CN208143582U

CN208143582U - PCB board

Info

Publication number: CN208143582U
Application number: CN201820693516.2U
Authority: CN
Inventors: 胡泽波
Original assignee: Shenzhen Guo Hong Hong Electronic Technology Co Ltd
Current assignee: Shenzhen Guo Hong Hong Electronic Technology Co Ltd
Priority date: 2018-05-10
Filing date: 2018-05-10
Publication date: 2018-11-23
Anticipated expiration: 2028-05-10

Abstract

The utility model discloses a kind of pcb boards, heat dissipation for pyrotoxin, including plate body, the plate body includes upper and lower surfaces, the plate body offers dissipating vias group of at least one connection upper and lower surfaces, and at the corresponding dissipating vias group set on upper surface of a pyrotoxin, the dissipating vias group includes multiple dissipating vias, metal core is equipped in each dissipating vias, the metal core both ends pass through scolding tin respectively and are fixed on plate body upper and lower surfaces.Pcb board provided by the utility model, heat dissipation effect are stable, quick.

Description

Pcb board

Technical field

The utility model relates to PCB technical field of heat dissipation, specifically, being related to a kind of pcb board.

Background technique

Pcb board is also known as printed circuit board, the conductive layer including base and above base.Base is insulating layer, generally For resin composite materials, conductive layer is generally copper foil layer, and electronic component is set on copper foil layer.Since the resin of insulating layer is multiple Condensation material heating conduction is very poor, and the copper foil that the heat that electronic component work generates mainly passes through conductive layer is transferred to external sky Gas, but copper thickness is small-sized, the capacity of heat transmission is limited, encounters the big electronic component of some calorific values, may radiate not Foot causes local temperature excessively high, burns out component and pcb board.

In the prior art, for pcb board local electronic component heating problem, generally pass through the electronics member big in calorific value Dissipating vias is arranged at device to solve, when dissipating vias is excessive, is easy to lead to electricity because of the stress that soldering tin binds process generates Sub- component displacement, influences welding quality.And aperture it is excessive when, stress is concentrated at dissipating vias, and pcb board is easily broken off.Therefore one As use lesser dissipating vias, but when dissipating vias aperture is too small, scolding tin is difficult to penetrate into dissipating vias, influences heat transfer effect Rate.

Utility model content

The purpose of this utility model is to provide a kind of pcb boards of good heat dissipation effect.

Technical solution used by pcb board disclosed by the utility model is：A kind of pcb board, for the heat dissipation of pyrotoxin, packet Rubbing board body, the plate body include upper and lower surfaces, and the plate body offers at least one connection upper and lower surfaces Dissipating vias group, at the corresponding dissipating vias group set on upper surface of a pyrotoxin, the dissipating vias group includes more A dissipating vias is equipped with metal core in each dissipating vias, and the metal core both ends pass through scolding tin respectively and are fixed on plate Body upper and lower surfaces.

Preferably, in a dissipating vias group, the center line of multiple dissipating vias is more than upper surface Certain point intersection.

Preferably, the metal core is that copper or aluminium are made.

Preferably, the metal core outer dimension is harmonious with dissipating vias.

Preferably, each dissipating vias is equipped with close to lower surface side and offers counterbore, in the counterbore Filled with scolding tin.

The beneficial effect of pcb board disclosed by the utility model is：Dissipating vias group is connected to the upper and lower surfaces of plate body, Pyrotoxin is set to the dissipating vias group position of upper surface, wears metal core in each dissipating vias, metal core is fixed by scolding tin In the upper and lower surfaces of plate body.Pyrotoxin operational heat, heat are transferred to lower surface through metal core from the scolding tin of upper surface Scolding tin, and exchange heat with air, increase heat exchange area, improve heat dissipation effect.

Detailed description of the invention

Fig. 1 is the structural schematic diagram of the utility model pcb board.

Specific embodiment

The utility model is further elaborated and is illustrated with Figure of description combined with specific embodiments below：Please refer to figure 1, a kind of pcb board, the heating problem of the pyrotoxin 20 for solving pcb board part.Pcb board includes plate body 10, and plate body 10 includes Upper surface 11 and lower surface 12, plate body 10 offer the dissipating vias group of at least one connection upper surface 11 and lower surface 12.Its In, the corresponding dissipating vias group of a pyrotoxin 20, pyrotoxin 20 is set to above the dissipating vias group of upper surface 11, pyrotoxin The 20 i.e. electronic component of golf calorific value.

Dissipating vias group is for radiating to pyrotoxin 20 comprising multiple dissipating vias 13.In a dissipating vias In group, certain point of the center line of multiple dissipating vias 13 in 11 or more upper surface intersects.I.e. dissipating vias 13 is in tilted layout, and inclines Tilted direction increases effectively heat dissipation area towards 20 center of pyrotoxin with radial heat transfer heat dissipation, improves heat dissipation effect.And Since dissipating vias 13 is in tilted layout in the whole stress intensity in plate body 10, improving pcb board.

Metal core is equipped in each dissipating vias 13, metal core both ends pass through scolding tin respectively and are fixed on 10 upper surface of plate body 11 and lower surface 12.Metal core is that copper or aluminium are made.Copper, aluminium are with respect to having more preferably heating conduction for tin.

Metal core outer dimension is harmonious with dissipating vias 13.Can interference be set to dissipating vias 13 in.Improve the biography of metal core Heat area.Each dissipating vias 13 is equipped with close to 12 side of lower surface and offers counterbore 131, and scolding tin is filled in counterbore 131, with Accelerate the heat transfer rate with air.

Pcb board disclosed by the utility model, dissipating vias group are connected to the upper surface 11 and lower surface 12 of plate body 10, pyrotoxin 20 are set to the dissipating vias group position of upper surface 11, wear metal core in each dissipating vias 13, metal core is fixed by scolding tin In the upper surface of plate body 10 11 and lower surface 12.20 operational heat of pyrotoxin, the scolding tin of heat from upper surface 11 are passed through metal core It is handed to the scolding tin of lower surface 12, and is exchanged heat with air, heat dissipation effect is improved.

Finally it should be noted that above embodiments are only to illustrate the technical solution of the utility model, rather than to this reality With the limitation of novel protected range, although being explained in detail referring to preferred embodiment to the utility model, this field it is general Lead to it will be appreciated by the skilled person that can be with the technical solution of the present invention is modified or equivalently replaced, without departing from this The spirit and scope of utility model technical solution.

Claims

1. a kind of pcb board, the heat dissipation for pyrotoxin, which is characterized in that including plate body, the plate body includes upper surface and following table Face, the plate body offer the dissipating vias group of at least one connection upper and lower surfaces, and a pyrotoxin is corresponding to be set to At one dissipating vias group of upper surface, the dissipating vias group includes multiple dissipating vias, is worn in each dissipating vias Equipped with metal core, the metal core both ends pass through scolding tin respectively and are fixed on upper and lower surfaces.

2. pcb board as described in claim 1, which is characterized in that in a dissipating vias group, multiple dissipating vias Certain the point intersection of center line more than upper surface.

3. pcb board as claimed in claim 1 or 2, which is characterized in that the metal core is that copper or aluminium are made.

4. pcb board as claimed in claim 1 or 2, which is characterized in that the metal core outer dimension is harmonious with dissipating vias.

5. pcb board as claimed in claim 3, which is characterized in that the metal core outer dimension is harmonious with dissipating vias.

6. pcb board as claimed in claim 1 or 2, which is characterized in that each dissipating vias is equipped with close to lower surface side Counterbore is offered, is filled with scolding tin in the counterbore.

7. pcb board as claimed in claim 5, which is characterized in that each dissipating vias is equipped with close to lower surface side and opens Equipped with counterbore, scolding tin is filled in the counterbore.