CN208271909U - A kind of Zener diode regulator using glassivation chip package - Google Patents
A kind of Zener diode regulator using glassivation chip package Download PDFInfo
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- CN208271909U CN208271909U CN201820791779.7U CN201820791779U CN208271909U CN 208271909 U CN208271909 U CN 208271909U CN 201820791779 U CN201820791779 U CN 201820791779U CN 208271909 U CN208271909 U CN 208271909U
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- voltage stabilizing
- stabilizing chip
- chip
- zener diode
- glassivation
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Abstract
The utility model belongs to semiconductor power device electronic technology field, specifically a kind of Zener diode regulator using glassivation chip package.The Zener diode regulator using glassivation chip package of the utility model includes voltage stabilizing chip and packaging body, voltage stabilizing chip is hexagonal structure, voltage stabilizing chip two sides are the area Liang Ge P that two-sided boron diffuses to form, and are the area N between the area Liang Ge P, voltage stabilizing chip is made to form two opposite PN junctions；The voltage stabilizing chip two sides are connected separately with lead, and packaging body is for encapsulating voltage stabilizing chip and lead.The Zener diode regulator using glassivation chip package of the utility model is reasonable in design, can expand the high pressure scope of application of diode, and motional impedance can be greatly lowered, and has good application value.
Description
Technical field
The utility model relates to semiconductor power device electronic technology fields, specifically provide a kind of using glassivation chip
The Zener diode regulator of encapsulation.
Background technique
With the development in the fields such as mobile informatiom product, household electronic products and green illumination, industrial power, match for it
The electronic product of set has largely used diode power component, and " light, thin, the small, close " proposition to this kind of device products
Higher requirement.The plastic package structure of high power density level not only represents industry technology level, to the small-sized of rear class product
Change, reliability, high security etc. require most important.The biggish Zener diode of usage amount in semiconductor power component at present
Product also develops towards high power density direction, and axial encapsulating products have irreplaceable advantage in the application.
It is able to satisfy the requirement that chip maximizes encapsulation using GPP chip, that is, high temperature passivation chip technology encapsulating products, again
It ensure that high power density, high reliability, moreover it is possible to it meets environmental requirements, still, the existing Zener diode axially encapsulated, with
GPP chip is that main encapsulation mostly uses traditional regular quadrangle chip, for cylinder packaging body, due to diagonal-size
The problem of cannot make full use of cylinder area, limit chip size maximization.And pickling O.J chip is although six sides can be used
Shape chip, but there is a problem of that environmental requirement is not achieved in technique and product electrical leakage problems reliability is not high.
Summary of the invention
In order to solve the above problems, the utility model provides a kind of reasonable in design, can expand diode
The high pressure scope of application, and the Zener diode regulator using glassivation chip package of motional impedance can be greatly lowered.
To achieve the above object, the utility model provides following technical solution:
A kind of Zener diode regulator using glassivation chip package, including voltage stabilizing chip and packaging body, pressure stabilizing core
Piece is hexagonal structure, and voltage stabilizing chip two sides are the area Liang Ge P that two-sided boron diffuses to form, and is the area N between the area Liang Ge P, makes pressure stabilizing
Chip forms two opposite PN junctions；The voltage stabilizing chip two sides are connected separately with lead, and packaging body is for encapsulating voltage stabilizing chip
And lead.
Copper lead is used in the utility model.It is respectively equipped with metalization layer outside the area Liang Ge P of the voltage stabilizing chip two sides, gold
Categoryization layer is Ni-Au or Ni-Ag layers.
Diode is formed using hexagon glassivation chip package in the utility model, substantially increases the function of diode
Rate density.It is described that two opposite PN junctions are diffuseed to form using two-sided boron, it is carried out using the negative temperature coefficient feature of positive PN junction
Compensation, the quadrangle chip that traditional substance diffusion is compared in two-sided boron diffusion increase 29.9% chip area, and temperature drift reduces
50%, achieve the effect that Low Drift Temperature.Two PN junctions expand the high pressure scope of application of Zener diode simultaneously, and are greatly lowered
Motional impedance.
It is mutually welded preferably, the voltage stabilizing chip two sides pass through weldment respectively with lead.
The weldment is slicker solder weld tabs.
Preferably, the weldment with a thickness of 0.05mm ± 0.02mm.
Preferably, the packaging body includes glass passivation layer and plastic packaging layer, glass passivation layer is used to encapsulate voltage stabilizing chip,
Plastic packaging layer is set to outside glass passivation layer, for encapsulating voltage stabilizing chip, weldment and lead.
PN junction is protected using glass passivation layer, the temperature stability of glass passivation layer is high, and good insulation preformance can be preferably
Protection PN junction effectively hinders voltage pole to become bring impact.The plastic packaging layer protects entire diode, and plastic packaging layer is epoxy resin
Material is prepared, and plastic packaging layer is cylindrical structure.Glass passivation layer adds plastic packaging layer, realizes the duplicate protection to diode.
Preferably, the glass passivation layer with a thickness of 20 μm -80 μm.
Preferably, the plastic packaging layer is cylindrical body, the diameter of plastic packaging layer is 2mm-9mm, and the height of plastic packaging layer is 5mm-
9mm。
Preferably, the voltage stabilizing chip with a thickness of 200um-280um, the across flats of voltage stabilizing chip are 1.5mm-
5.6mm.The diagonal length of the voltage stabilizing chip is 1.7mm-6.5mm, and the area of voltage stabilizing chip is 2 mm2-27 mm2。
Compared with prior art, the Zener diode regulator for using glassivation chip package of the utility model have with
Under it is outstanding the utility model has the advantages that
(1) Zener diode substantially increases the power of diode using hexagon glassivation chip package
Density；
(2) Zener diode diffuses to form two opposite PN junctions using two-sided boron, utilizes the negative temperature of positive PN junction
Coefficient feature compensates, and the quadrangle chip that traditional substance diffusion is compared in two-sided boron diffusion increases 29.9% chip area,
Temperature drift reduces by 50%, achievees the effect that Low Drift Temperature；Two PN junctions expand the high pressure scope of application of Zener diode simultaneously,
And motional impedance is considerably reduced, the perfect combination realizing Low Drift Temperature and axially encapsulating；
(3) PN junction is protected using glass passivation layer, the temperature stability of glass passivation layer is high, and good insulation preformance can be more
Good protection PN junction effectively hinders voltage pole to become bring impact；Entire diode, glassivation are protected using plastic packaging layer simultaneously
Layer plus plastic packaging layer realize the duplicate protection to diode, have good practicability.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the Zener diode regulator described in the utility model using glassivation chip package；
The structure of the voltage stabilizing chip of Fig. 2 Zener diode regulator described in the utility model using glassivation chip package
Schematic diagram；
Fig. 3 is the side sectional view of voltage stabilizing chip shown in Fig. 2.
Wherein, 1. voltage stabilizing chip, 2. plastic packaging layers, 3. glass passivation layers, 4. weldments, 5. bronze medal leads, 6. metalization layers.
Specific embodiment
The Zener pressure stabilizing two using glassivation chip package below in conjunction with drawings and examples, to the utility model
Pole pipe is described in further detail.
Embodiment
As shown in Figure 1, Figure 2 and Figure 3, the Zener diode regulator using glassivation chip package of the utility model,
Including voltage stabilizing chip 1, plastic packaging layer 2 and glass passivation layer 3.
Voltage stabilizing chip 1 is hexagonal structure, hexagon voltage stabilizing chip 1 with a thickness of 250um, across flats 2.8mm,
Diagonal length is 3.2mm, area 6.7mm2.1 two sides of voltage stabilizing chip are the area Liang Ge P that diffuses to form of two-sided boron, the area Liang Ge P it
Between be the area N, make voltage stabilizing chip 1 formed two opposite PN junctions.Metallization is respectively equipped with outside the area Liang Ge P of 1 two sides of voltage stabilizing chip
Layer 6, metalization layer 6 are Ni-Au layers.
1 two sides of voltage stabilizing chip pass through weldment 4 respectively and weld with 5 phase of copper lead.Weldment 4 with a thickness of 0.05mm.Glass
Glass passivation layer 3 is for encapsulating voltage stabilizing chip 1.Plastic packaging layer 2 is cylindrical body, is set to outside glass passivation layer 3, for encapsulating voltage stabilizing chip
1, weldment 4 and copper lead 5, the diameter of plastic packaging layer 2 are 5mm, and the cylinder height of plastic packaging layer 2 is 9mm.
Embodiment described above, only the utility model more preferably specific embodiment, those skilled in the art
The usual variations and alternatives carried out within the scope of technical solutions of the utility model should all be included in the protection scope of the utility model
It is interior.
Claims (7)
1. a kind of Zener diode regulator using glassivation chip package, it is characterised in that: including voltage stabilizing chip and encapsulation
Body, voltage stabilizing chip are hexagonal structure, and it is N between the area Liang Ge P that voltage stabilizing chip two sides, which are the area Liang Ge P that two-sided boron diffuses to form,
Area makes voltage stabilizing chip form two opposite PN junctions；The voltage stabilizing chip two sides are connected separately with lead, and packaging body is for encapsulating
Voltage stabilizing chip and lead.
2. the Zener diode regulator according to claim 1 using glassivation chip package, it is characterised in that: described
Voltage stabilizing chip two sides pass through weldment respectively and mutually weld with lead.
3. the Zener diode regulator according to claim 2 using glassivation chip package, it is characterised in that: described
Weldment with a thickness of 0.05mm ± 0.02mm.
4. the Zener diode regulator according to claim 1,2 or 3 using glassivation chip package, feature exist
In: the packaging body includes glass passivation layer and plastic packaging layer, and glass passivation layer is set to glass for encapsulating voltage stabilizing chip, plastic packaging layer
Outside passivation layer, for encapsulating voltage stabilizing chip, weldment and lead.
5. the Zener diode regulator according to claim 4 using glassivation chip package, it is characterised in that: described
Glass passivation layer with a thickness of 20 μm -80 μm.
6. the Zener diode regulator according to claim 5 using glassivation chip package, it is characterised in that: described
Plastic packaging layer is cylindrical body, and the diameter of plastic packaging layer is 2mm-9mm, and the height of plastic packaging layer is 5mm-9mm.
7. the Zener diode regulator according to claim 6 using glassivation chip package, it is characterised in that: described
Voltage stabilizing chip with a thickness of 200um-280um, the across flats of voltage stabilizing chip are 1.5mm-5.6mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820791779.7U CN208271909U (en) | 2018-05-25 | 2018-05-25 | A kind of Zener diode regulator using glassivation chip package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820791779.7U CN208271909U (en) | 2018-05-25 | 2018-05-25 | A kind of Zener diode regulator using glassivation chip package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208271909U true CN208271909U (en) | 2018-12-21 |
Family
ID=64684127
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820791779.7U Active CN208271909U (en) | 2018-05-25 | 2018-05-25 | A kind of Zener diode regulator using glassivation chip package |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208271909U (en) |
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2018
- 2018-05-25 CN CN201820791779.7U patent/CN208271909U/en active Active
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