CN215896324U

CN215896324U - Silicon chip suction transfer mechanism

Info

Publication number: CN215896324U
Application number: CN202122145293.0U
Authority: CN
Inventors: 陈国锋; 张青松
Original assignee: Suzhou Zhuoying Automation Equipment Co ltd
Current assignee: Suzhou Zhuoying Automation Equipment Co ltd
Priority date: 2021-09-06
Filing date: 2021-09-06
Publication date: 2022-02-22
Anticipated expiration: 2031-09-06

Abstract

The utility model discloses a silicon wafer absorbing and transferring mechanism, which aims at the problems that invisible deformation is generated inside a silicon wafer due to uneven acting force in the processing process of the silicon wafer, the silicon wafer is irreversibly destructive to high-precision materials, and the operation precision of the structure of the existing device cannot be ensured, and provides the following technical scheme, wherein the silicon wafer absorbing and transferring mechanism comprises a workbench and a metal beam frame, the workbench is provided with a stacking material box, a lifting assembly and a transmission assembly, the metal beam frame is connected with a sucker assembly in a sliding manner, the workbench is provided with a limiting sliding chute in sliding connection with the stacking material box, air blowing assemblies are symmetrically arranged on two sides of the limiting sliding chute, the lifting assembly is provided with a biasing cylinder, the biasing cylinder jacks up a workpiece and enables the workpiece to incline, and the sucker assembly is provided with a pneumatic sucker adsorbed in a partitioning manner; the mechanism is provided with a structure for inclining the silicon wafer at the top of the workpiece and blasting air in two directions, and has the advantages of protecting the silicon wafer, improving the working efficiency, adjusting and correcting and having strong applicability.

Description

Silicon chip suction transfer mechanism

Technical Field

The utility model relates to the field of semiconductor processing, in particular to a silicon wafer sucking and transferring mechanism.

Background

The silicon wafer is a semiconductor material made of monocrystalline silicon, has very stable chemical properties, is difficult to react with other substances except hydrogen fluoride at normal temperature, has better conductivity with higher purity, has wide application in the field of electronics, and is often used as a basic carrier of an operating circuit in the manufacture of semiconductor devices, new energy batteries and semiconductor computers.

At present, the chinese patent with application number 202110611437.9 discloses a solar cell silicon wafer conveying device, which comprises a frame; the sucking disc transferring unit is provided with an X-axis driving mechanism, two Y-axis driving mechanisms and two stepping sheet supplying units; the belt conveying mechanism adopts the air injection block to blow the silicon wafer group, so that the silicon wafers in the air injection area are respectively tilted upwards and separated, and when the sucking disc adsorbs the uppermost silicon wafer in the stacking space, the lifting mechanism drives the bearing plate to move downwards to generate a downward pulling action on the silicon wafer group, so that the silicon wafer group and the uppermost silicon wafer are pulled apart, the sucking disc is ensured to adsorb only one silicon wafer, and the stability and the reliability of production are improved; meanwhile, the sucker transfer unit and the two stepping wafer supply units are utilized to perform mutual cooperative work, so that the production efficiency can be improved, the air blowing time of the air injection block can be prolonged, the wafer separation is facilitated, and the state of the silicon wafer in the air blowing area tends to be stable.

Although the solar cell silicon wafer conveying device improves the production efficiency and separates the silicon wafers through air blowing, the silicon wafers are easy to generate invisible deformation inside the silicon wafers after being separated through one-way air blowing, the high-precision material, namely the silicon wafers, has irreversible destructiveness, the structure control performance of the existing device is poor, and in the silicon wafer processing production, all parts needing to run are corrected and adjusted to ensure the stability and the reliability of the silicon wafers, so that the solar cell silicon wafer conveying device has an improved space.

SUMMERY OF THE UTILITY MODEL

Aiming at the defects in the prior art, the utility model aims to provide a silicon wafer sucking and transferring mechanism which has the advantages of protecting a silicon wafer structure, improving the working efficiency, adjusting and correcting and having strong applicability.

In order to achieve the purpose, the utility model provides the following technical scheme:

the utility model provides a silicon chip absorbs and moves mechanism of carrying, includes workstation and metal roof beam structure, the workstation is provided with piles up magazine, lifting unit and transmission assembly, it is two sets of and arrange respectively in the transmission assembly both sides to pile up the magazine, sliding connection has the sucking disc subassembly on the metal roof beam structure, it sets up and arranges on the workstation along the straight line with transmission assembly in the working range of sucking disc subassembly to pile up the magazine, the workstation is provided with the spacing spout that sliding connection piles up the magazine, the blast air subassembly is installed at spacing spout bilateral symmetry to the workstation, lifting unit sets up and piles up the work piece lift in the magazine below and pile up the magazine, the last biasing cylinder that is provided with of lifting unit, biasing cylinder jack-up work piece makes its slope, be provided with the adsorbed air chuck of piecemeal on the sucking disc subassembly.

By adopting the technical scheme, the mechanism calls a silicon chip stack formed by orderly stacking a plurality of silicon chips as a workpiece, the workpiece is arranged in a stacking material box which is arranged in a limit chute, an operator can put the workpiece into the stacking material box in advance and then place the stacking material box at the appointed position of the limit chute, the efficiency of placing the workpiece by the operator can be effectively improved, the stacking material box and a transmission assembly are linearly arranged, the movement stroke of a sucker assembly can be greatly reduced, the working efficiency can be effectively improved after the stacking material box is used for a period of time in an accumulated way, the workpiece in the stacking material box is jacked up by a bias cylinder and inclined, the air blowing assemblies at two sides of the limit chute blow the workpiece, the top silicon chip in the inclined state is more easily separated from the lower workpiece under the action of opposite blowing air, and the two sides of the top silicon chip receive the action of stable compressed air, so that the silicon chip at the top cannot be damaged due to adhesion with the lower workpiece, the silicon chip that breaks away from the work piece shifts to the transmission subassembly under the effect of the pneumatic sucking disc that the piecemeal adsorbs and gets into in the process of next step, and above-mentioned technical scheme can effectually avoid because of the inside damage condition that the silicon chip atress is uneven and produce to an efficient material loading mode is provided, has the protection silicon chip structure, further improves work efficiency's advantage.

Further, pile up the magazine, include with spacing spout sliding connection's magazine base, install the magazine end liner on the magazine base, a plurality of limiting plates are installed all around to the magazine base, the limiting plate surrounds with the magazine base and constitutes the storage space who holds the work piece.

Adopt above-mentioned technical scheme, pile up the magazine including playing the magazine end liner that lifts the work piece effect, the magazine end liner is the elevating movement relative to the magazine base under elevating assembly's drive, the limiting plate still has the effect of restriction magazine end liner traffic direction, when elevating assembly's biasing cylinder jack-up work piece, the limiting plate restriction work piece makes the two can not lead to the slight change of structure and shape because of the rising state of biasing with the magazine end liner, have the improvement structure suitability, protect the technical effect of work piece inner structure.

Further, one end, far away from the material box base, of the limiting plate is a thin plate.

By adopting the technical scheme, one end, far away from the material box base, of the limiting plate is close to the air blowing assembly, the part is set to be of a thin plate structure, so that an operator can more easily put the part into a storage space when filling workpieces, and the structural characteristics of the limiting plate further reduce the collision influence generated when separating the silicon wafer from the workpieces, so that the technical effects of improving the working efficiency and protecting the internal structure of the silicon wafer are achieved.

Further, the air blowing assembly comprises an air blowing support connected with the workbench, the air blowing support is provided with an infrared detector, and air blowing devices are arranged on two sides of the air blowing support.

Adopt above-mentioned technical scheme, the blast air support symmetrical arrangement sets up the both sides of spacing spout at the workstation, the infrared detector relative arrangement of blast air support installation forms the infrared perception region of mutual discernment, when the work piece shields infrared perception region under lifting unit's drive, the air-blast device of both sides starts, and make the silicon chip with the work piece separation pass through the sucking disc subassembly and snatch, infrared perception region resumes to carry out above-mentioned operation once more this moment, when infrared perception region appears, the air-blast device is out of work, through reducing the condition that the blast air time reduces because of the atress is inhomogeneous and lead to producing the interior structure damage of silicon chip.

Further, the lifting assembly comprises a fixed platform connected with the workbench and a lifting rod installed on the fixed platform, the fixed platform is connected with the frame platform through a support column, the lifting rod is connected with a lifting sliding device and a lifting motor driving the lifting sliding device, the lifting sliding device is connected with the offset cylinder, and the lifting motor is installed on the frame platform.

Adopt above-mentioned technical scheme, fixed platform passes through the support column with the frame platform and constitutes frame construction, lifting unit moves in this frame construction, lifting unit passes through elevator motor drive lift slider and makes it move along the lifter, above-mentioned frame construction can provide stable lift space and load structure, the biasing cylinder is under lift slider's drive, steady jack-up work piece makes its silicon chip have stable connected state when separating with the work piece, above-mentioned structure has the advantage that the operation is stable, structural strength is high.

Further, install spacing detector on the support column, install the locating part that spacing detector detected on the lifting slide device.

By adopting the technical scheme, the limiting part is arranged on the lifting sliding device, whether the lifting sliding device resets is detected through the displacement detector on the supporting column, the operation of the lifting sliding device has periodicity, wherein the driving motor only performs rotation output in use, the position of the lifting sliding device is difficult to determine through the rotating speed and the screw pitch, the limiting part arranged together with the lifting sliding device can be detected through the fiber detector, and the lifting sliding device has the advantages of adjustment, correction and strong applicability.

Further, the sucking disc subassembly is including the mount of connecting the stroke slider, drive arrangement is installed to the mount, the last sucking disc support of installing of drive arrangement, install on the sucking disc support pneumatic suction disc.

By adopting the technical scheme, the driving device is connected with the pneumatic sucker through the sucker support, the pneumatic sucker completes the movement in the designated direction under the driving of the driving device, the silicon wafer can be more accurately sucked through the transmission structure of the part, the suction force of the sucker is increased in a mode of moving through the matched lifting assembly, and the pneumatic sucker has the advantages of being simple in structure and improving the adsorption capacity of the pneumatic sucker.

Further, install signal detector on the pneumatic chuck, signal detector and pneumatic chuck syntropy arrange, transmission assembly is provided with signal generator.

Adopt above-mentioned technical scheme, signal detector plays the effect of pneumatic sucking disc discernment characteristic, through the discernment ability that increases pneumatic sucking disc, improves pneumatic sucking disc's position control ability, specifically be through discernment and the relative position relation of piling up the magazine, make pneumatic sucking disc be located the absorption position of regulation and then improve the degree of accuracy of adsorbing the silicon chip, the signal generator signals that transmission assembly set up, can release the operation in real time when signal detector moves corresponding position, have the advantage that improves structure adjustment accuracy and adaptability.

Further, the transmission assembly comprises a supporting frame, two transmission belts, a tension wheel and a transmission motor are mounted on the supporting frame, the transmission motor is connected with the transmission rod and controls the two transmission belts to move, and the signal generator is arranged on the supporting frame.

Adopt above-mentioned technical scheme, through setting up the drive belt into two, and through the drive of the same transmission motor, relative and a drive belt have differential compensation ability, when the phenomenon of skidding appears in the drive belt, can effectually compensate the elasticity transform that prevents work piece conveying efficiency through another drive belt, set up single transmission motor control and can reduce cost and the control degree of difficulty, need not to satisfy differential compensation's technological effect through comparatively complicated circuit structure when the compensation, have the advantage that improves transmission stability, save the cost.

Further, the workstation is provided with position detector in spacing spout department.

By adopting the technical scheme, whether the stacking material box is located at the designated position of the limiting sliding groove or not is corrected through the position detector, the shape and position of the stacking material box can be effectively controlled through the correction detection mode, and the device has the advantages of improving the structure operation precision and reducing the misoperation of operators.

In conclusion, the utility model has the following beneficial effects:

1. the mechanism limits the shape and position of the stacked material box by arranging the limiting sliding chute and is used for keeping the stability of the structure, the air blowing devices which are symmetrically arranged are arranged on two sides of the limiting sliding chute, the lifting assembly which supports and jacks up a workpiece is also provided with a bias cylinder which enables a silicon wafer to be separated from the workpiece more easily, the pneumatic sucker adopts a blocking adsorption mode to enable the silicon wafer to be in a stable adsorption state under the condition that the silicon wafer is not completely adsorbed, and the transmission structure has the advantages of protecting the internal structure of the silicon wafer and improving the transmission stability of the mechanism;

2. the mechanism is provided with a position detector at a limiting sliding chute for determining the position of a stacked material box, and an infrared detector is arranged on a blowing component which is symmetrically arranged for identifying the position relation of a workpiece and improving the operation accuracy of the blowing component;

3. the mechanism is compact in structure, the number of used driving devices is small, the lifting assembly is only provided with a single lifting motor, the transmission assembly is only provided with a transmission motor of an electric instrument, and the sucker assembly is only provided with the driving devices and the stroke sliding blocks, so that the difficulty of operation and control can be effectively reduced by reducing driving pieces, and the mechanism has the advantages of reducing cost and reducing operation difficulty.

Drawings

FIG. 1 is a schematic view of the overall structure of the present embodiment;

FIG. 2 is a schematic structural view of the stacking magazine and the lifting assembly of the present embodiment;

FIG. 3 is a schematic structural diagram of the stacking magazine of the present embodiment;

FIG. 4 is a schematic structural diagram of the lifting assembly of the present embodiment;

FIG. 5 is a schematic structural diagram of the chuck assembly of the present embodiment;

fig. 6 is a schematic structural diagram of the transmission assembly of the present embodiment.

In the figure: 1. a work table; 11. a metal beam frame; 12. a limiting chute; 13. a position detector; 14. a frame platform; 15. a limit detector; 16. a support pillar; 2. a sucker component; 21. a travel sliding table; 22. a stroke slider; 23. a drive device; 24. a fixed mount; 25. a suction cup holder; 26. a detector support; 27. a signal detector; 28. a pneumatic suction cup; 3. stacking the material boxes; 31. a material box bottom lining; 32. a magazine base; 33. a limiting plate; 34. a linkage through hole; 4. a lifting assembly; 41. a fixed platform; 411. a connecting rod; 42. a lifting rod; 43. a mobile platform; 431. a lifting slide device; 44. a limiting member; 45. a coupling; 46. a lifting motor; 47. a frame bar; 48. pushing the disc; 49. an offset cylinder; 5. a transmission assembly; 51. a support frame; 511. a vertical plate; 52. a transmission belt; 53. a transmission motor; 54. a tension wheel; 55. a transmission rod; 56. a signal generator; 6. a workpiece; 7. a blower assembly; 71. an infrared detector; 72. a blower mount; 73. and a blower device.

Detailed Description

The present invention will be described in detail below with reference to the accompanying drawings and examples.

The present embodiment is only for explaining the present invention, and it is not limited to the present invention, and those skilled in the art can make modifications of the present embodiment without inventive contribution as needed after reading the present specification, but all of them are protected by patent law within the scope of the claims of the present invention.

A silicon chip suction transfer mechanism is a transfer mechanism which is provided with a bidirectional blast and matched with an inclined workpiece structure, is convenient to separate a silicon chip from a workpiece so as to protect a crystal structure inside the silicon chip, is provided with a detection device on each transmission device, identifies the motion condition of each motion part so as to improve the accuracy of the operation structure of the mechanism, and has the advantages of silicon chip protection, work efficiency improvement, adjustment and correction and strong applicability.

Referring to fig. 1, the present invention provides an embodiment, which includes a working table 1 and a metal beam frame 11, wherein the working table 1 is a plane made of a metal material, and has a stable structure and a strong structural strength, the metal beam frame 11 is disposed above the working table 1, a plurality of metal beam frames 11 are arranged along a straight line, a stroke sliding table 21 is fixedly mounted on the metal beam frame 11, the stroke sliding table 21 is connected with the plurality of metal beam frames 11 arranged along a straight line, the stroke sliding table 21 is slidably connected with a stroke sliding block 22, the stroke sliding block 22 is fixedly connected with a sucker assembly 2, and the sucker assembly 2 is driven to displace by the stroke sliding table 21 matching with the stroke sliding block 22, so that the sucker assembly 2 is slidably connected with the metal beam frame 11; be provided with on workstation 1 and pile up magazine 3, lifting unit 4 and transmission assembly 5, wherein pile up magazine 3 and transmission assembly 5 and set up in the working range of sucking disc subassembly 2 and arrange on workstation 1 along the straight line, it is two and arrange respectively in the both sides of transmission assembly 5 to pile up magazine 3, install two sets of sucking disc subassemblies 2 on stroke slider 22, sucking disc subassembly 2 respectively with pile up magazine 3 or the contact of transmission assembly 5 under stroke slider 22's the drive, contact with the transmission structure of difference respectively through setting up two sets of sucking disc subassemblies 2 and accomplish and snatch or place the action, linear arrangement then effectual stroke slider 22's that has reduced motion stroke motion, be of being of value to the work efficiency who improves the mechanism.

Referring to fig. 1 and 2, a limiting chute 12 connected with a stacking magazine 3 in a sliding manner is arranged on a workbench 1, a notch is formed in one side of the limiting chute 12 far away from a transmission assembly 5 and used for inserting the stacking magazine 3 into the limiting chute 12 to slide, air blowing assemblies 7 are arranged on two sides of the limiting chute 12 of the workbench 1, the air blowing assemblies 7 are symmetrically arranged on two sides of the stacking magazine 3, a lifting assembly 4 is arranged below the stacking magazine 3 of the workbench 1, the lifting assembly 4 pushes a workpiece 6 in the stacking magazine 3, wherein a combined structure formed by stacking a plurality of silicon wafers is called as the workpiece 6, the lifting assembly 4 is provided with an offset cylinder 49 at one end pushing the workpiece 6, the offset cylinder 49 jacks up the workpiece 6 and inclines by a certain angle, a connection state with the workpiece 6 is broken when the workpiece 6 is inclined, so that the uppermost silicon wafer in the workpiece 6 is more easily blown up by the air blowing assemblies 7 on two sides and separated from the workpiece 6, and because the blast action that the silicon chip received is two-sided synchronous going on, the silicon chip keeps the separation state parallel relatively when separating, and then the inside crystal structure of protection silicon chip does not receive the destruction, be provided with the pneumatic sucking disc 28 that the piecemeal adsorbs on sucking disc subassembly 2, the pneumatic sucking disc 28 that has the piecemeal adsorption structure can keep the level and smooth of silicon chip under the condition of not adsorbing the silicon chip completely to keep the silicon chip to keep keeping the level and smooth stable adsorption state in the operation process, above-mentioned scheme can effectually prevent that the silicon chip from producing the condition that crystal structure warp because of the atress is uneven.

Referring to fig. 2 and 3, the stacking magazine 3 is a square frame structure, and includes a magazine base 32 disposed in the limiting chute 12 and slidably connected in the limiting chute 12, the magazine base 32 is a rectangular plate-shaped structure made of stainless steel, a magazine bottom 31 is mounted on the magazine base, linkage through holes 34 are formed on the magazine base 32 and the magazine bottom 31, a bias cylinder 49 of the lifting assembly 4 passes through the linkage through holes 34 to contact with the workpiece 6, a plurality of limiting plates 33 are mounted around the magazine base 32, the limiting plates 33 are connected with the magazine base 32 through fasteners, the limiting plates 33 and the magazine base 32 form a temporary storage space, the limiting plates 33 are made of stainless steel and arranged in a direction perpendicular to the magazine base 32, one end of the limiting plates 33 away from the magazine base 32 is configured to be thin plate-shaped, the end of the thin plate has certain elasticity, when the workpiece 6 inclines, the end part of the limiting plate 33, which is in contact with the workpiece 6, does not deform the workpiece 6, an operator can slide the stacking magazine 3 out of the limiting chute 12 and load the workpiece 6 into the stacking magazine 3, and the elastic end part of the limiting plate 33 enables the operator to load the workpiece 6 into the storage space more easily; the workbench 1 is provided with a position detector 13 at one side of the limit chute 12 close to the transmission assembly 5, the position detector 13 is opposite to a material box bottom liner 31 in the stacked material box 3, and the position detector 13 determines whether the structure of the stacked material box 3 is located at a set position through contact limit so as to ensure the transmission stability of the workpiece 6 in the separation adjustment process.

Referring to fig. 2, the blowing assemblies 7 are symmetrically arranged at both sides of the stacking magazine 3, and include blowing brackets 72 arranged perpendicular to the table 1, the blowing brackets 72 having infrared detectors 71 and blowing devices 73 mounted at ends remote from the table 1, the blowing devices 73 being two and mounted at both sides of the infrared detectors 71, wherein the infrared detectors 71 are arranged right opposite to both sides of the stacking box to form an infrared sensing plane for detecting the workpieces 6, when the workpiece 6 is lifted to the infrared sensing plane position by the lifting assembly 4, the workpiece 6 blocks the opposite induction lines of the infrared detector 71, at this time, the air blowing device 73 works to blow air to the silicon wafer on the top of the workpiece 6, the silicon wafer is stably separated from the workpiece 6 by matching with a certain inclination angle, so that the damage of an internal crystal mechanism caused by uneven stress of the silicon wafer due to single-side blowing is avoided, and the technical effect of protecting the silicon wafer structure is achieved.

Referring to fig. 2 and 4, the lifting assembly 4 is disposed below the position-limiting sliding groove 12 of the workbench 1, the lifting assembly 4 includes a fixed platform 41 connected to the workbench 1, and a lifting rod 42 mounted on the fixed platform 41, the fixed platform 41 is connected to the frame platform 14 through a supporting column 16 to form a stable frame structure, the fixed platform 41 is rectangular and is mounted at four corners with connecting rods 411 connected to the workbench 1, the supporting columns 16 are multiple and penetrate through the frame platform 14, the lifting rod 42 is connected to a lifting sliding device 431 and a lifting motor 46 driving the lifting sliding device 431, the lifting motor 46 is mounted at one end of the frame platform 14 far from the workbench 1, the lifting motor 46 is mounted at the end connected to the frame platform 14 with a coupler 45 for protecting the lifting motor 46, the lifting sliding device 431 is mounted with a moving platform 43, the moving platform 43 is connected to a frame rod 47 and penetrates through the fixed platform 41 through the frame rod 47, one end of the frame rod 47 penetrating through the fixed platform 41 is fixedly connected with a pushing disc 48, and the pushing disc 48 is connected with an offset cylinder 49; the frame structure provides a stable operation environment for the lifting sliding device 431, the lifting sliding device 431 rotates along the lifting rod 42 under the driving of the lifting motor 46, the lifting sliding device 431 and the moving platform 43 connected with the lifting sliding device 431 drive the pushing disc 48 to move, and finally the workpiece 6 in the stacking material box 3 is jacked up, and the structural scheme has high stability and can adjust the transmission efficiency as required; the support column 16 is provided with a limit detector 15 at one end close to the frame platform 14, a limit piece 44 is arranged on a movable platform 43 connected with the lifting sliding device 431, the limit piece 44 is inserted in the limit detector 15, when the lifting sliding device 431 performs lifting motion, the limit piece 44 is separated from the limit detector 15, when the lifting sliding device 431 resets, the limit piece 44 is inserted in the limit detector 15, the motion of the lifting assembly 4 is periodic, the period can be judged by the limit detector 15, and an operator can conveniently correct the motion.

Referring to fig. 1 and 5, the suction cup assembly 2 includes a fixing frame 24 connected with a stroke slider 22, the fixing frame 24 is made of stainless steel material and has strong structural strength, a driving device 23 is installed on the fixing frame 24, the driving device 23 includes a stroke cylinder, the driving device 23 is arranged perpendicular to the stroke slider 22 and is opposite to the stacking magazine 3 and the transmission assembly 5, a suction cup support 25 is connected to the driving device 23, the suction cup support 25 is of a triangular structure and is provided with a plurality of connecting arms, the suction cups are connected with a pneumatic suction cup 28 through the connecting arms, in the structure, the driving device 23 can enable the pneumatic suction cup 28 to be matched with the lifting assembly 4 more easily, so that the pneumatic suction cup 28 is attached to a silicon wafer for adsorption, and the silicon wafer is kept stable in the transferring process; the pneumatic suction cup 28 is provided with the detector support 26, the detector support 26 is provided with the signal detector 27 along the vertical direction, the probe of the signal detector 27 faces downwards, and the signal detector 27 can identify the characteristics of the stacking material box 3 and the transmission assembly 5, so that the pneumatic suction cup 28 can more accurately grab and release the silicon wafer.

With reference to figures 1 and 5 of the drawings, in fig. 6, the transmission assembly 5 comprises a support frame 51 installed on the working table 1, the support frame 51 is arranged perpendicular to the working table 1, the support frame 51 comprises two vertical plates 511, a plurality of tension pulleys 54 are installed on the vertical plates 511, a tensioned transmission belt 52 is installed on the tension pulleys 54, the support frame 51 is provided with a transmission motor 53 on one vertical plate 511, the transmission motor is connected with a transmission rod 55 penetrating through the two vertical plates 511, the transmission rod 55 is connected with the transmission belt 52, so that the transmission motor 53 can drive the transmission belt 52 on different vertical plates 511 at the same time, the support frame 51 is provided with a signal generator 56 between the two vertical plates 511, a signal sent by the signal generator 56 is detected by a signal detector 27 in the suction cup assembly 2 moving above the transmission assembly 5, and the structure shape of the silicon wafer can be kept stable when the silicon wafer is placed on the transmission belt 52 is improved.

The working process of the embodiment:

referring to fig. 1, 2, 3, 4, 5 and 6, an operator slides and draws out the stacking magazine 3 from the limiting chute 12 and fills the workpiece 6 into the stacking magazine 3, the operator places the stacking magazine 3 into the limiting chute 12 and contacts with the position detector 13 on one side of the limiting chute 12, after reaching a specified position, the lifting slide device 431 drives the lifting slide device 46, the lifting slide device 431 drives the pushing disk 48 to push the magazine bottom liner 31 to ascend and the offset cylinder 49 makes the workpiece 6 to have a certain inclination angle, the inclination state can change the connection state between silicon wafers, further the workpiece 6 is lifted to the infrared induction plane, the air blowing device 73 blows the silicon wafer on the top of the workpiece 6 after the workpiece 6 passes through the infrared induction plane, so that the silicon wafer is separated from the workpiece 6, at this moment, the stroke slider 22 conveys the suction cup assembly 2 to the top of the stacking magazine 3, the driving device 23 drives the pneumatic sucker 28 to descend, the signal detector 27 arranged on the pneumatic sucker 28 detects the position of the silicon wafer and adsorbs the separated silicon wafer to be transported to the transmission assembly 5, when the stroke slider 22 runs to the upper part of the transmission assembly 5, a signal sent by the signal generator 56 arranged on the supporting frame 51 is identified by the signal detector 27, the position of the pneumatic sucker 28 is corrected, the silicon wafer is placed at a specified position, the pneumatic sucker 28 is recovered, the stroke slider 22 moves to the upper part of the stacking material box 3 at the other side again, the structure running of one motion period is completed, the structure has a silicon wafer protection structure, the working efficiency is improved, the adjustment and correction are performed, and the applicability is strong.

The above description is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above embodiments, and all technical solutions belonging to the idea of the present invention belong to the protection scope of the present invention. It should be noted that modifications and embellishments within the scope of the utility model may occur to those skilled in the art without departing from the principle of the utility model, and are considered to be within the scope of the utility model.

Claims

1. The utility model provides a silicon chip absorbs and moves mechanism of carrying, includes workstation (1) and metal roof beam structure (11), workstation (1) is provided with and piles up magazine (3), lifting unit (4) and transmission assembly (5), it is two sets of and arrange respectively in transmission assembly (5) both sides to pile up magazine (3), sliding connection has sucking disc subassembly (2), its characterized in that on metal roof beam structure (11): pile up magazine (3) and transmission assembly (5) and set up in the working range of sucking disc subassembly (2) and arrange on workstation (1) along the straight line, workstation (1) is provided with spacing spout (12) that sliding connection piles up magazine (3), workstation (1) is installed blast air subassembly (7) in spacing spout (12) bilateral symmetry, lifting unit (4) set up and pile up work piece (6) in magazine (3) below and pile up magazine (3) and go up and down, be provided with biasing cylinder (49) on lifting unit (4), biasing cylinder (49) jack-up work piece (6) and make its slope, be provided with the pneumatic chuck (28) that the piecemeal adsorbs on sucking disc subassembly (2).

2. The silicon wafer sucking and transferring mechanism of claim 1, wherein: pile up magazine (3) include with spacing spout (12) sliding connection's magazine base (32), install magazine end liner (31) on magazine base (32), a plurality of limiting plates (33) are installed all around to magazine base (32), limiting plate (33) and magazine base (32) surround the storage space who constitutes holding workpiece (6).

3. The silicon wafer sucking and transferring mechanism of claim 2, wherein: one end of the limiting plate (33) far away from the box base (32) is provided with a thin plate.

4. The silicon wafer sucking and transferring mechanism of claim 1, wherein: the air blowing assembly (7) comprises an air blowing support (72) connected with the workbench (1), wherein the air blowing support (72) is provided with an infrared detector (71) and air blowing devices (73) on two sides of the air blowing support.

5. The silicon wafer sucking and transferring mechanism of claim 1, wherein: lifting unit (4) include fixed platform (41) be connected with workstation (1), install lifter (42) on fixed platform (41), fixed platform (41) are through support column (16) connection frame platform (14), lifter (42) are connected and are gone up and down slider (431) and drive lift motor (46) of going up and down slider (431), lift slider (431) are connected offset cylinder (49), install on frame platform (14) lift motor (46).

6. The silicon wafer sucking and transferring mechanism of claim 5, wherein: install spacing detector (15) on support column (16), install spacing detector (15) the locating part (44) that detect on lifting slide device (431).

7. The silicon wafer sucking and transferring mechanism of claim 1, wherein: sucking disc subassembly (2) are including mount (24) of connecting stroke slider (22), drive arrangement (23) are installed to mount (24), install sucking disc support (25) on drive arrangement (23), install on sucking disc support (25) pneumatic suction cup (28).

8. The silicon wafer sucking and transferring mechanism of claim 7, wherein: the pneumatic sucker (28) is provided with a signal detector (27), the signal detector (27) and the pneumatic sucker (28) are arranged in the same direction, and the transmission assembly (5) is provided with a signal generator (56).

9. The silicon wafer sucking and transferring mechanism of claim 8, wherein: the transmission assembly (5) comprises a supporting frame (51), two transmission belts (52), a tension wheel (54) and a transmission motor (53) are mounted on the supporting frame (51), the transmission motor (53) is connected with a transmission rod (55) and controls the two transmission belts (52) to move, and the supporting frame (51) is provided with the signal generator (56).

10. The silicon wafer suction and transfer mechanism according to any one of claims 1 to 9, wherein: the workbench (1) is provided with a position detector (13) at the position of the limiting sliding groove (12).