CN208127878U - A kind of parallel RC rescap - Google Patents
A kind of parallel RC rescap Download PDFInfo
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- CN208127878U CN208127878U CN201820742082.0U CN201820742082U CN208127878U CN 208127878 U CN208127878 U CN 208127878U CN 201820742082 U CN201820742082 U CN 201820742082U CN 208127878 U CN208127878 U CN 208127878U
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Abstract
The utility model discloses a kind of parallel RC rescaps, including substrate, it is characterised in that：Setting has been arranged in parallel resistance and capacitor between two electrodes there are two electrode on the substrate.Specifically, the same face of substrate is arranged in the resistance and capacitor, and insulating protective layer is provided between the resistance and capacitor, and the another side that the substrate is not provided with resistance is provided with mark；Alternatively, the front and back sides of substrate are arranged in the resistance and capacitor；The electrode both ends are arranged in front and back sides and by the lateral electrode connections in substrate side；The substrate is provided with insulating protective layer in resistance lower surface；The insulating protective layer lower surface is provided with mark.The utility model has the characteristics that design is small and exquisite, structure precision is high, performance is stable and convenient for large-scale production, is well positioned to meet the use demand of various electronic equipments.
Description
Technical field
The utility model relates to electronic equipment accessory technical field, especially a kind of parallel RC rescap.
Background technique
Resistance made of ceramic resistor refers to through thick film or film printing and fires on substrate, feature are volume
It is small, structure precision is high and easy to make, in electronic equipment of various using increasingly extensive.In answering for the electronic equipments such as lightning protection
With in field, need by ceramic substrate resistance and the elements such as capacitor carry out parallel connection, form high voltage relief RC capacitance-resistance
Component need to carry out more optimized design to the specific structure of ceramic resistor and capacitor, preferably to meet the needs of industrialized production.
Summary of the invention
In view of the deficiencies of the prior art, the utility model provide it is a kind of design that small and exquisite, structure precision is high, performance is stable and
Connection formula RC rescap.
The technical solution of the utility model is：A kind of parallel RC rescap, including substrate, it is characterised in that：It is described
Setting has been arranged in parallel resistance and capacitor between two electrodes there are two electrode on substrate.
The same face of substrate is arranged in the resistance and capacitor；Insulating protective layer is provided between the resistance and capacitor；
The another side that the substrate is not provided with resistance is provided with mark.
The front and back sides of substrate are arranged in the resistance and capacitor；The electrode both ends are arranged in front and back sides and by substrate
The lateral electrode of side connects；The substrate is provided with insulating protective layer in resistance lower surface；The insulating protective layer lower surface is set
It is equipped with mark.
The capacitor is multi-layer ceramic capacitance.The substrate is ceramic substrate.The capacitor is connect with electrode by scolding tin.
The ceramic substrate is rectangular configuration.
The beneficial effects of the utility model are：Parallel RC rescap provided by the utility model has design small
Ingeniously, the characteristics of structure precision is high, performance is stable and is convenient for large-scale production, the use for being well positioned to meet various electronic equipments needs
It asks.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the parallel RC rescap embodiment 1 of the utility model.
Fig. 2 is the structural schematic diagram of the parallel RC rescap embodiment 2 of the utility model.
In figure, 1- ceramic substrate, 2- electrode layer, 20- back electrode layer, 21- side electrode layer, 22- front electrode layer, 3-
Intermediate resistor layer, 4- insulating protective layer, 5- mark, 6- multi-layer ceramic capacitance, 7- scolding tin, the electrode of 8- multi-layer ceramic capacitance.
Specific embodiment
Specific embodiment of the present utility model is described further with reference to the accompanying drawing：
Embodiment 1：As shown in Figure 1, parallel RC rescap provided by the embodiment, including ceramic substrate（1）, institute
State ceramic substrate（1）Upper surface is successively printed with electrode layer from bottom to top（2）, intermediate resistor layer（3）And insulating protective layer（4）,
The ceramic substrate（1）Upper surface be arranged in parallel a multi-layer ceramic capacitance（6）；
In the present embodiment, the substrate is the ceramic substrate of rectangular configuration（1）, the electrode layer（2）Inside and centre
Resistive layer（3）It connects and inside upper surface is by intermediate resistor layer（3）Covering, the insulating protective layer（4）Intermediate electricity is completely covered
Resistance layer（3）, pass through scolding tin（7）By multi-layer ceramic capacitance（6）Electrode（8）With the electrode layer of resistance（2）Connection；The electrode layer
（2）And intermediate resistor layer（3）Collectively cover ceramic substrate（1）All upper surfaces, electrode layer（2）And intermediate resistor layer（3）Together
Step extends to ceramic substrate（1）Opposite sides；The substrate lower surface is provided with mark（5）.
Embodiment 2：As shown in Fig. 2, parallel RC rescap provided by the embodiment, including ceramic substrate（1）, institute
State ceramic substrate（1）Two sides are provided with electrode layer（2）, the electrode layer（2）Including being wholely set, extending to ceramic substrate（1）
Opposite sides the back electrode layer positioned at upper surface（20）, side electrode layer positioned at side（21）And it is located at lower surface
Front electrode layer（22）, the back electrode layer（20）On pass through scolding tin（7）With multi-layer ceramic capacitance（6）Electrode（8）Even
It connects, the front electrode layer（22）Lower section is disposed with intermediate resistor layer（3）And insulating protective layer（4）, in the present embodiment,
The substrate is the ceramic substrate of rectangular configuration（1）, the insulating protective layer（4）Lower surface is provided with mark（5）.
When it is implemented, the ceramic substrate（1）For aluminium oxide or aluminium nitride ceramic substrate；The side electrode layer
（21）For using the conductor paste of one or both of gold, palladium, platinum and silver；The intermediate resistor layer（3）To use ruthenium system
The thick film resistive layer of resistance slurry, or the intermediate resistor layer（3）For using Ni/Cr alloy film, SnCl4 oxidation film or SnCl3
The thin film resistive layer of oxidation film；The insulating protective layer（4）Material using polyimides, resin, organo-silicon compound or
Pyrex inorganic compound.
The description of the embodiments and the specification only illustrate the principle of the present utility model and most preferred embodiment, is not taking off
Under the premise of from the spirit and scope of the utility model, the utility model also has various changes and improvements, these changes and improvements
It falls within the scope of the claimed invention.
Claims (10)
1. a kind of parallel RC rescap, including substrate, it is characterised in that：Electrode there are two settings on the substrate, two
Resistance and capacitor have been arranged in parallel between electrode.
2. parallel RC rescap according to claim 1, it is characterised in that：The resistance and capacitor are arranged in substrate
The same face.
3. parallel RC rescap according to claim 2, it is characterised in that：It is provided between the resistance and capacitor
Insulating protective layer.
4. parallel RC rescap according to claim 3, it is characterised in that：The substrate is not provided with the another of resistance
Face is provided with mark.
5. parallel RC rescap according to claim 1, it is characterised in that：The resistance and capacitor are arranged in substrate
Front and back sides.
6. parallel RC rescap according to claim 5, it is characterised in that：The electrode both ends are arranged in front and back sides
And pass through the lateral electrode connection in substrate side.
7. parallel RC rescap according to claim 6, it is characterised in that：The substrate is arranged in resistance lower surface
There is insulating protective layer.
8. parallel RC rescap according to claim 7, it is characterised in that：The insulating protective layer lower surface setting
There is mark.
9. parallel RC rescap according to claim 1-8, it is characterised in that：The capacitor is multilayer pottery
Porcelain capacitor.
10. parallel RC rescap according to claim 1-8, it is characterised in that：The substrate is ceramics
Substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820742082.0U CN208127878U (en) | 2018-05-16 | 2018-05-16 | A kind of parallel RC rescap |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820742082.0U CN208127878U (en) | 2018-05-16 | 2018-05-16 | A kind of parallel RC rescap |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208127878U true CN208127878U (en) | 2018-11-20 |
Family
ID=64185834
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820742082.0U Active CN208127878U (en) | 2018-05-16 | 2018-05-16 | A kind of parallel RC rescap |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208127878U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110571208A (en) * | 2019-08-19 | 2019-12-13 | 中国电子科技集团公司第四十三研究所 | Anti-lightning protection circuit, protection device and manufacturing method of protection device |
-
2018
- 2018-05-16 CN CN201820742082.0U patent/CN208127878U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110571208A (en) * | 2019-08-19 | 2019-12-13 | 中国电子科技集团公司第四十三研究所 | Anti-lightning protection circuit, protection device and manufacturing method of protection device |
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Legal Events
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|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20190311 Address after: 610000 No. 19 Tianyu Road, West Park, Chengdu High-tech Zone, Chengdu, Sichuan Province Patentee after: Sichuan Zhongguang Lightning Protection Technologies Co., Ltd. Address before: 523808 Room 302, Modern Enterprise Accelerator 4, Industrial East Road, Songshan Lake High-tech Industrial Development Zone, Dongguan City, Guangdong Province Patentee before: Dongguan Tps Electronic Technology Co., Ltd. |