CN208128620U - A kind of heat radiating type PCB multilayer board - Google Patents

Abstract

The utility model provides a kind of heat radiating type PCB multilayer board, is related to PCB multilayer board field.The heat radiating type PCB multilayer board, including PCB multilayer board ontology, the PCB multilayer board ontology includes top layer, bottom and intermediate wiring layer, the two sides of the bottom are fixedly connected to mounting blocks, column is fixedly connected at the top of the mounting blocks, the top of the column sequentially passes through intermediate wiring layer and top layer and is fixedly connected with conflict block, is fixedly connected at the top of the bottom of the conflict block and top layer.The heat radiating type PCB multilayer board, pass through setting heat dissipating layer, radiating groove, mini-fan, heat exhausting pipe, heat-dissipating pipe and heat release hole, when PCB multilayer board operation, start mini-fan, mini-fan flows air, the air-flow of flowing radiates to PCB multilayer board ontology, and the thermal current of flowing is being transported to the outside of PCB multilayer board ontology by heat-dissipating pipe by heat exhausting pipe, to improve the heat dissipation effect of PCB multilayer board ontology.

Description

A kind of heat radiating type PCB multilayer board

Technical field

The utility model relates to PCB multilayer board technical field, specially a kind of heat radiating type PCB multilayer board.

Background technique

PCB multilayer board refers to for the multilayer circuit board in electric equipment products, multi-layer board more single sided boards or two-sided The wiring plate of plate.With one piece it is two-sided make internal layer, two pieces of single sides make outer layer or two pieces it is two-sided make internal layer, two pieces of single sides make the print of outer layer Brush wiring board, alternately together and the print that is interconnected by design requirement of conductive pattern by positioning system and adhesive material Brush wiring board just becomes four layers, six-layer printed circuit board, also referred to as multilayer printed circuit board.But currently, existing PCB Multi-layer board heat dissipation effect is bad.

Utility model content

(1) the technical issues of solving

In view of the deficiencies of the prior art, the utility model provides a kind of heat radiating type PCB multilayer board, solves existing The bad problem of PCB multilayer board heat dissipation effect.

(2) technical solution

In order to achieve the above object, the utility model is achieved by the following technical programs：A kind of heat radiating type PCB multilayer Plate, including PCB multilayer board ontology, the PCB multilayer board ontology include top layer, bottom and intermediate wiring layer, and the two of the bottom Side is fixedly connected to mounting blocks, and column is fixedly connected at the top of the mounting blocks, during the top of the column sequentially passes through Between wiring layer and top layer and be fixedly connected with conflict block, be fixedly connected at the top of the bottom of the conflict block and top layer, the top There are gaps between the bottom of layer and the top of intermediate wiring layer, stay between the bottom of the intermediate wiring layer and the top of bottom There is gap, heat dissipating layer is fixedly connected at the top of the bottom, the top of the heat dissipating layer and the bottom of intermediate wiring layer do not connect Touching, offers radiating groove at the top of the heat dissipating layer, and the slot bottom of the radiating groove is fixedly mounted mini-fan, in the radiating groove The two sides in portion are fixedly connected to heat exhausting pipe, heat-dissipating pipe are communicated on the left of the heat exhausting pipe, the heat-dissipating pipe is far from heat exhausting pipe One end run through the inner wall of radiating groove, the front of the mounting blocks offers heat release hole, and the heat-dissipating pipe runs through radiating groove inner wall One end through mounting blocks top and be connected to the inside of heat release hole.

Preferably, the column is rubber and plastic column, and the conflict block is plastic cement conflict block.

Preferably, it is fixedly connected with winding displacement seat at the top of the intermediate wiring layer, the top of the winding displacement seat and top layer Bottom is fixedly connected.

Preferably, the side of the winding displacement seat offers winding displacement hole, and the inner wall in the winding displacement hole is provided with insulating layer.

Preferably, the quantity of the winding displacement seat is three, and three winding displacement seat equidistant arrangements are at the top of intermediate wiring layer.

Preferably, the winding displacement hole is in trumpet type, and the heat release hole is in round.

(3) beneficial effect

The utility model provides a kind of heat radiating type PCB multilayer board.Has following beneficial effect：

1, the heat radiating type PCB multilayer board by setting heat dissipating layer, radiating groove, mini-fan, heat exhausting pipe, heat-dissipating pipe and dissipates Hot hole starts mini-fan when PCB multilayer board operation, and mini-fan flows air, and the air-flow of flowing is to PCB Multi-layer board ontology radiates, and the thermal current of flowing is being transported to the outer of PCB multilayer board ontology by heat-dissipating pipe by heat exhausting pipe Portion, to improve the heat dissipation effect of PCB multilayer board ontology.

2, the heat radiating type PCB multilayer board is easily installed PCB multilayer board sheet by setting mounting blocks, column and conflict block Body, also, column and conflict block are respectively rubber and plastic column and plastic cement conflict block, and mounting structure is not only made to have the mesh of insulation , and the effect for leading to short circuit because of metal mounting structure is avoided, and setting winding displacement seat and winding displacement hole, the row of being not only convenient for Line, and route is avoided to have abrasion, extend the service life of PCB multilayer board ontology.

Detailed description of the invention

FIG. 1 is a schematic structural view of the utility model；

Fig. 2 is the structure top view of the utility model heat dissipating layer；

Fig. 3 is the structure sectional view of the utility model winding displacement seat.

In figure：1PCB multi-layer board ontology, 2 top layers, 3 bottoms, 4 intermediate wiring layers, 5 mounting blocks, 6 columns, 7 conflict blocks, 8 dissipate Thermosphere, 9 radiating grooves, 10 mini-fans, 11 heat exhausting pipes, 12 heat-dissipating pipes, 13 heat release holes, 14 winding displacement seats, 15 winding displacement holes.

Specific embodiment

The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work Every other embodiment obtained, fall within the protection scope of the utility model.

The utility model embodiment provides a kind of heat radiating type PCB multilayer board, as shown in Figure 1-3, include PCB multilayer board ontology 1, PCB multilayer board ontology 1 includes that top layer 2, bottom 3 and intermediate wiring layer 4, the two sides of bottom 3 are fixedly connected to mounting blocks 5, The top of mounting blocks 5 is fixedly connected with column 6, and the top of column 6 sequentially passes through intermediate wiring layer 4 and top layer 2 and is fixedly connected There is conflict block 7, column 6 is rubber and plastic column, and conflict block 7 is plastic cement conflict block, and the bottom of conflict block 7 and the top of top layer 2 are fixed Connection is easily installed PCB multilayer board ontology 1, also, column 6 and conflict block 7 respectively rubber and plastic column and plastic cement conflict block, no Only make mounting structure that there is the purpose of insulation, and avoids the effect for leading to short circuit because of metal mounting structure, top layer 2 There are gaps between bottom and the top of intermediate wiring layer 4, between the bottom of intermediate wiring layer 4 and the top of bottom 3 there are Gap, the top of bottom 3 are fixedly connected with heat dissipating layer 8, and the top of heat dissipating layer 8 is not contacted with the bottom of intermediate wiring layer 4, heat dissipating layer 8 top offers radiating groove 9, and mini-fan 10 is fixedly mounted in the slot bottom of radiating groove 9, and the two sides inside radiating groove 9 are fixed It is connected with heat exhausting pipe 11, the left side of heat exhausting pipe 11 is communicated with heat-dissipating pipe 12, and the one end of heat-dissipating pipe 12 far from heat exhausting pipe 11 is through scattered The inner wall of heat channel 9, the front of mounting blocks 5 offer heat release hole 13, and heat release hole 13 is in round, and heat-dissipating pipe 12 is in radiating groove 9 One end of wall is run through the top of mounting blocks 5 and is connected to the inside of heat release hole 13, when PCB multilayer board operation, starts miniature wind Fan 10, mini-fan 10 flows air, and the air-flow of flowing radiates to PCB multilayer board ontology 1, the hot gas of flowing Stream is being transported to the outside of PCB multilayer board ontology 1 by heat-dissipating pipe 12 by heat exhausting pipe 11, to improve PCB multilayer board ontology 1 Heat dissipation effect, the top of intermediate wiring layer 4 is fixedly connected with winding displacement seat 14, and the top of winding displacement seat 14 and the bottom of top layer 2 are solid Fixed connection, the side of winding displacement seat 14 offer winding displacement hole 15, and winding displacement hole 15 is in trumpet type, and the inner wall in winding displacement hole 15 is provided with insulation Layer, the quantity of winding displacement seat 14 is three, and three 14 equidistant arrangements of winding displacement seat are in the top of intermediate wiring layer 4, the row of being not only convenient for Line, and route is avoided to have abrasion, extend the service life of PCB multilayer board ontology 1.

The electric elements occurred in this article are electrically connected with extraneous main controller and 220V alternating current, and main controller can be meter Calculation machine etc. plays the conventionally known equipment of control.

In conclusion the heat radiating type PCB multilayer board, by the way that heat dissipating layer 8, radiating groove 9, mini-fan 10, heat exhausting pipe is arranged 11, heat-dissipating pipe 12 and heat release hole 13 start mini-fan 10 when PCB multilayer board operation, and mini-fan 10 carries out air Flowing, the air-flow of flowing radiate to PCB multilayer board ontology 1, and the thermal current of flowing is passing through heat-dissipating pipe by heat exhausting pipe 11 12 are transported to the outside of PCB multilayer board ontology 1, to improve the heat dissipation effect of PCB multilayer board ontology 1.

Also, by setting mounting blocks 5, column 6 and conflict block 7, it is easily installed PCB multilayer board ontology 1, also, column 6 It is respectively rubber and plastic column and plastic cement conflict block with conflict block 7, not only makes mounting structure that there is the purpose of insulation, but also avoid Lead to the effect of short circuit, and setting winding displacement seat 14 and winding displacement hole 15 because of metal mounting structure, is not only convenient for winding displacement, and keep away Exempting from route has abrasion, extends the service life of PCB multilayer board ontology 1.

It should be noted that, in this document, relational terms such as first and second and the like are used merely to a reality Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation In any actual relationship or order or sequence.Moreover, the terms "include", "comprise" or its any other variant are intended to Non-exclusive inclusion, so that the process, method, article or equipment including a series of elements is not only wanted including those Element, but also including other elements that are not explicitly listed, or further include for this process, method, article or equipment Intrinsic element.

While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art, It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.

Claims (6)

1. a kind of heat radiating type PCB multilayer board, including PCB multilayer board ontology (1), it is characterised in that：The PCB multilayer board ontology It (1) include that top layer (2), bottom (3) and intermediate wiring layer (4), the two sides of the bottom (3) are fixedly connected to mounting blocks (5), Be fixedly connected with column (6) at the top of the mounting blocks (5), the top of the column (6) sequentially pass through intermediate wiring layer (4) and Top layer (2) is simultaneously fixedly connected with conflict block (7), is fixedly connected at the top of the bottom and top layer (2) of the conflict block (7), described There are gap, the bottom of the intermediate wiring layer (4) and bottoms between the bottom of top layer (2) and the top of intermediate wiring layer (4) (3) it there are gap between top, is fixedly connected with heat dissipating layer (8) at the top of the bottom (3), the top of the heat dissipating layer (8) Portion is not contacted with the bottom of intermediate wiring layer (4), offers radiating groove (9), the radiating groove at the top of the heat dissipating layer (8) (9) mini-fan (10) are fixedly mounted in slot bottom, and the internal two sides of the radiating groove (9) are fixedly connected to heat exhausting pipe (11), It is communicated with heat-dissipating pipe (12) on the left of the heat exhausting pipe (11), the one end of the heat-dissipating pipe (12) far from heat exhausting pipe (11) is through scattered The front of the inner wall of heat channel (9), the mounting blocks (5) offers heat release hole (13), and the heat-dissipating pipe (12) runs through radiating groove (9) One end of inner wall is run through the top of mounting blocks (5) and is connected to the inside of heat release hole (13).

2. a kind of heat radiating type PCB multilayer board according to claim 1, it is characterised in that：The column (6) is vertical for rubber and plastic Column, the conflict block (7) are plastic cement conflict block.

3. a kind of heat radiating type PCB multilayer board according to claim 1, it is characterised in that：The top of the intermediate wiring layer (4) Portion is fixedly connected with winding displacement seat (14), and the top of the winding displacement seat (14) is fixedly connected with the bottom of top layer (2).

4. a kind of heat radiating type PCB multilayer board according to claim 3, it is characterised in that：The side of the winding displacement seat (14) It offers winding displacement hole (15), the inner wall of the winding displacement hole (15) is provided with insulating layer.

5. a kind of heat radiating type PCB multilayer board according to claim 3, it is characterised in that：The quantity of the winding displacement seat (14) It is three, and three winding displacement seat (14) equidistant arrangements are at the top of intermediate wiring layer (4).

6. a kind of heat radiating type PCB multilayer board according to claim 4, it is characterised in that：The winding displacement hole (15) is in loudspeaker Type, the heat release hole (13) is in round.