CN208572212U

CN208572212U - Camera module and its molding photosensory assembly and electronic equipment

Info

Publication number: CN208572212U
Application number: CN201820520309.7U
Authority: CN
Inventors: 王明珠; 田中武彦; 郭楠; 陈振宇; 赵波杰
Original assignee: Ningbo Sunny Opotech Co Ltd
Current assignee: Ningbo Sunny Opotech Co Ltd
Priority date: 2017-04-12
Filing date: 2018-04-12
Publication date: 2019-03-01
Anticipated expiration: 2028-04-12
Also published as: JP7075415B2; WO2018188628A1; JP7253644B2; US20200156295A1; JP2020517166A; CN108696681A; US11094727B2; EP3611913A1; KR102334464B1; CN110337804A; JP2022070925A; US11139328B2; KR20190133235A; EP3611913A4; US20210343768A1; US20190319057A1

Abstract

The utility model provides a kind of camera module and its molding photosensory assembly and manufacturing method and electronic equipment.The molding photosensory assembly includes an at least molded section, at least a sensitive chip and an at least wiring board, wherein the sensitive chip is set to the wiring board, wherein the molded section includes a molded section main body, wherein the molded section main body is made of transparent material, wherein the molded section main body, the sensitive chip, the wiring board is set to form integral structure by moulding technology, to facilitate production.

Description

Camera module and its molding photosensory assembly and electronic equipment

Technical field

The utility model relates to optical imaging field, in particular to a kind of camera module and its molding photosensory assembly and electricity Sub- equipment.

Background technique

Conventional molding, especially MOC (Molding on Chip), chip photosensitive area are needed by stringent protection, to keep away Exempt to be damaged or polluted by other materials by mold, but always inevitably occur in actual production it is bad, it is final to lead to product report Useless and cost allowance.

The moulding material used in conventional molding is often opaque material, generally black.Conventional Shooting Technique is adopted It is nylon, LCP (Liquid Crystal Polymer, polymeric liquid crystal copolymer), (Polypropylene gathers PP Propylene) etc., mould pressing process generally uses resin.Although molding photosensory assembly made of these opaque materials may be implemented to protect Chip photosensitive area, but often much limited in structure and technique in production molding photosensory assembly and camera module System, especially needs to open hole and form the optical window above chip photosensitive area.The reliability for making the product formed also needs to be mentioned Height, the requirement for environment is also higher, is damaged under poor environment or the reliability of pollution effect product etc..

Utility model content

It is described the purpose of this utility model is to provide a kind of camera module and its molding photosensory assembly and electronic equipment The molded section main body for molding an at least molded section for photosensory assembly is made of transparent material.

The another object of the utility model is to provide a kind of camera module and its molding photosensory assembly and electronic equipment, The outer surface in the molded body portion is provided with an at least light shield layer, and the size and size for adjusting the light shield layer can fast velocity modulations Characteristic of whole light portal such as size, position, shape etc. eliminates conventional method adjustment light portal and die sinking is needed to have a fling at Complicated procedures of forming.

The another object of the utility model is to provide a kind of camera module and its molding photosensory assembly and electronic equipment, An at least filter element can be directly attached to an at least photosensitive area for an at least sensitive chip for the molding photosensory assembly Top, adjustment to the filter element can be substituted by adjusting the size and size of the light shield layer.

The another object of the utility model is to provide a kind of camera module and its molding photosensory assembly and electronic equipment, The molded section is capable of an at least wiring board for the fully wrapped around sensitive chip and the molding photosensory assembly, and protection is omitted The step of photosensitive area, improves yield and efficiency while reducing cost.

The another object of the utility model is to provide a kind of camera module and its molding photosensory assembly and electronic equipment, The reliability of the camera module further increases, dirty even semi-finished product can also use under relatively worse environment Or slight damage only needs directly to wipe cleaning, or gets rid of transparent material with physical means such as plasma process, polishings Superficial layer.

The another object of the utility model is to provide a kind of camera module and its molding photosensory assembly and electronic equipment, The difficulty of processing of mold required for molding and time substantially reduce, while the difficulty of material filling is significantly reduced when producing, Cost is reduced while efficiency gets a promotion.

The another object of the utility model is to provide a kind of camera module and its molding photosensory assembly and electronic equipment, By adjusting different-thickness and the different materials even different surfaces shape of the molded section main body above the sensitive chip Also different optical properties can be obtained, the camera lens for being equivalent to a monolith transparent material and top has collectively constituted a huge mirror Head group, provides more design spaces for lens design, and the camera module that assembling can finally formed obtains better Optical property and smaller outer dimension.

The another object of the utility model is to provide a kind of camera module and its molding photosensory assembly and electronic equipment, An at least light for the molded section leads to region and is coated with an at least filter layer or an at least reflective layer.Can have preferably thoroughly It crosses rate and improves optical filtering efficiency.

The another object of the utility model is to provide a kind of camera module and its molding photosensory assembly and electronic equipment, The reflection of light, flash, stray light can be reduced.

In order to realize at least one above-mentioned purpose of utility model, the utility model provides a kind of molding photosensory assembly, answers For an at least camera module, comprising:

An at least molded section, wherein the molded section includes a molded section main body, wherein the molded section main body is transparent Material is made；

An at least sensitive chip；And

An at least wiring board, wherein the sensitive chip is set to the wiring board；

Wherein make the molded section main body, the sensitive chip, the wiring board of the molded section by moulding technology Form integral structure.

In some embodiments, the molding photosensory assembly further comprises an at least light shield layer, wherein the molded section Main body coats the sensitive chip and the wiring board completely, wherein the light shield layer is capped on the outer of the molded section main body The a part on surface, and the top of the molded section main body also forms an at least light and leads to region, the light leads to region and the sense Optical chip is opposite, to provide the passage of light of the sensitive chip.

In some embodiments, the logical region of the light of the molded section is also wrapped on an at least filter layer or at least one Reflective layer.

In some embodiments, the edge of the edge and the light shield layer of the filter layer or the reflective layer is It overlaps.

In some embodiments, the top of the molded section main body of the molded section has an at least groove, wherein institute It states groove and is recessed by the top surface of the molded section main body and formed, the light leads to region and is arranged at the groove.

In some embodiments, the molded section further includes an at least camera lens construction section, wherein the lens construction section by The molded section main body circumference upwardly extends to be formed, and the camera lens construction section and the molded section main body integrally mold connection.

In some embodiments, the top of the molded section is planar, i.e., the top surface of the described molded section main body is smooth, Wherein the logical region of the light is defined in the smooth top surface of the molded section main body.

In some embodiments, the molded section coats the sensitive chip completely.

In some embodiments, the molded section main body is encapsulated in the translucent element side and bottom, wherein described Optical element top surface and the molded section top surface are in same plane.

It in some embodiments, further comprise an at least lead, the lead is electrically connected the sensitive chip and described Wiring board, the molded section also coat the lead.

It in some embodiments, further comprise an at least electronic component, the electronic component is arranged at described Wiring board, the molded section also coat the electronic component.

In some embodiments, the molded section further comprises at least a molded section main body and at least a light shield layer, The light shield layer is capped on a part of the outer surface of the molded section main body, and the molded section main body also forms at least one Through-hole, the through-hole is corresponding with the sensitive chip, to provide the passage of light of the sensitive chip.

In some embodiments, the bottom of the through-hole is skewed in being gradually increased from the bottom to top.

In some embodiments, the molding photosensory assembly further comprises a translucent element, wherein the molded section Support the translucent element in the through-hole, for filtering light.

In some embodiments, the top of the molded section be suitable for being installed to the camera lens of a few camera module, driver or Filter element.

In some embodiments, the top of the molded section has a mounting groove, and the mounting groove is connected to the through-hole, For installing at least filter element of a camera module, camera lens or driver.

It in some embodiments, further comprise an at least lead, the lead is electrically connected the sensitive chip and described Wiring board, the molded section also coat the lead portion or whole.

In some embodiments, the sensitive chip includes a photosensitive area and a non-photo-sensing area, and the non-photo-sensing area surrounds In the photosensitive area periphery, the molded section also coats the non-photo-sensing area of the sensitive chip.

In some embodiments, the molded section further includes an at least camera lens construction section, the camera lens construction section and described Molded body integrally molds connection.

Another aspect according to the present utility model additionally provides a kind of camera module, including an at least camera lens and one Or multiple aforementioned molding photosensory assemblies, the camera lens are located at the optics of the sensitive chip of the molding photosensory assembly Path.

It in some embodiments, further comprise an at least filter element, the filter element is supported by the molded section, And it is set between the camera lens and the molding photosensory assembly.

It in some embodiments, further comprise an at least filter element, the filter element is mounted on described photosensitive Chip.

In some embodiments, the camera module is fixed-focus camera module or zoom camera mould group.

In some embodiments, the molding photosensory assembly further comprises a supporting member, wherein described state bearing Element is arranged at the wiring board.

In some embodiments, the molded section embeds the outer side edges of the supporting member.

In some embodiments, the supporting member embeds the lead.

Another aspect according to the present utility model additionally provides a kind of camera module, including an at least camera lens and one Or multiple molding photosensory assemblies above-mentioned, the camera lens are located at the light of the sensitive chip of the molding photosensory assembly Ways for education diameter, the molded section of the molding photosensory assembly and the camera lens form an at least lens group for the camera module.

Another aspect according to the present utility model additionally provides a kind of electronic equipment, including one or more institutes above-mentioned The camera module stated, wherein each camera module be used to obtain image.

Another aspect according to the present utility model, additionally provides a kind of array camera module, including at least two camera lenses and At least two molding photosensory assemblies above-mentioned, each camera lens are located at each photosensitive core of each molding photosensory assembly The optical path of piece.

It in some embodiments, further comprise at least two filter elements, each filter element is by each molded section Support, and be set between each camera lens and each molding photosensory assembly.

It in some embodiments, further comprise at least two filter elements, each filter element is mounted on each described Sensitive chip.

In some embodiments, each camera module is fixed-focus camera module or zoom camera mould group.

Another aspect according to the present utility model, additionally provides a kind of array camera module, including at least two camera lenses and The two molding photosensory assemblies above-mentioned, each camera lens are located at each sensitive chip of each molding photosensory assembly The molded section of optical path, multiple molding photosensory assemblies is integrally formed.

Another aspect according to the present utility model, additionally provides a kind of array camera module, including at least one as described above Camera module；At least another camera module as described above, wherein the camera module and another camera module are simultaneously Row ground setting, wherein two adjacent camera modules are molded ground integrally connected by the molded section.

In some embodiments, the adjacent wiring board is connected to form a whole wiring board.

In some embodiments, the adjacent wiring board is arranged by interval, wherein the molded section fills adjacent institute State wiring board interval, the adjacent wiring board of molding ground integrally connected.

In some embodiments, it is whole to be connected to form one for the adjacent translucent element.

Another aspect according to the present utility model additionally provides an array camera module, comprising:

At least two camera lenses；

At least two sensitive chips, wherein the camera lens is held in the photosensitive path of the corresponding sensitive chip；

An at least wiring board, wherein the sensitive chip is attached at the wiring board electrically；And

One disjunctor molded section, wherein the disjunctor molded section, the wiring board and the sensitive chip pass through moulding technology It is integrated, wherein the disjunctor molded section is made of clear material.

Another aspect according to the present utility model, additionally provides a kind of electronic equipment, including it is one or more above-mentioned The array camera module, wherein each array camera module be used to obtain image.

Detailed description of the invention

Fig. 1 be a preferred embodiment according to the present utility model a kind of camera module and its molding photosensory assembly and The stereoscopic schematic diagram of electronic equipment.

Fig. 2 is the molding photosensory assembly production schematic diagram of above-described embodiment according to the present utility model.

Fig. 3 is the molding photosensory assembly production schematic diagram of above-described embodiment according to the present utility model.

Fig. 4 is the stereoscopic schematic diagram of the camera module of above-described embodiment according to the present utility model.

Fig. 5 is another variant embodiment of the molding photosensory assembly of above-described embodiment according to the present utility model Stereoscopic schematic diagram.

Fig. 6 is the module diagram of an electronic equipment of above-described embodiment according to the present utility model.

Fig. 7 is the stereoscopic schematic diagram of the electronic equipment.

Fig. 8 is the solid of another embodiment of the molding photosensory assembly based on the above embodiments of the present invention Schematic diagram.

Fig. 9 is the solid of another embodiment of the molding photosensory assembly based on the above embodiments of the present invention Schematic diagram.

Figure 10 is the vertical of another embodiment of the molding photosensory assembly based on the above embodiments of the present invention Body schematic diagram.

Figure 11 is the vertical of another embodiment of the molding photosensory assembly based on the above embodiments of the present invention Body schematic diagram.

Figure 12 is the vertical of another embodiment of the molding photosensory assembly based on the above embodiments of the present invention Body schematic diagram.

Figure 13 is the vertical of another embodiment of the molding photosensory assembly based on the above embodiments of the present invention Body schematic diagram.

Figure 14 is the vertical of another embodiment of the molding photosensory assembly based on the above embodiments of the present invention Body schematic diagram.

Figure 15 is that the solid of another embodiment of the camera module based on the above embodiments of the present invention is shown It is intended to.

Figure 16 is the stereoscopic schematic diagram of an array camera module of the embodiment based on the utility model.

Figure 17 is the vertical of another embodiment of the array camera module based on the above embodiments of the present invention Body schematic diagram.

Figure 18 is the vertical of another embodiment of the array camera module based on the above embodiments of the present invention Body schematic diagram.

Figure 19 is the vertical of another embodiment of the array camera module based on the above embodiments of the present invention Body schematic diagram.

Figure 20 is the vertical of another embodiment of the array camera module based on the above embodiments of the present invention Body schematic diagram.

Figure 21 is the vertical of another embodiment of the array camera module based on the above embodiments of the present invention Body schematic diagram.

Figure 22 is the vertical of another embodiment of the array camera module based on the above embodiments of the present invention Body schematic diagram.

Figure 23 is the vertical of another embodiment of the array camera module based on the above embodiments of the present invention Body schematic diagram.

Figure 24 is the vertical of another embodiment of the array camera module based on the above embodiments of the present invention Body schematic diagram.

Figure 25 is the vertical of another embodiment of the array camera module based on the above embodiments of the present invention Body schematic diagram.

Figure 26 is the vertical of another embodiment of the array camera module based on the above embodiments of the present invention Body schematic diagram.

Figure 27 is the vertical of another embodiment of the array camera module based on the above embodiments of the present invention Body schematic diagram.

Figure 28 is the vertical of another embodiment of the array camera module based on the above embodiments of the present invention Body schematic diagram.

Specific embodiment

It is described below for disclosing the utility model so that those skilled in the art can be realized the utility model.It retouches below Preferred embodiment in stating is only used as illustrating, it may occur to persons skilled in the art that other obvious modifications.It is retouched following The basic principle of the utility model defined in stating can be applied to other embodiments, deformation scheme, improvement project, etc. Tongfangs The other technologies scheme of case and the spirit and scope without departing from the utility model.

It will be understood by those skilled in the art that in the exposure of the utility model, term " longitudinal direction ", " transverse direction ", "upper", The orientation of the instructions such as "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom" "inner", "outside" or position are closed System is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of describing the present invention and simplifying the description, without It is that the device of indication or suggestion meaning or element must have a particular orientation, be constructed and operated in a specific orientation, therefore on Stating term should not be understood as limiting the present invention.

It is understood that term " one " is interpreted as " at least one " or " one or more ", i.e., in one embodiment, The quantity of one element can be one, and in a further embodiment, the quantity of the element can be it is multiple, term " one " is no It can be interpreted as the limitation to quantity.

Referring to shown in the Fig. 1 to Fig. 4 of attached drawing, the molding photosensory assembly of a preferred embodiment according to the present utility model and take the photograph As mould group is illustrated.The molding photosensory assembly 10 is wrapped for camera module described in assembly, the molding photosensory assembly 10 Include a molded section 11 and a photographic department 12.It is connected to the photographic department 12 to the 11 one molding of molded section.The molded section A 11 molded section main body 111 is made of transparent material, can be completely covered in the surface of the photographic department 12, for later Light shield layer, reflective layer or translucent element etc. are formed on the surface of the molded section main body 111.

The molded section main body 111 of the utility model is made of transparent material, and transparent material used can be poly- first Base methyl acrylate, polystyrene, polyester, polycarbonate, poly 4-methylpene-1, polyacrylate, transparent epoxy resin, APO resin, ZEONEX resin, ARTON resin etc..It will be appreciated by those skilled in the art that the class of aforementioned transparent material Type can also be that other enforceable transparent materials, the utility model are not limited thereto in this regard as just citing.

The photographic department 12 includes a sensitive chip 121 and a wiring board 122, and the sensitive chip 121 is arranged at institute It states on wiring board 122.This embodiment according to the present utility model, the sensitive chip 121 are connected to the line with being molded Road plate 122.That is, in this preferred embodiment of the utility model, the molded section main body made of transparent material 111 i.e. the molding mode of MOC is molded into the photographic department 12 in a manner of being molded into chip, so that the sensitive chip 121 is attached In the wiring board 122.Those skilled in the art is known that the basic conception and basic technology of the MOC molding mode, this Place repeats no more.

The photographic department 12 further includes a lead 123 and an electronic component 124.The lead 123 is electrically connected to institute State sensitive chip 121 and the wiring board 122.The lead 123 can be by specifically in each embodiment of the utility model It is embodied as gold thread, copper wire, aluminum steel and silver wire etc..It will be appreciated by those skilled in the art that the lead 123 is carried out It is gold thread, copper wire, aluminum steel and silver wire etc. as just citing, the utility model can also have other conjunctions in other embodiments The embodiment of reason, the utility model are not limited thereto in this regard.The photographic department 12 further includes not shown in the figure One connection line, the connection line are predetermined in the wiring board 122, and the electronic component 124 is connected to the company Link and the sensitive chip 121, so that the sensitive chip 121 is able to carry out photosensitive work.The i.e. described electronics member device Part 124 is electrically connected to the wiring board 122 and the sensitive chip 121.

The electronic component 124 is projectedly set to the wiring board 122 in the preferred embodiment of the utility model. The electronic component 124 can be tangibly embodied as in each embodiment of the utility model resistance, capacitor, diode, Triode, potentiometer, relay or driver etc..It will be appreciated by those skilled in the art that the electronic component 124 are implemented as resistance, capacitor, diode, triode, potentiometer, relay or driver etc. as just citing, this reality There can also be other reasonable embodiments in other embodiments with novel, the utility model in this regard and is not limited System.It will be appreciated by those skilled in the art that in this embodiment of the utility model, with the electronic component It is illustrated for the 124 protrusion wiring boards 122, and in the other embodiments of the utility model, the electronic component 124 can be embedded in the wiring board 122 without protruding from the wiring board 122, it will be appreciated by those skilled in the art that , shape, type and the setting position of the electronic component 124 are not the limitation of the utility model.

The molded section main body 111 made of transparent material is in this preferred embodiment of the utility model will be described Lead 123 and the electronic component 124 are wrapped in inside it, it is preferable that the molded section main body 111 will be wrapped fully The lead 123 and the electronic component 124 are wrapped up in, so that the lead 123 and the electronic component 124 will not be straight It connects and is exposed in space, thus when the molding photosensory assembly 10 assembling forms the camera module, the electronic component 124 Prevent dust, sundries from staying in 123 surface of circuit element by way of molding cladding.In moulding process and later Assembling and the course of work in, the lead 123 can also be protected.

The sensitive chip 121 includes a photosensitive area 1211 and a non-photo-sensing area 1212, wherein the sensitive chip 121 The photosensitive area 1211 and the non-photo-sensing area 1212 are integrally formed, and the photosensitive area 1211 is located at the photosensitive core The middle part of piece 121, the non-photo-sensing area 1212 is located at the outside of the sensitive chip 121, and the non-photo-sensing area 1212 encloses Around the photosensitive area 1211 at least side.Light molded section main body made of transparent material of object reflection or transmitting 111 can be received and be carried out photoelectric conversion by the photosensitive area 1211 of the sensitive chip 121, associated with object to obtain Image.

It is noted that in this preferred embodiment of the utility model, the molded section made of transparent material Main body 111 is preferably to be completely covered by the upper surface of the sensitive chip 121.That is, it is preferable that the molded section 11 Coat the photosensitive element 121 the photosensitive area 1211 and the non-photo-sensing area 1212.The molding made of transparent material Portion's main body 111 being capable of the fully wrapped around sensitive chip 121 and the line in this preferred embodiment of the utility model Road plate 122 the step of so as to which the photosensitive area 1211 for protecting the sensitive chip 121 are omitted, reduces the same of cost Shi Tigao yield and efficiency.

Further, the molded section main body 111 made of transparent material can be completely covered by the sensitive chip Light shield layer is formed in transparent material surface after 121 upper surface.That is, the molding photosensory assembly 10 further comprises One light shield layer 112.The light shield layer 112 is arranged at the outer surface of the molded section main body 111.In this of the utility model In a preferred embodiment, the light shield layer 112 is not covered with the upper area of the photosensitive area 1211.That is, in this reality With in this novel preferred embodiment, the outer surface of the molded section main body 111 does not have the region of the light shield layer 112 to be formed One light of the molded section 11 leads to region 110, and the light leads to region 110 and is defined in the molded section 11 by the light shield layer 112, Corresponding to the photosensitive area 1211, so that the external light being reflected by the object can be by the area Guang Tong of the molded section 11 Domain 110 receives and carries out photoelectric conversion by the photosensitive area 1211 of the sensitive chip 121, associated with object to obtain Image.

It will be appreciated by those skilled in the art that in the preferred embodiment of the utility model, the molded section master Other than the light leads to region 110, outer surface all is merely possible to lift by the light shield layer 112 covering for the outer surface of body 111 Example, there are also other reasonable implementation modes in other embodiments.In other words, it will be appreciated by those skilled in the art that, In the case where not influencing the reception of the photosensitive area 1211 and carrying out photoelectric conversion, the light shield layer 112 is in the molded section The setting position of the outer surface of the 11 molded section main body 111 is adjusted according to actual needs.The light shield layer 112 it is big Small and size can be also adjusted according to actual needs.

In addition, it is noted that light portal can quickly be adjusted i.e. by adjusting the size of the light shield layer 112 and size Light described here leads to the characteristic, such as size, position, shape etc. in region 110, and eliminating conventional method adjustment light portal needs It is opened the complicated procedures of forming having a fling at.

It is noted that the molded section main body 111 made of transparent material can further increase what assembling was formed The reliability of camera module, even the molding photosensory assembly 10 that assembling is formed waits semi-finished product also can be relatively worse It is used under environment.Only needed when there is dirty or slight damage directly wipe cleaning, or with plasma process, throwing The physical means such as light get rid of the superficial layer of the molded section 11.

As shown in figure 4,10 assembly of molding photosensory assembly of this preferred embodiment based on the utility model Made of camera module 100 be illustrated.Wherein the camera module 100 includes the molding photosensory assembly 10 and a camera lens 20.The photosensitive path for being supported in the photosensitive element 21 of the molding photosensory assembly 10 is set in the camera lens 20.By object The light of reflection from the camera lens 20 enter the camera module 100 inside, with subsequent by the molding photosensory assembly 10 The sensitive chip 121 receive and carry out photoelectric conversion, to obtain image associated with object.

In addition, the preferred embodiment of the utility model is by MOC moulding technology, the camera module 100 is implemented as One zoom camera mould group.The camera module 100 further includes a driver 30, and the driver 30 can drive the camera lens 20 move back and forth along the photosensitive path of the sensitive chip 121, so as to adjust the focal length of the camera module 100.In other words It says, camera lens 20 described in the driver 30 is supported in the driver 30 by driveably setting.It is noted that the drive The type of dynamic device 30 is unrestricted in the camera module 100 of the utility model, such as in another embodiment, the drive Dynamic device 30 may be implemented as any sense that can drive the camera lens 20 along the photosensitive element 21 such as voice coil motor Light path generates the driver of displacement, wherein the driver 30 can receive electric energy and control signal in running order.

It will be appreciated by those skilled in the art that in other embodiments, the camera module 100 is implemented as one Fixed-focus camera module.That is, when the camera module 100 is implemented as a fixed-focus camera module, 11 quilt of molded section Deformation implementation is the lens bracket for assembling the camera lens 20, the camera lens 20 10 integrated molding of molding photosensory assembly it It is directly mounted at the molded section 11 for being embodied as lens bracket afterwards, to simplify the assembling procedure of the camera module 100.

Further, as shown in Figure 1 and Figure 4, the camera module 100 further comprises an at least filter element 40, institute State the optical path that filter element 40 is located at the camera lens 20.In this preferred embodiment of the utility model, in the mould After moulding the molding formation of photosensory assembly 10, the filter element 40 is mounted on the molded section of the molding photosensory assembly 10 10 top, assembling form the camera module 100.Wherein, the filter element 40 is located at the photosensitive of the sensitive chip 121 Path.The light being reflected by the object enters from each optical mirror slip of the camera lens 20, and after being filtered by the filter element 40 The inside of the camera module 100 can be received and be carried out photoelectric conversion by the photosensitive element 21.That is, the filter Optical element 40 can filter the veiling glare in the light being reflected by the object from each optical mirror slip of the camera lens 20, such as infrared ray Part or visible light part can change the image quality of the camera module 100 in this way.

Specifically, in this preferred embodiment of the utility model, the filter element 40 is located at the camera lens 20 Optical path, the light that the filter element 40 is arranged at the molded section 11 lead to region 110.That is, the mould The position of the bottom connection touching of the molded section main body 111 and filter element 40 in modeling portion 11 is not provided with the light shield layer 112.It is noted that the filter element 40 is directly attached to described in this preferred embodiment of the utility model Molded section 11, and be located at right above the photosensitive area 1211 of the sensitive chip 121, due to the size of the light shield layer 112 It is adjustable to be compared with traditional technology, it is no longer necessary to additional small microscope base assists to limit the size of the filter element 40, as long as Adjusting the light shield layer 112 can.

Further, 11 top surface of molded section is recessed to form a groove, and the logical region 110 of the light is defined in described recessed Bottom surface corresponds to the photosensitive area 1211.The filter element 40 covers the light and leads to region 110, for filtering light. Preferably, in the present embodiment, the groove gradually decreasees from top to bottom, and on the one hand reduces the size of the filter element 40, On the other hand certain drafting angle is formed, the reduction so that mold is obstructed during being pulled out.

It will be appreciated by those skilled in the art that in the different examples of the camera module 100, the optical filtering member Part 40 can be implemented as different types, such as the filter element 40 can be implemented as IR cut filter element, complete The combination of light transmission spectrum filter element and other filter elements or multiple filter elements, such as the filter element 40 can It is implemented as the combination of IR cut filter element and full impregnated spectral filtering element, i.e., the described IR cut filter element and described Full impregnated spectral filtering element can be switched to be optionally situated on the photosensitive path of the photosensitive element 21, such as on daytime When using the camera module 100 under the more sufficient environment of equal light, the IR cut filter element can be switched to The photosensitive path of the sensitive chip 121, to enter the camera module 100 by the IR cut filter element filters The infrared ray in light being reflected by the object can be with when using the camera module 100 in the environment of the darks such as night The full impregnated spectral filtering element is switched to the photosensitive path of the sensitive chip 121, to allow access into the camera module Infrared part in 100 light being reflected by the object penetrates.

It is illustrated in figure 5 another variant embodiment of the molded section 11 based on preferred embodiment shown in FIG. 1.With Unlike the molded section 11 in embodiment described in Fig. 1, in Fig. 5, the molded section 11 further includes camera lens installation Section 114.That is, in this embodiment, the molded section 11 includes that the molded section main body 111 and the camera lens are pacified Fill section 114.The light shield layer 112 is other than being set to the outer surface of the molded section main body 111, also according to actual need It wants, is arranged at the outer surface of the camera lens construction section 114.The molded section main body 11 and the camera lens construction section 114 are successively Integrally molding connection.The camera lens construction section 114 is used to install the camera lens 20 (camera lens 20 is not shown in Figure 5), That is, the camera lens 20 is installed in the camera lens when the molding photosensory assembly 10 be used to assemble camera module 114 inside of construction section, in order to provide stable installation site for the camera lens 20.The camera lens construction section 114 integrally by 111 circumference of molded section main body upwardly extends, and provides support fixed position for the camera lens 20, additional without providing Component the camera lens 20 is installed.In other words, the molded section 11 integrally upwardly extends, and internal formation is step-like, To mold the wiring board 122, sensitive chip 121, lead 123, the electronic component 124 and the support camera lens respectively 20。

It is noted that the inner surface of the camera lens construction section 114 is smooth, to be suitable for installing non-threaded described Camera lens 20 forms fixed-focus mould group.Particularly, the camera lens 20 can be fixed on the camera lens construction section by way of bonding 114.It's also worth mentioning that the camera lens 20 is installed in the camera lens construction section 114, so that the molded section 11 is equivalent to The function of bracket or lens barrel in traditional camera module provides support, fixed position, 11 generation of molded section for the camera lens 20 For traditional bracket, and installation site is provided for the camera lens 20, avoids bracket bring inclination when pasting assembling and miss Difference reduces the cumulative limit of camera module assembling.

As shown in Figure 6 and Figure 7, the molding photosensory assembly of the utility model assembles the camera module 100 to be formed An electronic equipment ontology 200 can be arranged at.That is, wherein the electronic equipment ontology 200 includes at least one camera shooting Mould group 100, wherein each camera module 100 is used to obtain figure, wherein each camera module 200 is further respectively Including the camera lens 20 and the molding photosensory assembly 10.

It is noted that the back side that the camera module 100 can be arranged at the electronic equipment ontology 200 is carried on the back Against the side of the display screen of the electronic equipment ontology 200, the camera module 100 can also be arranged at the electronics The side of the display screen of the both described electronic equipment ontology 200 in front of apparatus body 200 or at least one described camera shooting mould Group 100 is arranged at the back side of the electronic equipment ontology 200 and at least one described camera module 100 be arranged at it is described The front of electronic equipment ontology 200.Certainly, it will be appreciated by those skilled in the art that, in other embodiments, can also be with The camera module 100 is arranged in the side of the electronic equipment ontology 200, the utility model is not in this regard by this Limitation.

Fig. 8 to Figure 12 show the variant embodiment of the molded section 11 of the preferred embodiment of the utility model, these In variant embodiment, described molding photosensory assembly 10A, 10B, 10C, 10D include light shield layer 112A, 112B, 112C, 112D, mould Modeling portion 11A, 11B, 11C, 11D and photographic department 12A, 12B, 12C, 12D, wherein described molded section 11A, 11B, 11C, 11D are coated The surface described photographic department 12A, 12B, 12C, 12D, described light shield layer 112A, 112B, 112C, 112D are attached to the molded section The outer surface 11A, 11B, 11C, 11D.

Described photographic department 12A, 12B, 12C, 12D include sensitive chip 121A, 121B, 121C, 121D, wiring board 122A, 122B, 122C, 122D, lead 123A, 123B, 123C, 123D, electronic component 124A, 124B, 124C, 124D.The molding Portion 11A, 11B, 11C, 11D include molded section main body 111A, 111B, 111C, 111D.The sensitive chip 121A, 121B, 121C, 121D have photosensitive area 1211A, 1211B, 1211C, 1211D and non-photo-sensing area 1212A, 1212B, 1212C, 1212D. As shown in figure 8, another variant embodiment of the molded section 11 of the preferred embodiment based on the utility model is illustrated.With it is upper It states unlike preferred embodiment, is a flat surface at the top of molded section 11A.To which the manufacture difficulty of mold reduces, due to described The drop of the photosensitive surface of the top mounting surface of molded section 11A and the sensitive chip 121A no longer needs mold to realize, Identical topology requirement can be realized in the surface drop that mold only needs to provide very little, and the difficulty of processing of mold and time drop significantly It is low, while the difficulty of material filling is significantly reduced when producing, the reduction of promotion and cost for efficiency all has contributed much.

That is, the logical region 110A of the light is defined in the molded section main body 111A by the light shield layer 112A and puts down Whole top mounting surface, the photosensitive area 121A corresponding to the sensitive chip 121A.Correspondingly, the translucent element 40A covers It covers the light and leads to region 110A, be attached at the smooth top mounting surface of the molded section main body 111A.

As shown in figure 9, another variant embodiment quilt of the molded section 11 of the preferred embodiment based on the utility model It illustrates.It is compared with the molded section 11A of Fig. 8, for the ease of attaching filter element 40B, the top mounting surface of molded section 11B The light lead to region 110B extend downwardly and inwardly to form a filter element mounting groove, the filter element 40B is installed in In the filter element mounting groove, the upper surface of the filter element 40B and the molding for being provided with the light shield layer 112B The top mounting surface of portion 11B in the same plane, thus for the embodiment in described Fig. 8, the embodiment of Fig. 9 In the filter element 40B will not protrude from the molded section main body 111B of the molded section 11B.

That is, the groove is implemented as the filter element mounting groove.The light leads to region 110B and is defined as The bottom surface of the filter element mounting groove, the filter element 40B are installed on the filter element mounting groove.At this point, described Molded section main body 111B is coated on the side and bottom surface of the translucent element 40B, wherein the top surface of the translucent element 40B and The top mounting surface of the molded section 11B is in same level.As shown in Figure 10, based on the preferred implementation of the utility model Another variant embodiment of the molded section 11 of example is illustrated.It is compared with the molded section 11A of Fig. 8, the filter element The installation site of 40C is different.In embodiment shown in Fig. 10, the filter element 40C is mounted on the sensitive chip 121C On.That is, when molding, the molded section 11C of formation is molded by the filter element 40C and described photosensitive The sensitive chip 121C of portion 12C is fully wrapped around.Do not have in the embodiment as Fig. 9 the molded section 11B's in this way Top surface is additionally formed the filter element mounting groove for installing the filter element 40B.To further make adding for mold Work difficulty and time substantially reduce, while the difficulty of material filling is significantly reduced when producing, the promotion and cost for efficiency Reduction all have contributed much.

That is, the logical region 110A of the light is defined in the molded section main body 111A by the light shield layer 112A and puts down Whole top mounting surface, the photosensitive area 121A corresponding to the sensitive chip 121A.The molded section main body 111C coats institute Filter element 40C is stated in the sensitive chip 121C, and coats the sensitive chip 121C, the wiring board 122C, described draw Line 123C and or the electronic component 124C.

There are many variant embodiments in various embodiments for the installation site of the filter element 40.Institute in Figure 10 It states filter element 40C and is mounted on the sensitive chip 121C.The filter element 40C and the photosensory assembly 20C are in mold In be commonly moulded together and be completed.In other embodiments such as the embodiment of Fig. 1 and Fig. 8, the filter element 40,40A is set It is placed in the molded section 11, the top of 11A is in the molding photosensory assembly 10, and 10A is installed after being molded integrated molding The filter element 40,40A.

It will be appreciated by those skilled in the art that filter element 40C described in embodiment shown in Fig. 10 is mounted The implementation of Fig. 1 and Fig. 5 is readily applicable in the photosensitive element 121C, and by the molded section 11C deformation implementation wrapped up In example, belong to the variant embodiment of the different installation sites of the filter element 40.It certainly, in other embodiments can also be with Other embodiments mode, the utility model are not limited thereto in this regard.

As shown in figure 11, another variant embodiment quilt of the molded section 11 of the preferred embodiment based on the utility model It illustrates.Further, for the embodiment of Fig. 8, the filter element 40A is cast out, it is only necessary to will be played optical filtering and be made Optical filtering plated film leads to region 110D in the light of not lightproof area i.e. the molded section 11D and directly forms a filter layer 113D, that is, the filter element 40A may be implemented as the filter layer 113D.Relative to the conventional optical filtering Unorganic glass substrate used in element 40, the organic material that moulding material uses have better transmitance, being capable of certain journey Degree improves optical filtering efficiency.

It is noted that the engagement edge of the light shield layer 112D and the filter layer 113D be it is overlapped to avoid Full spectrum light line is directly entered the photosensitive area 1211D of the sensitive chip 121D.It will be appreciated by those skilled in the art that , the light shield layer 112D can be on the filter layer 113D, can also be under the filter layer 113D.Such as Figure 12 Shown, another variant embodiment of the molded section 10 of the preferred embodiment based on the utility model is illustrated.Further, For the embodiment of Fig. 1, the filter element 40 is cast out, it is only necessary to will play the light absorbent of filter action not Lightproof area i.e. the light of the molded section 11 lead to region 110 and directly form a reflective layer 113a, described reflective Layer 113a concentrates the light of reflection specified wavelength, such as infrared light or visible light.Similarly, relative to the conventional optical filtering Unorganic glass substrate used in element 40, the organic material that moulding material uses have better transmitance, being capable of certain journey Degree improves optical filtering efficiency.It is noted that the engagement edge of the light shield layer 112 and the reflective layer 113a are overlapped The photosensitive area 1211 of the sensitive chip 121 is directly entered to avoid full spectrum light line.The light shield layer 112 can be It, can also be under the reflective layer 113a on the reflective layer 113a.

It will be appreciated by those skilled in the art that the reflective layer 113a also can be incorporated in shown in Figure 11 in fact It applies in example, with the filter layer 113D of embodiment in alternate figures 11.Certainly, there can also be other implementations in other embodiments Mode, the utility model are not limited thereto in this regard.

Each embodiment shown in Fig. 1 to Figure 12 be all using MOC technique.As shown in Figure 13, Figure 14 and Figure 15, institute State camera module 100E, 100F, 100G be based on MOB technique, the shape and structure of the molded section 11 and deformation implementation and The utility model people in other patent documents MOB technique disclose molded section 11 and deformation can be it is identical, it is different It is that in embodiment shown in Figure 13, the molded section main body 111E is made of transparent material, and the utility model people is special at other The material of MOB technique discloses in sharp file molded section main body 111 and deformation is non-transparent material.The substitution of this material is same Sample can embody the advantage in above-mentioned MOC moulding technology.In addition it is possible to reduce the reflection of light, flash, stray light.

As shown in FIG. 13 to 15, described molding photosensory assembly 10E, 10F, 10G include molded section 11E, 11F, a 11G And photographic department 12E, 12F, a 12G, described photographic department 12E, 12F, 12G include sensitive chip 121E, 121F, a 121G and One wiring board 122E, 122F, 122G.Described sensitive chip 121E, 121F, 121G be set to the wiring board 122E, 122F, 122G makes the molded section 11E, 11F, 11G, the sensitive chip 121E, 121F, 121G, the route by moulding technology Plate 122E, 122F, 122G form integral structure.

Described molded section 11E, 11F, 11G further comprise at least molded section main body 111E, 111F, 111G.The sense Optical assembly 10E, 10F, 10G further comprise at least light shield layer 112E, 112F, 112G, the light shield layer 112E, 112F, 112G is capped on a part of the outer surface of described molded section main body 111E, 111F, 111G, and the molded section main body 111E, 111F, 111G also form an at least through-hole, and the through-hole is opposite with described sensitive chip 121E, 121F, 121G, to mention For the passage of light of described sensitive chip 121E, 121F, 121G.Incline in what is be gradually increased from the bottom to top the bottom of the through-hole It is ramp-like.Described molded section main body 111E, 111F, 111G are made of clear material.

The top of described molded section 11E, 11F, 11G are suitable for being installed to camera lens, driver or the optical filtering of a few camera module Element.Described molding photosensory assembly 10E, 10F, 10G further include at least electronic component 124E, 124F, 124G, the electricity Sub- component 124E, 124F, 124G are arranged at described wiring board 122E, 122F, 122G, described molded section 11E, 11F, 11G Also coat described electronic component 124E, 124F, 124G.Described molding photosensory assembly 10E, 10F, 10G further include at least one drawing Line 123E, 123F, 123G, described lead 123E, 123F, 123G are electrically connected described sensitive chip 121E, 121F, 121G and described Wiring board 122E, 122F, 122G, described molded section 11E, 11F, 11G also coat the part lead 123E, 123F, 123G or Person is whole.

In other embodiments of the utility model, the molded section 11E also coats the institute of the sensitive chip 121E State non-photo-sensing area 1212E.That is, non-photo-sensing region 1212E molded section main body made of transparent material The photosensitive area 1211E of 111E protection, the exposure sensitive chip 121E receives light conversion signal.The translucent element 40E, 40F is supported in the through-hole by the molded section, for filtering light, and forms the space of sealing, avoids described in dust pollution Photosensitive area 1211E.

In addition, in other embodiments, the top of the molded section 11E has a mounting groove, and the mounting groove is connected to The through-hole, with filter element 40E, 40F, 40G, camera lens 20E, 20G or the driver for installing an at least camera module 30E, 30G, as shown in figures 13 and 15.

As shown in figure 14 in Figure 13 unlike, the molded section 11F further includes an at least camera lens construction section 114F, The camera lens construction section 114F and the molded body 111F integrally mold connection, i.e., the described camera lens construction section 114F is by described The circumference of molded body 111F upwardly extends to be formed.The camera lens construction section 114F is used to install the mirror of an at least camera module Head.

As shown in Figures 2 and 3, when progress moulding technology forms the molded section main body 111, have by a molding 900 to form the moulding material for being implemented as fluid state after hardening at least integrally formed described in the wiring board 122 Molded section main body 111.

Specifically, the molding die 900 includes a upper mold 901 and once mold 902, wherein the upper mold 901 and the lower mold 902 at least one mold can be moved so that the upper mold 901 and the lower mold 902 can be by carry out die closing operation, and an at least molding space is formed between the upper mold 901 and the lower mold 902 903, wherein the molded section main body 111 is added into the molding space 903 by the moulding material and is formed after hardening.

It is noted that the utility model relates to the moulding material of flow-like can be fluent material or solid Body granular materials or liquid and solid particle mixing material, it is to be understood that no matter the moulding material is implemented as liquid Body material is also implemented as solid particulate materials or is implemented as liquid and solid particle mixing material, being added into After the molding space 903 for stating molding die 900, can it solidify to form the molded section main body 111.Such as in this reality With in this novel specific example, the moulding material of flow-like is implemented as the thermosetting material of such as liquid, wherein The moulding material solidifies after the molding space 903 for being added into the molding die 900 to form the molded section master Body 111.It is noted that when the moulding material of flow-like is added into the molding space of the molding die 900 After 903, the curing mode of the moulding material of flow-like does not limit the content and range of the utility model.

Therefore, the manufacture difficulty of the molding die 900 is lowered, due to top mounting surface and chip photosensitive surface Drop no longer needs the molding die 900 to realize, the surface drop that mold only needs to provide very little can be realized identical Topology requirement, the difficulty of processing of the molding die 900 and time substantially reduce, at the same when producing material filling difficulty it is also bright Aobvious to reduce, efficiency is enhanced while cost is also reduced by.

It is noted that the molding portion of the molding photosensory assembly of the utility model is identical as routine, only institute It states molding die 900 and no longer needs contact chip surface, semi-finished product need to be fixed on described in 900 cavity of molding die 900 side of molding die, the other side do not contact completely with the molding die 900.

It is noted that the formation of the light shield layer 112 and the filter layer 113 can be carried out with random order, shape At mode include but is not limited to be electroplated, change plating, sputter, attach, printing, spraying, package, molding, injection molding etc. modes.Simultaneously not The position for needing to form light shield layer or filter layer applies certain safeguard measure, and safeguard measure can just shift to an earlier date before this process It is carried out and is blocked with other removable materials such as exposure mask mask, mold, other media or light shield layer itself, it can also be at this Required layer is formed directly with required shape by software set when process carries out.

That is, when forming the molded section 11 using moulding technology following steps can be used:

(a) photographic department 12 of a molding photosensory assembly 10 is accommodated in the molding space 903 of the molding die 900, Described in molding photosensory assembly 10 semi-finished product be fixed in the lower mold 902, wherein it is described molding photosensory assembly 10 sense The inner bottom surface of optical chip 121 and the upper mold 901 has default spacing.

(b) moulding material of fluid state is injected in the molding space 903, wherein the moulding material is transparent material Material.

(c) solidify the moulding material, the molded section main body 111 is formed, wherein the molded section main body 111 is coated on The surface of the photographic department 12.

(d) correspond to sensitive chip 121, form a light shield layer in predeterminated position, define the light and lead to region 112.

(e) filter layer or a reflective layer are formed and leads to region 112 in the light, for filtering light.

Or

(f) translucent element 40 is attached, light is stated described in covering and leads to region 112.

Preferably, the inner bottom surface of the upper mold 901 forms a lug boss, is used to form the translucent element installation Slot.Lug boss size under upper is gradually reduced, to reduce die drawing resistance.At this point, the light lead to region 112 be defined with The translucent element installs trench bottom, and the translucent element 40 or the filter layer are accordingly mounted or are formed in the light transmission Member mounting recess.

Certainly, when forming the molded section as described in Fig. 8 and Figure 10,11 upper flat of molded section not necessarily forms institute State lug boss.Further, when forming molding photosensory assembly 10C as described in Figure 10, the filter element 40C is first mounted on The sensitive chip 121C, then step (a) is executed, to realize that the molded section 11C coats the filter element 40C and the sense The surface optical chip 121C.

As shown in figure 15, wherein the camera module 100G further comprises the supporting member 70G of an at least frame shape, Described in supporting member 70G be arranged at the wiring board 122G, wherein the molded section main body 111G is at least wrapped after shaping The outer side edges of the supporting member 70G are buried, so that the sensitive chip 121G, the wiring board 122G, the supporting member 70G It is integrally combined with the molded section main body 111G, wherein the molded section main body 111G can embed the lead 123G extremely Few a part or the supporting member 70G embed at least part of the lead 123G, the molded section main body 111G and The supporting member 70G embeds at least part of the lead 123G respectively.In other examples, the molded section main body 111G can also further embed at least part of the top surface of the supporting member 70G.

Further, the supporting member 70G is arranged on the outside of the lead 123G, in order to avoid hinder the sensitive chip The connection of the connection point 1221G of the photosensitive tie point 1210G and the wiring board 122G of 121G, reduce the lead 123G Needed length, especially when the lead 123G be gold thread when.At this point, the inner side edge of the supporting member 70G can embed institute Lead 123G is stated, or the supporting member 70G and lead 123G is embedded by the molded section 11G.

The supporting member 70G can by but be not limited to glue formed after hardening or metal plating or change plating shape At or solution coating after lose solvent cures and formed so that the supporting member 70G protrudes from the wiring board 122G, in a molding process, guarantee that the wiring board 122G mounts the site flatness of the sensitive chip 121G.Separately Outside, the supporting member 70G also can have elasticity, to result from the upper mold when the molding die 900 is molded The impact force of tool 901 and the lower mold 902 can be absorbed by the supporting member 70G and avoid acting on the wiring board 122G On, in addition, the supporting member 70G can also prevent top surface and institute in the supporting member 70G by way of deformation It states and generates gap between the forming surface of upper mold 901.Also, the supporting member 70G can support the upper mold 901 The forming surface, to prevent the upper mold 901 from applying pressure to the lead 123G, to guarantee the good electricity of the lead 123G Property.

The utility model is also disclosed that an array camera shooting that the molding photosensory assembly 10 assembling of the utility model is formed Mould group 1000, wherein each molded section main body is all made of transparent material.The array camera module 1000 can be applied In various electronic equipments, to assist user that can shoot the image of object or person by the array camera module, such as The array camera module can be used to shoot the image datas such as image or the video of object or personage.Preferably, institute A mobile electronic device can be applied to by stating array camera module, such as the mobile electronic device can be but not limited to hand Machine or tablet computer equipment.

As shown in Figure 16 to Figure 28, the array camera module of the utility model is carried out in following description with it For the content and advantage for illustrating the utility model for the array camera module of a twin-lens.The array camera module includes two Camera lens and two molding photosensory assemblies, and in the other embodiments of the utility model, the camera lens and photosensitive group of the molding The quantity of part can be more, and such as three or more, those skilled in the art is it should be understood that its quantity is not this reality With the limitation of novel array camera module.

Those skilled in the art is it should be understood that a camera lens and a molding photosensory assembly can phases Mutually cooperation is to be used for filmed image.Specifically, subject, as object or person reflect light by the camera lens it It can be received afterwards by the sensitive chip of the molding photosensory assembly to carry out photoelectric conversion, in other words, the sensitive chip can To convert optical signal into electric signal, and the electric signal can be passed by the wiring board of the molding photosensory assembly It send to the electronic equipment, to generate image relevant to reference object on the electronic equipment.

Specifically, as shown in Figure 16 to Figure 28, array camera module 1000H, 1000I, 1000J, 1000K, 1000L, 1000M, 1000N, 1000O, 1000P, 1000Q, 1000R, 1000S, 1000T respectively include camera lens 20H, 20I, 20J, 20K, 20L, 20M, 20N, 20O, 20P, 20Q, 20R, 20S, 20T and molding photosensory assembly 10H, 10I, 10J, 10K, 10L, 10M, 10N,10O,10P,10Q, 10R,10S,10T.Dynamic coke camera module 1000H, 1000I, 1000K, 1000L, 1000M, 1000O, 1000P, 1000Q, 1000S, 1000T can also include driver 30H, 30I, 30K, 30L, 30M, 30O, 30P, 30Q, 30S, 30T。

Described molding photosensory assembly 10H, 10I, 10J, 10K, 10L, 10M, 10N, 10O, 10P, 10Q, 10R, 10S, 10T points Not Bao Kuo light shield layer 112H, 112I, 112J, 112K, 112L, 112M, 112N, 112O, 112P, 112Q, 112R, 112S, 112T, molded section 11H, 11I, 11J, 11K, 11L, 11M, 11N, 11O, 11P, 11Q, 11R, 11S, 11T and photographic department 12H, 12I,12J,12K, 12L,12M,12N,12O,12P,12Q,12R,12S,12T.The photographic department 12H, 12I, 12J, 12K, 12L, 12M, 12N, 12O, 12P, 12Q, 12R, 12S, 12T respectively include sensitive chip 121H, 121I, 121J, 121K, 121L, 121M, 121N, 121O, 121P, 121Q, 121R, 121S, 121T, wiring board 122H, 122I, 122J, 122K, 122L, 122M, 122N, 122O, 122P, 122Q, 122R, 122S, 122T, lead 123H, 123I, 123J, 123K, 123L, 123M, 123N, 123O, 123P, 123Q, 123R, 123S, 123T, electronic component 124H, 124I, 124J, 124K, 124L, 124M, 124N, 124O,124P,124Q,124R,124S,124T.The molded section 11H, 11I, 11J, 11K, 11L, 11M, 11N, 11O, 11P, 11Q, 11R, 11S, 11T respectively include molded section main body 111H, 111I, 111J, 111K, 111L, 111M, 111N, 111O, 111P、 111Q、111R、111S、111T。

The sensitive chip 121H, 121I, 121J, 121K, 121L, 121M, 121N, 121O, 121P, 121Q, 121R, 121S, 121T be respectively provided with photosensitive area 1211H, 1211I, 1211J, 1211K, 1211L, 1211M, 1211N, 1211O, 1211P, 1211Q, 1211R, 1211S, 1211T and non-photo-sensing area 1212H, 1212I, 1212J, 1212K, 1212L, 1212M, 1212N,1212O,1212P,1212Q,1212R, 1212S,1212T.The camera lens and the mould described in above-described embodiment Modeling photosensory assembly may be suitable for constituting the array camera module 1000H, 1000I, 1000J, 1000K, 1000L, 1000M, 1000N, 1000O, 1000P, 1000Q, 1000R, 1000S, 1000T, association, preparation method between element and Details are not described herein again for feature etc..

As shown in figure 16, an embodiment of the array camera module 1000H is illustrated, wherein the camera module 1000H includes two camera lens 20H, two sensitive chip 121H and a wiring board 122H, wherein described It is molded at least one disjunctor molded section 300H on wiring board 122H and is provided at least two groups lead 123H, wherein each institute The chip attachment region that sensitive chip 121H is mounted on the wiring board 122H respectively is stated, and is led by the lead 123H Lead to each sensitive chip 121H.Each optical lens 20H is respectively held in the photosensitive of each sensitive chip 121H Path.The disjunctor molded section 300H is formed by the adjacent molded section main body 111H integrally connected.The light shield layer 112H It is covered in the outer surface of the disjunctor molded section 300H.

In addition, the array camera module 1000H can also include two driver 30H, wherein each mirror Head 20H is driveably set to each driver 30H respectively, and each driver 30H is mounted on described respectively Molded section 11H, so that each camera lens 20H is respectively held in the photosensitive path of each sensitive chip 121H.

Further, the camera module 1000H can further include an at least filter element 40H, wherein each The filter element 40H is respectively held between each camera lens 20H and each sensitive chip 121H.For example, every A filter element 40H can be mounted on the molded section 11H respectively so that each filter element 40H respectively by It is maintained between each camera lens 20H and each sensitive chip 121H.

It is noted that the array camera module 1000H shown in attached drawing 16 is merely illustrative, when the array images When mould group 1000H is implemented as comprising more described camera lens 20H, the quantity of the sensitive chip 121H, the filter element The quantity of 40H and the quantity of the driver 30H can be consistent with the quantity of the camera lens 20H.

That is, the molding photosensory assembly 10H of the array mould group 1000H may be implemented as the molding sense in Fig. 1 Optical assembly 10, particularly, the adjacent wiring board 122 are connected to form wiring board entirety, i.e., the described wiring board 122H.

It is appreciated that the disjunctor molded section 300H of the array mould group 1000H, the driver 30H, filter The features such as optical element 40H and whole wiring board can also be applied in the following embodiments, and details are not described herein again.

As shown in figure 17, a variant embodiment and Figure 16 difference of the array camera module 1000H are shown , wherein the camera module 1000I includes two camera lens 20I, two sensitive chip 121I and two institutes Wiring board 122I is stated, the molded section 11I of connection makes two wiring board 122I moldings be combined as a whole.That is, The molding photosensory assembly 10I of the camera module 1000I may be implemented as the molding photosensory assembly 10 in Fig. 1, particularly, phase The adjacent wiring board 122, i.e., the described wiring board 122I is spaced apart from each other, wherein the molded section 11I fills the adjacent line Road plate 122 is spaced, so that the two is connected.

As shown in figure 18, another variant embodiment of the array camera module 1000H, the molded section are shown The structure of the molded section 11 in 11J and Fig. 5 is identical, that is to say, that molding photosensory assembly 10 shown in fig. 5 is in the present embodiment Middle implementation, as molding photosensory assembly 10J.Specifically, the molded section 11J further includes an at least camera lens construction section 114J, The camera lens installation portion 114J is integrally upwardly extended in the molded section main body 111J, and each camera lens 20 is set respectively In the camera lens construction section 114J, so that each camera lens is respectively held in the photosensitive path of each sensitive chip 121J.

As shown in figure 19, another variant embodiment of the array camera module 1000H is shown, the array is taken the photograph As one of them described camera lens 20K of mould group 1000K is driveably set to the driver 30K, the driver 30K It is mounted on the molded section 11K, another described camera lens 20K is arranged at the camera lens construction section 114K, so that the mirror Head 20K is maintained at the photosensitive path of the sensitive chip 121K.The molded section 11K of Figure 19 is molded section described in Fig. 1 The implementation of the molded section 11 in 11 and Fig. 5 in the array camera module 1000K.

That is, described light shield layer 112H, 112I, 112J, 112K correspond to photosensitive area as shown in Figure 16 to 19 1211H, 1211I, 1211J, 1211K define light and lead to region 110H, 110I, 110J, 110K.The filter element 40H, 40I, 40J, 40K are covered in the light and lead to region 110H, 110I, 110J, 110K.

As shown in figure 20, another variant embodiment of the array camera module 1000H and the institute of Figure 16 are shown State array camera module 1000H the difference is that, the filter element 40H is rejected, the array camera module 1000L's The filter layer 113L is arranged by the top surface in the molded section 11L to realize in the demand of filtering functions.That is, institute State the molding photosensory assembly 10 that molding photosensory assembly 10L is implemented as described Figure 12, particularly, the adjacent route Plate 122 is connected to form a whole wiring board, i.e. wiring board 122L.

As shown in figure 21, another variant embodiment of the array camera module 1000H and the institute of Figure 20 are shown State array camera module 1000L the difference is that, wherein the camera module 1000M include two camera lens 20M, two The sensitive chip 121M and two wiring board 122M, the molded section 11M of connection make two wiring boards 122M molding is combined as a whole.That is, the difference is that, the wiring board 122M is spaced apart from each other, wherein the mould with Figure 20 Modeling portion 11M fills the adjacent interval the wiring board 122M, so that the two molding ground is connected.

As shown in figure 22, another variant embodiment of the array camera module 1000H and the institute of Figure 20 are shown State array camera module 1000L the difference is that, the molded section 11N further includes an at least camera lens construction section 114N, described Camera lens installation portion 114N is integrally upwardly extended to be arranged at respectively in the molded section main body 111N, each camera lens 20N The camera lens construction section 114N, so that each camera lens 20N is respectively held in the photosensitive of each sensitive chip 121N Path.

As shown in figure 23, another variant embodiment of the array camera module 1000H and the institute of Figure 22 are shown State array camera module 1000N the difference is that, one of them described camera lens 20O quilt of the array camera module 1000O It is driveably set to the driver 30O, the driver 30O is mounted on the molded section 11O, another described camera lens 20O is arranged at the camera lens construction section 114O, so that the camera lens 20O is maintained at the photosensitive road of the sensitive chip 121O Diameter.

That is, described light shield layer 1211L, 1211M, 1211N, 1211O correspond to photosensitive as shown in Figure 20 to 23 Area 1212L, 1212M, 1212N, 1212O define light and lead to region 110L, 110M, 110N, 110O.The filter element is rejected, Described filter layer 113L, 113M, 113N, 113O are covered in the light and lead to region 110L, 110M, 110N, 110O.

Array camera module described above can be realized based on previously described MOC technique, specifically realize step and mistake Details are not described herein again for journey.

As shown in figure 24, another variant embodiment of the array camera module 1000H is shown, the array is taken the photograph As the structure of the molded section 11P of mould group 1000P is identical with the structure of molded section 11E described in Figure 13.Particularly, adjacent The wiring board 122 is connected to form a whole wiring board, i.e. wiring board 122P.

As shown in figure 25, another variant embodiment of the array camera module 1000H and the institute of Figure 24 are shown State array camera module 1000P the difference is that, wherein the camera module 1000Q include two camera lens 20Q, two The sensitive chip 121Q and two wiring board 122Q, the molded section 11Q of connection make two wiring boards 122Q molding is combined as a whole.That is, the wiring board 122Q is spaced apart from each other, wherein molded section 11Q filling is adjacent The interval the wiring board 122Q so that the two be connected.

As shown in figure 26, another variant embodiment of the array camera module 1000H and the institute of Figure 24 are shown State array camera module 1000P the difference is that, the molded section 11R of the array camera module 1000R further include to Few camera lens construction section 114R, the camera lens installation portion 114R are integrally upwardly extended in the molded section main body 111R, each Camera lens is arranged at the camera lens construction section 114R respectively, so that each camera lens 20R is respectively held in each sense The photosensitive path of optical chip 121R.That is, photosensitive group of molding shown in the structure and Figure 14 of the molding photosensory assembly 10R Part 10F is identical, and particularly, adjacent wiring board 122F is adjacent, the integral wiring board of shape, i.e. wiring board 122R.

As shown in figure 27, another variant embodiment of the array camera module 1000H and the institute of Figure 26 are shown State array camera module 1000R the difference is that, one of them described camera lens 20S quilt of the array camera module 1000S It is driveably set to the driver 30S, the driver 30S is mounted on the molded section 11S, another described camera lens 20S is arranged at the camera lens construction section 114S, so that the camera lens 20S is maintained at the photosensitive road of the sensitive chip 121S Diameter.

As shown in figure 28, show the array camera module 1000H another variant embodiment and above-mentioned implementation Unlike example, wherein the quantity of the filter element 40T of the array camera module 1000T is implemented as one, thus Each camera lens 20T can correspond respectively to the different location of the filter element 40T.That is, adjacent camera shooting mould The translucent element connection shape of group 1000T is integral, i.e., the described translucent element 40T.

That is, the camera shooting molding of array shown in Figure 24 to 28 can be realized based on MOB technique above, herein no longer It repeats.At this point, translucent element 40P, 40Q, 40R, 40S, 40T are by described molded section main body 111P, 111Q, 111R, 111S, 111T Support, the photosensitive area corresponding to described sensitive chip 121P, 121Q, 121S, 121T.

It is noted that in the other embodiments of the utility model, the molding photosensory assembly and other normal lights When learning lens assembling formation camera module or array camera module, the MOC by Fig. 1 to Figure 12 of transparent material molds work The molded section main body 111 and optical lens made of skill are capable of forming the camera module or the array camera module An at least lens group.That is, the molded section main body 111 after molding can assist in other common lens opticals and set Meter.Since transparent material relative atmospheric has bigger refractive index to light, by adjusting the different-thickness of hyaline layer above chip Different optical properties can be also obtained with different materials even different surfaces shape, is equivalent to a monolith transparent material and top Camera lens has collectively constituted a huge lens group, provides more design spaces for lens design, can finally make to assemble shape Better optical property and smaller outer dimension are obtained at camera module or array camera module.

It is noted that internal structure can be observed directly before the light shield layer 112 formation, ultrasonic wave is omitted Or the complicated procedures of forming of X-ray examination, promote the efficiency of the bad discovery of quality；Simultaneously in the event of different in all process steps later Often, the transparent position that the light shield layer 112 exposes the molded section 11 can also be removed, whether directly inspection product is problematic.

In addition, it is noted that form camera module or array camera shooting mould since the molding photosensory assembly assembles The other component such as camera lens and driver etc. of group can be used lighttight glue and fixes, and can also play interception, these The light shield layer 112 for drawing glue position also can be omitted to save material and process.It is assembled simultaneously in the molding photosensory assembly If formed camera module when perhaps array camera module is arranged at 200 inside of electronic equipment photography/videography mould group or Array camera module rigging position side does not have illumination or light and can be blocked by equipment other component, the shading of side Layer 112 can equally save.

It is noted that the utility model is mainly by taking monomer camera module as an example to the camera shooting mould of the utility model The feature and advantage of group are expounded, it will be understood by those skilled in the art that in other examples, institute It states camera module 100 and is also possible to twin-lens camera module or array camera module, therefore, monomer camera module is not constituted Limitation to the content and range of the utility model.

It should be understood by those skilled in the art that foregoing description and the embodiments of the present invention shown in the drawings are only used as It illustrates and is not intended to limit the utility model.The purpose of this utility model completely and effectively realizes.The function of the utility model Energy and structural principle show and illustrate in embodiment, under without departing from the principle, the embodiments of the present invention Can there are any deformation or modification.

Claims

1. a kind of molding photosensory assembly is applied to an at least camera module characterized by comprising

One molded section, wherein the molded section includes a molded section main body, wherein the molded section main body is made of transparent material；

One sensitive chip；And

One wiring board, wherein the sensitive chip is attached to the wiring board electrically；

Wherein form the molded section main body of the molded section, the sensitive chip, the wiring board by moulding technology Integral structure.

2. molding photosensory assembly as described in claim 1, further comprises a light shield layer, wherein the light shield layer is covered in institute The outer surface of molded section main body is stated, wherein the light shield layer defines at least area Yi Guangtong in the top surface of the molded section main body Domain, the logical region of the light is corresponding with the sensitive chip, to provide the passage of light of the sensitive chip.

3. as described in claim 1 molding photosensory assembly, wherein the molded section main body coat completely the sensitive chip with The wiring board.

4. as claimed in claim 2 molding photosensory assembly, wherein the molded section main body coat completely the sensitive chip with The wiring board.

5. molding photosensory assembly as claimed in claim 2 or 4, wherein the molded section main body has an at least groove, wherein The groove is recessed by the top surface of the molded section main body and is formed, wherein the light, which leads to region, is arranged at the groove.

6. molding photosensory assembly as claimed in claim 2 or 4, wherein the top surface of the molded section main body is smooth, wherein institute It states the logical region of light and is defined in the smooth top surface of the molded section main body.

7. molding photosensory assembly as claimed in claim 5 further has a filter layer, wherein described in filter layer cladding Light leads to region.

8. molding photosensory assembly as claimed in claim 6 further has a filter layer, wherein described in filter layer cladding Light leads to region.

9. molding photosensory assembly as claimed in claim 7, wherein the edge of the edge of the filter layer and the light shield layer Place is to overlap.

10. molding photosensory assembly as claimed in claim 8, wherein the edge of the edge of the filter layer and the light shield layer Place is to overlap.

11. molding photosensory assembly as claimed in claim 5 further has a reflective layer, wherein reflective layer cladding The light leads to region.

12. molding photosensory assembly as claimed in claim 6 further has a reflective layer, wherein reflective layer cladding The light leads to region.

13. molding photosensory assembly described in claim 11, wherein the edge of the edge of the reflective layer and the light shield layer Place is to overlap.

14. molding photosensory assembly described in claim 12, wherein the edge of the edge of the reflective layer and the light shield layer Place is to overlap.

15. molding photosensory assembly as claimed in claim 5, further comprises a translucent element, wherein the translucent element is pacified Loaded on the groove, covers the light and lead to region.

16. molding photosensory assembly as claimed in claim 6, further comprises a translucent element, wherein the translucent element covers It covers the light and leads to region.

17. molding photosensory assembly as claimed in claim 15, wherein the molded section main body is encapsulated in the translucent element week Side and bottom, wherein the translucent element top surface and the molded section body top surface are in same plane.

18. molding photosensory assembly as claimed in claim 15, wherein the groove gradually decreasees from top to bottom.

19. the molding photosensory assembly as described in Claims 1-4 is any further comprises a translucent element, wherein the optical filtering Element is attached at sensitive chip surface, wherein the molded section main body coats the filter element in the sensitive chip.

20. the molding photosensory assembly as described in Claims 1-4 is any, wherein the molded section further includes at least camera lens peace Fill section, formed wherein the camera lens construction section is upwardly extended by the molded section main body circumference, wherein the camera lens construction section and The molded section main body integrally molds connection.

21. molding photosensory assembly described in claim 5, wherein the molded section further includes a camera lens construction section, wherein described Camera lens construction section is upwardly extended by the molded section main body circumference and is formed, wherein the camera lens construction section and the molded section main body Integrally molding connection.

22. molding photosensory assembly as claimed in claim 6, wherein the molded section further includes a camera lens construction section, wherein described Camera lens construction section is upwardly extended by the molded section main body circumference and is formed, wherein the camera lens construction section and the molded section main body Integrally molding connection.

23. the molding photosensory assembly as described in Claims 1-4 is any further comprises an at least electronic component, wherein institute It states electronic component and is electrically connected to the wiring board, wherein the molded section main body coats the sensitive chip, the wiring board With the electronic component.

24. the molding photosensory assembly as described in Claims 1-4 is any further comprises an at least lead, wherein the lead It is electrically connected the sensitive chip and the wiring board, wherein the molded section main body coats the lead.

25. molding photosensory assembly as described in claim 1, further comprises a light shield layer, the light shield layer is covered in described The outer surface of molded section main body, wherein the molded section main body have an at least through-hole, wherein the through-hole with it is described photosensitive Chip is corresponding, to provide the passage of light of the sensitive chip.

26. molding photosensory assembly as claimed in claim 25, further comprises an at least electronic component, wherein the electronics Component is electrically connected to the wiring board, wherein the molded section main body coats the electronic component in the wiring board.

27. molding photosensory assembly as claimed in claim 25, further comprises an at least lead, wherein the lead is electrically connected The sensitive chip and the wiring board, wherein the molded section main body coats the lead.

28. molding photosensory assembly as claimed in claim 26, wherein the molded section main body is coated on the sensitive chip One non-photo-sensing region.

29. the molding photosensory assembly as described in claim 25 to 28 is any, wherein the through-hole is gradually increased from the bottom to top.

30. the molding photosensory assembly as described in claim 25 to 28 is any further comprises a translucent element, wherein the mould Modeling portion supports the translucent element in the through-hole, for filtering light.

31. the molding photosensory assembly as described in claim 25 to 28 is any, wherein the molded section further includes camera lens installation Section, forms wherein the camera lens construction section is upwardly extended by the main circumference of the molded section, wherein the camera lens construction section and described Molded section main body integrally molds connection.

32. the molding photosensory assembly as described in claim 25 to 28 is any further comprises a supporting member, wherein the branch It holds element and is arranged at the wiring board, wherein the molded section main body embeds the supporting member outer side edges.

33. molding photosensory assembly as claimed in claim 32, further comprises an at least lead, wherein the lead is electrically connected The sensitive chip and the wiring board, the supporting member embed the lead.

34. a camera module characterized by comprising

One camera lens；With

Just like any molding photosensory assembly of claims 1 to 33, wherein the camera lens is supported on the sensitive chip Photosensitive path.

35. camera module as claimed in claim 34 further comprises a driver, wherein the camera lens is driveably set It is placed in the driver, so that the driver drives the camera lens to move back and forth along the photosensitive path of the sensitive chip.

36. camera module as claimed in claim 34 supports the mirror wherein the molded section is implemented as lens bracket Head.

37. a camera module characterized by comprising

At least two camera lenses；

At least two sensitive chips, wherein the camera lens is held in the photosensitive path of the corresponding sensitive chip；An at least line Road plate, wherein the sensitive chip is attached at the wiring board electrically；And

One disjunctor molded section, wherein the disjunctor molded section, the wiring board and the sensitive chip are one by moulding technology Body, wherein the disjunctor molded section is made of clear material.

38. camera module as claimed in claim 37, further there is a light shield layer, wherein the light shield layer be covered in it is described Disjunctor molded section outer surface, wherein the light shield layer, which defines at least two light in the top surface of the disjunctor molded section, leads to region, institute It is corresponding with the sensitive chip to state the logical region of light, to provide the passage of light of the sensitive chip.

39. camera module as claimed in claim 38, wherein the disjunctor molded section coats at least two photosensitive cores completely Piece and the wiring board.

40. camera module as claimed in claim 39 further has at least two filter layers, wherein the filter layer is corresponding It coats the light and leads to region.

41. camera module as claimed in claim 39 further comprises at least two translucent elements, wherein the translucent element pair The covering the answered light leads to region.

42. camera module as claimed in claim 37, further there is a light shield layer, wherein the light shield layer be covered in it is described The outer surface of molded section main body, wherein the molded section main body has at least two through hole, wherein the through-hole and the photosensitive core Piece is corresponding, to provide the passage of light of the sensitive chip.

43. camera module as claimed in claim 42 further comprises at least two translucent elements, wherein the disjunctor molded section Support the translucent element corresponding in corresponding through-hole.

44. camera module as claimed in claim 43, wherein adjacent translucent element connection shape is integral.

45. the camera module as described in claim 37 to 44 is any further comprises an at least driver, wherein at least one institute It states camera lens and is driveably set to the corresponding driver, wherein the driver is installed in the disjunctor molded section.

46. the camera module as described in claim 37 to 44 is any further comprises an at least camera lens construction section, wherein described Camera lens is installed in the corresponding camera lens construction section, wherein the camera lens construction section is by the corresponding sensitive chip circumference Disjunctor molded section part upwardly extends to be formed.

47. the camera module as described in claim 37 to 44 is any, wherein the corresponding line of the adjacent sensitive chip Road plate is arranged by interval, wherein the disjunctor molded section fills the adjacent wiring board interval, molding ground integrally connected is adjacent The wiring board.

48. a camera module characterized by comprising

At least two camera lenses；

At least two sensitive chips, wherein the camera lens is held in the photosensitive path of the corresponding sensitive chip；One wiring board, Wherein the sensitive chip is attached at the wiring board electrically；And

At least two molded sections, wherein the molded section includes a molded section main body, wherein the molded section main body is by by transparent material Material is made, wherein the molded section and the sensitive chip are accordingly integrally molded into the wiring board, wherein adjacent institute Molded section is stated to be arranged by interval.

49. camera module as claimed in claim 48, further there is a light shield layer, wherein the light shield layer be covered in it is described Molded section body outer surface, wherein the light shield layer, which defines at least two light in the top surface of the molded section main body, leads to region, institute It is corresponding with the sensitive chip to state the logical region of light, to provide the passage of light of the sensitive chip.

50. an electronic equipment characterized by comprising

One electronic equipment ontology；With

At least just like any camera module of claim 34 to 36, wherein the camera module is installed in the electronics Apparatus body.

51. an electronic equipment characterized by comprising

One electronic equipment ontology；With

At least just like any array camera module of claim 37 to 47, wherein the array camera module is installed in The electronic equipment ontology.