CN208478383U

CN208478383U - A kind of packaging system of LED flip chip

Info

Publication number: CN208478383U
Application number: CN201821236576.8U
Authority: CN
Inventors: 李现力; 刘峥嵘; 李现雄
Original assignee: Shenzhen Changmei Lighting Co Ltd
Current assignee: Shenzhen Changmei Lighting Co Ltd
Priority date: 2018-08-02
Filing date: 2018-08-02
Publication date: 2019-02-05
Anticipated expiration: 2028-08-02

Abstract

The utility model discloses a kind of packaging system of LED flip chip, the packaging system includes: substrate；Independent first conductive layer and the second conductive layer on the substrate is set；Wherein, for connecting with the cathode of the LED flip chip, second conductive layer is connect first conductive layer with the anode of the LED flip chip.The packaging system is not necessarily to package support and pcb board, LED flip chip is directly carried out to the die bond of ad hoc fashion on the electrically conductive, increase the bonding area of positive and negative anodes, high degree reduces packaging cost, and, since LED flip chip and the conductive layer can be very good to connect, yield is encapsulated to improve it.

Description

A kind of packaging system of LED flip chip

Technical field

The utility model relates to LED encapsulation technology fields, more specifically more particularly to a kind of envelope of LED flip chip Assembling device.

Background technique

With the continuous development of science and technology, containing LED (Light Emitting Diode, light emitting diode) upside-down mounting core The equipment of piece is widely used in daily life, work and industry, is brought greatly for daily life Convenience.

At present to there are mainly three types of the packaged types of LED flip chip, the first, LED flip chip die bond is being encapsulated On bracket, then encapsulate again；Second, by LED flip chip die bond in PCB (Printed Circuit Board, printing electricity Road plate) on plate, then encapsulates and cut again；The third, CSP encapsulates (Chip Scale Package, wafer-level package).

But the packaging cost of the first and second of packaged type can be very high, the third packaged type is opposite to be packaged into This is lower, but since the pole chip PN is smaller, causes subsequent attachment yield low.

Utility model content

In order to solve the above technical problems, the utility model provides a kind of packaging system of LED flip chip, increase positive and negative The bonding area of pole, packaging cost is lower, and yield is high.

To achieve the above object, the utility model provides the following technical solutions:

A kind of packaging system of LED flip chip, the packaging system include:

Substrate；

Independent first conductive layer and the second conductive layer on the substrate is set；

Wherein, first conductive layer with the cathode of the LED flip chip for connecting, second conductive layer and institute State the anode connection of LED flip chip.

Preferably, in above-mentioned packaging system, the material of the substrate is sticking adhesive film material.

Preferably, in above-mentioned packaging system, first conductive layer is copper foil layer or tin plating copper foil layer or gold-plated copper foil Layer or iron plate silver coating or iron plate tin coating；

Second conductive layer is that copper foil layer or tin plating copper foil layer or gold-plated copper foil layer or iron plate silver coating or iron plate are tin plating Layer.

Preferably, in above-mentioned packaging system, first conductive layer and the second conductive layer are respectively oxidation resistant conduction Layer.

Preferably, in above-mentioned packaging system, first conductive layer is different from the shape of second conductive layer.

Preferably, in above-mentioned packaging system, the shape of second conductive layer is rectangle, the shape of first conductive layer Shape is that rectangle jaggy is arranged.

It can be seen from the above technical proposal that a kind of packaging system of LED flip chip provided by the utility model, institute Stating packaging system includes: substrate；Independent first conductive layer and the second conductive layer on the substrate is set；Wherein, described First conductive layer with the cathode of the LED flip chip for connecting, and second conductive layer and the LED flip chip are just Pole connection.

As can be seen from the above description, which is not necessarily to package support and pcb board, is directly leading LED flip chip The die bond that ad hoc fashion is carried out in electric layer, increases the bonding area of positive and negative anodes, and high degree reduces packaging cost, and And since LED flip chip and the conductive layer can be very good to connect, yield is encapsulated to improve it.

Detailed description of the invention

In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only It is the embodiments of the present invention, for those of ordinary skill in the art, without creative efforts, also Other attached drawings can be obtained according to the attached drawing of offer.

Fig. 1 is a kind of cross section structure schematic diagram of the packaging system of LED flip chip provided by the embodiment of the utility model；

Fig. 2 is a kind of overlooking structure diagram of single led Flip-Chip Using provided by the embodiment of the utility model；

Fig. 3 is a kind of structural schematic diagram of conductive layer provided by the embodiment of the utility model；

Fig. 4 is a kind of structural schematic diagram of the conductive layer containing LED flip chip provided by the embodiment of the utility model；

Fig. 5 is the structural schematic diagram of another conductive layer provided by the embodiment of the utility model；

Fig. 6 is the structural schematic diagram of another conductive layer containing LED flip chip provided by the embodiment of the utility model；

Fig. 7 is the overlooking structure diagram of the single led Flip-Chip Using of another kind provided by the embodiment of the utility model；

Fig. 8 be it is provided by the embodiment of the utility model another contain the structural schematic diagram of the conductive layer of LED flip chip.

Specific embodiment

The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work Every other embodiment obtained, fall within the protection scope of the utility model.

To keep the above objects, features, and advantages of the utility model more obvious and easy to understand, with reference to the accompanying drawing and have Body embodiment is described in further detail the utility model.

With reference to Fig. 1 and Fig. 2, Fig. 1 is a kind of cutting for packaging system of LED flip chip provided by the embodiment of the utility model Face structural schematic diagram, Fig. 2 are a kind of plan structure signal of single led Flip-Chip Using provided by the embodiment of the utility model Figure, the packaging system include:

Substrate 11；Independent first conductive layer 12 and the second conductive layer 13 on the substrate 11 are set.

Wherein, described as shown in Fig. 2, first conductive layer 12 with the cathode of the LED flip chip 21 for connecting Second conductive layer 13 is connect with the anode of the LED flip chip 21.

Specifically, the conductive layer is drawn as shown in figure 3, be etched to whole piece conductive layer or punch forming It is divided into multiple identical conductive layer units 31, and multiple conductive layer units 31 are at array arrangement.Also, the conductive layer list Member 31 includes the first conductive layer 12 and the second conductive layer 13, is existed between first conductive layer 12 and second conductive layer 13 Gap, the first conductive layer 12 as shown in Figure 4 and the second conductive layer 13 with the positive and negative anodes of LED flip chip for connecting respectively, most After carry out dividing processing, form the encapsulating structure of single LED flip chip as shown in Figure 2.

Optionally, first conductive layer 12 is different from the shape of second conductive layer 13.

Specifically, first conductive layer 12 is shaped to difference with second conductive layer 13, it can be obvious Distinguish the conductive layer connecting with 21 anode of LED flip chip and the conductive layer connecting with 21 cathode of LED flip chip.

Optionally, as shown in Figure 5 and Figure 6, the shape of second conductive layer 13 is rectangle, first conductive layer 12 Shape is that rectangle jaggy is arranged.

Specifically, as shown in fig. 7, after the completion of segmentation, the first conductive layer for being connect with 21 cathode of LED flip chip 12 are set as rectangle jaggy, and the specific location and concrete shape of notch setting are not construed as limiting in the present embodiment.

It should be noted that in the present invention, as shown in figure 8, whole piece conductive layer can also be etched to place Reason or punch forming, form multiple bar shaped hollowed out areas, the side of the negative strap shape hollowed out area of LED flip chip, LED The other side of the positive strap shape hollowed out area of flip-chip, and the corresponding side of cathode of LED flip chip be provided with it is scarce Mouthful.

The full wafer conductive layer for completing LED flip chip to die bond is split processing, to form as shown in Figure 7 single The encapsulating structure of LED flip chip.

That is, the manufacture craft encapsulated on the electrically conductive simultaneously to multiple LED flip chips in the present invention Without limiting, can there are many multiplicity, after the completion of need to only guaranteeing segmentation, the cathode of single led flip-chip and anode are respectively It is connect with two independent conductive layers.

Optionally, the material of the substrate 11 is sticking adhesive film material.

Specifically, the sticking adhesive film material of material selection of the substrate 11 can be very good for conductive layer to be attached to On the substrate 11.

Optionally, first conductive layer 12 is including but not limited to copper foil layer or tin plating copper foil layer or gold-plated copper foil layer Or iron plate silver coating or iron plate tin coating.

Second conductive layer 13 is copper foil layer or tin plating copper foil layer or gold-plated copper foil layer or iron plate silver coating or iron plate plating Tin layers.

Specifically, first conductive layer 12 and the second conductive layer 13 can be all conductive sheet metals, it is preferred that first leads Electric layer 12 is identical with the material of the second conductive layer 13.

Optionally, first conductive layer 12 and second conductive layer 13 are respectively oxidation resistant conductive layer.

Specifically, if being needed when first conductive layer 12 and second conductive layer 13 are not oxidation resistant conductive layers Anti-oxidant treatment is carried out to it, therefore directly preferably uses oxidation resistant conductive layer in the utility model embodiment.

As can be seen from the above description, the packaging system of a kind of LED flip chip provided by the utility model, the packaging system Without package support and pcb board, LED flip chip is directly carried out to the die bond of ad hoc fashion on the electrically conductive, increased positive and negative The bonding area of pole, high degree reduce packaging cost and patch processing yield, also, by LED flip chip and institute Stating conductive layer can be very good to connect, and encapsulate yield to improve it.

It should be noted that all the embodiments in this specification are described in a progressive manner, each embodiment weight Point explanation is the difference from other embodiments, and the same or similar parts between the embodiments can be referred to each other.

It should also be noted that, herein, relational terms such as first and second and the like are used merely to one Entity or operation are distinguished with another entity or operation, without necessarily requiring or implying between these entities or operation There are any actual relationship or orders.Moreover, the terms "include", "comprise" or its any other variant are intended to contain Lid non-exclusive inclusion, so that article or equipment including a series of elements not only include those elements, but also It including other elements that are not explicitly listed, or further include for this article or the intrinsic element of equipment.Do not having In the case where more limitations, the element that is limited by sentence "including a ...", it is not excluded that in the article including above-mentioned element Or there is also other identical elements in equipment.

The foregoing description of the disclosed embodiments can be realized professional and technical personnel in the field or using originally practical new Type.Various modifications to these embodiments will be readily apparent to those skilled in the art, and determine herein The General Principle of justice can be realized in other embodiments without departing from the spirit or scope of the present utility model.Cause This, the present invention will not be limited to the embodiments shown herein, and is to fit to and principles disclosed herein The widest scope consistent with features of novelty.

Claims

1. a kind of packaging system of LED flip chip, which is characterized in that the packaging system includes:

Substrate；

Wherein, first conductive layer is with the cathode of the LED flip chip for connecting, second conductive layer with it is described The anode connection of LED flip chip.

2. packaging system according to claim 1, which is characterized in that the material of the substrate is sticking glue film material Material.

3. packaging system according to claim 1, which is characterized in that first conductive layer is copper foil layer or tin plating copper foil Layer or gold-plated copper foil layer or iron plate silver coating or iron plate tin coating；

Second conductive layer is copper foil layer or tin plating copper foil layer or gold-plated copper foil layer or iron plate silver coating or iron plate tin coating.

4. packaging system according to claim 1, which is characterized in that first conductive layer and second conductive layer point It Wei not oxidation resistant conductive layer.

5. packaging system according to claim 1, which is characterized in that first conductive layer and second conductive layer Shape is different.

6. packaging system according to claim 1, which is characterized in that the shape of second conductive layer is rectangle, described The shape of first conductive layer is that rectangle jaggy is arranged.