CN208113049U - A kind of high efficiency and heat radiation multilayer circuit board - Google Patents

Abstract

The utility model discloses a kind of high efficiency and heat radiation multilayer circuit boards, including circuit board, screw hole is equipped with inside the two sides of the circuit board, the lower port of the screw hole is bonded with the first lantern ring, the lower end of first lantern ring is bonded with rubber ring, the lower end of the rubber ring is bonded with the second lantern ring, and side bonds have follow block in the lower end of the circuit board, and the lower end two sides of the follow block are fixedly connected with dog-ear elastic slice.Pass through the gap fibre structure of alumina fiber layer, heat dispersion is transmitted on silver layer, silver layer one side high efficiency and heat radiation distributes even heat on one side by the heat absorption hole in gap and glass layer inside copper mesh layers, so that heat dissipation for circuit board effect is more excellent, circuit board two sides pass through the elastic force of rubber ring and spring, bounce rapidly, and middle part passes through the inflection elastic force of dog-ear elastic slice, side in circuit board is bounced together, it is convenient that circuit board is taken out out of circuit board slot.

Description

A kind of high efficiency and heat radiation multilayer circuit board

Technical field

The utility model relates to multilayer circuit board technical field, specially a kind of high efficiency and heat radiation multilayer circuit board.

Background technique

Multi-layer board is exactly multilayer routing layer, is dielectric layer between every two layers, and dielectric layer can be made thin.

Existing multilayer circuit board multi-pass excessively internal layers of copper or aluminium layer are radiated, and are to make multilayer circuit board It is very thin, but heat dissipation effect is undesirable, in the machine more demanding for installation adaptation, circuit board slot is for monolithic stability electricity Road plate, and cooperate gap very little with circuit board when maintenance, dismantles end screw when circuit board is mounted in casing interior circuit board slot Afterwards, because of the electronic component for having other to spread in casing, when inversion, can pour out together the electronic component of distribution, admittedly it cannot be inverted, It needs to be pulled out circuit board out of casing interior circuit board slot with tweezers are careful, it is very troublesome.

Utility model content

The purpose of this utility model is to provide a kind of high efficiency and heat radiation multilayer circuit boards, to solve in above-mentioned background technique The problem of proposition.

To achieve the above object, the utility model provides the following technical solutions：A kind of high efficiency and heat radiation multilayer circuit board, packet Circuit board is included, is equipped with screw hole inside the two sides of the circuit board, the lower port of the screw hole is bonded with the first lantern ring, described The lower end of first lantern ring is bonded with rubber ring, and the lower end of the rubber ring is bonded with the second lantern ring, in the lower end of the circuit board Side bonds have follow block, and the lower end two sides of the follow block are fixedly connected with dog-ear elastic slice, and the lower end of the dog-ear elastic slice is fixedly connected On the inside of the upper end of the second lantern ring, the inside of the circuit board include PCB substrate, aluminium foil layer, alumina fiber layer, silver layer, Copper mesh layers and glass layer.

Preferably, spring is cased on the outside of the rubber ring, the upper end of spring is fixedly connected on the lower end of the first lantern ring, bullet The lower end of spring is fixedly connected on the upper end of the second lantern ring.

Preferably, the inner surface of the PCB substrate is bonded in the outer surface of aluminium foil layer, and the inner surface of aluminium foil layer is bonded in oxygen Change the outer surface of aluminum fiber layer, the inner surface of alumina fiber layer is silver coated, and the inner surface welding of silver layer is in the outer of copper mesh layers Surface, the inner surface of copper mesh layers are bonded in the outer surface of glass layer, and the inside of glass layer is uniformly provided with heat absorption hole.

Compared with prior art, the utility model has the beneficial effects that：The high efficiency and heat radiation multilayer circuit board, passes through oxidation Heat dispersion is transmitted on silver layer by the gap fibre structure of aluminum fiber layer, and silver layer one side high efficiency and heat radiation passes through copper mesh layers on one side The heat absorption hole in internal gap and glass layer, even heat is distributed, so that heat dissipation for circuit board effect is more excellent, Circuit board two sides pass through the elastic force of rubber ring and spring, bounce rapidly, and middle part passes through the inflection elastic force of dog-ear elastic slice, by circuit board Middle side is bounced together, the circuit board slot so that four side of circuit board is emerged, convenient that circuit board is taken out out of circuit board slot.

Detailed description of the invention

Fig. 1 is the main view local cutting schematic diagram of the utility model；

Fig. 2 is enlarged structure schematic diagram at a of the utility model；

Fig. 3 is that the circuit board slot of the utility model and circuit board cooperate schematic diagram.

In figure：1 circuit board, 2 screw holes, 3 first lantern rings, 4 rubber rings, 5 second lantern rings, 6 springs, 7 follow blocks, 8 dog-ear bullets Piece, 9PCB substrate, 10 aluminium foil layers, 11 alumina fiber layers, 12 silver layers, 13 copper mesh layers, 14 glass layers, 15 heat absorption holes.

Specific embodiment

The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work Every other embodiment obtained, fall within the protection scope of the utility model.

In the description of the present invention, it should be understood that term " longitudinal direction ", " transverse direction ", "upper", "lower", " preceding ", The orientation or positional relationship of the instructions such as " rear ", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside" be based on Orientation or positional relationship shown in the drawings is merely for convenience of description the utility model, rather than the dress of indication or suggestion meaning It sets or element must have a particular orientation, be constructed and operated in a specific orientation, therefore should not be understood as to the utility model Limitation.

Fig. 1-3 is please referred to, the utility model provides a kind of technical solution：A kind of high efficiency and heat radiation multilayer circuit board, including The two sides inside of circuit board 1, circuit board 1 is equipped with screw hole 2, circuit board 1 to be mounted on the casing of machine with screw, spiral shell The lower port of wire hole 2 is bonded with the first lantern ring 3, and the lower end of the first lantern ring 3 is bonded with rubber ring 4, and the lower end of rubber ring 4 is bonded with Second lantern ring 5, the outside of rubber ring 4 are cased with spring 6, and the upper end of spring 6 is fixedly connected on the lower end of the first lantern ring 3, spring 6 Lower end is fixedly connected on the upper end of the second lantern ring 5, and the specification of spring 6 is that spring muscle diameter is 0.6 millimeter, and natural height is 6 millimeters, Maximum bounce is 0.5 newton, and for rubber ring 4 with a thickness of 1 millimeter, natural height is 6 millimeters, and maximum bounce is 0.8 newton, electricity Plate 1 self gravity in road is 0.7 newton, and by circuit board 1, the sum of compressed bounce is 0.7 to rubber ring 4 downwards with spring 6 at this time Newton, when circuit board 1 is fixed in circuit board slot by screw, spring 6 and be 1 with the sum of the compression lifting force of rubber ring 4 Newton, and it is 1 newton that dog-ear elastic slice 8, which bends elastic force, when screw deviates from the screw hole on machine, can bounce circuit board 1, bounce Height is 4 millimeters, and when actual installation, and 1 upper surface of circuit board and circuit board slot upper surface are the state that maintains an equal level, and circuit board 1 Body is with a thickness of 2 millimeters, and side bonds have follow block 7 in the lower end of circuit board 1, and the lower end two sides of follow block 7 are fixedly connected with dog-ear elastic slice 8, the lower end of dog-ear elastic slice 8 is fixedly connected on the inside of the upper end of the second lantern ring 5, passes through 5 middle part of the first lantern ring 3 and the second lantern ring Hole, the inside for conveniently penetrating screw circuit board 1 includes PCB substrate 9, aluminium foil layer 10, alumina fiber layer 11, silver layer 12, copper Stratum reticulare 13 and glass layer 14, the inner surface of PCB substrate 9 are bonded in the outer surface of aluminium foil layer 10, the inner surface of aluminium foil layer 10 It is bonded in the outer surface of alumina fiber layer 11, the inner surface of alumina fiber layer 11 silver coated 12, silver-colored thermal diffusivity is at present most By force, by silver layer 12, can 1 heat dissipation effect of accentuator plate, the inner surface welding of silver layer 12 is in the outer surface of copper mesh layers 13, copper mesh The inner surface of layer 13 is bonded in the outer surface of glass layer 14, and the inside of glass layer 14 is uniformly provided with heat absorption hole 15.

The utility model is in the specific implementation：When circuit board 1 comes into operation in machine, in the PCB substrate 9 in outside Electronic component fever, by aluminium foil layer 10, heat is assembled rapidly, and a part of heat sheds, and after the aggregation of another part heat, leads to Heat dispersion is transmitted on silver layer 12,12 one side high efficiency and heat radiation of silver layer, one by the gap fibre structure of peroxidating aluminum fiber layer 11 Side is distributed even heat, by the heat absorption hole 15 in gap and glass layer 14 inside copper mesh layers 13 so that circuit 1 heat dissipation effect of plate is more excellent, and when circuit board 1 is mounted in the circuit board slot on machine casing, spring 6 and rubber ring 5 are pressure Contracting state, and dog-ear elastic slice 8 is bending state, for screw after the back-out of machine upper screwed hole, 1 two sides of circuit board pass through rubber ring 5 With the elastic force of spring 6, bounce rapidly, and middle part passes through the inflection elastic force of dog-ear elastic slice 8, and side in circuit board 1 is bounced together, is made 1 four side of circuit board is emerged circuit board slot, it is more convenient that circuit board 1 is taken out out of circuit board slot.

While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art, It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.

Claims (3)

1. a kind of high efficiency and heat radiation multilayer circuit board, including circuit board (1), it is characterised in that：In the two sides of the circuit board (1) Portion is equipped with screw hole (2), and the lower port of the screw hole (2) is bonded with the first lantern ring (3), the lower end of first lantern ring (3) It is bonded with rubber ring (4), the lower end of the rubber ring (4) is bonded with the second lantern ring (5), side in the lower end of the circuit board (1) It is bonded with follow block (7), the lower end two sides of the follow block (7) are fixedly connected with dog-ear elastic slice (8), under the dog-ear elastic slice (8) End is fixedly connected on the inside of the upper end of the second lantern ring (5), and the inside of the circuit board (1) includes PCB substrate (9), aluminium foil layer (10), alumina fiber layer (11), silver layer (12), copper mesh layers (13) and glass layer (14).

2. a kind of high efficiency and heat radiation multilayer circuit board according to claim 1, it is characterised in that：The rubber ring (4) Outside is cased with spring (6), and the upper end of spring (6) is fixedly connected on the lower end of the first lantern ring (3), and the lower end of spring (6) is fixed to be connected Connect the upper end in the second lantern ring (5).

3. a kind of high efficiency and heat radiation multilayer circuit board according to claim 1, it is characterised in that：The PCB substrate (9) Inner surface is bonded in the outer surface of aluminium foil layer (10), and the inner surface of aluminium foil layer (10) is bonded in the appearance of alumina fiber layer (11) Face, the inner surface of alumina fiber layer (11) is silver coated (12), and the inner surface welding of silver layer (12) is in the outer of copper mesh layers (13) Surface, the inner surface of copper mesh layers (13) are bonded in the outer surface of glass layer (14), and the inside of glass layer (14) is uniform Equipped with heat absorption hole (15).