CN108695295A - A kind of chip change-over panel and its manufacturing method - Google Patents
A kind of chip change-over panel and its manufacturing method Download PDFInfo
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- CN108695295A CN108695295A CN201810845151.5A CN201810845151A CN108695295A CN 108695295 A CN108695295 A CN 108695295A CN 201810845151 A CN201810845151 A CN 201810845151A CN 108695295 A CN108695295 A CN 108695295A
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- plate ontology
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- over panel
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 22
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 47
- 229910052802 copper Inorganic materials 0.000 claims description 47
- 239000010949 copper Substances 0.000 claims description 47
- 238000012545 processing Methods 0.000 claims description 20
- 238000005553 drilling Methods 0.000 claims description 5
- 238000005516 engineering process Methods 0.000 abstract description 13
- 238000013461 design Methods 0.000 description 12
- 230000000694 effects Effects 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 238000005538 encapsulation Methods 0.000 description 6
- 238000005457 optimization Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000035800 maturation Effects 0.000 description 1
- 239000002086 nanomaterial Substances 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
- H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
- H01L2924/15172—Fan-out arrangement of the internal vias
- H01L2924/15174—Fan-out arrangement of the internal vias in different layers of the multilayer substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
The invention discloses a kind of chip change-over panel and its manufacturing method, which includes:First face of plate ontology, the plate ontology is provided with multiple the first pads corresponding with chip pin, and the second face of the plate ontology is provided with multiple second pads, first pad and second pad one-to-one correspondence and electric interconnection.The chip of small spacing chip pin can be welded on the PCB of big spacing PCB pins by the chip change-over panel of the present invention, can meet practical impedance demand without using high cost, the technology of low yield, and yield is improved.
Description
Technical field
The present invention relates to chip manufacturing field more particularly to a kind of chip change-over panel and its manufacturing methods.
Background technology
It is continued to develop with the signal rate in the fields such as communication, big data, storage, PCB (Printed Circuit
Board, printed circuit board) signal transmission rate has arrived at 30-60Gbps substantially, it is believed that and future can faster.With mole fixed
The encapsulation that the continuous renewal of rule advances chip is also smaller and smaller, so as to cause chip pin spacing (Pitch) from original
1mm narrows down to 0.3mm or even smaller.Requirement based on above-mentioned background in PCB designs is higher and higher, makes high performance PCB
The cost of plate is also higher and higher, in signal integrity the optimization of via also become abnormal difficulty.
It can pass through substantially when chip of traditional pin spacing more than 0.8mm on PCB by doing through hole impedance optimization
Via size, anti-pad size, back drill are adjusted to optimize through hole impedance.When pin spacing is narrowed down to less than 0.4mm, PCB design
When the number of plies is more, the limitation for production technology and small pin spacing this body structure can not use smaller drill, anti-pad can not
Continue to dig big, via and is unable to back drill.This leads to BGA (Ball Grid Array, the soldered ball battle array of small pin spacing in high-rise PCB
Row encapsulation) chip vias impedance will be unable to continue to optimize, seriously affect the signal quality of high speed signal.
Standard machinery boring aperture can not accomplish that smaller, back drill difficulty is big, radius-thickness ratio is excessive, common process cannot be satisfied and want
It asks, therefore, generally uses HDI (High Density Interconnector, high density interconnection) processing technology, but it adds
Work is of high cost, yield is poor.
Invention content
The object of the present invention is to provide a kind of chip change-over panel and its manufacturing methods, meet using smaller pin spacing
Chip manufacturing high performance PCB plate improves yield, reduces processing cost.
Technical solution provided by the invention is as follows:
A kind of chip change-over panel, including:Plate ontology, the first face of the plate ontology are provided with multiple corresponding with chip pin
The first pad, the second face of the plate ontology is provided with multiple second pads, first pad and second pad one
One correspondence and electric interconnection.
In the above-mentioned technical solutions, the chip of small spacing chip pin can be welded in big spacing PCB by chip change-over panel
On the PCB of pin, practical impedance demand can be met without using high cost, the technology of low yield.
Further, the plate ontology includes:First plate ontology and the second plate ontology, first pad are set to described
On one plate ontology, second pad is set on the second plate ontology;The first plate ontology is away from first weldering
Disk and the second plate ontology be away from the while contact of second pad.
In the above-mentioned technical solutions, the first plate ontology 11 and the second plate ontology 12 are respectively the weldering of the first pad 111 and second
Disk 121 provides installation site.And define that the position of the first pad 111 and the second pad 121 is located at opposite two of plate ontology
Face makes chip pass through chip change-over panel and is welded on PCB as stepped construction, saves space, convenient for encapsulation.
Further, first pad is set to being plated by laser drill and by hole wall on the first plate ontology
On first copper facing hole of copper;Second pad be set on the second plate ontology by machine drilling and pass through hole wall
On copper-plated second copper facing hole.
In the above-mentioned technical solutions, the first copper facing hole and the second copper facing hole are made using different processing technologys, made adjacent
The spacing of two the first pads meets the requirement of small chip pin spacing.
Further, further include:The fixed structure being connect with printed circuit board.
In the above-mentioned technical solutions, fixed structure makes chip change-over panel that can be fixedly connected with PCB.
Further, the fixed structure is mounting hole, and the mounting hole is from second pad to first pad
Direction extends, and the plate ontology is fixedly connected by the mounting hole with the printed circuit board.
Further, the mounting hole is several, and encloses the surrounding set on second pad.
In the above-mentioned technical solutions, multiple mounting holes can help chip change-over panel to be preferably fixedly connected with PCB, connection
Effect is more stable.
Further, first pad passes through the intrinsic cabling of the plate and the second pad electric interconnection.
In the above-mentioned technical solutions, the setting of cabling can be completed when producing internal layer, simple for process, convenient for production, and
The electric interconnection of first pad and the second pad makes the volume smaller of chip change-over panel without the space outside occupying.
The present invention also provides a kind of manufacturing methods of chip change-over panel, include the following steps:It is given birth to according to chip pin quantity
At corresponding all internal layers;The internal layer for belonging to the first plate ontology and the internal layer for belonging to the second plate ontology are pressed respectively, form institute
State the first plate ontology and the second plate ontology;The first plate ontology is handled using laser, using mechanical processing pair
The second plate ontology is handled;By after treatment the first plate ontology and the second plate ontology press to form plate
Ontology;Multiple the first pads corresponding with chip pin are made in the first face of the plate ontology, the second of the plate ontology
Face makes multiple second pads.
In the above-mentioned technical solutions, using different bore process, meet practical spacing demand, and make simply, conveniently,
It is of low cost.
Further, described to be handled specially using laser pair the first plate ontology:Using laser in the first plate sheet
It drills on body, obtains multiple first holes;For the hole wall copper facing in each first hole, multiple first copper facing hole is obtained;Wherein, institute
The first pad is stated to be set at first copper facing hole.
Further, described that the second plate ontology is handled specially using mechanical processing:Using being machined in
It drills on the second plate ontology, obtains multiple second holes;For the hole wall copper facing in each second hole, multiple second platings are obtained
Copper hole;Wherein, second pad is set to second copper facing hole.
A kind of chip change-over panel provided by the invention and its manufacturing method, what can be brought has the beneficial effect that:
The chip of small spacing chip pin can be welded in the PCB of big spacing PCB pins by the chip change-over panel of the present invention
On, practical impedance demand can be met without using high cost, the technology of low yield, and yield is improved.
Description of the drawings
Below by a manner of clearly understandable, preferred embodiment is described with reference to the drawings, to chip change-over panel and its manufacture
Above-mentioned characteristic, technical characteristic, advantage and its realization method of method are further described.
Fig. 1 is the structural schematic diagram of chip change-over panel one embodiment of the present invention;
Fig. 2 is the structural representation of one embodiment of first pad of the invention and corresponding second pad electric interconnection
Figure;
Fig. 3 is the structural representation that chip of the present invention welds one embodiment on a printed circuit by chip change-over panel
Figure;
Fig. 4 is the flow chart of manufacturing method one embodiment of chip change-over panel of the present invention.
Drawing reference numeral explanation:
1. plate ontology, 11. first plate ontologies, 111. first pads, 112. first copper facing holes, 12. second plate ontologies, 121.
Second pad, 122. second copper facing holes, 2. mounting holes, 3. cablings, 4. printed circuit boards, 5. chips.
Specific implementation mode
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, control is illustrated below
The specific implementation mode of the present invention.It should be evident that drawings in the following description are only some embodiments of the invention, for
For those of ordinary skill in the art, without creative efforts, other are can also be obtained according to these attached drawings
Attached drawing, and obtain other embodiments.
To make simplified form, part related to the present invention is only schematically shown in each figure, their not generations
Its practical structures as product of table.
As shown in Figure 1, 2, the chip change-over panel of the one embodiment shown, including:Plate ontology 1, the plate ontology
First face is provided with multiple the first pads 111 corresponding with chip pin, and the second face of the plate ontology is provided with multiple second
Pad 121, first pad 111 and second pad 121 correspond and electric interconnection.
Specifically, when needing to convert chip pin spacing, it is corresponding according to the pin number of chip and line space design
Chip change-over panel, to keep it successfully welded on printed circuit board.Chip change-over panel can also pass through internal cabling weight
The Pin locations being electrically connected with PCB on new adjustment chip
The chip change-over panel of the present embodiment can be applied to the case where chip pin spacing very little, such as:Between chip pin
Away from no more than 0.4mm, a chip change-over panel can be designed, the spacing between two neighboring first pad is allowed to be not more than 0.4mm.
It therefore,, can be with when being if desired welded on printed circuit board 4 for the too small chip 5 of chip pin spacing
Chip change-over panel through this embodiment is realized.
First pad 111 is corresponded with chip pin, allows the chip with small spacing chip pin by first
Pad 111 is welded to the first face of chip change-over panel, and the spacing of adjacent first pad 111 is determined according to the spacing of chip pin
It is fixed.
It is the line width that is connected up in design chips change-over panel, line-spacing, folded according to the spacing and quantity of the actual chips pin of chip
Layer first ensures that the impedance of chip change-over panel is met the requirements.Meanwhile when making chip and PCB be connected using chip change-over panel,
The through hole impedance optimization done on PCB, can ensure that (this product refers to the PCB to link together, core to this product made
Piece change-over panel and chip) meet actual signal resistance requirements.
Second pad in addition to other than the first pad electric interconnection, also for welding with PCB, and through hole impedance is done on PCB
Optimize, the PCB pins on the second pad and PCB correspond, and therefore, the spacing between two adjacent second pads needs big by one
A bit, the spacing generally larger than between two adjacent first pads.Optionally, the spacing between two adjacent second pads is more than
0.8mm.Preferably, the spacing between two adjacent second pads is more than or equal to 1mm.
As shown in Fig. 2, the first pad 111 passes through cabling 3 in plate ontology 1 and 121 electric interconnection of the second pad.
Specifically, plate ontology is made of multiple internal layers, it can be connected up, made every in the corresponding position of corresponding internal layer according to design
A first pad 111 is by the cabling 3 of design with corresponding second pad, 121 electric interconnection (it can be appreciated that electrically connecting
It connects).
When chip is welded on chip change-over panel, various ways may be used, such as:Tin ball bonding, conductive film, conduction
Nano material, surface dress needle etc..Similarly, when chip change-over panel being welded on PCB, above-mentioned described a variety of sides can also be used
Formula.
Such as:Upper tin ball is planted on the second pad, and chip change-over panel is welded in by PCB by the tin ball on the second pad
On.
The chip of small spacing chip pin can be implemented novel chip conversion by this and be welded in big spacing PCB pins
Traditional handicraft still can be used on PCB, on PCB and do through hole impedance optimization, reduce processing cost;And ripe conventional machining process
Improve production yield.
Preferably, plate ontology 1 includes:First plate ontology 11 and the second plate ontology 12, first pad 111 are set to institute
It states on the first plate ontology 11, second pad 121 is set on the second plate ontology 12;First plate ontology 11 is away from
First pad 111 and the second plate ontology 12 be away from the while contact of second pad 121.
It is provided specifically, the first plate ontology 11 and the second plate ontology 12 are respectively the first pad 111 and the second pad 121
Installation site.And define that the position of the first pad 111 and the second pad 121 is located at the opposite two sides of plate ontology, make chip
Being welded on PCB by chip change-over panel becomes stepped construction, saves space, convenient for encapsulation.
As shown in Fig. 2, the first plate ontology 11 has 2 layers of internal layer, the second plate ontology 12 haves three layers internal layer.Layer number in specific
With wire location determined according to chip pin spacing and quantity.
First pad 111 be set on the first plate ontology 11 by laser drill and by hole wall copper-plated the
On one copper facing hole 112;Second pad 121 be set on the second plate ontology 12 by machine drilling and through via
On wall copper-plated second copper facing hole 122.
Specifically, there are the first copper facing hole of the first pad 111 attachment in the first plate ontology 11, when two adjacent the
Spacing very hour between one pad 111 cannot be satisfied requirement, therefore, using laser drilling according to traditional mechanical drill
Hole technology drills on the first plate ontology, obtains multiple first holes, to obtaining the first plating after the hole wall copper facing in each first hole
Copper hole makes the spacing that two adjacent first pads 111 on the first copper facing hole 112 are arranged meet the actual needs.
Second pad is to allow chip change-over panel to be welded on PCB, and spacing is bigger, therefore, traditional machine can be used
Tool drill drills on the second plate ontology, obtains multiple second holes, to obtaining multiple second after the hole wall copper facing in each second hole
Copper facing hole.
It should be noted that first pad 111, a second copper facing hole are only arranged on a first copper facing hole 112
One the second pad 121 is only set on 122.
According to actual welding demand, the first copper facing hole and the second copper facing hole are made using different processing technologys, make chip
The chip of small spacing chip pin can be welded on the PCB of big spacing PCB pins by change-over panel, without using high cost, low
The technology of yield can meet practical impedance demand, and yield is improved.
Furthermore, it is contemplated that the spacing of two adjacent first pads is different from two adjacent spacing of second pad,
When making plate ontology, it is divided into two parts and is made, processing efficiency is improved.
In another embodiment of the present invention, a kind of chip change-over panel, including:Plate ontology 1, the first of the plate ontology
Face is provided with multiple the first pads 111 corresponding with chip pin, and the second face of the plate ontology is provided with multiple second pads
121, first pad 111 and second pad 121 correspond and electric interconnection;Consolidate with what printed circuit board 4 was connect
Determine structure.
Specifically, the fixed structure being arranged on chip change-over panel makes chip change-over panel that can be fixedly connected with PCB.Fixed structure
There are many, the modes such as chip change-over panel can be connected through a screw thread, be clamped, grafting are fixedly connected with PCB.
Optionally, fixed structure is mounting hole 2, and the mounting hole 2 is from second pad to the side of first pad
To extension, the plate ontology is fixedly connected by the mounting hole 2 with the printed circuit board.
Specifically, having corresponding structure when fixed structure is set as mounting hole 2, on PCB, make plate ontology and printed circuit
Plate is fixedly connected.
Such as:1, mounting hole is through-hole, and corresponding through-hole also is provided on PCB, by screw, nut by printed circuit board
It is fixedly connected with chip change-over panel.
2, when mounting hole is blind hole, blind hole is recessed from second the first face towards close fixed plate of fixed plate, on PCB
Fixed column is set, is fixedly connected with inserting mode.
3, when mounting hole is blind hole, blind hole is recessed from second the first face towards close fixed plate of fixed plate, on PCB
Flexible fastening column is set, is fixedly connected with snap fit.
Preferably, mounting hole 2 is several, and encloses the surrounding set on second pad 121.
Specifically, multiple mounting holes can help chip change-over panel to be preferably fixedly connected with PCB, connection effect is more steady
It is fixed.
Multiple mounting holes 2 can uniformly enclose the surrounding set on second pad 121, can also be set to chip change-over panel
Four angles, so that chip change-over panel is fixedly connected on how uniform by strength on PCB, connection effect is more stable.
First pad 111 passes through cabling 3 in plate ontology 1 and 121 electric interconnection of the second pad.
Preferably, plate ontology 1 includes:First plate ontology 11 and the second plate ontology 12, first pad 111 are set to
On the first plate ontology 11, second pad 121 is set on the second plate ontology 12;First plate ontology 11 is separate
In first pad 111 and the second plate ontology 12 be away from the while contact of second pad 121.
First pad 111 be set on the first plate ontology 11 by laser drill and by hole wall copper-plated the
On one copper facing hole 112;Second pad 121 be set on the second plate ontology 12 by machine drilling and through via
On wall copper-plated second copper facing hole 122.
Specifically, fixed structure is arranged again after the first plate ontology and the pressing of the second plate ontology are plate ontology.With it is above-mentioned
Therefore not to repeat here for the explanation of embodiment same section, refers to above-described embodiment.
As shown in figure 3, showing that the chip 5 of one embodiment is welded in by chip change-over panel on printed circuit board 4.
The present embodiment chips change-over panel increases fixed structure, and chip change-over panel is made more stably to be connect with PCB, improves
Installation effect.
The chip of small spacing chip pin is welded on the PCB of big spacing PCB pins by the chip conversion in the present invention, can
Meet practical impedance demand, and yield is improved, makes simply, conveniently.
As shown in figure 4, showing the manufacturing method of the chip change-over panel of one embodiment, include the following steps:
S101 generates corresponding all internal layers according to chip pin quantity;
S102 presses the internal layer for belonging to the first plate ontology and the internal layer for belonging to the second plate ontology respectively, forms described first
Plate ontology and the second plate ontology;
S103 is handled the first plate ontology using laser, is carried out to the second plate ontology using mechanical processing
Processing;
S104 by after treatment the first plate ontology and the second plate ontology press and to form plate ontology;
S105 makes multiple the first pads corresponding with chip pin in the first face of the plate ontology, in the plate ontology
The second face make multiple second pads.
Specifically, before actually manufacturing chip change-over panel, need first to be estimated according to the chip pin quantity and spacing of chip
Chip change-over panel lamination ensures that internal routing layer has reference layer up and down, according to actual signal resistance requirements design line width, line-spacing,
Lamination, if timing reference HDI (High Density Interconnector, high density interconnection) techniques and processing DFM
The requirement of (Design for Manufacture, manufacturability design).
Principle picture and text are established using EDA (Electronics Design Automation, electric design automation) tool
Part and chip PCB encapsulation and the amplified encapsulation of pin spacing, import Layout Software on Drawing PCB drawings.To high in chip
Fast signal is emulated, and determines the information such as bore size, to meet signal integrity requirement.
Production is processed to internal layer according to the PCB drawings of output later, produces all internal layers, and is divided into two parts
It presses respectively, obtains the first plate ontology and the second plate ontology.It should be noted that the internal layer produced is according to design cloth
Line convenient for walking.
According to information such as bore size, the positions previously obtained, using different processing technologys in the first plate ontology and
It is handled on two plate ontologies.
It is handled specially using laser pair the first plate ontology:
It is drilled on the first plate ontology using laser, obtains multiple first holes;For the hole wall in each first hole
Copper facing obtains multiple first copper facing hole;Wherein, first pad is set at first copper facing hole.
Specifically, the first copper facing hole on the first plate ontology is in order to corresponding with chip pin, two neighboring first copper facing hole
Spacing it is smaller, mechanical processing cannot be satisfied demand, therefore, is drilled using the higher laser processing of precision, is later carried out
Copper facing.
The second plate ontology is handled specially using mechanical processing:
It is drilled using being machined on the second plate ontology, obtains multiple second holes;For each second hole
Hole wall copper facing obtains multiple second copper facing hole;Wherein, second pad is set to second copper facing hole.
Specifically, the second copper facing hole on the second plate ontology is corresponding with PCB pins, between two neighboring first copper facing hole
Away from bigger, mechanical processing can meet demand therefore drilled using traditional mechanical processing, carry out copper facing, technology later
Maturation, it is of low cost.
Be plate ontology by the two pressing after the completion of processing, tabulate again later on the first face and the second face of plate ontology the
One pad and the second pad lay the first stone to be subsequently electrically connected with chip and PCB.
There are many modes of electric (gas) connection, such as:Tin ball bonding, conductive film, electrical-conductive nanometer material, surface dress needle etc.
Deng as long as can achieve the effect that electrical connection.
Preferably, after chip change-over panel has been made, testing impedance is carried out to chip change-over panel.To ensure chip change-over panel
Influence chip that will not be excessive be welded on PCB after impedance effect.
Optionally, after the completion of plate ontology, fixed structure can be made thereon.Such as:Mounting hole, fixed column etc..Make core
Connection effect between piece change-over panel and PCB is more stable.
Chip conversion in the present embodiment using different bore process, meets practical spacing demand in the production process,
And make simply, conveniently, it is of low cost.
It should be noted that above-described embodiment can be freely combined as needed.The above is only the preferred of the present invention
Embodiment, it is noted that for those skilled in the art, in the premise for not departing from the principle of the invention
Under, several improvements and modifications can also be made, these improvements and modifications also should be regarded as protection scope of the present invention.
Claims (10)
1. a kind of chip change-over panel, which is characterized in that including:
First face of plate ontology, the plate ontology is provided with multiple the first pads corresponding with chip pin, the plate ontology
Second face is provided with multiple second pads, first pad and second pad one-to-one correspondence and electric interconnection.
2. chip change-over panel as described in claim 1, which is characterized in that the plate ontology includes:
First plate ontology and the second plate ontology, first pad are set on the first plate ontology, and second pad is set
It is placed on the second plate ontology;
The first plate ontology is away from the one side of first pad and the second plate ontology is away from second pad
One side contact.
3. chip change-over panel as claimed in claim 2, it is characterised in that:
First pad be set on the first plate ontology by laser drill and pass through copper-plated first copper facing of hole wall
Kong Shang;
Second pad be set on the second plate ontology by machine drilling and pass through copper-plated second copper facing of hole wall
Kong Shang.
4. chip change-over panel as described in claim 1, which is characterized in that further include:The fixed knot being connect with printed circuit board
Structure.
5. chip change-over panel as claimed in claim 4, it is characterised in that:The fixed structure is mounting hole, the mounting hole
Extend from second pad to the direction of first pad, the plate ontology passes through the mounting hole and the printed circuit
Plate is fixedly connected.
6. chip change-over panel as claimed in claim 5, which is characterized in that the mounting hole is several, and is enclosed set on described
The surrounding of second pad.
7. chip change-over panel as described in claim 1, it is characterised in that:First pad by the plate it is intrinsic walk
Line and the second pad electric interconnection.
8. a kind of manufacturing method of chip change-over panel, which is characterized in that include the following steps:
Corresponding all internal layers are generated according to chip pin quantity;
By the internal layer for belonging to the first plate ontology and belong to the internal layer of the second plate ontology and press respectively, formed the first plate ontology and
The second plate ontology;
The first plate ontology is handled using laser, the second plate ontology is handled using mechanical processing;
By after treatment the first plate ontology and the second plate ontology press and to form plate ontology;
Multiple the first pads corresponding with chip pin are made in the first face of the plate ontology, in the second face of the plate ontology
Make multiple second pads.
9. the manufacturing method of chip change-over panel as claimed in claim 8, which is characterized in that described to use laser pair the first plate sheet
Body is handled specially:
It is drilled on the first plate ontology using laser, obtains multiple first holes;
For the hole wall copper facing in each first hole, multiple first copper facing hole is obtained;
Wherein, first pad is set at first copper facing hole.
10. the manufacturing method of chip change-over panel as claimed in claim 8, which is characterized in that described to use mechanical processing to institute
The second plate ontology is stated to be handled specially:
It is drilled using being machined on the second plate ontology, obtains multiple second holes;
For the hole wall copper facing in each second hole, multiple second copper facing hole is obtained;
Wherein, second pad is set to second copper facing hole.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810845151.5A CN108695295A (en) | 2018-07-27 | 2018-07-27 | A kind of chip change-over panel and its manufacturing method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810845151.5A CN108695295A (en) | 2018-07-27 | 2018-07-27 | A kind of chip change-over panel and its manufacturing method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110691463A (en) * | 2019-09-02 | 2020-01-14 | 歌尔股份有限公司 | PCB board |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1242602A (en) * | 1998-07-16 | 2000-01-26 | 日东电工株式会社 | Wafer-scale package structure and circuit board used therein |
| CN203445108U (en) * | 2013-07-10 | 2014-02-19 | 詹泽明 | Chip packaging and switching board and circuit board with chip packaging and switching board |
| CN103890933A (en) * | 2011-09-15 | 2014-06-25 | 弗利普芯片国际有限公司 | High precision self aligning die for embedded die packaging |
| US20180063960A1 (en) * | 2016-08-31 | 2018-03-01 | Fujitsu Limited | Semiconductor device, electronic device, method of manufacturing semiconductor device, and method of manufacturing electronic device |
-
2018
- 2018-07-27 CN CN201810845151.5A patent/CN108695295A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1242602A (en) * | 1998-07-16 | 2000-01-26 | 日东电工株式会社 | Wafer-scale package structure and circuit board used therein |
| CN103890933A (en) * | 2011-09-15 | 2014-06-25 | 弗利普芯片国际有限公司 | High precision self aligning die for embedded die packaging |
| CN203445108U (en) * | 2013-07-10 | 2014-02-19 | 詹泽明 | Chip packaging and switching board and circuit board with chip packaging and switching board |
| US20180063960A1 (en) * | 2016-08-31 | 2018-03-01 | Fujitsu Limited | Semiconductor device, electronic device, method of manufacturing semiconductor device, and method of manufacturing electronic device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110691463A (en) * | 2019-09-02 | 2020-01-14 | 歌尔股份有限公司 | PCB board |
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