CN207692165U - A kind of multi-layered high-density PCB circuit board manufacture postcooling device - Google Patents
A kind of multi-layered high-density PCB circuit board manufacture postcooling device Download PDFInfo
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- CN207692165U CN207692165U CN201721706569.5U CN201721706569U CN207692165U CN 207692165 U CN207692165 U CN 207692165U CN 201721706569 U CN201721706569 U CN 201721706569U CN 207692165 U CN207692165 U CN 207692165U
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- main casing
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- circuit board
- condensate
- pipeline
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Abstract
The utility model discloses a kind of multi-layered high-density PCB circuit boards to manufacture postcooling device, including device main casing, described device main casing top middle portion is connected with air refreshing tube, and air refreshing tube top is equipped with air exhauster, described device main casing bottom left rear and front end is respectively connected with the high bar of left frame, and both ends are both provided with tapped through hole inside the high bar lower end of left frame, the high bar lower end of left side frame is connected with condensate flow pipeline, and condensate liquid inlet pipeline is installed on the left of condensate flow pipeline front end, it is connected with condensate outlet pipeline on the right side of the condensate flow rear end of pipeline, and condensate outlet pipeline external is provided with device main casing, condensate flow pipeline bottom end is connected with air cooling-down room.It is compact that the multi-layered high-density PCB circuit board manufactures postcooling apparatus structure, convenient for manufacture, and the multi-layered high-density PCB circuit board after being made without special movement, it can cool down to the multi-layered high-density PCB circuit board after making in multi-layered high-density PCB circuit board normal transportation, the time is more saved, cooling efficiency is improved.
Description
Technical field
The utility model is related to multi-layered high-density circuit board production techniques field, specially a kind of multi-layered high-density PCB electricity
Road plate manufactures postcooling device.
Background technology
Before printed circuit board (PCB) appearance, the interconnection between electronic component is directly connected to and group by electric wire
At complete circuit.In the present age, circuit board is intended only as effective experimental tool and exists, and printed circuit board is in electronics work
At the status for occupying empery in industry.Early 20th century, people reduce electronics to simplify the making of e-machine
The advantages that wiring between part, reduction cost of manufacture, then start to study intensively the method for replacing wiring in a manner of printing.30 years
Between, constantly there is engineer to propose that being subject to metallic conductor on the substrate of insulation makees wiring.And most successful is nineteen twenty-five, the U.S.
CharlesDucas prints out line pattern on the substrate of insulation, then in a manner of plating, is successfully established conductor and makees wiring,
PCB circuit board is required to cool down after being electroplated.
PCB (Printed Circuit Board) printed board, is also printed circuit board, printed circuit board.It is multilayered printed
Plate refers to just two layers or more of printed board, it is by the connecting wire and erection welding electronic component use on several layers of insulating substrates
Pad composition, not only had and each sandwich circuit be connected, but also have the function of insulating each other.
PCB multilayer board refers to for the multilayer circuit board in electric equipment products, and multi-layer board has used more single sided boards or two-sided
The wiring plate of plate.With one piece it is two-sided make internal layer, two pieces of single sides make outer layer or two pieces it is two-sided make internal layer, two pieces of single sides make the print of outer layer
Brush wiring board, alternately together and the print that is interconnected by design requirement of conductive pattern by positioning system and adhesive material
Brush wiring board just becomes four layers, six-layer printed circuit board, also referred to as multilayer printed circuit board.
As the continuous development of SMT (surface mounting technique), and the continuous of a new generation SMD (surface mount device) push away
Go out, such as QFP, QFN, CSP, BGA (especially MBGA), make that electronic product is more intelligent, miniaturization, thus has pushed PCB works
The major reform and progress of industry technology.Since IBM Corporation successfully develops high-density multi-layered plate (SLC) first since 1991, respectively
Guo Ge large groups also develop various high density interconnection (HDI) microwell plates in succession.The fast development of these processing technologies,
The design of PCB has been promoted gradually to develop to the direction of multilayer, high-density wiring.Multilayer board is with its flexible design, stabilization
Reliable electric property and superior economic performance, have been widely used in the manufacturing of electronic product.
Common multi-layered high-density PCB circuit board cooling device there are complicated, current cooling technology and is required to
Circuit board is moved among specific machine and is cooled down, plenty of time and artificial is consumed.
Utility model content
The purpose of this utility model is to provide a kind of multi-layered high-density PCB circuit boards to manufacture postcooling device, to solve
The problems mentioned above in the background art.
To achieve the above object, the utility model provides the following technical solutions：
A kind of multi-layered high-density PCB circuit board manufacture postcooling device, including device main casing, described device main casing top
End middle part is connected with air refreshing tube, and air refreshing tube top is equipped with air exhauster, two before and after described device main casing bottom left
End is respectively connected with the high bar of left frame, and both ends are both provided with tapped through hole, described device main casing inside the high bar lower end of left frame
Bottom right rear and front end is respectively connected with the high bar of left side frame, and both sides are both provided with tapped through hole inside the high bar lower end of left side frame,
Described device main casing inner upper is provided with acceleration air-exchanging chamber, and accelerates to be equipped with the first wind turbine, institute in front of air-exchanging chamber top
It states the first wind turbine rear and is connected with the second wind turbine, and be provided with acceleration air-exchanging chamber outside the second wind turbine, under the high bar of left side frame
End is connected with condensate flow pipeline, and is equipped with condensate liquid inlet pipeline, the condensation on the left of condensate flow pipeline front end
Liquid stream is moved and is connected with condensate outlet pipeline on the right side of rear end of pipeline, and condensate outlet pipeline external is provided with device main casing,
Condensate flow pipeline bottom end is connected with air cooling-down room, and air cooling-down room bottom is equipped with isolation board.
Preferably, the condensate flow pipeline is continuous S-shaped structure, and condensate flow internal diameter of the pipeline is equal to condensate liquid
Inlet pipeline and condensate outlet internal diameter of the pipeline.
Preferably, the width of first wind turbine and the second wind turbine is equal to the width of condensate flow pipeline, and first
Maximum distance between wind turbine and the second wind turbine is equal to the length of condensate flow pipeline.
Preferably, the isolation board is reticular structure, and isolation board length and width are equal to the length and width of device main casing, isolation board
By welding with device main casing, the high bar of left frame and the high bar of left side frame at fixed structure.
Preferably, the high bar of the left frame and the high bar of left side frame are handstand T-shaped structure, and the high bar of left frame and left side frame
High bar is with device main casing center line at bilateral symmetry.
Compared with prior art, the utility model has the beneficial effects that：The multi-layered high-density PCB circuit board manufactures postcooling
Apparatus structure is compact, convenient for manufacture, and without the multi-layered high-density PCB circuit board after special movement making, in multi-layered high-density
It can cool down to the multi-layered high-density PCB circuit board after making in PCB circuit board normal transportation, when more saving
Between, improve cooling efficiency.The isolation board that this multi-layered high-density PCB circuit board manufactures postcooling device passes through welding and device main casing
The high bar of body, left frame and the high bar of left side frame are at fixed structure so that the conveyer belt of multi-layered high-density PCB circuit board after conveying makes
It can be passed through between the gap between device main casing, the high bar of left frame and the high bar of left side frame, volume is not required to when to reach cooling
The purpose of outer walking circuit plate, the condensate flow pipeline that this multi-layered high-density PCB circuit board manufactures postcooling device are continuous S
Shape structure, this structure increases the path length and residence time that condensate liquid is flowed in device main casing, more efficient to air
Cool down, so as to save time and artificial.
Description of the drawings
Fig. 1 is the utility model entirety main structure diagram；
Fig. 2 is A-A schematic cross-sectional views in the utility model Fig. 1；
Fig. 3 is B-B schematic cross-sectional views in the utility model Fig. 1.
In figure：1, air exhauster, 2, air refreshing tube, 3, accelerate air-exchanging chamber, 4, condensate liquid inlet pipeline, 5, condensate flow pipe
Road, 6, device main casing, the 7, first wind turbine, 8, condensate outlet pipeline, 9, air cooling-down room, 10, isolation board, 11, left frame
High bar, 12, tapped through hole, 13, the high bar of left side frame, the 14, second wind turbine.
Specific implementation mode
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
The every other embodiment obtained, shall fall within the protection scope of the present invention.
- 3 are please referred to Fig.1, a kind of multi-layered high-density PCB circuit board manufacture postcooling device provided by the utility model wraps
Device main casing 6 is included, 6 top middle portion of device main casing is connected with air refreshing tube 2, and 2 top of air refreshing tube is equipped with air exhauster
1,6 bottom left rear and front end of device main casing is respectively connected with the high bar 11 of left frame, and both ends inside high 11 lower end of bar of left frame
It is both provided with tapped through hole 12, the high bar 11 of left frame and the high bar of left side frame 13 are handstand T-shaped structure, and high 11 He of bar of left frame
For the high bar of left side frame 13 with 6 center line of device main casing at bilateral symmetry, this structure makes the high bar 11 of left frame and left side frame
The contact area of high bar 13 increases, and can bear larger pressure, and the high bar 11 of left frame and the high bar of left side frame 13 can be uniform
The pressure that subject the transmission of device main casing 6, the case where present apparatus centre-of gravity shift will not be caused.
6 bottom right rear and front end of device main casing is respectively connected with the high bar 13 of left side frame, and in high 13 lower end of bar of left side frame
Portion both sides are both provided with tapped through hole 12, and 6 inner upper of device main casing, which is provided with, accelerates air-exchanging chamber 3, and air-exchanging chamber 3 is accelerated to push up
End front is equipped with the first wind turbine 7, and the width of the first wind turbine 7 and the second wind turbine 14 is equal to the width of condensate flow pipeline 5,
And the first maximum distance between wind turbine 7 and the second wind turbine 14 is equal to the length of condensate flow pipeline 5, this structure makes first
The air acceleration for accelerating air-exchanging chamber 3 can be blown on condensate flow pipeline 5 by wind turbine 7 and the second wind turbine 14, and can be by cold
Cold wind is blowed to air cooling-down room 9 until cold wind touches the multi-layered high-density after making by the gap between lime set flow duct 5
PCB circuit board cools down to it.
First wind turbine, 7 rear is connected with the second wind turbine 14, and is provided with outside the second wind turbine 14 and accelerates air-exchanging chamber 3, right side
High 13 lower end of bar of frame is connected with condensate flow pipeline 5, and is equipped with condensate liquid inlet tube on the left of 5 front end of condensate flow pipeline
Road 4, condensate flow pipeline 5 is continuous S-shaped structure, and 5 internal diameter of condensate flow pipeline is equal to condensate liquid inlet pipeline 4 and cold
8 internal diameter of condensate outlet pipeline, this structure make the condensate liquid unit stream in condensate liquid inlet pipeline 4 and condensate outlet pipeline 8
Amount be equal to condensate flow pipeline 5 in condensate liquid specific discharge, enable condensate liquid that can at the uniform velocity flow, and this structure extend it is cold
Lime set is accelerating residence time in air-exchanging chamber 3, increases the flow path of condensate liquid so that air and condensate flow pipeline
5 outer walls can be contacted adequately with by air cooling-down.
It is connected with condensate outlet pipeline 8 on the right side of 5 rear end of condensate flow pipeline, and is set outside condensate outlet pipeline 8
It is equipped with device main casing 6,5 bottom end of condensate flow pipeline is connected with air cooling-down room 9, and 9 bottom of air cooling-down room is equipped with
Isolation board 10, isolation board 10 is reticular structure, and 10 length and width of isolation board are equal to the length and width of device main casing 6, and isolation board 10 is logical
Welding is crossed with device main casing 6, the high bar 11 of left frame and the high bar 13 of left side frame at fixed structure, after this structure makes transport make
Multi-layered high-density PCB circuit board conveyer belt can be between the high bar 11 of left frame and the high bar of left side frame 13 gap pass through,
And the isolation board 10 of reticular structure can not only prevent operating personnel from accidentally putting in air cooling-down room 9 hand and damage, but also can be with
Cold air is not hindered to be blown on circuit board and cooled down to circuit board by the first wind turbine 7 and the second wind turbine 14.
The operation principle of the utility model：When manufacturing postcooling device using the multi-layered high-density PCB circuit board, first examine
The present apparatus is looked into whether there is or not breakage cracking place, begins to use if all are intact, passes through the high bar 11 of left frame and the high bar of left side frame 13
The tapped through hole 12 of lower end fixes this multi-layered high-density PCB circuit board manufacture postcooling device on the ground, and conveys and make
The conveyer belt of multi-layered high-density PCB circuit board afterwards is located between the high bar 11 of left frame and the high bar of left side frame 13, isolation board 10
Lower section begins to use the present apparatus, condensate liquid to pass through when conveyer belt starts the multi-layered high-density PCB circuit board after conveying makes
Condensate liquid inlet pipeline 4 enters in condensate flow pipeline 5, then flows out condensate flow pipeline by condensate outlet pipeline 8
5, start air exhauster 1, the first wind turbine 7 and the second wind turbine 14, the first wind turbine 7 and the second wind turbine 14, which are blown, to be accelerated in air-exchanging chamber 3
Air is contacted with condensate flow pipeline 5, and the condensate liquid in condensate flow pipeline 5 lowers the temperature of air to form cold air
Into in air cooling-down room 9, after air cooling-down room 9 is blowed to making by the first wind turbine 7 and the second wind turbine 14 by isolation board 10 again
Multi-layered high-density PCB circuit board on cool down to circuit board, air exhauster 1 continues the air outside suction apparatus main casing 6
It is sent by air refreshing tube 2 and is accelerated in air-exchanging chamber 3, cooling is then contacted with condensate flow pipeline 5 for using, thus
Complete a series of activities.
Although the utility model is described in detail with reference to the foregoing embodiments, those skilled in the art is come
Say, still can with technical scheme described in the above embodiments is modified, or to which part technical characteristic into
Row equivalent replacement, within the spirit and principle of the utility model, any modification, equivalent replacement, improvement and so on should all
It is included within the scope of protection of this utility model.
Claims (5)
1. a kind of multi-layered high-density PCB circuit board manufactures postcooling device, including device main casing (6), it is characterised in that：It is described
Device main casing (6) top middle portion is connected with air refreshing tube (2), and air refreshing tube (2) top is equipped with air exhauster (1), described
Device main casing (6) bottom left rear and front end is respectively connected with the high bar of left frame (11), and inside the high bar of left frame (11) lower end
Both ends are both provided with tapped through hole (12), and described device main casing (6) bottom right rear and front end is respectively connected with the high bar of left side frame
(13), and inside the high bar of left side frame (13) lower end both sides are both provided with tapped through hole (12), on described device main casing (6) inside
Side, which is provided with, accelerates air-exchanging chamber (3), and accelerates to be equipped with the first wind turbine (7), first wind turbine in front of air-exchanging chamber (3) top
(7) rear is connected with the second wind turbine (14), and is provided with outside the second wind turbine (14) and accelerates air-exchanging chamber (3), and the left side frame is high
Bar (13) lower end is connected with condensate flow pipeline (5), and is equipped with condensate liquid import on the left of condensate flow pipeline (5) front end
Pipeline (4), condensate flow pipeline (5) the rear end right side are connected with condensate outlet pipeline (8), and condensate outlet pipeline
(8) external to be provided with device main casing (6), condensate flow pipeline (5) bottom end is connected with air cooling-down room (9), and empty
Gas cooling chamber (9) bottom is equipped with isolation board (10).
2. multi-layered high-density PCB circuit board according to claim 1 manufactures postcooling device, it is characterised in that：It is described cold
Lime set flow duct (5) is continuous S-shaped structure, and condensate flow pipeline (5) internal diameter is equal to condensate liquid inlet pipeline (4) and cold
Condensate outlet pipeline (8) internal diameter.
3. multi-layered high-density PCB circuit board according to claim 1 manufactures postcooling device, it is characterised in that：Described
The width of one wind turbine (7) and the second wind turbine (14) is equal to the width of condensate flow pipeline (5), and the first wind turbine (7) and
Maximum distance between two wind turbines (14) is equal to the length of condensate flow pipeline (5).
4. multi-layered high-density PCB circuit board according to claim 1 manufactures postcooling device, it is characterised in that：It is described every
It is reticular structure from plate (10), and isolation board (10) length and width are equal to the length and width of device main casing (6), isolation board (10) passes through weldering
It connects with device main casing (6), the high bar of left frame (11) and the high bar of left side frame (13) into fixed structure.
5. multi-layered high-density PCB circuit board according to claim 1 manufactures postcooling device, it is characterised in that：The left side
The high bar of side frame (11) and the high bar of left side frame (13) are handstand T-shaped structure, and the high bar of left frame (11) and the high bar of left side frame (13)
With device main casing (6) center line at bilateral symmetry.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721706569.5U CN207692165U (en) | 2017-12-11 | 2017-12-11 | A kind of multi-layered high-density PCB circuit board manufacture postcooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721706569.5U CN207692165U (en) | 2017-12-11 | 2017-12-11 | A kind of multi-layered high-density PCB circuit board manufacture postcooling device |
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| Publication Number | Publication Date |
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| CN207692165U true CN207692165U (en) | 2018-08-03 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201721706569.5U Active CN207692165U (en) | 2017-12-11 | 2017-12-11 | A kind of multi-layered high-density PCB circuit board manufacture postcooling device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108882508A (en) * | 2018-08-22 | 2018-11-23 | 汪洁 | A kind of circuit board mounting plate with heat sinking function |
| CN109348630A (en) * | 2018-10-26 | 2019-02-15 | 蚌埠国显科技有限公司 | A kind of array substrate protective device |
-
2017
- 2017-12-11 CN CN201721706569.5U patent/CN207692165U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108882508A (en) * | 2018-08-22 | 2018-11-23 | 汪洁 | A kind of circuit board mounting plate with heat sinking function |
| CN109348630A (en) * | 2018-10-26 | 2019-02-15 | 蚌埠国显科技有限公司 | A kind of array substrate protective device |
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