CN208687688U - A kind of high compound copper base of heat dissipation - Google Patents
A kind of high compound copper base of heat dissipation Download PDFInfo
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- CN208687688U CN208687688U CN201820647921.0U CN201820647921U CN208687688U CN 208687688 U CN208687688 U CN 208687688U CN 201820647921 U CN201820647921 U CN 201820647921U CN 208687688 U CN208687688 U CN 208687688U
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- copper base
- conducting plate
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Abstract
The utility model discloses a kind of high compound copper base of heat dissipation, including base main body, and the upper surface left and right sides of composite plate, the base main body is provided with heat conductive insulating block, and the composite plate is connect between heat conductive insulating block and with base main body, heat conductive insulating block；The composite plate is made of insulation frame, copper base, heat-conducting plate, layer, the layer bottom surface is connect with base main body, the heat-conducting plate is placed in layer upper surface, the copper base is placed in heat-conducting plate upper surface, the middle part of the heat-conducting plate has phase transformation crystalline region in the horizontal plane, there are several boss in the copper base upper surface, and the insulation frame offers the hole for boss insertion, and the insulation frame is mounted on copper base upper surface.When in use, the characteristics of heat source can be radiated by all kinds of means by copper base, heat conductive insulating block, heat-conducting plate etc., have excellent heat dissipation performance, and radiating mode is effectively smooth, long service life.
Description
Technical field
The utility model belongs to copper base technical field, and in particular to a kind of high compound copper base of heat dissipation.
Background technique
In LED illumination product, copper base is its pith, and copper base can play fixed function, while its to LED lamp source
Internal circuit connects to the control circuit conductive to power to LED lamp source.Since copper base itself can be thermally conductive, in conducting process
In, being easy to produce heat makes circuit generate thermal resistance to influence circuit normal operation, so that LED lamp source is shone unstable, so needing
Heat dissipation element is added to copper base and realize heat dissipation.Existing copper base heat dissipation element radiating mode is more passive, heating conduction
It is poor, copper base can not be made efficiently to be radiated.
Utility model content
In order to solve the above technical problems, the utility model provides a kind of high compound copper base of heat dissipation, there is excellent heat dissipation performance,
The characteristics of radiating mode is effectively smooth, long service life, to solve the problems mentioned in the above background technology.
Used technical solution is this utility model in order to achieve the above objectives:
A kind of high compound copper base of heat dissipation, including base main body, composite plate, the upper surface left and right sides of the base main body
It is provided with heat conductive insulating block, the composite plate is connect between heat conductive insulating block and with base main body, heat conductive insulating block；It is described
Composite plate is made of insulation frame, copper base, heat-conducting plate, layer, and the layer bottom surface is connect with base main body, the heat-conducting plate peace
It sets in layer upper surface, the copper base is placed in heat-conducting plate upper surface, and the middle part of the heat-conducting plate has phase in the horizontal plane
There are several boss in metacrystal area, the copper base upper surface, and the insulation frame offers the hole for boss insertion, the insulation frame
It is mounted on copper base upper surface.
Preferably, the composition part of the composite plate is connected by heat conductive silica gel between layers.
Preferably, the phase transformation crystalline region of the heat-conducting plate has several phase transformation crystal blocks, and the heat-conducting plate is insulation.
Preferably, the circuit-line of the copper base is laid below insulation frame.
Compared with prior art, the utility model has the beneficial effects that:
When in use, heat source can be radiated by all kinds of means by copper base, heat conductive insulating block, heat-conducting plate etc..Copper base
Surface has boss, directly contacts with air, and heat dissipation is smooth；Phase transformation crystalline region, the phase transformation on phase transformation crystalline region are provided in heat-conducting plate
Crystal block can absorb internal heat resource heat, while heat conductive insulating block can further promote the export of internal heat, reduce electricity
The thermal resistance on road keeps related elements performance more stable.In addition, the phase transformation crystal block of phase transformation crystalline region has heat absorption melting, crystallisation by cooling
Feature has the characteristic recycled.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the utility model；
Fig. 2 is the structural schematic diagram of the utility model heat-conducting plate；
Fig. 3 is the structural schematic diagram of phase transformation crystalline region in the utility model heat-conducting plate；
Wherein: 1, base main body；2, composite plate；3, heat conductive insulating block；4, copper base；401, boss；5, insulate frame；6, it leads
Hot plate；601, phase transformation crystalline region；602, phase transformation crystal block；7, layer.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
Please refer to Fig. 1-3, the utility model the following technical schemes are provided:
A kind of high compound copper base of heat dissipation, including base main body 1, composite plate 2, the upper surface left and right sides of base main body 1
It is provided with heat conductive insulating block 3, composite plate 2 is connect between heat conductive insulating block 3 and with base main body 1, heat conductive insulating block 3；It is multiple
Plywood 2 is made of insulation frame 5, copper base 4, heat-conducting plate 6, layer 7, and the composition part of composite plate passes through thermal conductive silicon between layers
Glue connection, 7 bottom surface of layer are connect with base main body 1, and heat-conducting plate 6 is placed in 7 upper surface of layer, and heat-conducting plate 6 is insulation, copper-based
Plate 4 is placed in 6 upper surface of heat-conducting plate, and the middle part of heat-conducting plate 6 has phase transformation crystalline region 601 in the horizontal plane, this phase transformation crystalline region tool
There are several phase transformation crystal blocks, 4 upper surface of copper base there are several boss 401, and the insulation frame 5 is offered to be embedded in for boss 401
Hole, the insulation frame 5 is mounted on 4 upper surface of copper base, and the circuit-line of copper base 4 is laid on 5 lower section of insulation frame.
Specifically, when in use, heat source can be carried out scattered by all kinds of means by copper base 4, heat conductive insulating block 3, heat-conducting plate 6 etc.
Heat.4 surface of copper base has boss 401, directly contacts with air, and heat dissipation is smooth；Phase transformation crystalline region 601 is provided in heat-conducting plate 6,
Phase transformation crystal block 602 on phase transformation crystalline region 601 can absorb internal heat resource heat, while heat conductive insulating block 3 can further promote
The export of internal heat reduces the thermal resistance of circuit, keeps related elements performance more stable.In addition, the phase metacrystal of phase transformation crystalline region 601
Block 602 has the characteristics of heat absorption melting, crystallisation by cooling, can absorb heat melting storage in heat source work phase metacrystal block 602
In closed crystalline region, heat source rest phase metacrystal block 602 can release small heat and by heat-conducting plate 6, heat conductive insulating block 3
Heat dissipation, becomes crystallization again, has the characteristic recycled.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired
Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.
Claims (4)
1. a kind of high compound copper base of heat dissipation, including base main body (1), composite plate (2), the upper surface of the base main body (1)
The left and right sides is provided with heat conductive insulating block (3), and the composite plate (2) is embedded between heat conductive insulating block (3) and and base main body
(1), heat conductive insulating block (3) connects；The composite plate (2) is by insulation frame (5), copper base (4), heat-conducting plate (6), layer (7) structure
At layer (7) bottom surface is connect with base main body (1), and the heat-conducting plate (6) is placed in layer (7) upper surface, described copper-based
Plate (4) is placed in heat-conducting plate (6) upper surface, and the middle part of the heat-conducting plate (6) has phase transformation crystalline region (601), institute in the horizontal plane
Stating copper base (4) upper surface has several boss (401), and insulation frame (5) offers the hole for boss (401) insertion, institute
It states insulation frame (5) and is mounted on copper base (4) upper surface.
2. a kind of high compound copper base of heat dissipation according to claim 1, it is characterised in that: the composition of the composite plate (2)
Part is connected by heat conductive silica gel between layers.
3. a kind of high compound copper base of heat dissipation according to claim 1, it is characterised in that: the phase transformation of the heat-conducting plate (6)
Crystalline region (601) has several phase transformation crystal blocks (602), and heat-conducting plate (6) is insulation.
4. a kind of high compound copper base of heat dissipation according to claim 1, it is characterised in that: the circuit of the copper base (4)
Track laying is below insulation frame (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820647921.0U CN208687688U (en) | 2018-05-02 | 2018-05-02 | A kind of high compound copper base of heat dissipation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820647921.0U CN208687688U (en) | 2018-05-02 | 2018-05-02 | A kind of high compound copper base of heat dissipation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208687688U true CN208687688U (en) | 2019-04-02 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820647921.0U Active CN208687688U (en) | 2018-05-02 | 2018-05-02 | A kind of high compound copper base of heat dissipation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208687688U (en) |
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2018
- 2018-05-02 CN CN201820647921.0U patent/CN208687688U/en active Active
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