CN108735642A - A kind of chip transmission device, silicon chip transmission system and chip transmission method - Google Patents
A kind of chip transmission device, silicon chip transmission system and chip transmission method Download PDFInfo
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- CN108735642A CN108735642A CN201810846002.0A CN201810846002A CN108735642A CN 108735642 A CN108735642 A CN 108735642A CN 201810846002 A CN201810846002 A CN 201810846002A CN 108735642 A CN108735642 A CN 108735642A
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 428
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 423
- 239000010703 silicon Substances 0.000 title claims abstract description 423
- 230000005540 biological transmission Effects 0.000 title claims abstract description 99
- 238000000034 method Methods 0.000 title claims abstract description 41
- 230000007246 mechanism Effects 0.000 claims abstract description 68
- 230000004308 accommodation Effects 0.000 claims abstract description 28
- 238000003860 storage Methods 0.000 claims abstract description 12
- 230000032258 transport Effects 0.000 claims description 78
- 238000007664 blowing Methods 0.000 claims description 39
- 230000008569 process Effects 0.000 abstract description 14
- 238000012545 processing Methods 0.000 abstract description 10
- 230000000694 effects Effects 0.000 abstract description 9
- 230000000712 assembly Effects 0.000 description 16
- 238000000429 assembly Methods 0.000 description 16
- 238000001179 sorption measurement Methods 0.000 description 12
- 238000010586 diagram Methods 0.000 description 11
- 230000009471 action Effects 0.000 description 6
- 239000012634 fragment Substances 0.000 description 4
- 238000009826 distribution Methods 0.000 description 3
- 230000005484 gravity Effects 0.000 description 3
- 230000002745 absorbent Effects 0.000 description 2
- 239000002250 absorbent Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 235000012489 doughnuts Nutrition 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000013519 translation Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a kind of chip transmission device, silicon chip transmission system and chip transmission methods, are related to solar energy technical field of processing equipment.The chip transmission device includes Transport Desk and external force mechanisms, and Transport Desk is used to the first silicon chip and the second silicon chip being successively transported to designated position；External force mechanisms are corresponding with the designated position, and can apply external force to first silicon chip for first reaching the designated position, so as to form the accommodation space for accommodating second silicon chip between first silicon chip and the Transport Desk.In the chip transmission device, the first silicon chip for first reaching designated position is detached under the force effect of external force mechanisms with Transport Desk, second silicon chip is transported by Transport Desk to accommodation space, so that the second silicon chip is located at the bottom of the first silicon chip, to realize stacking of the silicon chip in transportational process, facilitate the storage and processing of silicon chip.
Description
Technical field
The present invention relates to solar cell technical field of processing equipment more particularly to a kind of chip transmission device, silicon chip to pass
Defeated system and chip transmission method.
Background technology
In the processing of silicon chip, in order to meet different application demands, often need to silicon chip carrying out various chemistry
Processing, with popularizing for automated production, silicon chip can generally be transported to each processing stations by assembly line, and in order to improve life
Efficiency is produced, some processing workshop sections, which need a silicon chip being put into another silicon chip bottom, to be stacked, so as to following process, transport
Or storage.In the prior art, the stacking of silicon chip is generally realized by manpower, it is not only time-consuming and laborious, stack efficiency it is low, be unfavorable for producing
It is industry, of high cost, and be easy to lead to wafer contamination or breakage because of misoperation.Therefore, there is an urgent need for a kind of novel silicon chip biographies
Defeated device solves the above problems.
Invention content
Can be that silicon chip stacks in transmission process an object of the present invention is to provide a kind of chip transmission device,
Convenient for the following process of silicon chip, transport and storage.
For this purpose, the present invention uses following technical scheme：
A kind of chip transmission device, including：
Transport Desk, for the first silicon chip and the second silicon chip to be successively transported to designated position；And
External force mechanisms, it is corresponding with the designated position, and can be to first reaching first silicon chip of the designated position
Apply external force, so as to form the accommodation space for accommodating second silicon chip between first silicon chip and the Transport Desk.
Wherein, the external force mechanisms exert a force to first silicon chip using intermittent force mechanism.
Wherein, the external force mechanisms stop force after second silicon chip enters the accommodation space, so that described the
One silicon chip and second silicon chip are least partially overlapped.
Wherein, the external force mechanisms include air blowing component or getter assembly.
Wherein, when the external force mechanisms include the air blowing component, the air blowing component is located under the designated position
Side；When the external force mechanisms include getter assembly, the getter assembly is located at the top of the designated position.
Wherein, the chip transmission device further includes position limiting structure, and the position limiting structure corresponds to the designated position.
Wherein, the chip transmission device further includes accommodating mechanism, and the accommodating mechanism corresponds to the designated position, described
Accommodating mechanism is internally provided with position limiting structure.
Wherein, the position limiting structure includes the upper limit part being correspondingly arranged up and down, lower limit part and is arranged on described
Side board between locating part and the lower limit part.
Wherein, the distance between the upper limit part and the lower limit part are at least first silicon chip and described second
The sum of thickness of silicon chip.
Wherein, the air blowing component includes gas hole, air duct and air blower, and the air blower connects the air duct, institute
It states air duct and is connected to the gas hole.
Wherein, the gas hole is located at Transport Desk lower section or the Transport Desk surface.
Wherein, the gas hole is a plurality of, and a plurality of gas holes are distributed in first silicon chip close to described the
The entering bit end of two silicon chips.
Wherein, the gas hole is a plurality of, and a plurality of gas holes are distributed in the two of the first silicon chip center line
Side.
Wherein, the getter assembly includes：
Sucker, the first fixed frame and vacuum extractor, machine of first fixed mount setting in the chip transmission device
On frame, the vacuum extractor is arranged on fixed frame, and the vacuum extractor connects the sucker, and the sucker is described in
Transport Desk is arranged.
Wherein, the sucker can the relatively described rack slide up and down and/or along silicon chip transporting direction slide.
Wherein, the external force mechanisms include clamp assemblies.
Wherein, when the external force mechanisms include clamp assemblies, the clamp assemblies, which are located at, reaches the of the designated position
At least one side of one silicon chip, and both horizontally and vertically having certain degree of freedom.
Wherein, the clamp assemblies include clamping jaw, the second fixed frame and sliding equipment, and second fixed mount setting exists
In the rack for stating chip transmission device, the sliding equipment is arranged on second fixed frame, and the sliding equipment connects institute
State clamping jaw.
Wherein, the sliding equipment includes horizontal slide and vertical sliding assembly, the horizontal slide installation
In on second fixed frame, horizontal slide is connect with the vertical sliding assembly, the vertical sliding assembly with it is described
Clamping jaw connects.
Wherein, the Transport Desk includes a conveying track.
Wherein, the designated position is located at the transit terminal of the conveying track.
Wherein, the transit terminal of the conveying track further includes telescopic platform.
Wherein, the Transport Desk includes two rectangular conveying tracks.
Wherein, the designated position is located at the intersection of two conveying track extending directions.
Wherein, the transit terminal of at least one conveying track includes telescopic platform in two conveying tracks.
Can be silicon chip heap in transmission process it is another object of the present invention to propose a kind of silicon chip transmission system
It is folded, it is convenient for the storage and processing of silicon chip.
For this purpose, the present invention uses following technical scheme：
A kind of silicon chip transmission system, including control system further include chip transmission device as described above, the control system
System is connect with the Transport Desk and the external force mechanisms respectively.
Wherein, the control system includes PLC control system and sensing device, and the sensing device corresponds to the specific bit
Set, the position for detecting first silicon chip, the PLC control system respectively with the sensing device, the Transport Desk and
The external force mechanisms connection.
Another object of the present invention is to propose a kind of chip transmission method, can be silicon chip heap in transmission process
It is folded, it is convenient for the storage and processing of silicon chip.
For this purpose, the present invention uses following technical scheme：
A kind of chip transmission method, includes the following steps：
First silicon chip, the second silicon chip are placed on Transport Desk, and transported to designated position；
The first silicon chip to first reaching designated position exerts a force, and so that it is detached from Transport Desk in whole or in part, in the first silicon chip
Accommodation space is formed between Transport Desk；
Second silicon chip is transported into the accommodation space, and below the first silicon chip.
Wherein, the first silicon chip stress is intermittent stress.
Wherein, start stress when first silicon chip reaches designated position, second wafer sections or fully enter appearance
Receive space when, first silicon chip stops stress and is simultaneously superimposed upon on the second silicon chip.
Wherein, the first silicon chip stress comes from the gas of air blowing component blowout.
Wherein, start to blow when first silicon chip reaches designated position, second wafer sections enter accommodation space
When, stop blowing.
Wherein, the first silicon chip stress comes from getter assembly.
Wherein, first silicon chip and the second silicon chip are successively transported to designated position on same conveying track.
Wherein, the designated position is located at the transit terminal of the conveying track.
Wherein, first silicon chip and the second silicon chip are located on two orthogonal conveying tracks and with successively suitable
Sequence reaches the designated position, and the designated position is located at the intersection of two conveying track extending directions.
Wherein, first silicon chip and the second silicon chip are stacked in specified location, and enter accommodating mechanism, the receipts
It is vertically movable to receive mechanism, carries out multiple-unit storage.
Advantageous effect：The present invention provides a kind of chip transmission device, silicon chip transmission system and chip transmission methods.The silicon
In piece transmitting device, the first silicon chip for first reaching designated position is detached to form appearance with Transport Desk under the force effect of external force mechanisms
Receive the accommodation space of the second silicon chip, the second silicon chip is transported by Transport Desk to accommodation space so that the second silicon chip is located at first
The bottom of silicon chip facilitates following process, transport and the storage of silicon chip to realize stacking of the silicon chip in transportational process.
Description of the drawings
Fig. 1 is the structural schematic diagram of the gaily decorated basket and silicon chip that the embodiment of the present invention 1 provides；
Fig. 2 is structure when air blowing component exerts a force to the first silicon chip in the silicon chip transportation system that the embodiment of the present invention 1 provides
Schematic diagram；
Fig. 3 is structure when the first silicon chip and the second silicon chip stack in the silicon chip transportation system that the embodiment of the present invention 1 provides
Schematic diagram；
Fig. 4 is the part-structure schematic diagram for the silicon chip transportation system that the embodiment of the present invention 1 provides；
Fig. 5 is the structural schematic diagram for the Transport Desk that the embodiment of the present invention 1 provides；
Fig. 6 is the part-structure schematic diagram for the silicon chip transportation system that the embodiment of the present invention 2 provides；
Fig. 7 is structure when getter assembly exerts a force to the first silicon chip in the silicon chip transportation system that the embodiment of the present invention 3 provides
Schematic diagram；
Fig. 8 is structure when the first silicon chip and the second silicon chip stack in the silicon chip transportation system that the embodiment of the present invention 3 provides
Schematic diagram；
Fig. 9 is the structural schematic diagram for the getter assembly that the embodiment of the present invention 3 provides；
Figure 10 is the structural schematic diagram for the sucker that the embodiment of the present invention 3 provides；
Figure 11 is the structural schematic diagram for the clamp assemblies that the embodiment of the present invention 4 provides.
Wherein：
1, Transport Desk；11, transmission frame；12, the first belt component；121, the first belt；122, the first belt pulley；21, it stretches
Contracting platform；22, the second belt component；221, the second belt；222, the second belt pulley；3, air blowing component；31, gas hole；32, wind
Road；33, air blower；4, getter assembly；41, sucker；411, adsorption hole；421, first support；4211, strip hole；422, second
Holder；5, clamp assemblies；51, clamping jaw；52, vertical sliding assembly；53, horizontal slide；54, clamping jaw fixed frame；6, the gaily decorated basket；
61, side plate；62, side supports bar；621, latch；63, bottom supporting rod；7, silicon chip.
Specific implementation mode
For make present invention solves the technical problem that, the technical solution that uses and the technique effect that reaches it is clearer, below
The technical solution further illustrated the present invention in conjunction with attached drawing and by specific implementation mode.
Embodiment 1
A kind of silicon chip transmission system is present embodiments provided, which can be applied to solar cell preparation
During, such as in process for etching, for transporting silicon chip 7, and the silicon chip 7 in transportational process can be stacked, to facilitate silicon
The storage or processing of piece 7.
Silicon chip transmission system includes chip transmission device and control assembly.Chip transmission device includes rack, 1 and of Transport Desk
External force mechanisms.External force mechanisms and Transport Desk 1 can be installed in rack.Transport Desk 1 can be used for carrying silicon chip 7, and by the
One silicon chip and the second silicon chip are successively transported to specified location, to be stacked.External force mechanisms are corresponding with designated position, so as to energy
Enough the first silicon chips to first reaching designated position apply external force, and the second silicon is accommodated so as to be formed between the first silicon chip and Transport Desk 1
The accommodation space of piece.
Specifically, the silicon chip 7 for first reaching designated position is the first silicon chip, and the rear silicon chip 7 for reaching designated position is the second silicon
Piece.Since external force mechanisms exert a force to the first silicon chip, the mode that interval may be used in external force mechanisms exerts a force to the first silicon chip,
After some or all of first silicon chip is detached from Transport Desk 1, the second silicon chip transports under the action of Transport Desk 1 to the first silicon chip
In the accommodation space formed with Transport Desk 1, external force mechanisms stop force later, and the first silicon chip falls, and at least partly with second
Silicon chip is overlapped.
In the present embodiment, external force mechanisms may include air blowing component 3.Air blowing component 3 can be located at and reach designated position
Lower section a part or whole part of the first silicon chip is lifted up to generating air-flow from bottom to top.
During the first silicon chip lifts, to avoid the first silicon chip from deviateing designated position, chip transmission device can be with
Including position limiting structure, position limiting structure corresponds to designated position setting, to limit the first silicon chip and second for being sent to designated position
The position of silicon chip avoids the first silicon chip or the second silicon chip from deviateing, is conducive to transport and the stacking of silicon chip 7.
Specifically, position limiting structure may include the upper limit part being correspondingly arranged up and down, lower limit part and be arranged in the upper limit
Side board between position part and lower limit part.Upper limit part, lower limit part and side board, which can enclose to set to be formed, accommodates silicon chip 7
Space.Upper limit part can be connected to the top surface of the first silicon chip, and the first silicon chip of limitation moves up distance；Lower limit part is located at
The lower section of first silicon chip, after the second silicon chip is transported to accommodation space, lower limit part is abutted with the bottom surface of the second silicon chip, from below
Limit the position of silicon chip 7；It (can be mutual that side board can be abutted at least two sides of the first silicon chip and the second silicon chip
Parallel two sides can also be 7 three sides in orthogonal two sides or silicon chip), by upper limit part, under
Locating part and side board can limit the position of silicon chip 7, realize that the first silicon chip and the second silicon chip are stacked without departing from transporter
To.
Enter accommodation space for convenience of the second silicon chip, so as to positioned at the lower section of the first silicon chip, upper limit part and lower limit part
The distance between not less than the first silicon chip and the second silicon chip thickness and.
In the present embodiment, silicon chip transmission system can also include accommodating mechanism, and accommodating mechanism can correspond to specific bit and install
It sets, to be stored in the transport to accommodating mechanism of silicon chip 7.Optionally, the first silicon chip and the second silicon chip can be in transportational processes
It stacks, can also be first to transport to accommodating mechanism so that the first silicon chip and the second silicon chip after stacking in transport to accommodating mechanism
It is overlapped in accommodating mechanism.When the first silicon chip and silicon chip 7 are overlapped in accommodating mechanism, accommodating mechanism includes above-mentioned limit knot
Structure.
In the present embodiment, Transport Desk 1 includes a conveying track, and the first silicon chip and the second silicon chip are successively transported by same
Defeated track reaches designated position, and designated position can be located at the transit terminal of conveying track.Position limiting structure can be set to transport
The transit terminal of track, side board can be abutted at least two orthogonal sides of the first silicon chip and the second silicon chip,
By upper limit part, lower limit part and side board, realize that the first silicon chip and the second silicon chip stack neatly.In the fortune of conveying track
Defeated terminal can also be correspondingly arranged accommodating mechanism, and the first silicon chip and the second silicon chip for being conducive to heap poststack enter in accommodating mechanism, or
Person stacks in including above-mentioned position limiting structure accommodating mechanism.
In the present embodiment, accommodating mechanism can be the gaily decorated basket 6, and the transit terminal of conveying track can extend into the gaily decorated basket 6,
So that the first silicon chip and the second silicon chip stack in the gaily decorated basket 6.As shown in Figure 1, the gaily decorated basket 6 can be placed vertically, two sides of the gaily decorated basket 6
Plate 61 is setting up and down, and latch 621 is both provided on side supports bar 62 and bottom supporting rod 63, and adjacent two latches 621 divide
Not Wei upper limit part and lower limit part, form card slot between upper limit part and lower limit part, side supports bar 62 and bottom support
Bar 63 can be side board.Silicon chip 7 is horizontal to be sent into the gaily decorated basket 6, and adjacent two latches 621 can be placed with two silicon chips 7.
As shown in Figures 2 and 3, when transporting silicon chip 7, two silicon can be conveyed into two adjacent latches 621 successively
Piece 7, and after first silicon chip 7 enters in card slot, air blowing component 3 starts, the first silicon chip stress under the action of air blowing component 3
It moves up so that the accommodation space for accommodating the second silicon chip is formed between the latch 621 below the first silicon chip and card slot；It transports later
Defeated track continues to transport the second silicon chip into the gaily decorated basket 6, and after being at least partially extend into accommodation space of the second silicon chip 7, blows
Pneumatic module 3 stops blowing, and the first silicon chip falls under the effect of gravity, and the first silicon chip is at least partly Chong Die with the second silicon chip.
Finally, conveying track can work on so that for the second silicon chip completely into card slot, the first silicon chip and the second silicon chip complete heap
It is folded.In the transmission and stacking process of the first silicon chip and the second silicon chip, the bottom supporting rod 63 and side supports bar 62 of the gaily decorated basket 6 can
Think that silicon chip 7 limits, ensures that two card silicon chips 7 stack neatly.
After being accommodated with two silicon chip 7 between two adjacent latches 621, the gaily decorated basket 6 can be moved in vertical direction so that
The transit terminal of conveying track is corresponding with the position of next card slot of the gaily decorated basket 6, to input silicon chip 7 into the gaily decorated basket 6 to continuation.?
Can also be that the gaily decorated basket 6 remains stationary as after being stacked with two silicon chip 7 in a card slot in other embodiment, the transport of silicon chip 7 system
Transport Desk 1 in system moves up and down, so that silicon chip 7 is opposite with next card slot.
As shown in figure 4, the transit terminal of conveying track can also include telescopic platform 21, telescopic platform 21 connects with conveying track
It connects, and can be flexible along the transporting direction of conveying track, to accept the silicon chip 7 on conveying track, and silicon chip 7 is continued to be fed into
In the gaily decorated basket 6.The width of telescopic platform 21 is less than the width that the gaily decorated basket 6 is open, so that telescopic platform 21 can smoothly enter into the gaily decorated basket 6.
Telescopic platform 21 can latch 621 parallel with the latch 621 of the lower end of corresponding card slot or a little higher than lower end so that silicon
Between piece 7 can smoothly enter into two latches 621 up and down, to improve the precision of the transport of silicon chip 7,7 fragment rate of silicon chip is reduced.To ensure
Silicon chip 7 enters the stability during card slot, and the end of telescopic platform 21 can extend into the center of the gaily decorated basket 6.
V belt translation, chain drive or idler wheel drive belt configuration may be used in conveying track.As shown in figure 5, in the present embodiment, fortune
Defeated track transmits silicon chip 7 using belt transmission structure comprising 121 component 12 of transmission frame 11 and the first belt.Wherein, the first skin
121 component 12 of band includes the first belt 121 and two the first belt pulleys 122, and one is the first master in two the first belt pulleys 122
Driving wheel, another is the first driven wheel.First belt pulley 122 is rotatably assorted with transmission frame 11, and the first belt 121 is wound on two
On one belt pulley 122, the rotation of the first driving wheel drives the rotation of the first driven wheel, to drive the rotation of the first belt 121, so as to reality
The transport of existing silicon chip 7.The width of conveying track can be adapted with the width of silicon chip 7, to improve carrying, to transport silicon chip 7
Stability.
During so that silicon chip 7 is sent to telescopic platform 21 by conveying track, uniform force, telescopic platform 21 can opposite fortune
The center line symmetrical setting of defeated track.The both sides of telescopic platform 21 are correspondingly arranged on 121 component of transmission frame 11 and the first belt respectively
12,121 component 12 of the first belt is correspondingly arranged on each transmission frame 11.Two 121 components 12 of the first belt respectively with silicon
The both sides of piece 7 coordinate, and improve the stationarity of chip transmission.
To enable the silicon chip 7 on telescopic platform 21 completely into in the gaily decorated basket 6, the second belt is additionally provided on telescopic platform 21
Component 22.Specifically, the second belt component 22 includes the second belt 221 and two the second belt pulleys 222, the second belt pulley 222
It is rotatablely connected with telescopic platform 21.One is the second driving wheel in two the second belt pulleys 222, another is the second driven wheel, the
Two driving wheels and the second driven wheel are respectively arranged at telescopic platform 21 along the both ends that 7 transporting direction of silicon chip is arranged, the second driving wheel energy
It is enough driven and is rotated by driving part.When transporting silicon chip 7, telescopic platform 21 stretches into the gaily decorated basket 6, at this time the silicon chip 7 on telescopic platform 21
It is at least partially disposed in card slot.Start the second belt component 22 later, the second driving wheel is rotated by driving part, band
Dynamic second driven wheel and the rotation of the second belt 221, to drive silicon chip 7 to move so that the silicon chip 7 on telescopic platform 21 is fully inserted into
Into card slot.Wherein, driving part can be motor.
In order to ensure uniform force in 7 transmit process of silicon chip, it can be arranged that there are two the second belt components on telescopic platform 21
22, the center symmetric setting of two 22 relative telescopic platforms 21 of the second belt component, can to avoid silicon chip 7 in transmission process position
It shifts.
In the present embodiment, external force mechanisms include air blowing component 3, and the air-flow generated by air blowing component 3 makes first silicon
Piece 7 is suspended in card slot.Specifically, gas hole 31 can be provided on telescopic platform 21, air blowing component 3 includes air duct 32 and and wind
The air blower 33 that road 32 connects, air duct 32 is connected to gas hole 31.After the first silicon chip is sent in card slot, air blowing component 3 opens
Dynamic, the air-flow that air blower 33 generates passes sequentially through air duct 32 and gas hole 31 acts on the first silicon chip, thus will be in card slot
First silicon chip blows and makes its suspension.
A plurality of gas holes 31 can be provided on telescopic platform 21, a plurality of gas holes 31 can be distributed in the first silicon chip and lean on
The entering bit end of nearly second silicon chip so that the first silicon chip at least entering bit end is lifted up under the action of air-flow, so as to telescopic platform
21 form accommodation space.Optionally, a plurality of gas holes 31 can be in multiple rows of distribution, and a plurality of gas holes 31 can symmetrically divide
Cloth advantageously ensures that the first silicon chip uniform force in the both sides of the first silicon chip center line.
In the present embodiment, it is provided with two rows of gas holes 31 on telescopic platform 21, often arranges transport of the gas hole 31 along vertical silicon chip 7
Direction is arranged, and can increase the contact area of air-flow and silicon chip 7 by the way that two rows of blow is arranged, to make silicon chip 7 be lifted up
Distance disclosure satisfy that the insertion of the second silicon chip, additionally it is possible to so that silicon chip 7 is more uniformly stressed, and steadily rise, avoid the first silicon
It is interfered between piece and the second silicon chip.In other embodiments, a row, three rows or four rows can also be arranged in gas hole 31, often
It can also be able to be in other modes distribution along the distribution of the direction of insertion of silicon chip 7 or multiple gas holes 31 to arrange gas hole 31, such as
Circle, triangle etc. are not particularly limited the number and arrangement mode of gas hole 31 in the present embodiment.
In other embodiments, gas hole 31 can also be arranged on conveying track or the lower section of conveying track.Work as air blowing
Hole 31 is arranged at the lower section of conveying track, and the vacancy section that gas hole 31 can be formed between two transmission frames 11 is corresponding to be set
It sets, so that air-flow is contacted with the first silicon chip.
Since the thickness of silicon chip 7 is generally 180 μm, the width of card slot is generally 4.2mm, considers the thickness of silicon chip 7
And the width of card slot, the air-flow that air blowing component 3 generates ensure that the first silicon chip is lifted up 2-3mm, such as 2mm,
2.1mm,2.2mm,2.3mm,2.4mm,2.5mm,2.6mm,2.7mm,2.8mm,2.9mm,3mm.In the present embodiment, the first silicon chip
Selection is lifted up 2mm.
In order to avoid air-flow is excessive to the power of silicon chip 7 so that the problems such as fragment occurs in silicon chip 7, and the diameter of gas hole 31 can
Think 0.8-1.5mm, such as can be 0.8mm, 0.9mm, 1.0mm, 1.1mm, 1.2mm, 1.3mm, 1.4mm, 1.5mm.This reality
It applies in example, the diameter of gas hole 31 is chosen for 1.0mm.
To enable Transport Desk 1 and external force mechanisms preferably to cooperate, control assembly includes PLC control system and induction
Device, PLC control system are electrically connected with Transport Desk 1, air blowing component 3 and sensing device respectively, and control assembly is according to sensing device
The start and stop of signal the control Transport Desk 1 and external force mechanisms of feedback, so that the two preferably coordinates the transport for completing silicon chip 7.Specifically
Ground, solenoid valve is provided on air duct 32, and control assembly passes through the start and stop for the open and close control air blowing component 3 for controlling solenoid valve.
Sensing device is used to detect the transmission location of the first silicon chip, lifts the first silicon chip to control the work of air blowing component 3
It rises, to facilitate the second silicon chip to be inserted into, the first silicon chip is avoided to be interfered with the second silicon chip.Optionally, sensing device can be set
It is placed on the lower section or telescopic platform 21 of telescopic platform 21, sensing device can be incuded by contact or the contactless senses such as photo-electric
The position of the first silicon chip should be detected.By taking photoelectric sensor as an example, sensor can be set to the lower section of telescopic platform 21, when first
The end-transfer of silicon chip to sensor underface when, the effects that due to silicon chip 7 to the refraction of light, reflection, sensor receives
To optical signal will change, to judge the first silicon chip reach designated position, by sensor to control assembly transmission letter
Number, i.e. controllable 3 work of air blowing component of control assembly.
To ensure that the second silicon chip is smoothly inserted into, the second silicon chip is blown when being inserted between the first silicon chip and telescopic platform 21
The air-flow that component 3 generates is not contacted with the second silicon chip, prevents the second silicon chip from being interfered with the first silicon chip under the action of air-flow,
To avoid silicon chip 7 from colliding with damage.After the second wafer sections are inserted into the gap of the first silicon chip and card slot, control assembly control
Air blowing component 3 is closed, and the second belt component 22 works on, until the second silicon chip is completely inserted into card slot.In the present embodiment,
After a quarter of second silicon chip is overlapped with the first silicon chip, air blowing component 3 is stopped.
In the present embodiment, the factor designs such as the transmission speed of silicon chip 7, the size of silicon chip 7, the depth of the gaily decorated basket 6 are considered
The distributing position of gas hole 31 and the start-stop time of air blowing component 3.Specifically, it by taking the depth of the gaily decorated basket 6 is 160mm as an example, stretches
The depth that contracting platform 21 stretches into the gaily decorated basket 6 is 80mm, and the distance between two rows of gas holes 31 and the end of telescopic platform 21 are respectively 20mm
And 50mm.
In addition, control assembly can also include control panel, it is provided with select button on control panel, passes through select button
It can select whether silicon chip transmission system carries out stacking the operation of silicon chip 7 during transmitting silicon chip 7.
The specific work process of 7 transportation system of silicon chip is as follows in the present embodiment：
The transit terminal of Transport Desk 1 is corresponding with corresponding groove position in the gaily decorated basket 6, to transport silicon chip 7 into the gaily decorated basket 6.
21 relative transport frame 11 of telescopic platform slides, to stretch into the gaily decorated basket 6.First belt, 121 component 12 works, and makes the first chip transmission
After on to telescopic platform 21, the second belt component 22 work so that the first silicon chip is completely into in card slot.Sensing device senses
First silicon chip reaches designated position, sends electric signal to PLC control system, after PLC control system receives electric signal, control is blown
Pneumatic module 3 works so that the first silicon chip moves up.During this, the second silicon chip is under the action of 121 component 12 of the first belt
It is delivered on telescopic platform 21, when the second silicon chip is when being inserted partially into accommodation space, for the air-flow for avoiding air blowing component 3 from generating
It influences the second silicon chip normally to convey, air blowing component 3 is closed after the 0.3s that works, and the second silicon chip about a quarter stretches into first at this time
It between silicon chip and card slot, is overlapped with the first silicon chip, the first silicon chip falls overlay on the second silicon chip under the effect of gravity；Second skin
Band component 22 works on, and drives the second silicon chip completely into in card slot.After two silicon chips 7 are inserted into card slot, telescopic platform 21
11 reverse slide of relative transport frame is to withdraw out of the gaily decorated basket 6, and the gaily decorated basket 6 is with respect to the movement of 7 transport device of silicon chip, so as to next card slot
Interior conveying silicon chip 7.
In above-mentioned steps, first the silicon chip 7 can also be sent to by 121 component 12 of the first belt on telescopic platform 21
Afterwards, telescopic platform 21 slides again extend into the gaily decorated basket 6.
Using silicon chip transmission system provided in this embodiment, silicon chip 7 can be stacked in designated position, facilitate the storage of silicon chip 7
It deposits and uses, and silicon chip 7 is transported into containers such as the gailys decorated basket 6 using above-mentioned silicon chip transmission system, it can be by the conevying efficiency of silicon chip 7
4800 per hour are promoted to by 4000 per hour, fragment rate can be reduced to 0.02% by 0.05%.
The present embodiment additionally provides a kind of chip transmission method, which can be applied to solar cell preparation
In the process, such as in process for etching, for transporting silicon chip 7, and the silicon chip 7 in transportational process can be stacked, to be transmitted to
In container.
Specifically, the first silicon chip and the second silicon chip are placed on Transport Desk 1, and are transported to designated position.To first reaching
The first silicon chip force power of designated position so that the Transport Desk 1 for being detached from carrying in whole or in part, transporting silicon chip 7 of the first silicon chip,
So that forming the accommodation space for accommodating the second silicon chip between the first silicon chip and Transport Desk 1, it is empty that the second silicon chip is sent into receiving
In, to make the first silicon chip at least partly ride on the second silicon chip, the first silicon chip of realization is stacked with the second silicon chip.Wherein,
First silicon chip refers to the silicon chip 7 first transported on Transport Desk 1 to designated position, and the second silicon chip refers to reaching finger after the first silicon chip
Position the silicon chip 7 set.
In the present embodiment, the first silicon chip and the second silicon chip successively reach designated position by same conveying track, due to
First silicon chip and the second silicon chip are sequentially delivered to designated position, and therefore, the stress of the first silicon chip can be intermittent stress, i.e., and the
After one silicon chip reaches designated position, the first silicon chip starts stress, when the second wafer sections or when fully entering accommodation space, first
Silicon chip stops stress, so that the first silicon chip and the second silicon chip are least partially overlapped, and the transport of the second silicon chip of external force pair is avoided to produce
It is raw to influence.In the present embodiment, the stress of the first silicon chip may come from the gas that air blowing component 3 is blown out upwards, will by gas
First silicon chip jacks up.
Heap poststack occurs in designated position in the first silicon chip and the second silicon chip, the first silicon chip and the second silicon chip, which can enter, to be received
It receives in mechanism.Accommodating mechanism is correspondingly arranged on multiple card slots, and the first silicon chip and the second silicon chip can be stored in each card slot.When
After one silicon chip and the second silicon chip enter in a card slot of accommodating mechanism, accommodating mechanism can vertically move, mostly single to carry out
The storage of member.
Embodiment 2
Present embodiments provide a kind of silicon chip transmission system and the silicon chip transmission system in method, with embodiment 1 and side
Method is roughly the same, unlike embodiment 1, as shown in fig. 6, in the present embodiment Transport Desk 1 include two conveying tracks, two
Conveying track can be arranged at an angle, and the intersection of two conveying track extended lines is the finger for carrying out silicon chip 7 and stacking
Positioning is set.In the present embodiment, the angle of two conveying tracks is rectangular, and the transit terminal of two conveying tracks crosses.
Specifically, two articles of conveying tracks be respectively convey the first track of the first silicon chip and for conveying the second silicon chip the
Two tracks.After the first silicon chip is by the first orbit transports to designated position, external force mechanisms start to exert a force to the first silicon chip so that
First silicon chip moves up.Later, the second silicon chip passes through the second rail transport to specified location.External force mechanisms stop force
Afterwards, the first silicon chip and the second silicon chip stack.
In the present embodiment, one transit terminal in the first track and the second track can be provided with expansion plate.To stretch
For contracting plate is connect with the second track, the first track is not less than expansion plate, the optional a little higher than expansion plate of first track.First rail
After road conveys the first silicon chip to transit terminal, the first silicon chip is fallen on expansion plate.Gas hole 31 can be arranged on expansion plate, the
After one silicon chip is lifted under the action of air blowing component 3 by air-flow, the second silicon chip is delivered on expansion plate by the second track so that the
One silicon chip and the second silicon chip stack.
In other embodiments, designated position can be provided with adapting table, and adapting table is located in accommodating mechanism, and adapting table
Surface not higher than groove lower end latch 621 upper surface.Gas hole 31 is arranged on adapting table.First track and the second rail
The transit terminal in road is connect with adapting table.The transit terminal of first track and the second track can be both provided with telescopic platform 21, stretch
Contracting platform 21 connect with adapting table after stretching out or above adapting table, and telescopic platform surface is not less than the lower end latch 621 of groove
Upper surface.Optionally, the transit terminal of a track is provided with telescopic platform 21 in the first track and the second track, and telescopic platform 21 is stretched
It is connect with adapting table after going out.
Silicon chip 7 is sent into accommodating mechanism for convenience of two conveying tracks, accommodating mechanism is only arranged on adjacent both sides
There is position limiting structure.
Embodiment 3
Present embodiments provide a kind of silicon chip transmission system and silicon chip transmission system in method, with above-described embodiment and
Method is roughly the same, and unlike above-described embodiment, the external force mechanisms in the present embodiment include getter assembly 4.
Specifically, as shown in Figure 7 and Figure 8, getter assembly 4 can be located at the top for the first silicon chip for reaching designated position,
So that getter assembly 4 applies upward adsorption capacity and the first silicon chip and Transport Desk 1 by the first silicon chip of upper direction of the first silicon chip
It is detached from the accommodation space for being formed and accommodating the second silicon chip.After the second silicon chip is at least partially into accommodation space, getter assembly 4 stops
It only works so that the first silicon chip is fallen under the effect of gravity, is stacked with the second silicon chip.
As shown in figure 9, getter assembly 4 includes the first fixed frame, sucker 41 and vacuum extractor (not shown).The
One fixed frame can be connect with the rack of chip transmission device, and sucker 41 and vacuum extractor can be fixed on the first fixed frame
On, vacuum extractor is connect with sucker 41, and sucker 41 is arranged towards Transport Desk 1.Wherein, the first fixed frame can be L-type structure,
Including the first support 421 being vertically arranged and horizontally disposed second support 422, first support 421 is connect with rack, second
Frame 422 is stretched out to the direction of designated position, and sucker 41 is fixed in second support 422, and is oppositely arranged with Transport Desk 1.It takes out true
Empty device is connected to by pipeline with sucker 41, and the silicon chip 7 on Transport Desk 1 is adsorbed onto on sucker 41 by air suction.
In order to adjust sucker 41 at a distance from the first silicon chip, to ensure that sucker 41 can adsorb the first silicon chip, the
One holder 421 can be slided up and down with respect to rack, so as to adjust the spacing of sucker 41 and the first silicon chip.Specifically, first support
It is provided with the strip hole 4211 being arranged along short transverse on 421, threaded hole is provided in rack, after screw passes through strip hole 4211
Coordinate with threaded hole, the first fixed frame is fixed on the rack.By adjusting the relative position of strip hole 4211 and threaded hole,
The distance between sucker 41 and the first silicon chip can be adjusted.
Optionally, sucker 41 rack can also be slided along the transporting direction of silicon chip relatively, to complete the receipts to silicon chip 7
After receiving, by sucker 41 by extraction in the gaily decorated basket 6.Specifically, second support 422 can be telescopic rod, pass through stretching for second support 422
Contracting, can drive sucker 41 to be moved along the transporting direction of silicon chip, to make sucker 41 can extend into the gaily decorated basket 6 or from the gaily decorated basket 6
Interior withdrawal.In addition, sucker 41 stretches into the gaily decorated basket 6 or interior withdraw of the gaily decorated basket 6 can also be by second support 422 with respect to first support again
421 slidings are realized.Can be provided with the sliding eye extended along silicon chip transporting direction in second support 422, first support 421 it is upper
End is provided with threaded hole, and screw coordinates after passing through sliding eye with threaded hole, can be with by adjusting position of the screw in sliding eye
Adjust the extension elongation of sucker 41.Sliding eye is identical as above-mentioned strip pore structure and function herein, and details are not described herein again.
In other embodiments, sucker 41 can be on the basis of can slide up and down with respect to rack, also can be with respect to rack
Transporting direction along silicon chip 7 slides.
In other embodiments, sucker can also pass through sliding-rail sliding etc. along transporting direction and the upper and lower directions sliding of silicon chip
It realizes.Specifically, first support 421 is provided with the first sliding block, and first of the transporting direction setting along silicon chip is provided in rack
Sliding rail, the first sliding block and the cooperation of the first sliding rail realize that first support 421 along the sliding of the transport of silicon chip, is stretched to change sucker 41
Enter the depth in the gaily decorated basket 6.It is provided with the second sliding rail extended in the vertical direction in first support 421, is arranged in second support 422
There is the second sliding block coordinated with the second sliding rail, the sliding up and down with respect to first support 421 of second support 422 may be implemented, to
Realize the adjustment of 41 short transverse of sucker.
As shown in Figure 10, the bottom of sucker 41 is provided with multiple adsorption holes 411, and adsorption hole 411 is connected to pipeline.In order to keep away
The problem of exempting from the local pressure unevenness of silicon chip 7 and silicon chip 7 is caused to damage, multiple adsorption holes 411 are arranged in multiple donuts, and
Diameter is few compared with 411 quantity of adsorption hole on small annulus, and the quantity of adsorption hole 411 is more on the annulus being relatively large in diameter, and is conducive to silicon
7 uniform force of piece.
To avoid 41 adsorption capacity of sucker is excessive from causing silicon chip 7 broken, the diameter of adsorption hole 411 can be 0.6-1mm, such as
0.6mm,0.7mm,0.8mm,0.9mm,1.0mm.Pressure in sucker 41 can in 0.4-0.5Mpa, such as 0.4Mpa,
0.45Mpa, 0.5Mpa can either ensure that silicon chip 7 is picked up and be in suspended state, and be avoided that gas differential pressure is excessive and cause silicon chip
7 fragments.In the present embodiment, the diameter of adsorption hole 411 can be 0.8mm, sucker 41 pressure be 0.45Mpa.
The start and stop of absorbent module are controlled in order to facilitate control assembly, and trigger valve and hand-operated valve are also provided on pipeline,
Control assembly is electrically connected with pneumatic operated valve, the start and stop of the open and close control absorbent module by controlling pneumatic operated valve.By the way that hand-operated valve is arranged,
Manually air pressure can be finely adjusted, obtain better adsorption effect.
In the present embodiment, getter assembly 4 can also be used cooperatively with air blowing component 3, preferably ensure that first silicon chip 7 is outstanding
Floating stationarity.When exerting a force to the first silicon chip for reaching designated position, it can first start air blowing component 3 and lift the first silicon chip
After certain distance, restart getter assembly 4, reduce the distance between silicon chip 7 and getter assembly 4, is conducive to reduce getter assembly 4
Gas differential pressure when startup damages to further avoid silicon chip 7.
Unlike the method in above-described embodiment, the stress of the first silicon chip comes from chip transmission method in the present embodiment
In the adsorption capacity of getter assembly 4.The work step of getter assembly 4 is roughly the same with air blowing component 3, and details are not described herein again.
Embodiment 4
Present embodiments provide a kind of silicon chip transmission system and silicon chip transmission system in method, with above-described embodiment and
Method is roughly the same, and unlike above-described embodiment, external force mechanisms include clamp assemblies 5 in the present embodiment.Clamp assemblies 5
At least one side for the first silicon chip for reaching designated position can be located at, and clamp assemblies 5 both horizontally and vertically have
Certain degree of freedom.
When external force mechanisms need to exert a force to the first silicon chip, clamp assemblies 5 can be by moves vertically and horizontally, moving
To the side of the first silicon chip, and at least one side by the way that the first silicon chip is clamped is fixed with the first silicon chip, passes through clamping later
5 upward vertical movement of component drives the first silicon chip to be detached from Transport Desk 1.
As shown in figure 11, clamp assemblies 5 include clamping jaw 51, the second fixed frame and sliding equipment, the second fixed mount setting
In the rack of chip transmission device, sliding equipment setting is connect on the second fixed frame, and with clamping jaw 51.Sliding equipment can be with
Clamping jaw 51 is driven both horizontally and vertically to move, so that the first silicon chip is clamped in the side that clamping jaw 51 is moved to the first silicon chip.
To realize the degree of freedom both horizontally and vertically of clamping jaw 51, sliding equipment includes horizontal slide 53 and vertical
Slide assemblies 52.Horizontal slide 53 includes horizontal stand, and horizontal stand is connect with the second fixed frame.Vertical sliding assembly 52
Including vertical support frame, one end and the horizontal stand of vertical support frame are slidably connected, and clamping jaw 51 passes through clamping jaw fixed frame 54 and vertical branch
Frame connects, and clamping jaw fixed frame 54 can vertically be slided along vertical support frame.
Specifically, it can be provided with horizontally extending the first sliding groove on horizontal stand, be provided on vertical support frame
With the first sliding block of the first sliding groove cooperation.To realize sliding of first sliding block along the first sliding groove, can be provided in the first sliding groove
First leading screw, the first sliding block are connect with the first leading screw spiral, after driving the rotation of the first leading screw by motor, can drive the first cunning
Block is slided along the first sliding groove.
In other embodiments, the first sliding block can also be driven along the sliding of the first sliding groove by linear motor or cylinder.
It can be provided with the second sliding slot extended in the vertical direction on vertical support frame, clamp and be provided on fixed frame and second
Second sliding block of sliding slot cooperation.Second sliding block can be identical as the first sliding groove as the first sliding block with the cooperation of second sliding slot,
To be driven by leadscrew-nut mechanism, linear motor or cylinder, details are not described herein again.
It is contacted with the first silicon chip for convenience of clamp assemblies 5, at least clamped side of the first silicon chip can stretch out Transport Desk 1
Side outside, to be contacted with clamp assemblies 5.
In 5 course of work of clamp assemblies, first by clamping jaw 51 by moves vertically and horizontally, being moved to the side of the first silicon chip
Side, ensure clamping jaw 51 opening be aligned with the side of the first silicon chip, rear clip-claw 51 pass through vertical support frame relative level holder
It is mobile, close to the first silicon chip so that after the side edge of the first silicon chip enters in the opening of clamping jaw 51, control assembly controls clamping jaw
51 are closed the first silicon chip of clamping, will pass through the sliding for clamping fixed frame Relative vertical holder, the first silicon chip are driven to move up.
Wherein, control assembly control clamping jaw 51 opens or closure is the technological means of comparative maturity in the prior art, herein no longer in detail
It introduces.
After the second silicon chip is completely into accommodation space, the first silicon chip is stacked on the second silicon by the movement of slide assemblies direction
On piece.
The above content is only presently preferred embodiments of the present invention, for those of ordinary skill in the art, according to the present invention
Thought, there will be changes in the specific implementation manner and application range, and the content of the present specification should not be construed as to the present invention
Limitation.
Claims (32)
1. a kind of chip transmission device, which is characterized in that including：
Transport Desk (1), for the first silicon chip and the second silicon chip to be successively transported to designated position；And
External force mechanisms, it is corresponding with the designated position, and first silicon chip for first reaching the designated position can be applied
External force, so as to form the accommodation space for accommodating second silicon chip between first silicon chip and the Transport Desk (1).
2. chip transmission device as described in claim 1, which is characterized in that the external force mechanisms are using intermittent force mechanism
It exerts a force to first silicon chip.
3. chip transmission device as described in claim 1, which is characterized in that the external force mechanisms enter in second silicon chip
Stop force after the accommodation space, so that first silicon chip and second silicon chip are least partially overlapped.
4. chip transmission device as described in claim 1, which is characterized in that the external force mechanisms include air blowing component (3) or
Getter assembly (4).
5. chip transmission device as claimed in claim 4, which is characterized in that the external force mechanisms include the air blowing component
(3) when, the air blowing component (3) is located at the lower section of the first silicon chip of the designated position；The external force mechanisms include getter assembly
(4) when, the getter assembly (4) is located above the first silicon chip of the designated position.
6. chip transmission device as claimed in claim 5, which is characterized in that the chip transmission device further includes limit knot
Structure, the position limiting structure correspond to the designated position.
7. chip transmission device as claimed in claim 5, which is characterized in that the chip transmission device further includes storage machine
Structure, the accommodating mechanism correspond to the designated position, and the accommodating mechanism is internally provided with position limiting structure.
8. chip transmission device as claimed in claims 6 or 7, which is characterized in that the position limiting structure includes corresponding up and down sets
Upper limit part, lower limit part and the side board being arranged between the upper limit part and the lower limit part set.
9. chip transmission device as claimed in claim 8, which is characterized in that between the upper limit part and the lower limit part
Distance be at least the sum of the thickness of first silicon chip and second silicon chip.
10. chip transmission device as claimed in claim 5, which is characterized in that the air blowing component (3) includes gas hole
(31), air duct (32) and air blower (33), the air blower (33) connect the air duct (32), the air duct (32) be connected to
The gas hole (31).
11. chip transmission device as claimed in claim 10, which is characterized in that the gas hole (31) is located at the Transport Desk
(1) lower section or the Transport Desk (1) surface.
12. chip transmission device as claimed in claim 11, which is characterized in that the gas hole (31) is a plurality of, plural number
A gas hole (31) is distributed in entering bit end of first silicon chip close to second silicon chip.
13. chip transmission device as claimed in claim 11, which is characterized in that the gas hole (31) is a plurality of, plural number
A gas hole (31) is distributed in the both sides of the first silicon chip center line.
14. chip transmission device as claimed in claim 5, which is characterized in that the getter assembly (4) includes：
Sucker (41), the first fixed frame and vacuum extractor, machine of first fixed mount setting in the chip transmission device
On frame, the vacuum extractor is arranged on fixed frame, and the vacuum extractor connects the sucker (41), the sucker (41)
It is arranged towards the Transport Desk (1)；
The sucker (41) can the relatively described rack slide up and down and/or along silicon chip (7) transporting direction slide.
15. the chip transmission device as described in any one of claim 1-7,10-14, which is characterized in that the Transport Desk (1)
Including a conveying track.
16. chip transmission device as claimed in claim 15, which is characterized in that the designated position is located at the conveying track
Transit terminal.
17. chip transmission device as claimed in claim 16, which is characterized in that the transit terminal of the conveying track further includes
Telescopic platform (21).
18. the chip transmission device as described in any one of claim 1-7,10-14, which is characterized in that the Transport Desk (1)
Including two rectangular conveying tracks.
19. chip transmission device as claimed in claim 18, which is characterized in that the designated position is located at two transports
The intersection of track extending direction.
20. chip transmission device as claimed in claim 19, which is characterized in that at least one fortune in two conveying tracks
The transit terminal of defeated track includes telescopic platform (21).
21. a kind of silicon chip transmission system, including control system, which is characterized in that further include such as any one of claim 1-20
The chip transmission device, the control system are connect with the Transport Desk (1) and the external force mechanisms respectively.
22. silicon chip transmission system as claimed in claim 21, which is characterized in that the control system includes PLC control system
And sensing device, the sensing device correspond to the designated position, the position for detecting first silicon chip, the PLC controls
System processed is connect with the sensing device, the Transport Desk (1) and the external force mechanisms respectively.
23. a kind of chip transmission method, which is characterized in that include the following steps：
First silicon chip, the second silicon chip are placed on Transport Desk, and transported to designated position；
To first reach designated position the first silicon chip exert a force, so that it is detached from Transport Desk (1) in whole or in part, with the first silicon chip with
The second silicon chip accommodation space is formed between Transport Desk；
Second silicon chip is transported into accommodation space described in the second silicon chip, and below the first silicon chip.
24. chip transmission method as claimed in claim 23, which is characterized in that the first silicon chip stress be it is intermittent by
Power.
25. chip transmission method as claimed in claim 23, which is characterized in that first silicon chip is opened when reaching designated position
Beginning stress, second wafer sections or when fully entering accommodation space, first silicon chip stops stress and is simultaneously superimposed to second
On silicon chip.
26. chip transmission method as claimed in claim 23, which is characterized in that the first silicon chip stress comes from air blowing group
The gas of part (3) blowout.
27. chip transmission method as claimed in claim 26, which is characterized in that first silicon chip is opened when reaching designated position
Begin to blow, when second wafer sections enter accommodation space, stops blowing.
28. chip transmission method as claimed in claim 23, which is characterized in that the first silicon chip stress comes from air-breathing group
Part (4).
29. chip transmission method as claimed in claim 23, which is characterized in that first silicon chip and the second silicon chip are same
Designated position is successively transported on conveying track.
30. chip transmission method as claimed in claim 29, which is characterized in that the designated position is located at the conveying track
Transit terminal.
31. chip transmission method as claimed in claim 23, which is characterized in that first silicon chip and the second silicon chip distinguish position
In reaching on two orthogonal conveying tracks and sequentially the designated position, the designated position is located at two institutes
State the intersection of conveying track extending direction.
32. the chip transmission method as described in claim 29 or 31, which is characterized in that first silicon chip and the second silicon chip exist
Specified location stacks, and enters accommodating mechanism, and the accommodating mechanism is vertically movable, carries out multiple-unit storage.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810846002.0A CN108735642A (en) | 2018-07-27 | 2018-07-27 | A kind of chip transmission device, silicon chip transmission system and chip transmission method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810846002.0A CN108735642A (en) | 2018-07-27 | 2018-07-27 | A kind of chip transmission device, silicon chip transmission system and chip transmission method |
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| Publication Number | Publication Date |
|---|---|
| CN108735642A true CN108735642A (en) | 2018-11-02 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112325622A (en) * | 2020-11-05 | 2021-02-05 | 陈开琴 | Drying equipment with three-dimensional floating function and implementation method thereof |
| CN113036503A (en) * | 2021-03-23 | 2021-06-25 | 江苏美勒家具科技有限公司 | Desktop socket structure |
| CN116008596A (en) * | 2022-12-02 | 2023-04-25 | 苏州锐杰微科技集团有限公司 | FT detection device for circuit board and chip packaging technology |
-
2018
- 2018-07-27 CN CN201810846002.0A patent/CN108735642A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112325622A (en) * | 2020-11-05 | 2021-02-05 | 陈开琴 | Drying equipment with three-dimensional floating function and implementation method thereof |
| CN112325622B (en) * | 2020-11-05 | 2021-12-14 | 苏州许本科技有限公司 | Drying equipment with three-dimensional floating function and implementation method thereof |
| CN113036503A (en) * | 2021-03-23 | 2021-06-25 | 江苏美勒家具科技有限公司 | Desktop socket structure |
| CN116008596A (en) * | 2022-12-02 | 2023-04-25 | 苏州锐杰微科技集团有限公司 | FT detection device for circuit board and chip packaging technology |
| CN116008596B (en) * | 2022-12-02 | 2023-11-28 | 苏州锐杰微科技集团有限公司 | FT detection device for circuit board and chip packaging technology |
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