CN208509365U - Radiator structure and electronic product - Google Patents
Radiator structure and electronic product Download PDFInfo
- Publication number
- CN208509365U CN208509365U CN201820965482.8U CN201820965482U CN208509365U CN 208509365 U CN208509365 U CN 208509365U CN 201820965482 U CN201820965482 U CN 201820965482U CN 208509365 U CN208509365 U CN 208509365U
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- CN
- China
- Prior art keywords
- piece
- cooling fin
- radiator structure
- pcb board
- ridge
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Abstract
The utility model discloses a kind of radiator structure and electronic product, wherein radiator structure includes cooling fin, IC piece and pcb board；The IC piece is set on the pcb board, the cooling fin is installed on the pcb board, and the cooling fin and the IC piece are respectively positioned on the same face of the pcb board, the cooling fin is equipped with the abutting part abutted with the IC piece, and the abutting part is connected to the IC on piece.Technical solutions of the utility model further promote the IC piece heat dissipation effect in electronic product and simplify structure.
Description
Technical field
The utility model relates to technical field of electronic products, in particular to a kind of radiator structure and electronic product.
Background technique
Precise electronic product technology is developed rapidly in recent years.The IC piece of precise electronic needs good heat dissipation effect
Fruit just can guarantee its stable operation.At present there are two types of mainstream IC piece radiate solution, the first scheme mainly by
Cooling fin, two heat conductive silica gels, shielding case and IC piece are sequentially connected assembling, and the heat of IC piece will pass to cooling fin up,
It needs by two heat conductive silica gels and shielding case, however heat conductive silica gel and shielding case heat transfer efficiency are all very poor, eventually result in big
Calorimetric amount accumulates in above IC piece, dissipates and does not go out；Second scheme mainly by cooling fin, shielding case, a heat conductive silica gel and
IC piece is sequentially connected assembling, and the heat of the IC piece of this scheme will be transmitted to cooling fin up, need to only pass through a thermal conductive silicon
Glue, although heat dissipation effect compares the first scheme and is greatly improved, heat is still easily collected on IC piece and leads
On hot silica gel.In conclusion in the prior art, while the scheme for solving IC piece heat dissipation problem has that part is more, at high cost, heat dissipation
The undesirable disadvantage of effect.
Utility model content
The main purpose of the utility model is to provide a kind of radiator structure, it is intended to further promote the IC piece in electronic product
Heat dissipation effect and simplified structure.
To achieve the above object, the utility model proposes radiator structure include cooling fin, IC piece and pcb board；It is described
IC piece is set on the pcb board, and the cooling fin is installed on the pcb board, and the cooling fin is respectively positioned on the IC piece
On the same face of the pcb board, the cooling fin is equipped with the abutting part abutted with the IC piece, and the abutting part is connected to institute
State IC on piece.
Preferably, the shielding part for shielding interference signal is additionally provided on the cooling fin, the shielding part is that setting exists
Shielding piece in the one side that the cooling fin is connect with the pcb board, and the shielding piece is located at the margin location of the cooling fin
It sets.
Preferably, the edge of the cooling fin is equipped with flange, and the flange is the shielding piece, multiple shielding pieces
Seal chamber is enclosed with the cooling fin, when the cooling fin is installed on the pcb board, the IC piece is located at the seal chamber
In.
Preferably, the edge of the cooling fin is equipped with heat dissipation ridge piece, and the heat dissipation ridge piece is provided in the shielding part phase
Pair position.
Preferably, the heat dissipation ridge piece includes that first extended away from the shielding part extends ridge piece, and described first prolongs
It is parallel with the cooling fin to stretch ridge piece.
Preferably, the heat dissipation ridge piece further includes extending ridge piece with unilateral second be oppositely arranged of the first extension ridge,
Described first, which extends the free end of ridge piece and described second, extends ridge piece circular sliding slopes.
Preferably, the first extension ridge piece and the second extension ridge on piece are equipped with multiple convection holes, and multiple institutes
Stating convection holes is in be intervally arranged.
Preferably, the abutting part is convex block of the projection on the cooling fin, and the convex block with the IC piece by connecting
Face convex to form；The top surface of the convex block is abutted with the IC piece, is coated with Heat sink grease on the convex block.
Preferably, the cooling fin by screw or is snapped connection with the pcb board.
The utility model also proposes a kind of electronic product, which includes the radiator structure and be set in described scattered
Shell outside heat structure.The radiator structure includes cooling fin, IC piece and pcb board；The IC piece is set on the pcb board,
The cooling fin is installed on the pcb board, and the cooling fin and the IC piece are respectively positioned on the same face of the pcb board,
The cooling fin is equipped with the abutting part abutted with the IC piece, and the abutting part is connected to the IC on piece.
Technical solutions of the utility model are set on pcb board by using by IC piece, on a heat sink setting and the IC piece
The abutting part of abutting, and pcb board is fixedly connected with cooling fin；So set, cooling fin is directly contacted with the abutting part of IC piece, make
The heat for obtaining IC piece can directly be shed by cooling fin, improving radiating effect.In addition the number of parts of entire radiator structure is few,
Also the difficulty of cost and assembling is reduced while simplifying structure.
Detailed description of the invention
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only
It is some embodiments of the utility model, for those of ordinary skill in the art, in the premise not made the creative labor
Under, the structure that can also be shown according to these attached drawings obtains other attached drawings.
Fig. 1 is the structural schematic diagram of one embodiment of the utility model radiator structure；
Fig. 2 is the structural schematic diagram of the cooling fin of the utility model radiator structure.
Drawing reference numeral explanation:
| Label | Title | Label | Title |
| 10 | Cooling fin | 20 | IC piece |
| 30 | Pcb board | 11 | Abutting part/convex block |
| 12 | Shielding part/shielding piece | 10a | Seal chamber |
| 13 | Radiate ridge piece | 131 | First extends ridge piece |
| 132 | Second extends ridge piece | 13a | Convection holes |
The embodiments will be further described with reference to the accompanying drawings for the realization, functional characteristics and advantage of the utility model aim.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describing, it is clear that described embodiment is only a part of the embodiment of the utility model, rather than all
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are not making creative work premise
Under every other embodiment obtained, fall within the protection scope of the utility model.
It is to be appreciated that the directional instruction (such as up, down, left, right, before and after ...) of institute in the utility model embodiment
It is only used for explaining in relative positional relationship, the motion conditions etc. under a certain particular pose (as shown in the picture) between each component, such as
When the fruit particular pose changes, then directionality instruction also correspondingly changes correspondingly.
In addition, the description for being related to " first ", " second " etc. in the present invention is used for description purposes only, and cannot understand
For its relative importance of indication or suggestion or implicitly indicate the quantity of indicated technical characteristic.Define as a result, " first ",
The feature of " second " can explicitly or implicitly include at least one of the features.In addition, the technical side between each embodiment
Case can be combined with each other, but must be based on can be realized by those of ordinary skill in the art, when the combination of technical solution
Conflicting or cannot achieve when occur will be understood that the combination of this technical solution is not present, also not in the requires of the utility model
Protection scope within.
The utility model proposes a kind of radiator structures.
In the utility model embodiment, referring to Figures 1 and 2, the radiator structure include cooling fin 10, IC piece 20 and
Pcb board 30；The IC piece 20 is set on the pcb board 30, and the cooling fin 10 is installed on the pcb board 30, and described scattered
Backing 10 and the IC piece 20, which are respectively positioned on the same face of the pcb board 30, to be arranged in the one side of the IC piece 20, the heat dissipation
Piece 10 is equipped with the abutting part 11 abutted with the IC piece 20, and the abutting part 11 is connected on the IC piece 20.
Specifically, in order to which the heat for the IC piece 20 being set on pcb board 30 can be directly transferred on cooling fin 10, therefore
Abutting part 11 is set on cooling fin 10, allows cooling fin 10 directly to contact with IC piece 20 by abutting part 11, realizes heat loss through conduction
Purpose.In the present embodiment, pcb board 30 is fixedly connected with cooling fin 10, so that the IC piece 20 being arranged on pcb board 30
Abutting part 11 contacted with cooling fin 10 it is closer, guarantee IC piece 20 heat can conduct to cooling fin 10.Pcb board 30 and dissipate
The connection of backing 10 is not specifically limited, as long as meeting current use demand.Preferably, the cooling fin 10 with it is described
Pcb board 30 is by screw or snaps connection, the contact compactness of heat radiation piece 10 and pcb board 30, with heat radiation piece 10
Heat dissipation effect.By above-mentioned setting, such cooling fin 10 is directly contacted with the abutting part 11 of IC piece 20, so that the heat of IC piece 20
It can directly be shed by cooling fin 10, improving radiating effect.In addition the number of parts of entire radiator structure is few, simplifies structure
The difficulty of cost and assembling is also reduced simultaneously.Preferably, in the present embodiment, cooling fin 10 uses the preferable material of heating conduction
Material, such as: metal material or heat conduction with phase change insulating materials.
Technical solutions of the utility model are by the way that IC piece 20 to be set on pcb board 30, setting and the IC on cooling fin 10
The abutting part 11 that piece 20 abuts, and pcb board 30 is fixedly connected with cooling fin 10；So set, cooling fin 10 and IC piece 20 supports
Socket part 11 directly contacts, so that the heat of IC piece 20 can directly be shed by cooling fin 10, improving radiating effect.In addition entire
The number of parts of radiator structure is few, and the difficulty of cost and assembling is also reduced while simplifying structure.
Further, referring to Figures 1 and 2, the shielding part 12 for shielding interference signal is additionally provided on the cooling fin 10,
The shielding part 12 is the shielding piece being arranged in the one side that the cooling fin 10 is connect with the pcb board 30, and the shielding
Piece is located at the marginal position of the cooling fin 10.In the present embodiment, in order to solve IC piece 20 from external interference effect of signals
Operation, therefore shielding part 12 is also set up in cooling fin 10.By being arranged to shielding part 12 to shield the shape of piece, increase shielding part
12 shielding surface promotes shield effectiveness；The one side that cooling fin 10 is connect with pcb board 30 is set by that will shield piece 12 simultaneously
On, and the marginal position that piece 12 is located at cooling fin 10 is shielded, it is formed and shielding protection sky is carried out to the IC piece 20 being set on pcb board 30
Between.
Further, referring to Figures 1 and 2, the edge of the cooling fin 10 is equipped with flange, and the flange is the shielding
Piece 12, multiple shielding pieces 12 enclose seal chamber 10a with the cooling fin 10, and the cooling fin 10 is installed in the PCB
When on plate 30, the IC piece 20 is located in the seal chamber 10a.
In the present embodiment, the comprehensive of the IC piece 20 of pcb board 30 is arranged in pairs in by multiple shielding 12 shapes of piece of setting
Shielding protection promotes shield effectiveness；Shielding piece 12 simultaneously is flange, on the one hand in process without adding other zero
Part is welded on cooling fin 10, but is formed from the direct flange of cooling fin 10, and manufacturing procedure is simplified；On the other hand, setting is utilized
Shielding piece 12 at the edge of cooling fin 10 forms the seal chamber 10a of accommodating IC piece 20, different direction is unfolded to IC piece 20
Shielding protection.Further, the edge of the cooling fin 10 is equipped with heat dissipation ridge piece 13, and the heat dissipation ridge piece 13 is provided in described
The opposite position of shielding part 11.In the present embodiment, by setting radiate ridge piece, increase cooling fin 10 heat dissipation area, with into
The heat dissipation area of one step heat radiation piece 10.
Further, referring to Figures 1 and 2, the heat dissipation ridge piece 13 includes that first extended away from the shielding part 11 prolongs
Ridge piece 131 is stretched, and the first extension ridge piece 131 is parallel with the cooling fin 10.In the present embodiment, by by cooling fin 10
The first extension ridge piece 131 has been extended to form, the heat dissipation area of heat dissipation ridge piece 13, improving radiating effect are further increased；While the
One extension ridge piece 131 is parallel with cooling fin 10, that is to say, that adding the first extension ridge piece 131 does not influence cooling fin 10 and pcb board
30 connection.
Still further, referring to Figures 1 and 2, the heat dissipation ridge piece 13 further includes extending 131 face phase of ridge piece with described first
Extend ridge piece 132 to the second of setting, described first, which extends the free end of ridge piece 131 and described second, extends 132 circular arc of ridge piece
Connection.Extend ridge piece 131 similarly with above-mentioned first, the second extension ridge piece 132 equally further increases dissipating for heat dissipation ridge piece 13
Heat area, improving radiating effect, and the connection of cooling fin 10 Yu pcb board 30 is not influenced.Certainly in other embodiments, radiate ridge
Piece 13 can also be arranged to other shapes to achieve the purpose that increase heat dissipation area.
Further, referring to Figures 1 and 2, it is all provided on the first extension ridge piece 131 and the second extension ridge piece 132
There are multiple convection holes 130, and multiple convection holes 130 are in be intervally arranged.In the present embodiment, multiple convection holes 130 are set,
It is introduced by convection holes 130 on the air to entire cooling fin 10 of flowing, is taken away and accumulated on cooling fin 10 with the air of flowing
Heat, reach heat dissipation purpose, thus further improving radiating effect.
Further, referring to Figures 1 and 2, the abutting part 11 is convex block of the projection on the cooling fin 10, described convex
Block is convexed to form by the face connecting with the IC piece；The top surface of the convex block 11 is abutted with the IC piece 20, on the convex block 11
It is coated with Heat sink grease.
In the present embodiment, the height of convex block 11 is consistent with the height of shielding part 12, so that IC piece 20 is abutted with convex block 11
When will not with shielding part 12 formed have the gap, cause shielding protection to fail.By the way that abutting part 11 is arranged to convex block, so that
IC piece 20 forms interference with abutting part 11 and abuts, and further increases contact dynamics of the IC piece 20 with abutting part 11, and then promoted and supported
The heat-conducting effect of socket part 11.Further, it is coated with Heat sink grease in the top surface of convex block 11, so that convex block 11 is abutted with IC piece 20
When, the radiating rate of convex block 11 can be accelerated, thus improving radiating effect.
The utility model also proposes a kind of electronic product, which includes the radiator structure and be set in described scattered
Shell outside heat structure, the specific structure of the radiator structure is referring to above-described embodiment, since this electronic product uses above-mentioned institute
There are whole technical solutions of embodiment, therefore at least all beneficial effects brought by the technical solution with above-described embodiment,
This is no longer going to repeat them.Wherein, electronic product described here can be any one electronic product for having radiating requirements, example
Such as above-mentioned described radiator structure can be applied to TV, sound equipment, computer or other electronic products.
The above is only the preferred embodiment of the present invention, and therefore it does not limit the scope of the patent of the utility model,
It is all under the inventive concept of the utility model, equivalent structure made based on the specification and figures of the utility model becomes
It changes, or directly/be used in other related technical areas indirectly and be included in the scope of patent protection of the utility model.
Claims (10)
1. a kind of radiator structure, which is characterized in that including cooling fin, IC piece and pcb board；The IC piece is set to the pcb board
On, the cooling fin is installed on the pcb board, and the cooling fin and the IC piece are respectively positioned on the same face of the pcb board
On, the cooling fin is equipped with the abutting part abutted with the IC piece, and the abutting part is connected to the IC on piece.
2. radiator structure as described in claim 1, which is characterized in that be additionally provided on the cooling fin for shielding interference signal
Shielding part, the shielding part is the shielding piece being arranged in the one side that the cooling fin is connect with the pcb board, and the screen
Cover the marginal position that piece is located at the cooling fin.
3. radiator structure as claimed in claim 2, which is characterized in that the edge of the cooling fin is equipped with flange, the flange
The as described shielding piece, multiple shielding pieces and the cooling fin enclose seal chamber, and the cooling fin is installed in the PCB
When on plate, the IC piece is located in the seal chamber.
4. radiator structure as claimed in claim 2 or claim 3, which is characterized in that the edge of the cooling fin is equipped with heat dissipation ridge piece, institute
It states heat dissipation ridge piece and is provided in the opposite position of the shielding part.
5. radiator structure as claimed in claim 4, which is characterized in that the heat dissipation ridge piece includes extending away from the shielding part
First extend ridge piece, and it is described first extend ridge piece it is parallel with the cooling fin.
6. radiator structure as claimed in claim 5, which is characterized in that the heat dissipation ridge piece further includes extending ridge with described first
Unilateral second be oppositely arranged extends ridge piece, and described first, which extends the free end of ridge piece and described second, extends ridge piece circular arc company
It connects.
7. radiator structure as claimed in claim 6, which is characterized in that described first, which extends ridge piece and described second, extends ridge piece
On be equipped with multiple convection holes, and multiple convection holes are in being intervally arranged.
8. radiator structure as described in claim 1, which is characterized in that the abutting part is that projection is convex on the cooling fin
Block, the convex block are convexed to form by the face connecting with the IC piece；The top surface of the convex block is abutted with the IC piece, the convex block
On be coated with Heat sink grease.
9. radiator structure as claimed in claim 8, which is characterized in that the cooling fin and the pcb board pass through screw or card
Button connection.
10. a kind of electronic product, which is characterized in that including radiator structure as claimed in any one of claims 1 to 9 and be arranged
Shell outside the radiator structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820965482.8U CN208509365U (en) | 2018-06-21 | 2018-06-21 | Radiator structure and electronic product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820965482.8U CN208509365U (en) | 2018-06-21 | 2018-06-21 | Radiator structure and electronic product |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208509365U true CN208509365U (en) | 2019-02-15 |
Family
ID=65285908
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820965482.8U Expired - Fee Related CN208509365U (en) | 2018-06-21 | 2018-06-21 | Radiator structure and electronic product |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208509365U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111845569A (en) * | 2019-10-11 | 2020-10-30 | 宁波峰梅视讯电子有限公司 | Interior rear-view mirror with heat radiation structure |
| CN113405670A (en) * | 2021-06-18 | 2021-09-17 | 徐州龙傲智能科技有限公司 | Infrared temperature measurement all-in-one with explosion-proof function |
-
2018
- 2018-06-21 CN CN201820965482.8U patent/CN208509365U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111845569A (en) * | 2019-10-11 | 2020-10-30 | 宁波峰梅视讯电子有限公司 | Interior rear-view mirror with heat radiation structure |
| CN111845569B (en) * | 2019-10-11 | 2022-06-03 | 宁波峰梅视讯电子有限公司 | Interior rear-view mirror with heat radiation structure |
| CN113405670A (en) * | 2021-06-18 | 2021-09-17 | 徐州龙傲智能科技有限公司 | Infrared temperature measurement all-in-one with explosion-proof function |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190215 Termination date: 20210621 |