CN208622769U - LED Huang wall encapsulating structure - Google Patents
LED Huang wall encapsulating structure Download PDFInfo
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- CN208622769U CN208622769U CN201821080424.3U CN201821080424U CN208622769U CN 208622769 U CN208622769 U CN 208622769U CN 201821080424 U CN201821080424 U CN 201821080424U CN 208622769 U CN208622769 U CN 208622769U
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Abstract
The utility model provides a kind of LED Huang wall encapsulating structure, for solve the problems, such as existing LED packaging as be five faces go out device caused by light front go out light illumination it is poor.Technical solution is as follows: the Huang wall encapsulating structure includes LED chip and die bond substrate, and the welding position of die bond is equipped on substrate, and LED chip is fixed on welding position, and spy is characterized in that: having yellow wall on substrate, yellow wall is the opaque solid bodies of yellow, is attached to substrate surface；It is yellow wall in LED chip surrounding, LED chip is embedded in yellow wall；The height of yellow wall is not higher than the height of LED chip；Yellow fluorescent powder colloid layer is coated in LED chip.The positive illumination of the device of the utility model is more preferable, and directionality is more preferable, increases the exterior quality of packaging；Also it can simplify the dispensing program of yellow fluorescent powder, operation precision requires low, operating efficiency height, and the front of device can have more luminous fluxes, and the utilization rate of luminous energy is high, the application being very suitable on the lamps and lanterns such as headlight for vehicles.
Description
Technical field
The utility model relates to a kind of LED encapsulation technologies, the LED encapsulation technology especially suitable for planar substrates.
Background technique
In existing white-light LED encapsulation technique, especially have certain requirements the LED light emitter of relatively high power to illumination
Part, such as the LED component of car light, have using a kind of powder injection process, i.e., by LED chip die bond on aluminum substrate after, will be saturating
Bright sealing (close to solid-state) is pressed together in LED chip, then sprays yellow fluorescent powder on packaging plastic surface.The encapsulation of such technology
LED chip be disposed on the substrate, the white light parts be five faces shine, i.e., front and four lateral emittings, the device of the class formation
The positive illumination of part is undesirable.
Utility model content
The technical problem to be solved by the utility model is to provide a kind of LED Huang wall encapsulating structures, for solving existing LED
Packaging is as being that five faces go out the front of device caused by light and go out the poor problem of illumination of light.
The technical solution that the utility model is proposed with regard to above-mentioned technical problem is as follows: a kind of LED Huang wall encapsulating structure, including
LED chip and die bond substrate are equipped with the welding position of die bond on substrate, and LED chip is fixed on welding position, and spy is characterized in that:
There is yellow wall on substrate, yellow wall is the opaque solid bodies of yellow, is attached to substrate surface；It is yellow wall, LED core in LED chip surrounding
Piece is embedded in yellow wall；The height of yellow wall is not higher than the height of LED chip；Yellow fluorescent powder colloid layer is coated in LED chip.
Preferred: the Huang wall is the silica gel material or EMC material that ginseng has yellow uitramarine.Silica gel is not allowed easy to change, participates in
After yellow uitramarine, whole is in stable yellow, and will not be changed colour for a long time.EMC material has good thermal diffusivity, can do this reality
With novel material.
Preferred: the height of the Huang wall is flushed with the height of LED chip.The height of yellow wall can be flushed with LED chip,
Can also be more slightly lower, but not above LED chip.It, can when its solidification if the height of yellow wall is higher than LED chip
It can be flow to chip surface, cause chip light-emitting face covered or part overlaid, the situation that can not go out light will lead to light loss.
Preferred: the yellow fluorescent powder colloid layer is that wet glue is sprayed on LED chip surface, yellow fluorescent powder colloid layer
Surface is smooth.Wet glue is the fluorescent powder colloid with mobility, and the fluorescent powder colloid of wet shot has apparent stream when spray
Dynamic property, after its solidification, surface is very smooth.
Preferred: the yellow fluorescent powder colloid layer is that dry glue is sprayed on LED chip surface, yellow fluorescent powder colloid layer
Rough surface.Dry glue is that it is solid immediately when spray to do the fluorescent powder colloid sprayed with the fluorescent powder colloid without mobility
It is scheduled on LED chip surface, solidifies front and back form and position on chip is constant, surface is more coarse.
Preferred: the height of the yellow fluorescent powder colloid layer is higher than the height of yellow wall, the yellow fluorescent powder colloid layer
It is covered on LED chip upper surface, and the edge of yellow fluorescent powder colloid layer is covered on yellow wall.Fluorescent powder colloid layer is covered on core
On yellow wall around piece, two kinds of yellow combine together, promote the consistency of the appearance color of packaging, improve its quality.It covers
The surface cover Huang Qiang will not generate apparent vision difference, and this mode can simplify gluing process, dot fluorescent powder colloid
Control do not have to excessively accurate, operability is stronger, operation it is more efficient.
Preferred: the basic glue of the yellow fluorescent powder colloid is silica gel.Fluorescent powder colloid is silica gel, more stable,
It is more preferable with the compatibility of yellow wall.
It is preferred: on substrate, to be fixed with multiple LED chips, multiple LED chips are embedded in Huang within the walls.
It is equipped with the cavity of the installation LED chip of multiple separations on the substrate, passes through Huang between each cavity
Wall isolation.This programme is suitable for the structure of multiple LED chips or multiple LED light modules, multiple welding positions, it is meant that on substrate
There are multiple light emitting sources, generally forms area source or the device of more luminous fluxes is provided.Since of the invention goes out bright aobvious tool
Directional, especially on the light direction of front, illumination is significantly improved, so multiple light emitting sources that multiple welding positions are formed can be with shape
At the directional light of larger area, in the case where improving illumination, bigger effective lighting area can be covered.
Yellow wall color and yellow fluorescent powder solid colour.The color of yellow wall according to the color of deployed fluorescent powder colloid into
Row determines, in the yellow uitramarine and fluorescent powder colloid solid colour that Huang participates within the walls, the in this way device after encapsulation, will not obviously see
Difference between fluorescent powder colloid and yellow wall, device overall appearance consistency obviously increase, and do not have the feeling in (welding position) hole.
Preferred: the substrate is aluminum substrate or ceramic substrate.
The beneficial effects of the utility model are as follows:
Compared with prior art, the utility model uses yellow wall construction, and LED light only can go out light, institute from its front substantially
More preferable with positive illumination, directionality is more preferable, is very suitable to the requirement of car light.And yellow fluorescent powder colloid can directly be put
Chip top, does not hinder beauty being left on yellow wall yet and light, which simplify gluing process out, improves efficiency.Yellow wall
Color is consistent with yellow fluorescent powder colloid color, so will not be clearly visible welding position in conventional visual, increase encapsulation apart from upper
The exterior quality of device.Since yellow wall acts on, may be implemented to carry out squirting glue in enclosure wall, it is smooth to its cooling later period surface,
Will not be coarse, and be not in picking situation, it is excited for a longer period of time with stable yellow light, entire packaging shines
Colour temperature is more stable, it is not easy to the problem of luminescent color unevenness occurs.Yellow fluorescent powder colloid is sprayed on chip, even if excessive, is overflow
Colloid out can also tile along chip edge and be solidificated in the surface Huang Qiang, and this structure can simplify the dispensing journey of yellow fluorescent powder
Sequence, operation precision requires low, operating efficiency height, and will not generate bad consequence, yellow fluorescent powder colloid and yellow wall color one
It causes, the influence without any surface quality.Due to the blocking of yellow wall, the directionality of LED chip to shine in front of device is more preferable, device
The front of part can have more luminous fluxes, and illumination significantly improves, and the utilization rate of luminous energy is high, be very suitable on the lamps and lanterns such as headlight for vehicles
Application.
Detailed description of the invention
It, below will be to required in embodiment description in order to illustrate more clearly of the technical scheme in the embodiment of the utility model
Attached drawing to be used is briefly described, it should be apparent that, the accompanying drawings in the following description is only some realities of the utility model
Example is applied, it for those of ordinary skill in the art, without creative efforts, can also be according to these attached drawings
Obtain other attached drawings.
Fig. 1 is the planar structure schematic diagram of the utility model.
Fig. 2 is the schematic diagram of the section structure of the utility model.
Specific embodiment
It is practical new to this below in conjunction with attached drawing to keep the purpose of this utility model, technical solution and advantage clearer
Type embodiment is described in further detail.
The utility model LED Huang wall encapsulating structure, referring to structure shown in Fig. 1 and Fig. 2 comprising LED chip 3 and die bond base
Plate 2, LED chip are generally blue chip, and substrate 2 is generally aluminum substrate.It is equipped with the welding position 4 of die bond on a substrate 2, in welding position 4
It is surrounded by the yellow wall 1 of yellow, LED chip is trapped among wherein by yellow wall 1, is filled with yellow fluorescent powder glue in LED chip upper surface
Body 5, the yellow fluorescent powder colloid colloid surface are smooth surface.The yellow fluorescent powder colloid is by glue spraying or powder injection process
It is injected in chip surface, by program curing, is cooled and solidified on it, until forming smooth surface.Substrate can also be ceramics
The ceramic materials such as substrate, such as aluminium nitride, aluminium oxide.
Yellow wall is the silica gel material that ginseng has yellow uitramarine.Silica gel do not allow it is easy to change, it is whole in stablizing after participating in yellow uitramarine
Yellow, and will not change colour for a long time.The yellow component of yellow wall determines by the color of yellow fluorescent powder colloid, can be glimmering according to yellow light
The yellow degree of the color configuration Huang wall of light arogel body, keeps the color of yellow wall consistent with the color keep of yellow fluorescent powder colloid.
Yellow wall is the filling protrusion object established in LED chip welding position surrounding, with LED chip contact aside (special case
Under, it is understood that there may be gap), which is distributed on the substrate in addition to welding position.In this example, yellow wall is coated in substrate surface
Coating protrusion.Yellow wall is centered around around welding position as wall, and LED chip is embedded in yellow wall, but the height of yellow wall is not
Higher than the height of LED chip, i.e., the height of yellow wall is flushed with the height of LED chip, or the height of yellow wall is slightly below LED chip
Height.
The welding position that yellow wall surrounds is in quadrangle, forms the cavity of quadrangle, welds LED chip in cavity.But it is not limited to
Above-mentioned quadrangle can also be round or ellipse or other shapes.The preparation of yellow wall, which can be, first prepares yellow silica gel, makes it
In half soft state, it is convenient for moulding, is then pressed against on substrate, is solidificated in it thoroughly on substrate.The chamber worked it out in this way
Shape is controllable, relatively beautiful.
It is equipped with the LED chip (welding position) of multiple separations on substrate, passes through yellow wall isolation between each LED chip.This
Scheme is suitable for the structure of multiple LED chips or multiple LED light modules, multiple welding positions, it is meant that there are multiple on substrate
Light emitting source generally forms area source or provides the device of more luminous fluxes.Since bright show that go out of the invention has directionality,
Especially on the light direction of front, illumination is significantly improved, so multiple light emitting sources that multiple welding positions are formed can form larger face
Long-pending directional light can cover bigger effective lighting area in the case where improving illumination.
Yellow wall is the opaque colloid of yellow a little on substrate, and surface is in natural coagulation state；Yellow wall color and yellow light
Fluorescent powder solid colour.The color of yellow wall is determined according to the color of deployed fluorescent powder colloid, is participated within the walls in Huang
Yellow uitramarine and fluorescent powder colloid solid colour, the device after encapsulating in this way, will not be clearly visible fluorescent powder colloid and Huang wall it
Between difference, device overall appearance consistency obviously increases, the feeling that will not have (welding position) to cheat because of color difference.The Huang of yellow wall
Color pigment can be that cadmium yellow etc. is inorganic or organic pigment.It is general to select Inorganic yellow pigment that silica gel be made more stable, and be not easy
Discoloration.
For yellow walled around welding position, there is seam in LED chip upper surface in yellow fluorescent powder colloid 5 between yellow wall and LED chip
In the case where gap, yellow fluorescent powder colloid can flow into the gap and be filled.Meeting exists before solidifying due to yellow fluorescent powder colloid 5
LED chip surface flow will form and overflow glue 6.It overflows glue 6 and is laid in the surface Huang Qiang around LED chip.Due to phosphor gel
The solid colour of the color of body and yellow wall, so the surface covering part Huang Qiang will not produce even if fluorescent powder colloid overflows notch
Raw apparent eye impressions, this mode can simplify glue spraying (or dusting) technique, and the control of the amount of fluorescent powder colloid is not used
In accurate, colloid amount error can permit bigger, and operability is stronger, operation it is more efficient.Overflowing glue 6 can be the wet of spray
Glue is also possible to the dry glue of spray.Wet glue is sprayed on LED chip surface can flow before curing, can be to yellow wall diffusion into the surface；
Dry glue will not then flow, even if it is sprayed on yellow wall, will not influence appearance consistency, but the surface of dry glue may be relatively thicker
It is rough.
The basic glue of yellow fluorescent powder colloid is silica gel.Yellow wall can be EMC material or silica gel material.Fluorescent powder colloid
It is more stable for silica gel, it is more preferable with the compatibility of yellow wall.
In other embodiments, yellow wall can also be by mode point for dispensing glue on substrate, and with reference to Fig. 2, use is for dispensing glue
When mode, the colloid of yellow wall spreads along substrate or continues dispensing.Spread substrate rest (i.e. non-welding position part) sufficiently
The colloid of full Huang wall, then makes its solidification.
For squirting glue, the manufacture of the utility model is summarized as follows:
Yellow fluorescent powder colloid is deployed, is sufficiently mixed yellow fluorescent powder with silica gel；
According to the color of yellow fluorescent powder, pigment is mixed with silica gel, deploy the color of yellow wall, makes the color and Huang of yellow wall
The color keep of emitting phosphor is consistent；
LED chip is fixed on substrate on substrate, completes die bond；
The colloid that upper yellow wall is put around LED chip pays attention to being distributed on substrate for the colloid for controlling yellow wall, until yellow wall will
LED chip is centered around in it, the contact aside of yellow wall and LED chip, and the height for controlling yellow wall is consistent with the height of LED chip.
This operation can be operated repeatedly repeatedly, it may be assumed that dispensing, solidification, again dispensing, resolidification until yellow wall is formed on substrate, and are formed
LED chip embedded structure；
The yellow fluorescent powder colloid (fluid) of wet glue is sprayed to LED chip surface, thickness is generally tens microns, to it
Cooling and solidifying after flowing is steady, the glue amount of glue spraying can appropriate excess, the yellow fluorescent powder colloid of spilling can be covered on yellow wall table
Face is merged with yellow wall, has desalinated the boundary between them.
The white light LED part worked it out according to the above method, since chip light emitting is only issued from front, good directionality,
Light emission rate is high, and device surface colour consistency is good (consistent yellow is presented), and quality is high.For planar substrates, may be implemented
The effect of positive light out, and realize that the structure of the positive effect of light out is simple, operation is easy to accomplish, and LED chip is by yellow wall
Protection, relative to LED paster structure, the LED chip impact resistance of the utility model, shock resistance, jitter immunity are stronger.
The above is only the preferred embodiment of the present invention, is not intended to limit the utility model, all practical at this
Within novel spirit and principle, any modification, equivalent replacement, improvement and so on should be included in the guarantor of the utility model
Within the scope of shield.
Claims (9)
1. a kind of LED Huang wall encapsulating structure, including LED chip and die bond substrate are equipped with the welding position of die bond, LED core on substrate
Piece is fixed on welding position, and spy is characterized in that: having yellow wall on substrate, yellow wall is the opaque solid bodies of yellow, is attached to substrate
Surface；It is yellow wall in LED chip surrounding, LED chip is embedded in yellow wall；The height of yellow wall is not higher than the height of LED chip；?
Yellow fluorescent powder colloid layer is coated in LED chip.
2. LED Huang wall encapsulating structure according to claim 1, it is characterised in that: the Huang wall is that ginseng has yellow uitramarine
Silica gel material or EMC material.
3. LED Huang wall encapsulating structure according to claim 1, it is characterised in that: the height and LED chip of the Huang wall
Height flushes.
4. LED Huang wall encapsulating structure according to claim 1, it is characterised in that: the yellow fluorescent powder colloid layer is wet
Glue is sprayed on LED chip surface, and the surface of yellow fluorescent powder colloid layer is smooth.
5. LED Huang wall encapsulating structure according to claim 1, it is characterised in that: the yellow fluorescent powder colloid layer is dry
Glue is sprayed on LED chip surface, the rough surface of yellow fluorescent powder colloid layer.
6. LED Huang wall encapsulating structure according to claim 1, it is characterised in that: the height of the yellow fluorescent powder colloid layer
Degree is higher than the height of yellow wall, and the yellow fluorescent powder colloid layer is covered on LED chip upper surface, and yellow fluorescent powder colloid layer
Edge is covered on yellow wall.
7. LED Huang wall encapsulating structure according to claim 1, it is characterised in that: the basis of the yellow fluorescent powder colloid
Glue is silica gel.
8. LED Huang wall encapsulating structure according to claim 1, it is characterised in that: on substrate, be fixed with multiple LED cores
Piece, multiple LED chips are embedded in Huang within the walls.
9. LED Huang wall encapsulating structure according to claim 1, it is characterised in that: the substrate is aluminum substrate or ceramic base
Plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821080424.3U CN208622769U (en) | 2018-07-09 | 2018-07-09 | LED Huang wall encapsulating structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821080424.3U CN208622769U (en) | 2018-07-09 | 2018-07-09 | LED Huang wall encapsulating structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208622769U true CN208622769U (en) | 2019-03-19 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201821080424.3U Expired - Fee Related CN208622769U (en) | 2018-07-09 | 2018-07-09 | LED Huang wall encapsulating structure |
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| Country | Link |
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| CN (1) | CN208622769U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112820637A (en) * | 2021-01-18 | 2021-05-18 | 香港中文大学（深圳） | Chip embedded compound for electron beam exposure and preparation method and application thereof |
-
2018
- 2018-07-09 CN CN201821080424.3U patent/CN208622769U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112820637A (en) * | 2021-01-18 | 2021-05-18 | 香港中文大学（深圳） | Chip embedded compound for electron beam exposure and preparation method and application thereof |
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190319 Termination date: 20200709 |