CN111315122B - Electronic component and electronic device - Google Patents
Electronic component and electronic device Download PDFInfo
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- CN111315122B CN111315122B CN202010122000.4A CN202010122000A CN111315122B CN 111315122 B CN111315122 B CN 111315122B CN 202010122000 A CN202010122000 A CN 202010122000A CN 111315122 B CN111315122 B CN 111315122B
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- connection
- electronic component
- solder ball
- distance
- segment
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
Abstract
The invention discloses an electronic component and an electronic device, the electronic component includes: the device comprises a device body, wherein a plurality of connection points are uniformly distributed on one surface of the device body, each connection point is communicated with an internal circuit of the device body, and the distance between two adjacent connection points is d1; and the connecting plate, the connecting plate includes relative first surface and the second surface that sets up, the second surface is provided with a plurality of second solder balls, the device body is equipped with the surface laminating of tie point sets up in the first surface to make each the second solder ball all with one tie point electric connection, adjacent two the interval d2 of second solder ball and adjacent two the relation between the interval d1 of tie point is: d2 > d1. The technical scheme of the invention aims to reduce the arrangement density of the connecting part of the electronic component, which is used for electrically connecting with an external circuit, prevent the electronic component from tin connection when a subsequent processing technology is carried out, and improve the yield of production.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to an electronic component and electronic equipment.
Background
At present, in the electronic product industry, particularly consumer electronics, the requirements on miniaturization, lightness, thinness and appearance attractiveness of products are higher and higher, so that the packaging difficulty of electronic devices, particularly parts closely related to the appearance of the whole machine, is improved, on one hand, the electronic devices need to be made small, the whole packaging size is reduced, the pin number of the parts is unchanged, the pin size and the space are reduced, the difficulty is increased for the manufacturing process of a rear-end circuit board and the part mounting process, and the part mounting defect is increased. In the electronic equipment, in order to reduce the size (especially the height) of electronic components, the trade has cancelled the shell encapsulation, adopts some to improve the encapsulation design and makes its whole size reduce, nevertheless causes electronic components to be used for increasing with external circuit electrical connection's tie point distribution density simultaneously, leads to electronic components to cause even tin easily when subsequent processing procedure technology goes on, greatly reduced the yields of production.
The above is only for assistance in understanding the technical solutions of the present application and does not represent an admission of prior art.
Disclosure of Invention
The invention mainly aims to provide an electronic component and electronic equipment, aiming at reducing the arrangement density of the connecting part of the electronic component for electrically connecting with an external circuit, preventing the electronic component from tin connection when a subsequent processing technology is carried out and improving the yield of production.
In order to achieve the above object, the present invention provides an electronic component, including:
the device comprises a device body, wherein a plurality of connection points are uniformly distributed on one surface of the device body, each connection point is communicated with an internal circuit of the device body, and the distance between two adjacent connection points is d1; and
the connecting plate, the connecting plate includes relative first surface and the second surface that sets up, the second surface is provided with a plurality of second solder balls, the device body is equipped with the surface laminating of tie point set up in the first surface, and make each the second solder ball all with one tie point electric connection, adjacent two the interval d2 of second solder ball and adjacent two the relation between the interval d1 of tie point is: d2 > d1.
In some embodiments of the invention, the device body projects onto the connection plate to form a projection area, and an outer contour of the projection area is located within an outer contour of the connection plate.
In some embodiments of the present invention, the connection board includes a connection side surface connecting the first surface and the second surface, the connection side surface is provided with a plurality of third solder balls, one of the third solder balls is electrically connected to one of the connection points, and a distance d3 between two adjacent third solder balls is greater than d1;
the distance d4 between the third solder ball and the second solder ball is in a relation d4 > d1 with d1.
In some embodiments of the present invention, the connection board further includes a fourth solder ball, the connection board includes a connection side surface connecting the first surface and the second surface, a portion of the fourth solder ball covers the second surface, another portion of the fourth solder ball covers the connection side surface, the fourth solder ball is electrically connected to the connection point, and a relationship between a distance d5 between the fourth solder ball and the second solder ball and a distance d1 between the fourth solder ball and the second solder ball is d5 > d1.
In some embodiments of the present invention, the second surface protrusion forms a boss, and at least a portion of the second solder ball is disposed on a top surface of the boss;
and/or the second surface is sunken to form a sinking platform, and at least part of the second solder balls are arranged on the bottom surface of the sinking platform.
In some embodiments of the present invention, a signal line is disposed in the connection board, and one end of the signal line is connected to the connection point, and the other end of the signal line is connected to the second solder ball.
In some embodiments of the present invention, the first surface is provided with a plurality of first solder balls, and each of the first solder balls electrically connects one of the connection points with one of the signal lines.
In some embodiments of the present invention, the signal line includes a first signal segment, a connection segment, and a second signal segment, the connection segment connects the first signal segment and the second signal segment, an end of the first signal segment away from the connection segment is connected to the first solder ball, an end of the second signal segment away from the connection segment is connected to the second solder ball, and the connection segment extends along an extending direction of the first surface.
In some embodiments of the invention, the connecting board further includes a pad disposed on the second surface, one side of the pad is fixedly connected to an end of the second signal segment away from the connecting segment, and the other side of the pad is connected to the second solder ball.
In some embodiments of the present invention, the range of d1 is 0 < d1 < 0.4mm;
and/or the value range of d2 is that d2 is more than or equal to 0.4mm.
The present invention also provides an electronic device including an electronic component, the electronic component including:
the device comprises a device body, wherein a plurality of connection points are uniformly distributed on one surface of the device body, each connection point is communicated with an internal circuit of the device body, and the distance between two adjacent connection points is d1; and
the connecting plate, the connecting plate includes relative first surface and the second surface that sets up, the second surface is provided with a plurality of second solder balls, the device body is equipped with the surface laminating of tie point set up in the first surface, and make each the second solder ball all with one tie point electric connection, adjacent two the interval d2 of second solder ball and adjacent two the relation between the interval d1 of tie point is: d2 > d1.
The technical scheme of the invention is that a plurality of uniformly arranged connection points are arranged on one surface of a device body, the connection points are communicated with an internal circuit of the device body, a connection plate is further arranged, a plurality of second welding balls are arranged on a second surface of the connection plate, each second welding ball is electrically connected with one connection point, and the relationship between the distance d2 between two adjacent second welding balls and the distance d1 between two adjacent connection points is as follows: d2 is greater than d1, when the part of the electronic component adopting the second solder ball is connected with the external circuit board, the distance between the connection part of the electronic component and the external circuit board is increased, so that the density of the connection part is increased, and the tin connection when the originally adopted connection part is connected with the external circuit board can be prevented. Therefore, the technical scheme of the invention can reduce the arrangement density of the connecting part of the electronic component for electrically connecting with an external circuit, prevent the electronic component from tin connection when a subsequent processing technology is carried out, and improve the yield of production.
Drawings
In order to more clearly illustrate the embodiments or technical solutions of the present invention, the drawings used in the embodiments or technical solutions of the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic diagram of an electronic component according to the present invention;
fig. 2 is a schematic structural diagram of an embodiment of an electronic component according to the present invention;
FIG. 3 is a schematic structural diagram of another embodiment of an electronic component according to the present invention;
fig. 4 is a schematic structural diagram of another embodiment of the electronic component of the present invention;
FIG. 5 is a schematic structural diagram of another embodiment of an electronic component according to the present invention;
FIG. 6 is a schematic structural diagram of another embodiment of an electronic component according to the present invention;
fig. 7 is a schematic structural diagram of another embodiment of an electronic component according to the present invention;
fig. 8 is a bottom view of the device body of the present invention;
fig. 9 is a bottom view of the connection plate of the present invention.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 100 | |
242 | Connecting |
| 10 | |
243 | |
| 11 | |
25 | |
| 20 | Connecting |
26 | |
| 21 | |
27 | |
| 22 | |
30 | |
| 221 | |
40 | |
| 222 | |
50 | |
| 23 | Connecting |
60 | |
| 24 | |
70 | Grating |
| 241 | A first signal segment |
The objects, features and advantages of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without inventive step based on the embodiments of the present invention, are within the scope of protection of the present invention.
It should be noted that all directional indicators (such as up, down, left, right, front, back \8230;) in the embodiments of the present invention are only used to explain the relative positional relationship between the components, the motion situation, etc. in a specific posture (as shown in the attached drawings), and if the specific posture is changed, the directional indicator is changed accordingly.
In addition, the descriptions relating to "first", "second", etc. in the present invention are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between the embodiments may be combined with each other, but must be based on the realization of the technical solutions by a person skilled in the art, and when the technical solutions are contradictory to each other or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
The present application provides an electronic component 100, which aims to reduce the arrangement density of the connection part of the electronic component 100 for electrically connecting with an external circuit, prevent the electronic component 100 from tin connection during subsequent processing, and improve the yield of production. The electronic component 100 can be applied to an electronic device, and it can be understood that the electronic device can be, but not limited to, a mobile phone, a tablet computer, a Personal Digital Assistant (PDA), an electronic book reader, an MP3 (moving Picture Experts Group Audio Layer III) player, an MP4 (moving Picture Experts Group Audio Layer IV) player, a notebook computer, a car computer, a set-top box, an intelligent tv, a wearable device, a navigator, a handheld game console, etc.
The following describes a specific structure of the electronic component 100 according to the present application in such a manner that a portion of the electronic component 100 for connection with an external circuit board is disposed on a horizontal plane:
referring to fig. 1 to 9, in some embodiments of the electronic component 100 according to the present invention, the electronic component 100 includes:
the device comprises a device body 10, wherein a plurality of connection points 11 are uniformly distributed on one surface of the device body 10, each connection point 11 is communicated with an internal circuit of the device body 10, and the distance between two adjacent connection points 11 is d1; and
the connection board 20, the connection board 20 includes a first surface 21 and a second surface 22 that are disposed opposite to each other, the second surface 22 is provided with a plurality of second solder balls 40, each of the second solder balls 40 is electrically connected to one of the connection points 11, and a relationship between a distance d2 between two adjacent second solder balls 40 and a distance d1 between two adjacent connection points 11 is: d2 > d1.
In one embodiment of the present application, the device body 10 may be a structure having a silicon-containing semiconductor, which is a wafer or other functional silicon wafer, which refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit and is called a wafer because its shape is a circle; various circuit element structures can be fabricated on a silicon wafer to form an integrated circuit product with specific electrical functions. In an embodiment, the device body 10 may be a light emitting device, one surface of the light emitting device is provided with a connection point 11, the connection point 11 is connected to an internal circuit of the light emitting device, a surface of the light emitting device facing away from the connection point 11 is provided with a grating 70, and an optical device formed by a large number of parallel slits with equal width and equal spacing of the grating 70 is called a grating 70 (grating). A typical grating 70 is made by etching a large number of parallel notches in a glass sheet, where the notches are opaque portions and the smooth portion between the two notches is transparent, which is equivalent to a slit. The light emitting effect of the light emitted from the light emitting device can be improved by providing the grating 70.
It will be appreciated that the second solder balls 40 are bump balls, which provide good connection to the conductive pads 25 on the external circuit board, thereby providing good drive to the electronic component 100 when powered. The Bumping can be made of copper and tin materials, so that the conductive effect is guaranteed. Alternatively, a metal material (e.g., gold) with a better conductivity may be provided to improve the electrical signal transmission of the electronic component 100.
And, the connection plate 20 may be made of a material having a certain supporting function and insulating function, thereby facilitating the support of the device body 10 and the insulation of the circuit. Specifically, the first connecting plate 20 may be made of plastic, rubber material, or other synthetic material. The outer contour of the connecting plate 20 may be circular or polygonal, as long as the electronic component 100 is conveniently disposed.
It should be noted that, in an embodiment, the connection point 11 is defined to have an outer contour having a geometric center, and the distance d1 between two adjacent connection points 11 is the distance between the geometric centers of two adjacent connection points 11. The second solder balls 40 are projected on the connecting plate 20 to form a solder ball projection profile, which has a geometric center, and at this time, the distance between the geometric centers of two adjacent second solder balls 40 is the distance d2 between two adjacent second solder balls 40.
Or, in an embodiment, the connection points 11 have outer contours, and a distance d1 between two adjacent connection points 11 is a length of a closest distance between the outer contours of two adjacent connection points 11, at this time, the second solder balls 40 are projected on the connection plate 20 to form a solder ball projection profile, and a length of the closest distance between two adjacent solder ball projection profiles is a distance d2 between two adjacent second solder balls 40. Thereby ensuring that the reference systems of all the intervals are correspondingly the same and avoiding the occurrence of continuous tin.
The technical scheme of the invention is that a plurality of uniformly arranged connection points 11 are arranged on one surface of a device body 10, the connection points 11 are communicated with an internal circuit of the device body 10, a connection plate 20 is further arranged, a plurality of second solder balls 40 are arranged on a second surface 22 of the connection plate 20, and each second solder ball 40 is electrically connected with one connection point 11, because the relation between the distance d2 between two adjacent second solder balls 40 and the distance d1 between two adjacent connection points 11 is as follows: d2 is greater than d1, when the part of the electronic component 100 adopting the second solder ball 40 is connected with the external circuit board, the distance between the connection positions of the electronic component 100 and the external circuit board is increased, so that the density of the connection positions is increased, and tin connection when the originally adopted connection point 11 is connected with the external circuit board can be prevented. Therefore, the technical scheme of the invention can reduce the arrangement density of the connecting part of the electronic component 100 for electrically connecting with an external circuit, prevent the electronic component 100 from tin connection during the subsequent processing technology and improve the yield of production.
In some embodiments of the present invention, the device body 10 is projected on the connection board 20 to form a projection area, and an outer contour of the projection area is located within an outer contour of the connection board 20. In this embodiment, the outer contour of the projection area formed by projecting the device body 10 on the connection board 20 is located within the outer contour of the connection board 20, and the contained form may be a full contained structure in a shape like a Chinese character 'hui' (the periphery of the first projection contour is not connected with the outer contour of the connection board 20), or a partial contained structure in a shape like a Chinese character 'mu' (the periphery of the first projection contour is connected with the outer contour of the connection board 20). So set up, on the one hand can be so that device body 10 and connecting plate 20 area of connection great, guarantee the steadiness that device body 10 set up to guarantee follow-up electronic components 100 set up the steadiness, on the other hand, can also make the position that sets up of second solder ball 40 increase, effectively reduced the density of arranging of second solder ball 40, thereby when making electronic components 100 adopt second solder ball 40 and external circuit board to be connected, reduced the emergence of the continuous tin condition, improve the yields of production.
Referring to fig. 3, in some embodiments of the present invention, the connection board 20 includes a connection side 23 connecting the first surface 21 and the second surface 22, the connection side 23 is provided with a plurality of third solder balls 50, one third solder ball 50 is electrically connected to one connection point 11, and a distance d3 between two adjacent third solder balls 50 is d3 > d1; the distances d4 and d1 between the third solder balls 50 and the second solder balls 40 are d4 > d1. In this embodiment, by providing the third solder balls 50 on the connecting side 23 of the connecting plate 20, on one hand, when the portion of the electronic component 100 using the third solder balls 50 is connected to the external circuit board, the distance between the connection points of the electronic component 100 and the external circuit board is increased, so that the density of the connection points is increased, the tin connection between the originally used connection points 11 and the external circuit board can be prevented, on the other hand, the free surface of the connecting plate 20 is effectively utilized, and the integration level of the electronic component 100 is improved. The third solder balls 50 may be made of the same material as the first solder balls 30 and the second solder balls 40, as long as the circuit is easily conducted.
It should be noted that, in an embodiment, the connection point 11 is defined to have an outer contour having a geometric center, and the distance d1 between two adjacent connection points 11 is the distance between the geometric centers of two adjacent connection points 11. At this time, the projection of the third solder ball 50 on the horizontal plane forms a projection profile of the third solder ball 50, and the distance between the geometric centers of the projection profiles of two adjacent third solder balls 50 is the distance d3 between two adjacent third solder balls 50. Or, in an embodiment, the connection points 11 have outer contours, and a distance d1 between two adjacent connection points 11 is a length of a closest distance between the outer contours of two adjacent connection points 11, at this time, a projection profile of the third solder ball 50 formed by projecting the third solder ball 50 onto the connection plate 20, and a length of a closest distance between projection profiles of two adjacent third solder balls 50 is a distance d3 between two adjacent third solder balls 50. Therefore, the reference systems of all the intervals are correspondingly the same, and the tin connection condition is avoided.
The distance d4 between the third solder ball 50 and the second solder ball 40 can also be defined according to the reference of d1, specifically, when d1 adopts the definition form of the distance between the geometric centers, d4 is the distance between the geometric centers of the projection profiles of the third solder ball 50 and the second solder ball 40 projected on the horizontal plane, respectively; or the shortest distance between the adjacent third solder ball 50 and the outer contour of the second solder ball 40.
Referring to fig. 7, in some embodiments of the present invention, the connection board 20 is further provided with a fourth solder ball 60, the connection board 20 includes a connection side 23 connecting the first surface 21 and the second surface 22, a portion of the fourth solder ball 60 covers the second surface 22, another portion of the fourth solder ball 60 covers the connection side 23, the fourth solder ball 60 is electrically connected to the connection point 11, and a distance d5 between the fourth solder ball 60 and the second solder ball 40 is d5 > d1. Through the fourth solder balls 60 covering the second surface 22 and the connecting side surface 23, on one hand, when the electronic component 100 is connected with an external circuit board by using the fourth solder balls 60, the distance between the connecting positions of the electronic component 100 and the external circuit board is increased, so that the density of the connecting positions is increased, and the tin connection when the originally-used connecting points 11 are connected with the external circuit board can be prevented, on the other hand, the free surface (namely the connecting side surface 23) of the connecting plate 20 is effectively utilized, and the integration level of the arrangement of the electronic component 100 is improved. The material of the fourth solder balls 60 may be the same as that of the second solder balls 40, so long as the circuit is easily conducted. Moreover, since part of the fourth solder balls 60 and the second solder balls 40 are located on the same surface, the space of the electronic component 100 is not occupied in the width direction, which is convenient for ensuring the miniaturization of the electronic component 100. The distance d5 between the fourth solder ball 60 and the second solder ball 40 can also be defined according to the reference of d1, specifically, when d1 adopts the definition form of the distance between the geometric centers, d5 is the distance between the geometric centers of the projection profiles of the fourth solder ball 60 and the second solder ball 40 projected on the horizontal plane, respectively; alternatively, when d1 is defined as the shortest distance, d5 is the shortest distance between the adjacent third solder balls 50 and the outer contours of the second solder balls 40.
In some embodiments of the present invention, the second solder ball 40, the third solder ball 50, and the fourth solder ball 60 may be manufactured by a ball-mounting process, specifically, conductive ball particles (the conductive ball particles are consistent with the material of the signal line 24 inside the connection board 20) are uniformly brushed on the surface where the ball-mounting is needed; then arranging a ball planting net cover on the surface needing ball planting; pouring the conductive ball particles into a ball planting net and spreading the conductive ball particles; removing the ball planting net when the conductive ball particles are adhered to the surface needing ball planting from the through holes on the ball planting net; heating is carried out until the conductive ball particles are melted, and a second solder ball 40, a third solder ball 50 and a fourth solder ball 60 are formed.
Referring to fig. 4, in some embodiments of the present invention, the second surface 22 is protruded to form a bump 221, and at least a portion of the second solder ball 40 is disposed on a top surface of the bump 221; by forming the bosses 221, on one hand, the distance between the second solder balls 40 adjacent to the second surface 22 can be increased, so that the arrangement density of the second solder balls 40 arranged on the second surface 22 is reduced, and the occurrence of the continuous tin condition is reduced, and on the other hand, the electronic component 100 can be adapted and mounted on different types of external circuit boards (some circuit boards may be provided with a recess to reduce the mounting area through the groove wall in order to reduce the mounting area), so that the mounting adaptability of the electronic component 100 is improved.
Referring to fig. 5, in some embodiments of the invention, the second surface 22 is recessed to form a platform 222, and at least a portion of the second solder balls 40 is disposed on a bottom surface of the platform 222. By forming the sinking platform 222, on one hand, the distance between the second solder balls 40 adjacent to the second surface 22 can be increased, so as to reduce the arrangement density of the second solder balls 40 arranged on the second surface 22, thereby reducing the occurrence of the continuous tin condition, and on the other hand, the electronic component 100 can be adapted and mounted on different types of external circuit boards (some circuit boards may be provided with the bosses 221 in order to reduce the mounting area thereof, so as to reduce the mounting area through the sidewalls of the bosses 221), thereby improving the mounting adaptability of the electronic component 100.
Referring to fig. 1 to 7, in some embodiments of the present invention, a signal line 24 is disposed in the connection plate 20, and one end of the signal line 24 is connected to the connection point 11 and the other end is connected to the second solder ball 40. It is understood that the signal line 24 is made of a conductive material, and may be made of a metal material such as gold, silver, or copper. The signal line 24 may be formed by deposition, etching, or plating. The signal lines 24 may be arranged in a straight line, an arc, a diagonal line, or any combination thereof, so long as good electrical conductivity is achieved.
Referring to fig. 2, in some embodiments of the present invention, the first surface 21 is provided with a plurality of first solder balls 30, and each of the first solder balls 30 electrically connects one of the connection points 11 with one of the signal lines 24. The contact area between the signal line 24 and the connection point 11 can be increased by arranging the first solder ball 30, so that the connection effect between the signal line 24 and the connection point 11 is ensured, and the connection effect between the second solder ball 40 and the connection point 11 is improved. The material of the first solder ball 30 can be similar to that of the second solder ball, so that the consistency of the electric conduction is ensured, and the production efficiency is improved.
Referring to fig. 1 to 5, in some embodiments of the present invention, the signal line 24 includes a first signal segment 241, a connection segment 242 and a second signal segment 243, the connection segment 242 connects the first signal segment 241 and the second signal segment 243, an end of the first signal segment 241 facing away from the connection segment 242 is connected to the first solder ball 30, an end of the second signal segment 243 facing away from the connection segment 242 is connected to the second solder ball 40, and the connection segment 242 extends along an extending direction of the first surface 21. In this embodiment, the signal line 24 is divided into three segments, the extending directions of the first signal segment 241 and the second signal segment 243 are consistent with the thickness direction of the connecting plate 20, the connecting segment 242 is arranged to stagger the extending directions (width directions) of the first signal segment 241 and the second signal segment 243 on the first surface 21, and then the second solder balls 40 connected with the second signal segment 243 are arranged, after the first solder balls 30 connected with the first signal segment 241 are arranged, so that the distance between two adjacent second solder balls 40 is greater than the distance between two adjacent first solder balls 30 in the extending direction of the first surface 21, the arrangement density of the second solder balls 40 is reduced, and tin connection during soldering is avoided.
In this embodiment, a method for manufacturing the connection board 20 is further provided, first providing the first connection layer 26, forming a plated through hole on the first connection layer 26, where the plated through hole is the second signal segment 243, depositing or electroplating a metal layer on a surface of the first connection layer 26, and etching the metal layer to form the connection segment 242; and then, arranging a second connecting layer 27 covering the connecting section 242, etching or drilling the second connecting layer 27 to form a through hole communicated with the connecting layer, and then depositing or electroplating metal at the formed through hole to form a first signal section 241, thereby completing the manufacture of the connecting plate 20 and the signal line 24 of the connecting plate 20. Further, by the ball mounting process, solder balls can be formed, and the electronic component 100 can be formed by further connecting the solder balls to the device body 10. Due to the arrangement, the arrangement density of the connection part of the electronic component 100 electrically connected with an external circuit is reduced, the continuous tin of the electronic component 100 is prevented when the subsequent manufacturing process is carried out, and the yield of production is improved.
Referring to fig. 6, in some embodiments of the present invention, the connection board 20 further includes a pad 25 disposed on the second surface 22, one side of the pad 25 is fixedly connected to an end of the second signal segment 243 away from the connection segment 242, and the other side of the pad is connected to the second solder ball 40. In this embodiment, the bonding pad 25 is a conductive layer laid on the second surface 22, so that the contact area between the second solder ball 40 and the signal line 24 can be increased, and the stability of the second solder ball 40 can be improved. In one embodiment, when the bonding pad 25 is a metal layer, a deposition and etching process may be used to form the metal layer into a suitable shape.
Referring to fig. 1 to 9, in some embodiments of the present invention, the value of d1 is in a range of 0 < d1 < 0.4mm; when d1 is larger than 0.4mm, it is disadvantageous to miniaturize the device body 10 and also increases the mounting space of the electronic component 100. When the value of d1 is 0.1mm, 0.15mm, 0.2mm, 0.25mm, 0.3mm, 0.35mm, or any value therebetween, the volume of the device body 10 can be ensured to be small, which is convenient for the electronic component 100 to have a small installation space.
In some embodiments of the present invention, the value range of d2 is d2 ≧ 0.4mm. Considering the diameter of the welding wire during soldering and the required soldering amount, the distance between the adjacent second solder balls 40 is set to be greater than or equal to 0.4mm, so that the tin connection can be well avoided, and the reasonable arrangement density of the second solder balls 40 is ensured. It can be understood that the value of d2 may also be 0.45mm, 0.5mm, 0.55mm, 0.6mm, 0.65mm, 0.7mm, 0.8mm, 0.9mm, or any value therebetween, which may better avoid tin connection and ensure reasonable arrangement density of the second solder balls 40.
Referring to fig. 8 and 9, in some embodiments of the present invention, the surface of the device body 10 where the connection points 11 are disposed is a surface with a rectangular outer contour, the length of the rectangular surface is 1.7mm, the width of the rectangular surface is 1.4mm, and the distance between adjacent connection points 11 is 0.3mm; the outer contour of the second surface 22 is rectangular, the length of the second surface 22 is 2.6mm, the width of the second surface 22 is 2.1mm, and the distance between the adjacent second solder balls 40 is 0.5mm, so that the mounting volume of the device body 10 is small, the arrangement density of the connecting parts (the second solder balls 40) of the electronic component 100 for electrically connecting with an external circuit is reduced, the electronic component 100 is prevented from being connected with tin during subsequent manufacturing processes, and the yield of production is improved.
The invention also provides an electronic device (not shown) comprising any one of the electronic components 100, wherein the electronic component 100 comprises a device body 10, a plurality of connection points 11 are uniformly distributed on one surface of the device body 10, each connection point 11 is communicated with an internal circuit of the device body 10, and the distance between two adjacent connection points 11 is d1; and the connecting plate 20, the connecting plate 20 includes a first surface 21 and a second surface 22 which are oppositely arranged, the second surface 22 is provided with a plurality of second solder balls 40, each second solder ball 40 is electrically connected with one of the connection points 11, and a relationship between a distance d2 between two adjacent second solder balls 40 and a distance d1 between two adjacent connection points 11 is: d2 > d1. Since the electronic device adopts all technical solutions of all the embodiments, at least all the beneficial effects brought by the technical solutions of the embodiments are achieved, and details are not repeated herein.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (9)
1. An electronic component, characterized in that the electronic component comprises:
the device comprises a device body, wherein a plurality of connection points are uniformly distributed on one surface of the device body, each connection point is communicated with an internal circuit of the device body, and the distance between two adjacent connection points is d1; and
the connecting plate, the connecting plate includes relative first surface and the second surface that sets up, the second surface is provided with a plurality of second solder balls, the device body is equipped with the surface laminating of tie point sets up in the first surface to make each the second solder ball all with a tie point electric connection, the interval d2 of two adjacent second solder balls and adjacent two relation between the interval d1 of tie point are: d2 > d1;
the connecting plate comprises a connecting side surface for connecting the first surface and the second surface, a plurality of third welding balls are arranged on the connecting side surface, one third welding ball is electrically connected with one connecting point, and the relation between the distance d3 and the distance d1 between every two adjacent third welding balls is that d3 is larger than d1;
the distance d4 between the third solder ball and the second solder ball and the distance d1 are in a relation that d4 is larger than d1;
the second surface is raised to form a boss, and at least part of the second solder balls are arranged on the top surface of the boss; and/or the second surface is sunken to form a sinking platform, and at least part of the second solder balls are arranged on the bottom surface of the sinking platform.
2. The electronic component according to claim 1, wherein the device body is projected on the connection board to form a projection area, and an outer contour of the projection area is located within an outer contour of the connection board.
3. The electronic component according to claim 1, wherein the connection board further includes a fourth solder ball, the connection board includes a connection side surface connecting the first surface and the second surface, a portion of the fourth solder ball covers the second surface, another portion of the fourth solder ball covers the connection side surface, the fourth solder ball is electrically connected to the connection point, and a distance d5 between the fourth solder ball and the second solder ball is greater than d1.
4. The electronic component according to any one of claims 1 to 3, wherein a plurality of signal lines are provided in the connection board, and each of the signal lines has one end connected to the connection point and the other end connected to the second solder ball.
5. The electronic component as claimed in claim 4, wherein the first surface is provided with a plurality of first solder balls, and each of the first solder balls electrically connects one of the connection points with one of the signal lines.
6. The electronic component according to claim 5, wherein the signal line includes a first signal segment, a connection segment, and a second signal segment, the connection segment connects the first signal segment and the second signal segment, an end of the first signal segment facing away from the connection segment is connected to the first solder ball, an end of the second signal segment facing away from the connection segment is connected to the second solder ball, and the connection segment extends in an extending direction of the first surface.
7. The electronic component as claimed in claim 6, wherein the connection board further includes a pad disposed on the second surface, one side of the pad is fixedly connected to an end of the second signal segment away from the connection segment, and the other side of the pad is connected to the second solder ball.
8. The electronic component according to any one of claims 1 to 3, wherein a value range of d1 is 0 < d1 < 0.4mm;
and/or the value range of d2 is that d2 is more than or equal to 0.4mm.
9. An electronic device characterized by comprising the electronic component according to any one of claims 1 to 8.
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| CN202010122000.4A CN111315122B (en) | 2020-02-26 | 2020-02-26 | Electronic component and electronic device |
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| CN202010122000.4A CN111315122B (en) | 2020-02-26 | 2020-02-26 | Electronic component and electronic device |
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| CN111315122A CN111315122A (en) | 2020-06-19 |
| CN111315122B true CN111315122B (en) | 2022-10-28 |
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| CN106206423A (en) * | 2016-09-08 | 2016-12-07 | 华进半导体封装先导技术研发中心有限公司 | Chip package sidewall plants ball technique |
| CN106252241A (en) * | 2016-09-08 | 2016-12-21 | 华进半导体封装先导技术研发中心有限公司 | Chip package sidewall pad or the processing technology of salient point |
| CN208622717U (en) * | 2018-07-27 | 2019-03-19 | 上海泽丰半导体科技有限公司 | A kind of chip change-over panel |
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| JP2017103278A (en) * | 2015-11-30 | 2017-06-08 | キヤノン株式会社 | Print circuit board, electronic apparatus including the print circuit board and soldering method on the print circuit board |
| JP2018137276A (en) * | 2017-02-20 | 2018-08-30 | キヤノン株式会社 | Printed circuit board and manufacturing method thereof, and electronic device |
| CN107275296A (en) * | 2017-06-30 | 2017-10-20 | 中国电子科技集团公司第五十八研究所 | A kind of three-dimensionally integrated encapsulating structure of embedded type based on TSV technology |
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| CN105047648A (en) * | 2015-06-23 | 2015-11-11 | 上海航天测控通信研究所 | System-level packaging structure and packaging method |
| CN106206423A (en) * | 2016-09-08 | 2016-12-07 | 华进半导体封装先导技术研发中心有限公司 | Chip package sidewall plants ball technique |
| CN106252241A (en) * | 2016-09-08 | 2016-12-21 | 华进半导体封装先导技术研发中心有限公司 | Chip package sidewall pad or the processing technology of salient point |
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| CN111315122A (en) | 2020-06-19 |
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Effective date of registration: 20201014 Address after: 261031, north of Jade East Street, Dongming Road, Weifang hi tech Zone, Shandong province (GoerTek electronic office building, Room 502) Applicant after: GoerTek Optical Technology Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Applicant before: GOERTEK Inc. |
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