CN208596666U - A kind of chip transmission device and silicon chip transmission system - Google Patents
A kind of chip transmission device and silicon chip transmission system Download PDFInfo
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- CN208596666U CN208596666U CN201821207182.XU CN201821207182U CN208596666U CN 208596666 U CN208596666 U CN 208596666U CN 201821207182 U CN201821207182 U CN 201821207182U CN 208596666 U CN208596666 U CN 208596666U
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 258
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 258
- 239000010703 silicon Substances 0.000 title claims abstract description 258
- 230000005540 biological transmission Effects 0.000 title claims abstract description 59
- 230000000712 assembly Effects 0.000 claims abstract description 45
- 238000000429 assembly Methods 0.000 claims abstract description 45
- 230000004308 accommodation Effects 0.000 claims abstract description 14
- 238000003860 storage Methods 0.000 claims abstract description 8
- 230000007246 mechanism Effects 0.000 claims description 30
- 230000009471 action Effects 0.000 abstract description 6
- 235000012431 wafers Nutrition 0.000 description 219
- 230000032258 transport Effects 0.000 description 50
- 238000000034 method Methods 0.000 description 9
- 230000008569 process Effects 0.000 description 8
- 238000010586 diagram Methods 0.000 description 5
- 230000007423 decrease Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000012634 fragment Substances 0.000 description 2
- 230000006698 induction Effects 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model discloses a kind of chip transmission device and silicon chip transmission systems, are related to solar energy technical field of processing equipment.The chip transmission device includes Transport Desk and clamp assemblies, and Transport Desk is used to the first silicon wafer and the second silicon wafer being successively transported to designated position；The clamp assemblies are corresponding with the designated position, and at least one side for first reaching first silicon wafer of the designated position can be clamped, and both horizontally and vertically having certain freedom degree, so as to form the accommodation space for accommodating second silicon wafer between first silicon wafer and the Transport Desk.In the chip transmission device, the first silicon wafer for first reaching designated position is detached under the action of clamp assemblies with Transport Desk, second silicon wafer is transported by Transport Desk to accommodation space, so that the second silicon wafer is located at the bottom of the first silicon wafer, to realize the stacking of silicon wafer during transportation, facilitate the storage and processing of silicon wafer.
Description
Technical field
The utility model relates to solar battery technical field of processing equipment more particularly to a kind of chip transmission devices and silicon
Piece Transmission system.
Background technique
In the processing of silicon wafer, in order to meet different application demands, often need to silicon wafer carrying out various chemistry
Processing, with popularizing for automated production, silicon wafer can generally be transported to each processing stations by assembly line, and in order to improve life
Efficiency is produced, some processing workshop sections, which need a silicon wafer being put into another silicon wafer bottom, to be stacked, so as to following process, transport
Or storage.In the prior art, the stacking of silicon wafer generally by manpower realize, it is not only time-consuming and laborious, stack low efficiency, be unfavorable for producing
It is industry, at high cost, and be easy to lead to wafer contamination or breakage because of misoperation.Therefore, a kind of novel silicon wafer biography is needed
Defeated device solves the above problems.
Utility model content
One purpose of the utility model is to propose a kind of chip transmission device, can be silicon wafer heap in transmission process
It is folded, convenient for the following process of silicon wafer, transport and storage.
For this purpose, the utility model uses following technical scheme:
A kind of chip transmission device, comprising:
Transport Desk, for the first silicon wafer and the second silicon wafer to be successively transported to designated position；And
Clamp assemblies, the clamp assemblies are corresponding with the designated position, and can clamp and first reach the designated position
First silicon wafer at least one side, and both horizontally and vertically having certain freedom degree, so that first silicon wafer
The accommodation space for accommodating second silicon wafer is formed between the Transport Desk.
Wherein, the clamp assemblies include clamping jaw, the second fixed frame and sliding equipment, and second fixed mount setting exists
In the rack of the chip transmission device, the sliding equipment is arranged on second fixed frame, the sliding equipment connection
The clamping jaw.
Wherein, the sliding equipment includes horizontal slide and vertical sliding assembly, the horizontal slide installation
In on second fixed frame, horizontal slide is connect with the vertical sliding assembly, the vertical sliding assembly with it is described
Clamping jaw connection.
Wherein, the chip transmission device further includes position limiting structure, and the position limiting structure corresponds to the designated position.
Wherein, the chip transmission device further includes accommodating mechanism, and the accommodating mechanism corresponds to the designated position, described
The position limiting structure is arranged in the inside of accommodating mechanism.
Wherein, the position limiting structure includes the upper limit part being correspondingly arranged up and down, lower limit part and is arranged on described
Side board between locating part and the lower limit part.
Wherein, the Transport Desk includes a conveying track, and the transport that the designated position is located at the conveying track is whole
End；Or
The Transport Desk includes two rectangular conveying tracks, and the designated position is located at two conveying tracks and prolongs
Stretch the intersection in direction.
Wherein, when the Transport Desk includes a conveying track, the transit terminal of the conveying track further includes stretching
Platform；
When the Transport Desk includes two rectangular conveying tracks, at least one transport in two conveying tracks
The transit terminal of track includes telescopic platform.
Another purpose of the utility model is to propose a kind of silicon chip transmission system, can be silicon wafer in transmission process
It stacks, convenient for the storage and processing of silicon wafer.
For this purpose, the utility model uses following technical scheme:
A kind of silicon chip transmission system, including control system further include chip transmission device as described above, the control system
System is connect with the Transport Desk and the clamp assemblies respectively.
Wherein, the control system includes PLC control system and sensing device, and the sensing device corresponds to the specific bit
Set, for detecting the position of first silicon wafer, the PLC control system respectively with the sensing device, the Transport Desk and
The clamp assemblies connection.
The utility model has the advantages that the utility model provides a kind of chip transmission device and silicon chip transmission system.Chip transmission dress
In setting, the first silicon wafer for first reaching designated position, which is detached to be formed with Transport Desk under the action of clamp assemblies, accommodates the second silicon wafer
Accommodation space, the second silicon wafer are transported by Transport Desk to accommodation space, so that the second silicon wafer is located at the bottom of the first silicon wafer, from
And realize the stacking of silicon wafer during transportation, facilitate following process, transport and the storage of silicon wafer.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the gaily decorated basket that the utility model embodiment 1 provides and silicon wafer；
Fig. 2 is the partial structure diagram for the silicon wafer transportation system that the utility model embodiment 1 provides；
Fig. 3 is the structural schematic diagram for the Transport Desk that the utility model embodiment 1 provides；
Fig. 4 is the structural schematic diagram for the clamp assemblies that the utility model embodiment 1 provides.
Fig. 5 is the partial structure diagram for the silicon wafer transportation system that the utility model embodiment 2 provides.
Wherein:
1, Transport Desk；11, transmission frame；12, the first belt component；121, the first belt；122, the first belt pulley；21, it stretches
Contracting platform；22, the second belt component；221, the second belt；222, the second belt pulley；5, clamp assemblies；51, clamping jaw；52, vertical sliding
Dynamic component；53, horizontal slide；54, clamping jaw fixed frame；6, the gaily decorated basket；61, side plate；62, side supports bar；621, latch；
63, bottom support rod；7, silicon wafer.
Specific embodiment
The technical issues of to solve the utility model, the technical solution of use and the technical effect that reaches are clearer,
Further illustrate the technical solution of the utility model below with reference to the accompanying drawings and specific embodiments.
Embodiment 1
A kind of silicon chip transmission system is present embodiments provided, which can be applied to solar battery preparation
During, such as in process for etching, for transporting silicon wafer 7, and the silicon wafer 7 in transportational process can be stacked, to facilitate silicon
The storage or processing of piece 7.
Silicon chip transmission system includes chip transmission device and control assembly.Chip transmission device includes rack, 1 and of Transport Desk
External force mechanisms.External force mechanisms and Transport Desk 1 can be installed in rack.Transport Desk 1 can be used for carrying silicon wafer 7, and by
One silicon wafer and the second silicon wafer are successively transported to specified location, to be stacked.External force mechanisms are corresponding with designated position, so as to energy
It is enough that external force is applied to the first silicon wafer for first reaching designated position, the second silicon is accommodated so as to be formed between the first silicon wafer and Transport Desk 1
The accommodation space of piece.
Specifically, the silicon wafer 7 for first reaching designated position is the first silicon wafer, and the rear silicon wafer 7 for reaching designated position is the second silicon
Piece.Since external force mechanisms exert a force to the first silicon wafer, external force mechanisms can be exerted a force by the way of interval to the first silicon wafer,
After some or all of first silicon wafer is detached from Transport Desk 1, the second silicon wafer is transported under the action of Transport Desk 1 to the first silicon wafer
In the accommodation space formed with Transport Desk 1, external force mechanisms stop force later, and the first silicon wafer falls, and at least partly with second
Silicon wafer overlapping.
In the present embodiment, external force mechanisms may include clamp assemblies 5.Clamp assemblies 5 can be corresponding with designated position, and energy
Enough clampings first reach at least one side of the first silicon wafer of designated position, and clamp assemblies 5 are both horizontally and vertically having
There is certain freedom degree.When external force mechanisms need to exert a force to the first silicon wafer, clamp assemblies 5 can be by vertically and horizontally moving
It is dynamic, it is moved to the side of the first silicon wafer, and at least one side by clamping the first silicon wafer is fixed with the first silicon wafer, Zhi Houtong
5 upward vertical movement of clamp assemblies is crossed, the first silicon wafer and Transport Desk 1 is driven to be detached from.During the first silicon wafer lifts, to keep away
Exempt from the first silicon wafer and deviate designated position, chip transmission device can also include position limiting structure, and position limiting structure corresponds to specific bit and installs
It sets, to limit the position of the first silicon wafer and the second silicon wafer that are sent to designated position, avoids the first silicon wafer or the second silicon wafer inclined
From being conducive to the transport and stacking of silicon wafer 7.
Specifically, position limiting structure may include the upper limit part being correspondingly arranged up and down, lower limit part and be arranged in the upper limit
Side board between position part and lower limit part.Upper limit part, lower limit part and side board, which can enclose to set to be formed, accommodates silicon wafer 7
Space.Upper limit part can be connected to the top surface of the first silicon wafer, and the first silicon wafer of limitation moves up distance；Lower limit part is located at
The lower section of first silicon wafer, after the second silicon wafer is transported to accommodation space, lower limit part is abutted with the bottom surface of the second silicon wafer, from below
Limit the position of silicon wafer 7；Side board can be abutted at least two sides of the first silicon wafer and the second silicon wafer (can be mutually
Parallel two sides are also possible to 7 three sides in orthogonal two sides or silicon wafer), by upper limit part, under
Locating part and side board can limit the position of silicon wafer 7, realize that the first silicon wafer and the second silicon wafer are stacked without departing from transporter
To.
Enter accommodation space for convenience of the second silicon wafer, to be located at the lower section of the first silicon wafer, upper limit part and lower limit part
The distance between not less than the first silicon wafer and the second silicon wafer thickness and.
In the present embodiment, silicon chip transmission system can also include accommodating mechanism, and accommodating mechanism can correspond to specific bit and install
It sets, to be stored in the transport to accommodating mechanism of silicon wafer 7.Optionally, the first silicon wafer and the second silicon wafer can be during transportation
It stacks, after stacking in transport to accommodating mechanism, is also possible to first transport to accommodating mechanism, so that the first silicon wafer and the second silicon wafer
It is overlapped in accommodating mechanism.When the first silicon wafer and silicon wafer 7 are overlapped in accommodating mechanism, accommodating mechanism includes above-mentioned limit knot
Structure.
In the present embodiment, Transport Desk 1 includes a conveying track, and the first silicon wafer and the second silicon wafer are successively transported by same
Defeated track reaches designated position, and designated position can be located at the transit terminal of conveying track.Position limiting structure can be set in transport
The transit terminal of track, side board can be abutted at least two orthogonal sides of the first silicon wafer and the second silicon wafer,
By upper limit part, lower limit part and side board, realize that the first silicon wafer and the second silicon wafer stack neatly.In the fortune of conveying track
Defeated terminal can also be correspondingly arranged accommodating mechanism, and the first silicon wafer and the second silicon wafer for being conducive to heap poststack enter in accommodating mechanism, or
Person is including stacking in above-mentioned position limiting structure accommodating mechanism.
In the present embodiment, accommodating mechanism can be the gaily decorated basket 6, and the transit terminal of conveying track can extend into the gaily decorated basket 6,
So that the first silicon wafer and the second silicon wafer stack in the gaily decorated basket 6.As shown in Figure 1, the gaily decorated basket 6 can be placed vertically, two sides of the gaily decorated basket 6
Plate 61 is setting up and down, and latch 621 is provided on side supports bar 62 and bottom support rod 63, and two adjacent latches 621 divide
Not Wei upper limit part and lower limit part, form card slot between upper limit part and lower limit part, side supports bar 62 and bottom support
Bar 63 can be side board.Silicon wafer 7 is horizontal to be sent into the gaily decorated basket 6, and two adjacent latches 621 can be placed with two silicon wafers 7.
When transporting silicon wafer 7, two silicon wafers 7 can be successively conveyed into two adjacent latches 621, and when first silicon
After piece 7 enters in card slot, clamp assemblies 5 start, and the first silicon wafer stress under the action of clamp assemblies 5 moves up, so that the
The accommodation space for accommodating the second silicon wafer is formed between latch 621 below one silicon wafer and card slot；Conveying track continues to flower later
Transport the second silicon wafer in basket 6, and after being at least partially extend into accommodation space of the second silicon wafer, clamp assemblies 5 drive first
Silicon wafer is downward, so that the first silicon wafer is fallen, and the first silicon wafer is at least partly Chong Die with the second silicon wafer.Clamp assemblies 5 unclamp first
Silicon wafer is simultaneously extracted out, finally, conveying track can work on, so that the second silicon wafer is completely into card slot, the first silicon wafer and second
Silicon wafer is completed to stack.In the transmission and stacking process of the first silicon wafer and the second silicon wafer, the bottom support rod 63 of the gaily decorated basket 6 and side
Support rod 62 can limit for silicon wafer 7, guarantee that two card silicon wafers 7 stack neatly.
After being accommodated with two silicon wafer 7 between two adjacent latches 621, the gaily decorated basket 6 can be mobile in vertical direction, so that
The transit terminal of conveying track is corresponding with the position of next card slot of the gaily decorated basket 6, to input silicon wafer 7 into the gaily decorated basket 6 to continuation.?
In other embodiments, after being stacked with two silicon wafer 7 in a card slot, it is also possible to the gaily decorated basket 6 and remains stationary, the transport of silicon wafer 7 system
Transport Desk 1 in system moves up and down, so that silicon wafer 7 is opposite with next card slot.
As shown in Fig. 2, the transit terminal of conveying track can also include telescopic platform 21, telescopic platform 21 and conveying track connect
It connects, and can be flexible along the transporting direction of conveying track, to accept the silicon wafer 7 on conveying track, and silicon wafer 7 is continued to be fed into
In the gaily decorated basket 6.The width of telescopic platform 21 is less than the width that the gaily decorated basket 6 is open, so that telescopic platform 21 can smoothly enter into the gaily decorated basket 6.
Telescopic platform 21 can lower end parallel or a little higher than with the latch 621 of the lower end of corresponding card slot latch 621 so that silicon
Piece 7 can smoothly enter between two latches 621 up and down, to improve the precision of the transport of silicon wafer 7, reduce 7 fragment rate of silicon wafer.To guarantee
Silicon wafer 7 enters the stability during card slot, and the end of telescopic platform 21 can extend into the center of the gaily decorated basket 6.
Conveying track can use V belt translation, chain conveyer or idler wheel drive belt configuration.As shown in figure 3, in the present embodiment, fortune
Defeated track transmits silicon wafer 7 using belt transmission structure comprising transmission frame 11 and the first belt component 12.Wherein, the first belt
Component 12 includes the first belt 121 and two the first belt pulleys 122, and one is the first driving wheel in two the first belt pulleys 122,
Another is the first driven wheel.First belt pulley 122 is rotatably assorted with transmission frame 11, and the first belt 121 is wound on two the first skins
On belt wheel 122, the rotation of the first driving wheel drives the rotation of the first driven wheel, so that the rotation of the first belt 121 is driven, to realize silicon
The transport of piece 7.The width of conveying track can be adapted with the width of silicon wafer 7, so as to the stabilization for improving carrying, transporting silicon wafer 7
Property.
During making silicon wafer 7 be sent to telescopic platform 21 by conveying track, uniform force, telescopic platform 21 can opposite fortune
The center line symmetrical setting of defeated track.The two sides of telescopic platform 21, which respectively correspond, is provided with transmission frame 11 and the first belt component 12,
The first belt component 12 is correspondingly arranged on each transmission frame 11.Two the first belt components 12 two sides with silicon wafer 7 respectively
Cooperation, improves the stationarity of chip transmission.
To enable the silicon wafer 7 on telescopic platform 21 completely into arriving in the gaily decorated basket 6, the second belt is additionally provided on telescopic platform 21
Component 22.Specifically, the second belt component 22 includes the second belt 221 and two the second belt pulleys 222, the second belt pulley 222
It is rotatablely connected with telescopic platform 21.One is the second driving wheel in two the second belt pulleys 222, another is the second driven wheel, the
Two driving wheels and the second driven wheel are respectively arranged at telescopic platform 21 along the both ends that 7 transporting direction of silicon wafer is arranged, the second driving wheel energy
It is enough driven and is rotated by driving part.When transporting silicon wafer 7, telescopic platform 21 is protruded into the gaily decorated basket 6, at this time the silicon wafer 7 on telescopic platform 21
It is at least partially disposed in card slot.Start the second belt component 22 later, the second driving wheel is rotated by driving part, band
Dynamic second driven wheel and the rotation of the second belt 221, to drive silicon wafer 7 mobile, so that the silicon wafer 7 on telescopic platform 21 is fully inserted into
Into card slot.Wherein, driving part can be motor.
In order to guarantee uniform force in 7 transmit process of silicon wafer, it can be set that there are two the second belt components on telescopic platform 21
22, the center symmetric setting of two 22 relative telescopic platforms 21 of the second belt component can be to avoid the position during transportation of silicon wafer 7
It shifts.
As shown in figure 4, clamp assemblies 5 include clamping jaw 51, the second fixed frame and sliding equipment, the second fixed mount setting exists
In the rack of chip transmission device, sliding equipment setting is connect on the second fixed frame, and with clamping jaw 51.Sliding equipment can band
Dynamic clamping jaw 51 is both horizontally and vertically moving, so that the side that clamping jaw 51 is moved to the first silicon wafer clamps the first silicon wafer.
To avoid clamping jaw 51 from damaging silicon wafer, the surface that clamping jaw 51 is contacted with silicon wafer 7 is also provided with elastic layer.It is optional
Ground, elastic layer can be made of silica gel, rubber or sponge.
For the freedom degree both horizontally and vertically for realizing clamping jaw 51, sliding equipment includes horizontal slide 53 and vertical
Slide assemblies 52.Horizontal slide 53 includes horizontal bracket, and horizontal bracket is connect with the first fixed frame.Vertical sliding assembly 52
Including vertical support frame, one end and the horizontal bracket of vertical support frame are slidably connected, and clamping jaw 51 passes through clamping jaw fixed frame 54 and vertical branch
Frame connection, and clamping jaw fixed frame 54 can vertically be slided along vertical support frame.
Specifically, horizontally extending first sliding groove can be set on horizontal bracket, be provided on vertical support frame
With the first sliding block of first sliding groove cooperation.To realize that the first sliding block can be set along the sliding of first sliding groove, first sliding groove
First lead screw, the first sliding block are connect with the first lead screw spiral, after rotating by the first lead screw of motor driven, first can be driven to slide
Block is slided along first sliding groove.
In other embodiments, the first sliding block can also be driven along the sliding of first sliding groove by linear motor or cylinder.
The second sliding slot extended in the vertical direction can be set on vertical support frame, clamp and be provided on fixed frame and second
Second sliding block of sliding slot cooperation.The cooperation of second sliding block and second sliding slot can and the first sliding block it is identical as first sliding groove,
With by leadscrew-nut mechanism, linear motor or cylinder driving, details are not described herein again.
It is contacted for convenience of clamp assemblies 5 with the first silicon wafer, at least clamped side of the first silicon wafer can stretch out Transport Desk 1
Side outside, to be contacted with clamp assemblies 5.
In 5 course of work of clamp assemblies, clamping jaw 51 is moved to the side of the first silicon wafer by vertical and horizontal movement first
Side guarantees that the opening of clamping jaw 51 is aligned with the side of the first silicon wafer, rear clip-claw 51 pass through vertical support frame relative level bracket
It is mobile, close to the first silicon wafer, so that control assembly controls clamping jaw after the side edge of the first silicon wafer enters in the opening of clamping jaw 51
51 closures clamp the first silicon wafer, will pass through the sliding for clamping fixed frame Relative vertical bracket, the first silicon wafer are driven to move up.
Wherein, control assembly control clamping jaw 51 opens or closure is the technological means of comparative maturity in the prior art, herein no longer in detail
It introduces.
After the second silicon wafer is completely into accommodation space, the first silicon wafer is stacked on the second silicon by the movement of slide assemblies direction
On piece.Since the thickness of silicon wafer 7 is generally 180 μm, the width of card slot is generally 4.2mm, comprehensively consider silicon wafer 7 thickness and
The width of card slot, clamp assemblies 5 guarantee that the first silicon wafer is lifted up 2-3mm, for example, 2mm, 2.1mm, 2.2mm, 2.3mm,
2.4mm,2.5mm,2.6mm,2.7mm,2.8mm,2.9mm,3mm.In the present embodiment, the selection of the first silicon wafer is lifted up 2mm.
To enable Transport Desk 1 preferably to cooperate with external force mechanisms, control assembly includes PLC control system and induction
Device, PLC control system are electrically connected with Transport Desk 1, clamp assemblies 5 and sensing device respectively, and control assembly is according to sensing device
The start and stop of signal the control Transport Desk 1 and clamp assemblies 5 of feedback, so that the two preferably cooperates the transport for completing silicon wafer 7.
Sensing device is used to detect the transmission location of the first silicon wafer, is moved to the first silicon wafer to control clamp assemblies 5
Side, and lifted the first silicon wafer by the first silicon wafer of clamping, so that the second silicon wafer be facilitated to be inserted into, avoid the first silicon wafer and second
Silicon wafer interferes.Optionally, sensing device can be set on the lower section of telescopic platform 21 or telescopic platform 21, and sensing device can be with
The position of the first silicon wafer is detected by non-contact inductives such as contact induction or photo-electrics.By taking photoelectric sensor as an example, pass
Sensor can be set in the lower section of telescopic platform 21, when the underface of the end-transfer of the first silicon wafer to sensor, due to silicon wafer 7
The effects of to the refraction of light, reflection, the optical signal that sensor receives will change, and refer to judge that the first silicon wafer reaches
Positioning is set, and transmits signal to control assembly by sensor, the i.e. controllable clamp assemblies 5 of control assembly work.
Stop after clamp assemblies 5 clamp the mobile a distance of the first silicon wafer, Transport Desk 1 conveys the second silicon wafer at this time.When
Second wafer sections or after being fully inserted into the gap of the first silicon wafer and card slot, control assembly controls clamp assemblies 5 and works, and drives
First silicon wafer falls, until the first silicon wafer is at least partly stacked with the second silicon wafer, later, clamp assemblies 5 unclamp the first silicon wafer simultaneously
Extraction.Second belt component 22 works on, until the second silicon wafer is completely inserted into card slot.In addition, control assembly can be with
Including control panel, it is provided with select button on control panel, silicon chip transmission system can choose by select button and transmitting
Whether carry out stacking the operation of silicon wafer 7 during silicon wafer 7.
In other embodiments, it can be in E type that clamping jaw 51 is whole, i.e., there are two for clamping silicon wafer 7 for the setting of clamping jaw 51
Groove body, two groove bodies are arranged in vertical.Clamping jaw 51 can successively clamp two silicon wafers, be placed on finger after clamping two silicon wafers
Place is set in positioning, to realize the stacking of silicon wafer.
The specific work process of 7 transportation system of silicon wafer is as follows in the present embodiment:
The transit terminal of Transport Desk 1 is corresponding with corresponding groove position in the gaily decorated basket 6, to transport silicon wafer 7 into the gaily decorated basket 6.
21 relative transport frame 11 of telescopic platform sliding, to protrude into the gaily decorated basket 6.The work of first belt component 12, makes the first chip transmission extremely
After on telescopic platform 21, the second belt component 22 work, so that the first silicon wafer is completely into in card slot.Sensing device senses
One silicon wafer reaches designated position, sends electric signal to PLC control system, after PLC control system receives electric signal, control clamping
Component 5 works, so that the first silicon wafer moves up.During this, the second silicon wafer conveys under the action of the first belt component 12
To telescopic platform 21, when the second silicon wafer is when being inserted partially into accommodation space, clamp assemblies 5 drive the decline of the first silicon wafer, make
It obtains the first silicon wafer to be at least partly overlapped with the second silicon wafer, clamp assemblies 5 unclamp the first silicon wafer and simultaneously extract out；Second belt component 22 after
Continuous work drives the second silicon wafer completely into in card slot.After two silicon wafers 7 are inserted into card slot, 21 relative transport frame of telescopic platform
11 reverse slides out of the gaily decorated basket 6 to withdraw, and the gaily decorated basket 6 is mobile relative to 7 transport device of silicon wafer, to convey silicon wafer into next card slot
7。
In above-mentioned steps, after first the silicon wafer 7 can also be sent on telescopic platform 21 by the first belt component 12,
Telescopic platform 21 slides again to be extend into the gaily decorated basket 6.
Using silicon chip transmission system provided in this embodiment, silicon wafer 7 can be stacked in designated position, facilitate the storage of silicon wafer 7
It deposits and uses, and silicon wafer 7 is transported into containers such as the gailys decorated basket 6 using above-mentioned silicon chip transmission system, it can be by the conevying efficiency of silicon wafer 7
4800 per hour are promoted to by 4000 per hour, fragment rate can be reduced to 0.02% by 0.05%.
Embodiment 2
A kind of silicon chip transmission system is present embodiments provided, it is roughly the same with the silicon chip transmission system in embodiment 1, with
Unlike in embodiment 1, as shown in figure 5, Transport Desk 1 includes two conveying tracks in the present embodiment, two conveying tracks can
To be arranged at an angle, and the intersection of two conveying track extended lines is the designated position for carrying out silicon wafer 7 and stacking.This implementation
In example, the angle of two conveying tracks is rectangular, and the transit terminal of two conveying tracks crosses.
Specifically, two articles of conveying tracks be respectively convey the first track of the first silicon wafer and for conveying the second silicon wafer the
Two tracks.After the first silicon wafer passes through the first orbit transports to designated position, clamp assemblies 5 start to exert a force to the first silicon wafer, make
The first silicon wafer is obtained to move up.Later, the second silicon wafer passes through the second rail transport to specified location.Clamp assemblies 5 drive the
The decline of one silicon wafer stacks the first silicon wafer and the second silicon wafer.
In the present embodiment, expansion plate has been can be set in one transit terminal in the first track and the second track.To stretch
For contracting plate is connect with the second track, the first track is not less than expansion plate, the optional a little higher than expansion plate of first track.First rail
After road conveys the first silicon wafer to transit terminal, the first silicon wafer is fallen on expansion plate.First silicon wafer quilt under the action of clamp assemblies 5
After lifting, the second silicon wafer is delivered on expansion plate by the second track, so that the first silicon wafer and the second silicon wafer stack.
In other embodiments, adapting table has can be set in designated position, and adapting table is located in accommodating mechanism, and adapting table
Surface not higher than groove lower end latch 621 upper surface.Clamp assemblies 5 are corresponding with the position of adapting table.First track and
The transit terminal of second track is connect with adapting table.The transit terminal of first track and the second track can be provided with telescopic platform
21, telescopic platform 21 connect with adapting table after stretching out or is located above adapting table, and telescopic platform surface is not less than the lower end latch of groove
621 upper surface.Optionally, the transit terminal of a track is provided with telescopic platform 21 in the first track and the second track, stretches
Platform 21 is connect after stretching out with adapting table.
Silicon wafer 7 is sent into accommodating mechanism for convenience of two conveying tracks, accommodating mechanism is only arranged on adjacent two sides
There is position limiting structure.
The above content is only the preferred embodiment of the utility model, for those of ordinary skill in the art, according to this reality
With novel thought, there will be changes in the specific implementation manner and application range, and the content of the present specification should not be construed as
Limitations of the present invention.
Claims (10)
1. a kind of chip transmission device characterized by comprising
Transport Desk (1), for the first silicon wafer and the second silicon wafer to be successively transported to designated position；And
Clamp assemblies (5), the clamp assemblies (5) are corresponding with the designated position, and can clamp and first reach the specific bit
At least one side for first silicon wafer set, and both horizontally and vertically having certain freedom degree, so that first silicon
The accommodation space for accommodating second silicon wafer is formed between piece and the Transport Desk (1).
2. chip transmission device as described in claim 1, which is characterized in that the clamp assemblies (5) include clamping jaw (51),
Two fixed frames and sliding equipment, second fixed mount setting is in the rack of the chip transmission device, the skate machine
Structure is arranged on second fixed frame, and the sliding equipment connects the clamping jaw (51).
3. chip transmission device as claimed in claim 2, which is characterized in that the sliding equipment includes horizontal slide
(53) it is installed on second fixed frame with vertical sliding assembly (52), the horizontal slide (53), horizontal Slide Group
Part (53) is connect with the vertical sliding assembly (52), and the vertical sliding assembly (52) connect with the clamping jaw (51).
4. chip transmission device as described in claim 1, which is characterized in that the chip transmission device further includes limit knot
Structure, the position limiting structure correspond to the designated position.
5. chip transmission device as claimed in claim 4, which is characterized in that the chip transmission device further includes storage machine
Structure, the accommodating mechanism correspond to the designated position, and the position limiting structure is arranged in the inside of the accommodating mechanism.
6. chip transmission device as described in claim 4 or 5, which is characterized in that the position limiting structure includes corresponding up and down sets
Upper limit part, lower limit part and the side board being arranged between the upper limit part and the lower limit part set.
7. chip transmission device according to any one of claims 1 to 5, which is characterized in that the Transport Desk (1) includes one
Conveying track, the designated position is located at the transit terminal of the conveying track；Or
The Transport Desk (1) includes two rectangular conveying tracks, and the designated position is located at two conveying tracks and prolongs
Stretch the intersection in direction.
8. chip transmission device as claimed in claim 7, which is characterized in that when the Transport Desk (1) includes a transport rail
When road, the transit terminal of the conveying track further includes telescopic platform (21)；
When the Transport Desk (1) includes two rectangular conveying tracks, at least one transport in two conveying tracks
The transit terminal of track includes telescopic platform (21).
9. a kind of silicon chip transmission system, including control system, which is characterized in that further include such as any one of claim 1-8 institute
The chip transmission device stated, the control system are connect with the Transport Desk (1) and the clamp assemblies (5) respectively.
10. silicon chip transmission system as claimed in claim 9, which is characterized in that the control system include PLC control system and
Sensing device, the sensing device correspond to the designated position, for detecting the position of first silicon wafer, the PLC control
System is connect with the sensing device, the Transport Desk (1) and the clamp assemblies (5) respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821207182.XU CN208596666U (en) | 2018-07-27 | 2018-07-27 | A kind of chip transmission device and silicon chip transmission system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821207182.XU CN208596666U (en) | 2018-07-27 | 2018-07-27 | A kind of chip transmission device and silicon chip transmission system |
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| Publication Number | Publication Date |
|---|---|
| CN208596666U true CN208596666U (en) | 2019-03-12 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201821207182.XU Active CN208596666U (en) | 2018-07-27 | 2018-07-27 | A kind of chip transmission device and silicon chip transmission system |
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| Country | Link |
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| CN (1) | CN208596666U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117711997A (en) * | 2023-11-29 | 2024-03-15 | 浙江浩鑫半导体材料有限公司 | Quartz boat device for solar cell diffusion |
-
2018
- 2018-07-27 CN CN201821207182.XU patent/CN208596666U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117711997A (en) * | 2023-11-29 | 2024-03-15 | 浙江浩鑫半导体材料有限公司 | Quartz boat device for solar cell diffusion |
| CN117711997B (en) * | 2023-11-29 | 2024-05-03 | 浙江浩鑫半导体材料有限公司 | Quartz boat device for solar cell diffusion |
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Address after: 224000 No. 66 Lijiang Road, Yancheng economic and Technological Development Zone, Yancheng City, Jiangsu Patentee after: YANCHENG ARTES SUNSHINE ENERGY TECHNOLOGY Co.,Ltd. Patentee after: Atlas sunshine Power Group Co.,Ltd. Address before: 224000 No. 66 Lijiang Road, Yancheng economic and Technological Development Zone, Yancheng City, Jiangsu Patentee before: YANCHENG ARTES SUNSHINE ENERGY TECHNOLOGY Co.,Ltd. Patentee before: CSI SOLAR POWER GROUP Co.,Ltd. |