239000000758 substrate Substances 0.000 claims abstract description 47
- 239000003292 glue Substances 0.000 claims abstract description 29
- 238000009826 distribution Methods 0.000 claims abstract description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 9
- 238000001746 injection moulding Methods 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 238000002347 injection Methods 0.000 claims description 3
- 239000007924 injection Substances 0.000 claims description 3
- 230000003647 oxidation Effects 0.000 claims description 3
- 238000007254 oxidation reaction Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 10
- 230000010354 integration Effects 0.000 abstract description 5
- 230000003287 optical effect Effects 0.000 description 5
- 239000004568 cement Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 241001062009 Indigofera Species 0.000 description 2
- 241001465382 Physalis alkekengi Species 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000003760 hair shine Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000000243 photosynthetic effect Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
Abstract
A kind of COB light source, including substrate, several LED chips being distributed on substrate and for the fluorescent film of light distribution；The fluorescent film includes grid, and the grid is fixed on substrate, and several filling regions are formed in the grid, and the filling region and LED chip correspond, and fluorescent glue is equipped in the filling region.The utility model is separated the LED chip on substrate using grid, and the COB light source of multi color temperature can be realized in the fluorescent glue that different-colour is filled in filling region, this kind of light-source structure is simple, and manufacturing process is simple；In addition, LED chip is blue chip, when manufacture, first LED chip is consolidated on substrate, then fluorescent film is pressed on substrate again, therefore the High Density Integration of LED chip may be implemented.
Description
Technical field
The utility model relates to LED field, especially a kind of double-colored temperature COB light source.
Background technique
COB light source be it is a kind of LED chip is placed directly against on the mirror surface substrate of high reflecting rate, it is logical using COB encapsulation technology
It crosses the high photosynthetic efficiency that bonding wire is bonded with circuit board and integrates area source, and covered with resin to ensure reliability, relative to it
The LED light source of his structure has electrical stabilization, Gao Xianse, the uniform, rapid heat dissipation that shines, is convenient for light distribution, exempts from reflow soldering, reduces
The advantages that Design of Luminaires difficulty, therefore had been more and more widely used in LED encapsulation technology field.
Currently, the high color temperature of COB or the display of low color temperature are by different fluorescent powders in existing COB light source lamps and lanterns
Type and the ratio of configuration fluorescent powder control the display of high low color temperature, later with carry out a powder after silica gel spin coating and cover chip.
This manufacture craft is only able to display a kind of colour temperature, and the conversion of two kinds of colour temperatures can not be carried out inside the same COB, is unable to satisfy certain
The demand of a little scene applications, and the COB light source of monochromatic temperature also brings certain limitation to the application of COB light source lamps and lanterns.
And some color temperature-tunable COB light sources on the market, CSP and blue chip are mainly set on substrate, then in one layer of covering
Fluorescent adhesive layer is to achieve the purpose that change colour temperature.Since CSP volume is larger, so the interval between LED chip is larger, this kind
COB light source cannot achieve High Density Integration.
Summary of the invention
The technical problem to be solved by the utility model is to provide a kind of COB light sources, can be realized the high density of LED chip
It is integrated, and manufacturing process is simple.
In order to solve the above technical problems, the technical solution of the utility model is: a kind of COB light source, including substrate, Ruo Ganfen
LED chip of the cloth on substrate and the fluorescent film for light distribution；The fluorescent film includes grid, and the grid is fixed on substrate
On, several filling regions are formed in the grid, the filling region and LED chip are corresponded, set in the filling region
There is fluorescent glue.The utility model is separated the LED chip on substrate using grid, and the glimmering of different-colour is filled in filling region
The COB light source of multi color temperature can be realized in optical cement, this kind of light-source structure is simple, and manufacturing process is simple；In addition, LED chip is indigo plant
LED chip when manufacture, is first consolidated on substrate, then fluorescent film is pressed on substrate again, therefore LED may be implemented by optical chip
The High Density Integration of chip.
As an improvement, the grid is formed by in-mould injection.
As an improvement, the grid passes through injection molding.
As an improvement, the grid is by aluminium flake punch forming.
As an improvement, the fluorescent glue includes just white fluorescent glue and warm white fluorescent glue, warm white fluorescent glue and just white fluorescent glue
It is spaced apart.
As an improvement, the edge of the grid is equipped with connecting plate, the connecting plate is equipped with the first screw hole, on the substrate
Equipped with the second screw hole, connecting plate is connected and fixed by bolt and substrate.
As an improvement, the one side of the grid is affixed with substrate.
As an improvement, the aluminum flake surface is equipped with oxidation film.
Brought beneficial effect is the utility model compared with prior art:
The utility model is separated the LED chip on substrate using grid, and the glimmering of different-colour is filled in filling region
The COB light source of multi color temperature can be realized in optical cement, this kind of light-source structure is simple, and manufacturing process is simple；In addition, LED chip is indigo plant
LED chip when manufacture, is first consolidated on substrate, then fluorescent film is pressed on substrate again, therefore LED may be implemented by optical chip
The High Density Integration of chip.
Detailed description of the invention
Fig. 1 is the grid of the injection molding on substrate.
Fig. 2 is the schematic diagram that fluorescent glue is put on the basis of the grid of Fig. 1.
Fig. 3 is the grid obtained by injection molding or aluminium flake impact forming method.
Fig. 4 is the schematic diagram that fluorescent glue is put on the basis of the grid of Fig. 3.
Fig. 5 is die bond schematic diagram on substrate.
Fig. 6 is the intention that fluorescent film is bonded with substrate.
Specific embodiment
The utility model is described in further detail with reference to the accompanying drawings of the specification.
As shown in Figures 1 to 6, a kind of COB light source including substrate 1, several distribution LED chips 3 on substrate 1 and is used for
The fluorescent film 7 of light distribution.The fluorescent film 7 includes grid 2, and the grid 2 is fixed on substrate 1, is formed in the grid 2 several
The shape of filling region 6, the grid 2 is identical as the die bond region shape on substrate 1, the filling region 6 and LED chip 3
It corresponds, i.e., each LED chip 3 is located in filling region 6.It is equipped with fluorescent glue 4 in the filling region 6, the present embodiment
Fluorescent glue 4 includes just white fluorescent glue and warm white fluorescent glue, and warm white fluorescent glue is spaced apart with just white fluorescent glue, and blue chip passes through
Different fluorescent glues are excited to generate the white light of different-colour.
There are many preparation methods of the COB of the utility model:
1, after the completion of 1 die bond of substrate, grid 2 as shown in Figure 1, 2, is formed by way of in-mould injection on substrate 1, this
When grid 2 can be good at the surface for being attached to substrate 1, and each LED chip 3 is fallen in corresponding filling region 6；Finally filling out
It fills and puts fluorescent glue in region 6.
2, as shown in figure 3, obtaining grid 2 by injection molding manner；As shown in figure 4, being put in the filling region 6 of grid 2 glimmering
Optical cement is simultaneously formed by curing fluorescent film 7；As shown in figure 5, die bond on substrate 1；As shown in fig. 6, on substrate 1 by the patch of fluorescent film 7.
3, as shown in figure 3, obtaining grid 2 by aluminium flake impact style；As shown in figure 4, point in the filling region 6 of grid 2
Fluorescent glue is simultaneously formed by curing fluorescent film 7；As shown in figure 5, die bond on substrate 1；As shown in fig. 6, fluorescent film 7 is attached to substrate 1
On.
The grid 2 obtained by injection molding manner or aluminium flake impact style can be fitted in substrate 1 in assembly with glue
On.Or connecting plate is reserved at the edge of grid 2 at the time of molding, the connecting plate is equipped with the first screw hole, sets on the substrate 1
There is the second screw hole, connecting plate is connected and fixed by bolt with substrate 1.When grid 2 is bonded with 1 surface of substrate, due to fluorescent glue
It for silica gel, can deform after being squeezed, so last 3 meeting of LED chip is so that the bottom surface of fluorescent glue deforms.
For the conduction for preventing aluminium flake, the aluminum flake surface is equipped with oxidation film.
The utility model is separated the LED chip 3 on substrate 1 using grid 2, fills different-colour in filling region 6
Fluorescent glue the COB light source of multi color temperature can be realized, this kind of light-source structure is simple, and manufacturing process is simple；In addition, LED chip 3 is equal
It is first that LED chip 3 is solid on substrate 1 when manufacture for blue chip, then again by the pressure of fluorescent film 7 on substrate 1, therefore can be with
Realize the High Density Integration of LED chip 3.
Claims (8)
1. a kind of COB light source, including substrate, several LED chips being distributed on substrate and for the fluorescent film of light distribution；Its feature
Be: the fluorescent film includes grid, and the grid is fixed on substrate, and several filling regions are formed in the grid, described
Filling region and LED chip correspond, and fluorescent glue is equipped in the filling region.
2. a kind of COB light source according to claim 1, it is characterised in that: the grid is formed by in-mould injection.
3. a kind of COB light source according to claim 1, it is characterised in that: the grid passes through injection molding.
4. a kind of COB light source according to claim 1, it is characterised in that: the grid is by aluminium flake punch forming.
5. a kind of COB light source according to claim 1, it is characterised in that: the fluorescent glue includes just white fluorescent glue and warms up
White fluorescent glue, warm white fluorescent glue are spaced apart with just white fluorescent glue.
6. a kind of COB light source according to claim 1, it is characterised in that: the edge of the grid is equipped with connecting plate, described
Connecting plate is equipped with the first screw hole, and the substrate is equipped with the second screw hole, and connecting plate is connected and fixed by bolt and substrate.
7. a kind of COB light source according to claim 1, it is characterised in that: the one side of the grid is affixed with substrate.
8. a kind of COB light source according to claim 4, it is characterised in that: the aluminum flake surface is equipped with oxidation film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820464516.5U CN208767333U (en) | 2018-04-03 | 2018-04-03 | A kind of COB light source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820464516.5U CN208767333U (en) | 2018-04-03 | 2018-04-03 | A kind of COB light source |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208767333U true CN208767333U (en) | 2019-04-19 |
Family
ID=66125192
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820464516.5U Active CN208767333U (en) | 2018-04-03 | 2018-04-03 | A kind of COB light source |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208767333U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021072962A1 (en) * | 2019-10-15 | 2021-04-22 | 广州光联电子科技有限公司 | Light-emitting light source having dual color temperatures or multiple color temperatures |
-
2018
- 2018-04-03 CN CN201820464516.5U patent/CN208767333U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021072962A1 (en) * | 2019-10-15 | 2021-04-22 | 广州光联电子科技有限公司 | Light-emitting light source having dual color temperatures or multiple color temperatures |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A COB light source Effective date of registration: 20231225 Granted publication date: 20190419 Pledgee: Agricultural Bank of China Limited Guangzhou green finance reform and innovation pilot zone Huadu Branch Pledgor: GUANGDONG RAYTON INTELLIGENT OPTO. Co.,Ltd. Registration number: Y2023980073647 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right |