CN207560450U - A kind of high wiring board of heat dissipation performance - Google Patents

A kind of high wiring board of heat dissipation performance Download PDF

Info

Publication number
CN207560450U
CN207560450U CN201721722461.5U CN201721722461U CN207560450U CN 207560450 U CN207560450 U CN 207560450U CN 201721722461 U CN201721722461 U CN 201721722461U CN 207560450 U CN207560450 U CN 207560450U
Authority
CN
China
Prior art keywords
heat dissipation
wiring board
layer
dissipation performance
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201721722461.5U
Other languages
Chinese (zh)
Inventor
张智慧
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dongguan Wen Shu Electronic Technology Co Ltd
Original Assignee
Dongguan Wen Shu Electronic Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dongguan Wen Shu Electronic Technology Co Ltd filed Critical Dongguan Wen Shu Electronic Technology Co Ltd
Priority to CN201721722461.5U priority Critical patent/CN207560450U/en
Application granted granted Critical
Publication of CN207560450U publication Critical patent/CN207560450U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Abstract

The utility model discloses a kind of high wiring boards of heat dissipation performance, including circuit plate body, coating, heat dissipating layer, line layer and carrying bottom, the wiring board body side installs headlamp by shelves, bottom is equipped with carrying bottom in the circuit plate body, the carrying bottom surface is equipped with waterglass layer, line layer is equipped at the top of the carrying bottom, and line layer inner top posts semiconductor chilling plate by silica gel, heat dissipating layer is equipped at the top of the line layer, coating is equipped at the top of the heat dissipating layer, and coating top side installs static elimination bar by bolt, the static elimination bar side aspiration pump is installed by screw rod, the aspiration pump side electronic component is installed by connecting seat.The high circuit board function of this kind of heat dissipation performance is powerful, and design science is easy to operate, and stability is good, and reliability is high, is suitble to be widely popularized.

Description

A kind of high wiring board of heat dissipation performance
Technical field
The utility model is related to a kind of hydraulic clip meter apparatus, the high wiring board of more particularly to a kind of heat dissipation performance.
Background technology
Wiring board is the carrier for carrying electronic component, and electronic equipment under normal conditions can all be produced in operation and work Heat amount if equipment cannot radiate in time, can cause equipment to fail rapidly, staff's job schedule be influenced very much, when long Between heat cannot normally shed and also result in the rapid aging of equipment.For this purpose, a kind of it is proposed that high wiring board of heat dissipation performance.
Invention content
The main purpose of the utility model is that providing a kind of heat dissipation performance high wiring board, background skill can be effectively solved The problems in art.
To achieve the above object, the technical solution that the utility model is taken is:
A kind of high wiring board of heat dissipation performance including circuit plate body, coating, heat dissipating layer, line layer and carries bottom, The wiring board body side installs headlamp by shelves, and bottom is equipped with carrying bottom in the circuit plate body, described It carries bottom surface and is equipped with waterglass layer, line layer is equipped with, and line layer inner top is pasted by silica gel at the top of the carrying bottom There is semiconductor chilling plate, heat dissipating layer is equipped at the top of the line layer, coating is equipped at the top of the heat dissipating layer, and at the top of coating Static elimination bar is installed in side by bolt, and aspiration pump, the aspiration pump one are installed in the static elimination bar side by screw rod Side electronic component is installed by connecting seat.
Further, high efficiency and heat radiation piece is equipped in the heat dissipating layer.
Further, heat dissipation copper pipe is equipped between the electronic component.
Further, it is equipped with heat emission hole in the carrying bottom.
Further, the circuit plate body is made of copper-clad laminate.
Compared with prior art, the utility model has the advantages that:
A kind of high wiring board of heat dissipation performance by the setting of heat dissipating layer, can play good heat dissipation effect, pass through line The setting of road floor semiconductor-on-insulator cooling piece can in time freeze when wiring board body temperature is excessively high, pass through heat emission hole Setting, the heat in circuit plate body can well be shed, by the setting of headlamp, when insufficient light, can give Staff provides effective illumination, by the setting of heat dissipation copper pipe, plays good conductive force, passes through setting for aspiration pump It puts, can effectively dredge the hot-fluid in circuit plate body, by the setting of static elimination bar, wiring board can be effectively eliminated On electrostatic, electrostatic is avoided excessively to adsorb dust or causes electrostatic hazard, by the setting of waterglass layer, is played anti-well Fire action.
Description of the drawings
Fig. 1 is the utility model for the high wiring board cross-sectional view of heat dissipation performance.
Fig. 2 is the utility model for the high wiring board main box surface texture schematic diagram of heat dissipation performance.
Fig. 3 is cotton feeding inlet structure schematic diagram of the utility model for the high wiring board of heat dissipation performance.
Fig. 4 is cotton feeding inlet structure schematic diagram of the utility model for the high wiring board of heat dissipation performance.
In figure:1st, circuit plate body;2nd, heat dissipating layer;3rd, line layer;4th, bottom is carried;5th, heat emission hole;6th, coating;7th, it shines Bright lamp;8th, electronic component;9th, heat dissipation copper pipe;10th, aspiration pump;11st, static elimination bar;12nd, semiconductor chilling plate;13rd, waterglass Layer.
Specific embodiment
To be easy to understand technical means, creative features, achievable purpose and effectiveness of the utility model, below With reference to specific embodiment, the utility model is expanded on further.
As shown in Figs 1-4, the high wiring board of a kind of heat dissipation performance, including circuit plate body 1, coating 6, heat dissipating layer 2, line Headlamp 7 is installed in road floor 3 and carrying bottom 4,1 side of circuit plate body by shelves, bottom in the circuit plate body 1 Portion is equipped with carrying bottom 4, and 4 surface of the carrying bottom is equipped with waterglass layer 13, and 4 top of carrying bottom is equipped with line layer 3, And 3 inner top of line layer posts semiconductor chilling plate 12 by silica gel, 3 top of line layer is equipped with heat dissipating layer 2, the heat dissipation 2 top of layer is equipped with coating 6, and 6 top side of coating installs static elimination bar 11, the static elimination bar 11 by bolt Aspiration pump 10 is installed in side by screw rod, and electronic component 8 is installed in 10 side of aspiration pump by connecting seat.
Wherein, high efficiency and heat radiation piece is equipped in the heat dissipating layer 2, the effect with heat dissipation.
Wherein, heat dissipation copper pipe 9 is equipped between the electronic component 8, plays good conductive force.
Wherein, heat emission hole 5 is equipped in the carrying bottom 4, plays good ventilation effect.
Wherein, the circuit plate body 1 is made of copper-clad laminate, can realize the electricity supported between various components Gas connects or electrical isolation.
It should be noted that the utility model is a kind of high wiring board of heat dissipation performance, during work, when wiring board is normally transported After row, the heat in circuit plate body 1 is effectively divided equally, can be dissipated in conductive process by the heat dissipation copper pipe 9 between electronic component 8 Go a part of heat, when aspiration pump 10 is run, the hot-fluid in wiring board is extracted out, the semiconductor chilling plate 12 in heat dissipating layer 2 starts Operation, by heat emission hole 5, effectively sheds the heat in circuit plate body 1, when equipment is out of service, opens electrostatic and disappears Except stick 11, the electrostatic in equipment can be effectively eliminated, avoids, because of the excessive dust of Electrostatic Absorption, causing ageing equipment rapid, It prevents from causing electrostatic hazard, when equipment damage or need in installation elements in equipment and during insufficient light, headlamp 7 can carry For effectively helping.
Static elimination bar 11 is produced for Shanghai Qi Pu Science and Technology Ltd.s, and spring vibration-isolator 15 is the quiet section's green technology in Qingdao Co., Ltd produces, and semiconductor chilling plate 12 is produced for Suzhou ice and snow Electronics Co., Ltd..
The basic principle of the utility model and main feature and the advantages of the utility model has been shown and described above.One's own profession The technical staff of industry is it should be appreciated that the present utility model is not limited to the above embodiments, described in above embodiments and description Only illustrate the principle of the utility model, on the premise of not departing from the spirit and scope of the utility model, the utility model is also Various changes and modifications are had, these various changes and improvements fall within the scope of the claimed invention.The utility model Claimed range is defined by the appending claims and its equivalent thereof.

Claims (5)

1. a kind of high wiring board of heat dissipation performance, including circuit plate body(1), coating(6), heat dissipating layer(2), line layer(3) With carrying bottom(4), it is characterised in that:The circuit plate body(1)Headlamp is installed by shelves in side(7), the line Road plate body(1)Interior bottom is equipped with carrying bottom(4), the carrying bottom(4)Surface is equipped with waterglass layer(13), the carrying Bottom(4)Top is equipped with line layer(3), and line layer(3)Inner top posts semiconductor chilling plate by silica gel(12), the line Road floor(3)Top is equipped with heat dissipating layer(2), the heat dissipating layer(2)Top is equipped with coating(6), and coating(6)Top side leads to Cross bolt installation static elimination bar(11), the static elimination bar(11)Side aspiration pump is installed by screw rod(10), the pumping Air pump(10)Side electronic component is installed by connecting seat(8).
2. a kind of high wiring board of heat dissipation performance according to claim 1, it is characterised in that:The heat dissipating layer(2)Inside set There is high efficiency and heat radiation piece.
3. a kind of high wiring board of heat dissipation performance according to claim 1, it is characterised in that:The electronic component(8)It Between be equipped with heat dissipation copper pipe(9).
4. a kind of high wiring board of heat dissipation performance according to claim 1, it is characterised in that:The carrying bottom(4)It is interior Equipped with heat emission hole(5).
5. a kind of high wiring board of heat dissipation performance according to claim 1, it is characterised in that:The circuit plate body(1) It is made of copper-clad laminate.
CN201721722461.5U 2017-12-12 2017-12-12 A kind of high wiring board of heat dissipation performance Expired - Fee Related CN207560450U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201721722461.5U CN207560450U (en) 2017-12-12 2017-12-12 A kind of high wiring board of heat dissipation performance

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201721722461.5U CN207560450U (en) 2017-12-12 2017-12-12 A kind of high wiring board of heat dissipation performance

Publications (1)

Publication Number Publication Date
CN207560450U true CN207560450U (en) 2018-06-29

Family

ID=62662909

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201721722461.5U Expired - Fee Related CN207560450U (en) 2017-12-12 2017-12-12 A kind of high wiring board of heat dissipation performance

Country Status (1)

Country Link
CN (1) CN207560450U (en)

Similar Documents

Publication Publication Date Title
CN104896450A (en) Light irradiation device
KR20090084689A (en) Led illuminating device, led light source module, and led support member
CN207560450U (en) A kind of high wiring board of heat dissipation performance
CN207560451U (en) A kind of pcb board of favorable anti-corrosion effect
CN202058388U (en) LED (Light Emitting Diode) display device
CN207692165U (en) A kind of multi-layered high-density PCB circuit board manufacture postcooling device
CN209558062U (en) A kind of lamps and lanterns
CN207065518U (en) A kind of LED for being easily installed dismounting
CN205946457U (en) Novel circuit board components
CN208227412U (en) A kind of wiring board for high-performance mobile power supply
CN203788546U (en) Heat dissipating PCB
CN108224123A (en) A kind of high-efficient heat-dissipating LED lamp
CN210075806U (en) High-speed PCB of heat dissipation dust-protection type
CN207516916U (en) A kind of porous Al alloy plate construction for heat dissipation
CN207665274U (en) A kind of radiating circuit plate
CN202216089U (en) High-power light-emitting diode (LED) square lamp with improved radiation performance
CN201992605U (en) Heat sink for high-power LED (light-emitting diode) lamps
CN207035037U (en) The high-power LED lamp of novel air-cooled radiating
CN206669363U (en) A kind of high-heat-dispersion LED driving power
CN107949156A (en) A kind of double-sided wiring board
CN220711703U (en) Antistatic multilayer HDI circuit board
CN204069604U (en) A kind of controlled cooling model air circulation electronic equipment cabinet automatically
CN205560315U (en) Light -emitting diode (LED) mining lamp
CN205140948U (en) Heat dissipation packaging structure
CN209089332U (en) A kind of industrial large power road lamp power supply device

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20180629

Termination date: 20201212

CF01 Termination of patent right due to non-payment of annual fee