CN108336081A - A kind of COB light source and COB substrates - Google Patents
A kind of COB light source and COB substrates Download PDFInfo
- Publication number
- CN108336081A CN108336081A CN201810292108.0A CN201810292108A CN108336081A CN 108336081 A CN108336081 A CN 108336081A CN 201810292108 A CN201810292108 A CN 201810292108A CN 108336081 A CN108336081 A CN 108336081A
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- pad group
- substrate
- connection line
- light source
- pad
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- 239000000758 substrate Substances 0.000 title claims abstract description 67
- 239000003292 glue Substances 0.000 claims abstract description 30
- 238000011049 filling Methods 0.000 claims abstract description 22
- 238000009826 distribution Methods 0.000 claims abstract description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 7
- 238000001746 injection moulding Methods 0.000 claims description 6
- 238000002347 injection Methods 0.000 claims description 3
- 239000007924 injection Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 15
- 238000005516 engineering process Methods 0.000 description 4
- 230000010354 integration Effects 0.000 description 4
- 239000003086 colorant Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 241001465382 Physalis alkekengi Species 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000004568 cement Substances 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- FGRBYDKOBBBPOI-UHFFFAOYSA-N 10,10-dioxo-2-[4-(N-phenylanilino)phenyl]thioxanthen-9-one Chemical compound O=C1c2ccccc2S(=O)(=O)c2ccc(cc12)-c1ccc(cc1)N(c1ccccc1)c1ccccc1 FGRBYDKOBBBPOI-UHFFFAOYSA-N 0.000 description 1
- 241001062009 Indigofera Species 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000003760 hair shine Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
- H01L33/504—Elements with two or more wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/508—Wavelength conversion elements having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
A kind of COB light source and COB substrates, including substrate, several LED chips being distributed on substrate and the fluorescent film for light distribution；The fluorescent film includes grid, and the grid is fixed on substrate, and several filling regions are formed in the grid, and the filling region is corresponded with LED chip, and fluorescent glue is equipped in the filling region；Substrate is equipped with the first series circuit and the second series circuit, and the first series circuit includes that several rows tilt spaced first pad group, and one end of adjacent first pad group is connected by the first connection line；Second series circuit includes that several rows tilt spaced second pad group, and one end of adjacent second pad group is connected by the second connection line；First connection line is moved towards around the other end of the second pad group, and the second connection line is moved towards around the other end of the first pad group.The COB light source of multi color temperature can be realized in the fluorescent glue that different-colour is filled in filling region, this kind of light-source structure is simple, and manufacturing process is simple；Circuit on substrate is not necessarily to take-up, and manufacturing process is simple.
Description
Technical field
The present invention relates to LED field, especially a kind of double-colored temperature COB light source and COB substrates.
Background technology
COB light source be it is a kind of LED chip is placed directly against on the minute surface substrate of high reflecting rate, it is logical using COB encapsulation technologies
It crosses the specular removal that bonding wire is bonded with circuit board and integrates area source, be used in combination resin covering to ensure reliability, relative to it
The LED light source of his structure has electrical stable, high colour developing, the uniform, rapid heat dissipation that shines, convenient for light distribution, exempts from reflow soldering, reduces
The advantages that Design of Luminaires difficulty, therefore had been more and more widely used in LED encapsulation technologies field.
Currently, in existing COB light source lamps and lanterns, the high color temperature of COB or the display of low color temperature are by different fluorescent powders
Type and the ratio of configuration fluorescent powder control the display of high low color temperature, later with carry out a powder after silica gel spin coating and cover chip.
This manufacture craft is only able to display a kind of colour temperature, and the conversion of two kinds of colour temperatures can not be carried out inside the same COB, cannot be satisfied certain
The demand of a little scene applications, and the COB light source of monochromatic temperature also brings certain limitation to the application of COB light source lamps and lanterns.
And some color temperature-tunable COB light sources on the market, CSP and blue chip are mainly set on substrate, then in one layer of covering
Fluorescent adhesive layer is to achieve the purpose that change colour temperature.Since CSP volumes are larger, so the interval between LED chip is larger, this kind
COB light source cannot achieve High Density Integration.Since the COB of double-colored temperature needs to control two kinds of colour temperatures respectively, so each colour temperature
LED chip is all connected in series with；In order to ensure even light mixing, the intervals the LED setting of each row of different-colour, therefore connecting phase
It needs take-up to connect when neighbour row LED, so increases the difficulty of technique.
Invention content
The first technical problem to be solved by the present invention is to provide a kind of COB light source, can realize the high density of LED chip
It is integrated, and manufacturing process is simple.
The second technical problem to be solved by the present invention is to provide a kind of COB substrates, can realize two kinds of different-colours
LED is controlled respectively, and manufacturing process is simple.
One of to solve above-mentioned technical problem, the technical scheme is that：A kind of COB light source, including substrate, Ruo Ganfen
LED light source of the cloth on substrate and the fluorescent film for light distribution；The fluorescent film includes grid, and the grid is fixed on substrate
On, several filling regions are formed in the grid, the filling region is corresponded with LED light source, is set in the filling region
There is fluorescent glue；The substrate is equipped with the first series circuit and the second series circuit, and first series circuit includes several rows
Spaced first pad group is tilted, one end of adjacent first pad group is connected by the first connection line, the first pad group
Including several spaced first pads；Second series circuit includes that several rows tilt spaced second pad
One end of group, adjacent second pad group is connected by the second connection line, and the second pad group includes several spaced second welderings
Disk；First pad group is staggered with the second pad group, with the first pad it is laterally adjacent and longitudinally adjacent be the second pad,
First connection line is moved towards around the other end of the second pad group, and the second connection line is moved towards around the other end of the first pad group.This
Invention is separated the LED chip on substrate using grid, and the fluorescent glue of filling different-colour can be realized more in filling region
The COB light source of colour temperature, this kind of light-source structure is simple, and manufacturing process is simple；When manufacture, first LED chip is consolidated on substrate, then
Fluorescent film is pressed on substrate again, therefore the High Density Integration of LED chip may be implemented.The present invention circuit be one-step print at
Type, is not necessarily to take-up, and manufacturing process is simple.
As an improvement, the grid is molded by in-mould injection.
As an improvement, the grid passes through injection molding.
As an improvement, the grid is by aluminium flake punch forming.
As an improvement, the fluorescent glue includes just white fluorescent glue and warm white fluorescent glue, warm white fluorescent glue and just white fluorescent glue
It is spaced apart.
As an improvement, the edge of the grid is equipped with connecting plate, the connecting plate is equipped with the first screw hole, on the substrate
Equipped with the second screw hole, connecting plate is fixed by bolt and substrate connection.
To solve above-mentioned technical problem two, the technical scheme is that：A kind of COB substrates, substrate are equipped with first
Series circuit and the second series circuit, first series circuit include that several rows tilt spaced first pad group, phase
One end of adjacent first pad group is connected by the first connection line, and the first pad group includes several spaced first pads；
Second series circuit includes that several rows tilt spaced second pad group, and one end of adjacent second pad group passes through second
Connection line connects, and the second pad group includes several spaced second pads；First pad group is interlocked with the second pad group
Setting, with the first pad it is laterally adjacent and longitudinally adjacent be the second pad, the first connection line is another around the second pad group
One end is moved towards, and the second connection line is moved towards around the other end of the first pad group.The circuit of the present invention is molded for one-step print, is not necessarily to
Take-up, manufacturing process are simple.
The beneficial effect of the invention compared with the existing technology is：
The present invention is separated the LED chip on substrate using grid, and the fluorescent glue of different-colour is filled in filling region
Realize the COB light source of multi color temperature, this kind of light-source structure is simple, and manufacturing process is simple；When manufacture, first LED chip is consolidated in substrate
On, then fluorescent film is pressed on substrate again, therefore the High Density Integration of LED chip may be implemented.The circuit of the present invention is one
Secondary printing molding, is not necessarily to take-up, manufacturing process is simple.
Description of the drawings
Fig. 1 is the grid of the injection molding on substrate.
Fig. 2 is the schematic diagram that fluorescent glue is put on the basis of the grid of Fig. 1.
Fig. 3 is the grid obtained by injection molding or aluminium flake impact forming method.
Fig. 4 is the schematic diagram that fluorescent glue is put on the basis of the grid of Fig. 3.
Fig. 5 is die bond schematic diagram on substrate.
Fig. 6 is the intention that fluorescent film is bonded with substrate.
Fig. 7 is the line layout figure on COB substrates.
Specific implementation mode
The invention is further explained in the following combination with the attached drawings of the specification.
As shown in Figures 1 to 6, a kind of COB light source, including substrate 1, several distribution LED chips 3 on substrate 1 and be used for
The fluorescent film 7 of light distribution.The fluorescent film 7 includes grid 2, and the grid 2 is fixed on substrate 1, is formed in the grid 2 several
Filling region 6, the shape of the grid 2 is identical as the die bond region shape on substrate 1, the filling region 6 and LED light source 3
It corresponds, i.e., each LED light source 3 is located in filling region 6.Fluorescent glue 4 is equipped in the filling region 6, the present embodiment
Fluorescent glue 4 includes just white fluorescent glue and warm white fluorescent glue, and warm white fluorescent glue is spaced apart with just white fluorescent glue, and blue chip passes through
Different fluorescent glues is excited to generate the white light of different-colour.
There are many preparation methods of the COB of the present invention：
1, as shown in Figure 1, 2, after the completion of 1 die bond of substrate, grid 2 is formed by way of in-mould injection on substrate 1, at this time grid
Lattice 2 can be good at the surface for being attached to substrate 1, and each LED light source 3 is fallen in corresponding filling region 6；Finally in fill area
Fluorescent glue is put in domain 6.
2, as shown in figure 3, obtaining grid 2 by injection molding manner；As shown in figure 4, point is glimmering in the filling region 6 of grid 2
Optical cement is simultaneously formed by curing fluorescent film 7；As shown in figure 5, die bond on substrate 1；As shown in fig. 6, on substrate 1 by the patch of fluorescent film 7.
3, as shown in figure 3, obtaining grid 2 by aluminium flake impact style；As shown in figure 4, point in the filling region 6 of grid 2
Fluorescent glue is simultaneously formed by curing fluorescent film 7；As shown in figure 5, die bond on substrate 1；As shown in fig. 6, fluorescent film 7 is attached to substrate 1
On.
The grid 2 obtained by injection molding manner or aluminium flake impact style can be fitted in substrate 1 in assembly with glue
On.Or connecting plate is reserved at the edge of grid 2 at the time of molding, the connecting plate is equipped with the first screw hole, is set on the substrate 1
There are the second screw hole, connecting plate to be connected and fixed by bolt and substrate 1.When grid 2 is bonded with 1 surface of substrate, due to fluorescent glue
It for silica gel, can deform after being squeezed, so last LED light source 3 can make the bottom surface of fluorescent glue deform.
To prevent the conduction of aluminium flake, the aluminum flake surface to be equipped with oxidation film.
As shown in fig. 7, substrate of the present invention is equipped with the first series circuit and the second series circuit, two kinds of different-colours
LED light source is respectively in different series circuits, to realize the independent control of different-colour.The first series circuit packet
It includes several rows and tilts spaced first pad group 8, adjacent first pad group 8 one end in the same direction passes through the first connection line 12
Connection is to realize series connection, in order to realize that one end connection in the same direction, one end of the first connection line 12 need and the first pad group 8
The other end is turned back to the other end；First pad group 8 includes several spaced first pads 10, and the first pad 10 can be arranged
Multiple LED chips, each first pad is provided with two blue-light LED chips in the present embodiment.Second series circuit includes
Several rows tilt spaced second pad group 9, and adjacent second pad group 9 one end in the same direction is connected by the second connection line 13
To realize series connection, in order to realize one end in the same direction connection, one end of the second connection line 13 needs another with the second pad group 9
It turns back to the other end at end；Second pad group 9 includes several spaced second pads 11, and the second pad 11 can be arranged multiple
LED chip, each second pad is provided with two blue-light LED chips in the present embodiment.First pad group 8 and the second pad group 9
Be staggered, with the first pad 10 it is laterally adjacent and longitudinally adjacent be the second pad 11, similarly, laterally with the second pad 11
Adjacent and longitudinally adjacent is the first pad 10, therefore the LED light source of two kinds of different-colours is staggeredly interval setting, makes COB
Light extraction evenly.First connection line 12 is moved towards around the other end of the second pad group 9, and the second connection line 13 is around the first pad
The other end trend of group 8；The first pad group 8 and the second pad group 9 are obliquely installed on substrate in 45 degree, first string
The anode and cathode of on line road and the second series circuit are located at two of substrate diagonally, and two just poles of series circuit,
The another two that first connection line 12 is located at substrate with the second connection line 13 is diagonal.LED light source on substrate is in length and breadth
It arranges, in lateral LED light source, two kinds of colour temperatures are staggered, and in longitudinal LED light source, two kinds of colour temperatures are staggered.
The present invention is separated the LED chip 3 on substrate 1 using grid 2, and filling different-colour is glimmering in filling region 6
The COB light source of multi color temperature can be realized in optical cement, this kind of light-source structure is simple, and manufacturing process is simple；In addition, LED chip 3 is indigo plant
Optical chip, it is first that LED chip 3 is solid on substrate 1 when manufacture, then again by the pressure of fluorescent film 7 on substrate 1, therefore may be implemented
The High Density Integration of LED chip 3.The circuit of the present invention is molded for one-step print, is not necessarily to take-up, and manufacturing process is simple.
Claims (10)
1. a kind of COB light source, including substrate, several LED light sources being distributed on substrate and the fluorescent film for light distribution；Its feature
It is：The fluorescent film includes grid, and the grid is fixed on substrate, and several filling regions are formed in the grid, described
Filling region is corresponded with LED light source, and fluorescent glue is equipped in the filling region；The substrate is equipped with the first series circuit
With the second series circuit, first series circuit includes that several rows tilt spaced first pad group, adjacent first weldering
One end of disk group is connected by the first connection line, and the first pad group includes several spaced first pads；Described second
Series circuit includes that several rows tilt spaced second pad group, and one end of adjacent second pad group passes through the second connection line
Connection, the second pad group includes several spaced second pads；First pad group is staggered with the second pad group, with
One pad it is laterally adjacent and longitudinally adjacent be the second pad, the first connection line is moved towards around the other end of the second pad group,
Second connection line is moved towards around the other end of the first pad group.
2. a kind of COB light source according to claim 1, it is characterised in that：The grid is molded by in-mould injection.
3. a kind of COB light source according to claim 1, it is characterised in that：The grid passes through injection molding.
4. a kind of COB light source according to claim 1, it is characterised in that：The grid is by aluminium flake punch forming.
5. a kind of COB light source according to claim 1, it is characterised in that：The fluorescent glue includes just white fluorescent glue and warms up
White fluorescent glue, warm white fluorescent glue are spaced apart with just white fluorescent glue.
6. a kind of COB light source according to claim 1, it is characterised in that：The edge of the grid is equipped with connecting plate, described
Connecting plate is equipped with the first screw hole, and the substrate is equipped with the second screw hole, and connecting plate is fixed by bolt and substrate connection.
7. a kind of COB light source according to claim 1, it is characterised in that：First series circuit and the second series line
The anode and cathode on road are located at two of substrate diagonally；First connection line is located at substrate with the second connection line
Another two is diagonal.
8. a kind of COB light source according to claim 1, it is characterised in that：The first pad group and the second pad group exist
It is obliquely installed in 45 degree on substrate.
9. a kind of COB substrates, it is characterised in that：Substrate is equipped with the first series circuit and the second series circuit, first string
On line road includes that several rows tilt spaced first pad group, and one end of adjacent first pad group passes through the first connection line
Connection, the first pad group includes several spaced first pads；Second series circuit includes that several rows tilt interval
One end of the second pad group being arranged, adjacent second pad group is connected by the second connection line, and the second pad group includes several
Every the second pad of setting；First pad group is staggered with the second pad group, laterally adjacent and longitudinally adjacent with the first pad
Be the second pad, the first connection line is moved towards around the other end of the second pad group, and the second connection line is around the first pad group
The other end trend.
10. a kind of COB substrates according to claim 9, it is characterised in that：First series circuit and the second series line
The anode and cathode on road are located at two of substrate diagonally；First connection line is located at substrate with the second connection line
Another two is diagonal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810292108.0A CN108336081B (en) | 2018-04-03 | 2018-04-03 | COB light source and COB base plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810292108.0A CN108336081B (en) | 2018-04-03 | 2018-04-03 | COB light source and COB base plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108336081A true CN108336081A (en) | 2018-07-27 |
| CN108336081B CN108336081B (en) | 2019-12-31 |
Family
ID=62933929
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810292108.0A Active CN108336081B (en) | 2018-04-03 | 2018-04-03 | COB light source and COB base plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108336081B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112201651A (en) * | 2020-10-29 | 2021-01-08 | 江苏稳润光电有限公司 | Multi-color temperature COB light source |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102290408A (en) * | 2010-06-21 | 2011-12-21 | 东芝照明技术株式会社 | Light-emitting device and lighting apparatus |
| US20140179042A1 (en) * | 2012-12-21 | 2014-06-26 | Advanced Optoelectronic Technology, Inc. | Light-emitting diode manufacturing method |
| CN204375748U (en) * | 2014-12-01 | 2015-06-03 | 王定锋 | A kind of COB encapsulation module of many glasss of polychromes |
| CN104900784A (en) * | 2015-05-22 | 2015-09-09 | 厦门多彩光电子科技有限公司 | Led packaging structure and manufacturing method thereof |
| CN205883717U (en) * | 2016-06-01 | 2017-01-11 | 深圳雷曼光电科技股份有限公司 | A printed circuit board structure and LED display screen for COB encapsulation |
-
2018
- 2018-04-03 CN CN201810292108.0A patent/CN108336081B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102290408A (en) * | 2010-06-21 | 2011-12-21 | 东芝照明技术株式会社 | Light-emitting device and lighting apparatus |
| US20140179042A1 (en) * | 2012-12-21 | 2014-06-26 | Advanced Optoelectronic Technology, Inc. | Light-emitting diode manufacturing method |
| CN204375748U (en) * | 2014-12-01 | 2015-06-03 | 王定锋 | A kind of COB encapsulation module of many glasss of polychromes |
| CN104900784A (en) * | 2015-05-22 | 2015-09-09 | 厦门多彩光电子科技有限公司 | Led packaging structure and manufacturing method thereof |
| CN205883717U (en) * | 2016-06-01 | 2017-01-11 | 深圳雷曼光电科技股份有限公司 | A printed circuit board structure and LED display screen for COB encapsulation |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112201651A (en) * | 2020-10-29 | 2021-01-08 | 江苏稳润光电有限公司 | Multi-color temperature COB light source |
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| Publication number | Publication date |
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| CN108336081B (en) | 2019-12-31 |
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| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
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Denomination of invention: Cob light source and cob substrate Effective date of registration: 20220506 Granted publication date: 20191231 Pledgee: Shanghai Pudong Development Bank Limited by Share Ltd. Guangzhou branch Pledgor: GUANGDONG RAYTON INTELLIGENT OPTO. Co.,Ltd. Registration number: Y2022980005125 |
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Date of cancellation: 20230615 Granted publication date: 20191231 Pledgee: Shanghai Pudong Development Bank Limited by Share Ltd. Guangzhou branch Pledgor: GUANGDONG RAYTON INTELLIGENT OPTO. Co.,Ltd. Registration number: Y2022980005125 |
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Denomination of invention: A COB light source and COB substrate Effective date of registration: 20230616 Granted publication date: 20191231 Pledgee: Shanghai Pudong Development Bank Limited by Share Ltd. Guangzhou branch Pledgor: GUANGDONG RAYTON INTELLIGENT OPTO. Co.,Ltd. Registration number: Y2023980044439 |