CN208622717U - A kind of chip change-over panel - Google Patents
A kind of chip change-over panel Download PDFInfo
- Publication number
- CN208622717U CN208622717U CN201821212696.4U CN201821212696U CN208622717U CN 208622717 U CN208622717 U CN 208622717U CN 201821212696 U CN201821212696 U CN 201821212696U CN 208622717 U CN208622717 U CN 208622717U
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- China
- Prior art keywords
- pad
- plate ontology
- chip
- over panel
- pcb
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
- H01L2924/15172—Fan-out arrangement of the internal vias
- H01L2924/15174—Fan-out arrangement of the internal vias in different layers of the multilayer substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
Abstract
The utility model discloses a kind of chip change-over panels, the chip change-over panel includes: plate ontology, first face of the plate ontology is provided with multiple the first pads corresponding with chip pin, second face of the plate ontology is provided with multiple second pads, first pad and second pad one-to-one correspondence and electric interconnection；Spacing between two adjacent first pads is not more than 0.4mm.The chip of small spacing chip pin can be welded on the PCB of big spacing PCB pin by the chip change-over panel of the utility model, can meet practical impedance demand without using high cost, the technology of low yield, and yield is improved.
Description
Technical field
The utility model relates to chip manufacturing field more particularly to a kind of chip change-over panels.
Background technique
As the signal rate in the fields such as communication, big data, storage continues to develop, PCB (Printed Circuit
Board, printed circuit board) signal transmission rate has arrived at 30-60Gbps substantially, it is believed that and future can faster.With mole fixed
The encapsulation that the continuous renewal of rule advances chip is also smaller and smaller, so as to cause chip pin spacing (Pitch) from original
1mm narrows down to 0.3mm, even more small.Requirement based on the above background in PCB design is higher and higher, makes high performance PCB
The cost of plate is also higher and higher, and the optimization of via hole also becomes abnormal difficulty in signal integrity.
It can pass through substantially when chip of traditional pin spacing greater than 0.8mm on PCB by doing through hole impedance optimization
Via hole size, anti-pad size, back drill are adjusted to optimize through hole impedance.When pin spacing is narrowed down to less than 0.4mm, PCB design
When the number of plies is more, for production technology and small pin spacing this body structure limitation be not available smaller drill, anti-pad can not
Continue to dig big, via hole and is unable to back drill.This leads to BGA (Ball Grid Array, the soldered ball battle array of small pin spacing in high-rise PCB
Column encapsulation) chip vias impedance will be unable to continue to optimize, seriously affect the signal quality of high speed signal.
Standard machinery boring aperture can not accomplish that smaller, back drill difficulty is big, radius-thickness ratio is excessive, common process is unable to satisfy and wants
It asks, therefore, generally uses HDI (High Density Interconnector, high density interconnection) processing technology, but it adds
Work is at high cost, yield is poor.
Summary of the invention
The purpose of the utility model is to provide a kind of chip change-over panels, meet the chip manufacturing using lesser pin spacing
High performance PCB plate improves yield, reduces processing cost.
The technical scheme that the utility model is provided is as follows:
A kind of chip change-over panel, comprising: plate ontology, the first face of the plate ontology are provided with multiple corresponding with chip pin
The first pad, the second face of the plate ontology is provided with multiple second pads, first pad and second pad one
One corresponding and electric interconnection.
In the above-mentioned technical solutions, the chip of small spacing chip pin can be welded in big spacing PCB by chip change-over panel
On the PCB of pin, practical impedance demand can be met without using high cost, the technology of low yield.
Further, the plate ontology includes: the first plate ontology and the second plate ontology, and first pad is set to described
On one plate ontology, second pad is set on the second plate ontology；The first plate ontology is away from first weldering
The one side of disk and the second plate ontology are away from a face contact of second pad.
In the above-mentioned technical solutions, the first plate ontology 11 and the second plate ontology 12 are respectively the first pad 111 and the second weldering
Disk 121 provides installation site.And define that the position of the first pad 111 and the second pad 121 is located at opposite two of plate ontology
Face, being welded in chip on PCB by chip change-over panel becomes stepped construction, saves space, convenient for encapsulation.
Further, first pad is set to plating on the first plate ontology by laser drill and by hole wall
On first copper facing hole of copper；Second pad is set to passing through machine drilling and passing through hole wall on the second plate ontology
On copper-plated second copper facing hole.
In the above-mentioned technical solutions, the first copper facing hole and the second copper facing hole are made using different processing technologys, made adjacent
The spacing of two the first pads meets the requirement of small chip pin spacing.
Further, further includes: the fixed structure being connect with printed circuit board.
In the above-mentioned technical solutions, fixed structure be fixedly connected with chip change-over panel can with PCB.
Further, the fixed structure is fixation hole, and the fixation hole is from second pad to first pad
Direction extends, and the plate ontology is fixedly connected by the fixation hole with the printed circuit board.
Further, the fixation hole is several, and encloses the surrounding set on second pad.
In the above-mentioned technical solutions, multiple fixation holes can help chip change-over panel to be preferably fixedly connected with PCB, connection
Effect is more stable.
Further, first pad passes through the intrinsic cabling of the plate and the second pad electric interconnection.
In the above-mentioned technical solutions, the setting of cabling can be completed when producing internal layer, simple process, convenient for production, and
The electric interconnection of first pad and the second pad keeps the volume of chip change-over panel smaller without the space outside occupying.
A kind of chip change-over panel provided by the utility model, can bring have the beneficial effect that
The chip of small spacing chip pin can be welded in big spacing PCB pin by the chip change-over panel of the utility model
PCB on, practical impedance demand can be met without using high cost, the technology of low yield, and yield is improved.
Detailed description of the invention
Below by clearly understandable mode, preferred embodiment is described with reference to the drawings, to the above-mentioned spy of chip change-over panel
Property, technical characteristic, advantage and its implementation are further described.
Fig. 1 is the structural schematic diagram of the utility model chip change-over panel one embodiment；
Fig. 2 is the structure of one embodiment of one the first pad of the utility model and corresponding second pad electric interconnection
Schematic diagram；
Fig. 3 is that the utility model chip is shown by the structure that chip change-over panel welds one embodiment on a printed circuit
It is intended to；
Fig. 4 is the flow chart of manufacturing method one embodiment of the utility model chip change-over panel.
Drawing reference numeral explanation:
1. plate ontology, 11. first plate ontologies, 111. first pads, 112. first copper facing holes, 12. second plate ontologies, 121.
Second pad, 122. second copper facing holes, 2. fixation holes, 3. cablings, 4. printed circuit boards, 5. chips.
Specific embodiment
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, attached drawing will be compareed below
Illustrate specific embodiment of the present utility model.It should be evident that the accompanying drawings in the following description is only the one of the utility model
A little embodiments for those of ordinary skill in the art without creative efforts, can also be according to these
Attached drawing obtains other attached drawings, and obtains other embodiments.
To make simplified form, part relevant to the utility model is only schematically shown in each figure, they are simultaneously
Its practical structures as product is not represented.
As shown in Figure 1, 2, the chip change-over panel of the one embodiment shown, comprising: plate ontology 1, the plate ontology
First face is provided with multiple the first pads 111 corresponding with chip pin, and the second face of the plate ontology is provided with multiple second
Pad 121, first pad 111 and second pad 121 correspond and electric interconnection.
Specifically, when needing to convert chip pin spacing, it is corresponding according to the pin number of chip and line space design
Chip change-over panel, to keep it successfully welded on printed circuit board.Chip change-over panel can also pass through internal cabling weight
The Pin locations being electrically connected on new adjustment chip with PCB
The chip change-over panel of the present embodiment can be applied to the case where chip pin spacing very little, such as: between chip pin
Away from 0.4mm is not more than, a chip change-over panel can be designed, the spacing between two neighboring first pad is allowed to be not more than 0.4mm.
Therefore, the chip 5 too small for chip pin spacing can be with when being if desired welded on printed circuit board 4
Chip change-over panel through this embodiment is realized.
First pad 111 is corresponded with chip pin, allows the chip with small spacing chip pin by first
Pad 111 is welded to the first face of chip change-over panel, and the spacing of adjacent first pad 111 is determined according to the spacing of chip pin
It is fixed.
It is the line width that is routed in design chips change-over panel, line-spacing, folded according to the spacing and quantity of the actual chips pin of chip
Layer first guarantees that the impedance of chip change-over panel is met the requirements.Meanwhile when chip and PCB is connected using chip change-over panel,
The through hole impedance optimization done on PCB, can guarantee that (this product refers to the PCB to link together, core to this product made
Piece change-over panel and chip) meet actual signal resistance requirements.
Second pad in addition to other than the first pad electric interconnection, also for welding with PCB, and through hole impedance is done on PCB
Optimize, the PCB pin on the second pad and PCB corresponds, and therefore, the spacing between two adjacent second pads needs big by one
A bit, the spacing generally larger than between two adjacent first pads.Optionally, the spacing between two adjacent second pads is greater than
0.8mm.Preferably, the spacing between two adjacent second pads is more than or equal to 1mm.
As shown in Fig. 2, the first pad 111 passes through the cabling 3 and 121 electric interconnection of the second pad in plate ontology 1.
Specifically, plate ontology is made of multiple internal layers, it can be routed, be made every in the corresponding position of corresponding internal layer according to design
A first pad 111 is by the cabling 3 of design with corresponding second pad, 121 electric interconnection (it can be appreciated that electrically connecting
It connects).
When chip is welded on chip change-over panel, various ways can be used, such as: tin ball bonding, conductive film, conduction
Nano material, surface dress needle etc..Similarly, when chip change-over panel being welded on PCB, above-mentioned described a variety of sides can also be used
Formula.
Such as: upper tin ball is planted on the second pad, and chip change-over panel is welded in by PCB by the tin ball on the second pad
On.
The chip of small spacing chip pin can be implemented novel chip conversion by this and be welded in big spacing PCB pin
Traditional handicraft still can be used on PCB, on PCB and do through hole impedance optimization, reduce processing cost；And mature conventional machining process
Improve production yield.
Preferably, plate ontology 1 includes: the first plate ontology 11 and the second plate ontology 12, and first pad 111 is set to
On the first plate ontology 11, second pad 121 is set on the second plate ontology 12；First plate ontology 11 is separate
A face contact of second pad 121 is away from the one side of first pad 111 and the second plate ontology 12.
Specifically, the first plate ontology 11 and the second plate ontology 12 are respectively that the first pad 111 and the second pad 121 provide
Installation site.And define that the position of the first pad 111 and the second pad 121 is located at the opposite two sides of plate ontology, make chip
Being welded on PCB by chip change-over panel becomes stepped construction, saves space, convenient for encapsulation.
As shown in Fig. 2, the first plate ontology 11 has 2 layers of internal layer, the second plate ontology 12 haves three layers internal layer.Layer number in specific
It with wire location is determined according to chip pin spacing and quantity.
First pad 111, which is set on the first plate ontology 11, passes through laser drill and by hole wall copper-plated the
On one copper facing hole 112；Second pad 121 be set on the second plate ontology 12 by machine drilling and through via hole
On wall copper-plated second copper facing hole 122.
Specifically, in the first plate ontology 11, there are the first copper facing holes of the first pad 111 attachment, due to two adjacent
Spacing between first pad 111 is very small, requirement is unable to satisfy according to traditional mechanical drill, therefore, using laser drilling
Hole technology drills on the first plate ontology, obtains multiple first holes, to obtaining the first plating after the hole wall copper facing in each first hole
Copper hole meets the actual needs the spacing that two adjacent first pads 111 on the first copper facing hole 112 are arranged in.
Second pad is to allow chip change-over panel to be welded on PCB, and spacing is bigger, therefore, traditional machine can be used
Tool drill drills on the second plate ontology, obtains multiple second holes, to obtaining multiple second after the hole wall copper facing in each second hole
Copper facing hole.
It should be noted that first pad 111, a second copper facing hole are only arranged on a first copper facing hole 112
One the second pad 121 is only set on 122.
According to actual welding demand, the first copper facing hole and the second copper facing hole are made using different processing technologys, make chip
The chip of small spacing chip pin can be welded on the PCB of big spacing PCB pin by change-over panel, without using high cost, low
The technology of yield can meet practical impedance demand, and yield is improved.
Furthermore, it is contemplated that the spacing of two adjacent first pads is different from the spacing of two adjacent second pads,
When making plate ontology, it is divided into two parts production, improves processing efficiency.
In another embodiment of the utility model, a kind of chip change-over panel, comprising: plate ontology 1, the plate ontology
First face is provided with multiple the first pads 111 corresponding with chip pin, and the second face of the plate ontology is provided with multiple second
Pad 121, first pad 111 and second pad 121 correspond and electric interconnection；It is connect with printed circuit board 4
Fixed structure.
Specifically, the fixed structure being arranged on chip change-over panel be fixedly connected with chip change-over panel can with PCB.Fixed structure
There are many, the modes such as chip change-over panel can be connected through a screw thread, be clamped, grafting are fixedly connected with PCB.
Optionally, fixed structure is fixation hole 2, and the fixation hole 2 is from second pad to the side of first pad
To extension, the plate ontology is fixedly connected by the fixation hole 2 with the printed circuit board.
Specifically, having corresponding structure when fixed structure is set as fixation hole 2, on PCB, make plate ontology and printed circuit
Plate is fixedly connected.
Such as: 1, fixation hole be through-hole, and corresponding through-hole also is provided on PCB, by screw, nut by printed circuit board
It is fixedly connected with chip change-over panel.
2, when fixation hole is blind hole, blind hole is recessed from second the first face towards close fixed plate of fixed plate, on PCB
Fixed column is set, is fixedly connected in a plug-in manner.
3, when fixation hole is blind hole, blind hole is recessed from second the first face towards close fixed plate of fixed plate, on PCB
Flexible fastening column is set, is fixedly connected with snap fit.
Preferably, fixation hole 2 is several, and encloses the surrounding set on second pad 121.
Specifically, multiple fixation holes can help chip change-over panel to be preferably fixedly connected with PCB, connection effect is more steady
It is fixed.
Multiple fixation holes 2 can uniformly enclose the surrounding set on second pad 121, also can be set in chip change-over panel
Four angles, be fixedly connected on chip change-over panel how uniform by strength on PCB, connection effect is more stable.
First pad 111 passes through the cabling 3 and 121 electric interconnection of the second pad in plate ontology 1.
Preferably, plate ontology 1 includes: the first plate ontology 11 and the second plate ontology 12, and first pad 111 is set to
On the first plate ontology 11, second pad 121 is set on the second plate ontology 12；First plate ontology 11 is separate
A face contact of second pad 121 is away from the one side of first pad 111 and the second plate ontology 12.
First pad 111, which is set on the first plate ontology 11, passes through laser drill and by hole wall copper-plated the
On one copper facing hole 112；Second pad 121 be set on the second plate ontology 12 by machine drilling and through via hole
On wall copper-plated second copper facing hole 122.
Specifically, fixed structure is arranged again after the first plate ontology and the pressing of the second plate ontology are plate ontology.With it is above-mentioned
Therefore not to repeat here for the explanation of embodiment same section, refers to above-described embodiment.
As shown in figure 3, the chip 5 for showing one embodiment is welded on printed circuit board 4 by chip change-over panel.
Chip change-over panel increases fixed structure in the present embodiment, connect chip change-over panel more stably with PCB, improves
Installation effect.
The chip of small spacing chip pin is welded in the PCB of big spacing PCB pin by the chip conversion in the utility model
On, practical impedance demand can be met, and yield is improved, production is simply, conveniently.
As shown in figure 4, showing the manufacturing method of the chip change-over panel of one embodiment, comprising the following steps:
S101 generates corresponding all internal layers according to chip pin quantity；
S102 presses the internal layer for belonging to the first plate ontology and the internal layer for belonging to the second plate ontology respectively, forms described first
Plate ontology and the second plate ontology；
S103 is handled the first plate ontology using laser, is carried out using machining to the second plate ontology
Processing；
S104 by after treatment the first plate ontology and the second plate ontology press and to form plate ontology；
S105 makees multiple the first pads corresponding with chip pin in the first wheat flour of the plate ontology, in the plate ontology
The second wheat flour make multiple second pads.
Specifically, needing first to be estimated according to the chip pin quantity and spacing of chip before actually manufacturing chip change-over panel
Chip change-over panel lamination guarantees that internal routing layer has reference layer up and down, according to actual signal resistance requirements design line width, line-spacing,
Lamination, if timing reference HDI (High Density Interconnector, high density interconnection) technique and processing DFM
The requirement of (Design for Manufacture, manufacturability design).
Principle picture and text are established using EDA (Electronics Design Automation, electric design automation) tool
Part and chip PCB encapsulation and the amplified encapsulation of pin spacing, import Layout Software on Drawing PCB drawing.To high in chip
Fast signal is emulated, and determines the information such as bore size, to meet signal integrity requirement.
Internal layer is processed according to the PCB drawing of output later, produces all internal layers, and is divided into two parts
It presses respectively, obtains the first plate ontology and the second plate ontology.It should be noted that the internal layer produced is according to design cloth
Line convenient for walking.
According to information such as bore size, the positions previously obtained, using different processing technologys in the first plate ontology and
It is handled on two plate ontologies.
The first plate ontology is handled using laser specifically:
It is drilled on the first plate ontology using laser, obtains multiple first holes；For the hole wall in each first hole
Copper facing obtains multiple first copper facing hole；Wherein, first pad is set at first copper facing hole.
Specifically, the first copper facing hole on the first plate ontology is in order to corresponding with chip pin, two neighboring first copper facing hole
Spacing it is smaller, machining is unable to satisfy demand, therefore, is drilled using the higher laser processing of precision, is later carried out
Copper facing.
The second plate ontology is handled using machining specifically:
It is drilled using being machined on the second plate ontology, obtains multiple second holes；For each second hole
Hole wall copper facing obtains multiple second copper facing hole；Wherein, second pad is set to second copper facing hole.
Specifically, the second copper facing hole on the second plate ontology be it is corresponding with PCB pin, between two neighboring first copper facing hole
Away from bigger, machining can meet demand therefore drilled using traditional machining, carry out copper facing, technology later
Maturation, it is low in cost.
After the completion of processing, the two is pressed as plate ontology, tabulate again later on the first face and the second face of plate ontology
One pad and the second pad lay the foundation for subsequent be electrically connected with chip and PCB.
There are many modes of electric (gas) connection, such as: tin ball bonding, conductive film, electrical-conductive nanometer material, surface dress needle etc.
Deng as long as can achieve the effect that electrical connection.
Preferably, after chip change-over panel has been made, testing impedance is carried out to chip change-over panel.To guarantee chip change-over panel
Not too big influence chip be welded on PCB after impedance effect.
Optionally, after the completion of plate ontology, fixed structure can be made thereon.Such as: fixation hole, fixed column etc..Make core
Connection effect between piece change-over panel and PCB is more stable.
Chip conversion in the present embodiment using different bore process, meets practical spacing demand in the production process,
And production is simply, conveniently, it is low in cost.
It should be noted that above-described embodiment can be freely combined as needed.The above is only the utility model
Preferred embodiment, it is noted that for those skilled in the art, do not departing from the utility model principle
Under the premise of, several improvements and modifications can also be made, these improvements and modifications also should be regarded as the protection scope of the utility model.
Claims (7)
1. a kind of chip change-over panel characterized by comprising
Plate ontology, the first face of the plate ontology are provided with multiple the first pads corresponding with chip pin, the plate ontology
Second face is provided with multiple second pads, first pad and second pad one-to-one correspondence and electric interconnection；
Spacing between two adjacent first pads is not more than 0.4mm.
2. chip change-over panel as described in claim 1, which is characterized in that the plate ontology includes:
First plate ontology and the second plate ontology, first pad are set on the first plate ontology, and second pad is set
It is placed on the second plate ontology；
The first plate ontology is away from the one side of first pad and the second plate ontology is away from second pad
A face contact.
3. chip change-over panel as claimed in claim 2, it is characterised in that:
First pad is set to passing through laser drill and passing through copper-plated first copper facing of hole wall on the first plate ontology
Kong Shang；
Second pad is set to passing through machine drilling and passing through copper-plated second copper facing of hole wall on the second plate ontology
Kong Shang.
4. chip change-over panel as described in claim 1, which is characterized in that further include: the fixed knot being connect with printed circuit board
Structure.
5. chip change-over panel as claimed in claim 4, it is characterised in that: the fixed structure is fixation hole, the fixation hole
Extend from second pad to the direction of first pad, the plate ontology passes through the fixation hole and the printed circuit
Plate is fixedly connected.
6. chip change-over panel as claimed in claim 5, which is characterized in that the fixation hole is several, and is enclosed set on described
The surrounding of second pad.
7. chip change-over panel as described in claim 1, it is characterised in that: first pad by the plate it is intrinsic walk
Line and the second pad electric interconnection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821212696.4U CN208622717U (en) | 2018-07-27 | 2018-07-27 | A kind of chip change-over panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821212696.4U CN208622717U (en) | 2018-07-27 | 2018-07-27 | A kind of chip change-over panel |
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| Publication Number | Publication Date |
|---|---|
| CN208622717U true CN208622717U (en) | 2019-03-19 |
Family
ID=65707966
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN201821212696.4U Active CN208622717U (en) | 2018-07-27 | 2018-07-27 | A kind of chip change-over panel |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111315122A (en) * | 2020-02-26 | 2020-06-19 | 歌尔股份有限公司 | Electronic component and electronic device |
| CN115279020A (en) * | 2022-08-01 | 2022-11-01 | 苏州源数芯通信科技有限公司 | Connecting structure of small pad pitch chip and PCB and processing method thereof |
-
2018
- 2018-07-27 CN CN201821212696.4U patent/CN208622717U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111315122A (en) * | 2020-02-26 | 2020-06-19 | 歌尔股份有限公司 | Electronic component and electronic device |
| CN111315122B (en) * | 2020-02-26 | 2022-10-28 | 歌尔光学科技有限公司 | Electronic component and electronic device |
| CN115279020A (en) * | 2022-08-01 | 2022-11-01 | 苏州源数芯通信科技有限公司 | Connecting structure of small pad pitch chip and PCB and processing method thereof |
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