CN106449093B - Composite electronic component and preparation method thereof - Google Patents
Composite electronic component and preparation method thereof Download PDFInfo
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- CN106449093B CN106449093B CN201610877829.9A CN201610877829A CN106449093B CN 106449093 B CN106449093 B CN 106449093B CN 201610877829 A CN201610877829 A CN 201610877829A CN 106449093 B CN106449093 B CN 106449093B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
- H01G4/306—Stacked capacitors made by thin film techniques
Abstract
The present invention relates to a kind of composite electronic components and preparation method thereof; the composite electronic component is integrated into capacitance and resistance in discrete component; the setting face electrode on the side of ceramic body; face electrode one end is electrically connected with first resistor layer; the other end of face electrode is electrically connected with the second termination electrode; a resistance in parallel with capacitance is formed between the first termination electrode and the second termination electrode by face electrode, can play the role of protecting capacitance.Above-mentioned composite electronic component it is applied widely, size is smaller, can be circuitry save space.
Description
Technical field
The present invention relates to electronic component technology fields, more particularly, to a kind of composite electronic component and preparation method thereof.
Background technology
Capacitor can be used for separated by direct communication, filtering and energy storage etc., have in the occasions such as transmission of electricity, distribution, electricity consumption extensive
Using.In the application of many circuits, when needing the circuit using resistance and capacitance cascaded structure, discrete component is generally used, i.e.,
Resistance is mounted in the outside of capacitance, attachment is less efficient, forms single resistance and single capacitance, and it is empty to occupy more circuit in this way
Between, it is unfavorable for the miniaturization of complete machine.
Invention content
Based on this, it is necessary to provide a kind of smaller composite electronic component of size and preparation method thereof.
A kind of composite electronic component, including ceramic body, the first connection electrode, first resistor layer, the first termination electrode, second end
Electrode and face electrode；
The ceramic body is cuboid, and the ceramic body has first end face and second end face relative to each other, Yi Jilian
Connect four sides of the first end face and the second end face；The ceramic body is filled with ceramic dielectric, the ceramics
Multiple first electrode layers and multiple the second electrode lays are interspersed in medium, the first electrode layer replaces with the second electrode lay
Stacking, and projection of the first electrode layer on the second electrode lay has lap with the second electrode lay,
The ceramic dielectric, the first electrode layer at least one are also filled between the first electrode layer and the second electrode lay
Place exposes to the first end face of the ceramic body, and the second end of the ceramic body is exposed at the second electrode lay at least one
Face；
First connection electrode is attached in the first end face of the ceramic body, first connection electrode and described the
One electrode layer is electrically connected, and the first resistor layer is attached in first connection electrode, and first termination electrode is attached to institute
It states on first resistor layer；
Second termination electrode is attached in the second end face of the ceramic body, second termination electrode and second electricity
Pole layer electrical connection；
The face electrode is attached on the side of the ceramic body, one end of the face electrode and first resistor layer electricity
Connection, the other end of the face electrode are electrically connected with second termination electrode.
In one embodiment, be additionally provided between second termination electrode and the second end face the second connection electrode with
And second resistance layer, second connection electrode are attached in the second end face, second connection electrode and described second
Electrode layer is electrically connected, and the second resistance layer is attached in second connection electrode, and second termination electrode is attached to described
On second resistance layer.
In one embodiment, the first resistor layer extends a distance on the side where the face electrode,
The first extension is formed, first extension has lap with the face electrode.
In one embodiment, the second resistance layer extends a distance on the side where the face electrode,
The second extension is formed, second extension has overlapping portion with the one end of the face electrode far from the first resistor layer
Point.
In one embodiment, first termination electrode extends a distance on the side where the face electrode,
Third extension is formed, the development length of the third extension is less than the development length of first extension.
In one embodiment, second termination electrode extends a distance on the side where the face electrode,
The 4th extension is formed, the development length of the 4th extension is less than the development length of second extension.
In one embodiment, for the first electrode layer perpendicular to the first end face, the second electrode lay is vertical
In the second end face, the first electrode layer and the second electrode lay are opposite and are arranged in parallel.
A kind of preparation method of composite electronic component, includes the following steps：
There is provided ceramic body, the ceramic body be cuboid, wherein the ceramic body have first end face relative to each other and
Second end face, and connect four sides of the first end face and the second end face；The ceramic body is filled with pottery
Ceramic dielectric is interspersed with multiple first electrode layers and multiple the second electrode lays, the first electrode layer and institute in the ceramic dielectric
State that the second electrode lay is alternately laminated, and projection of the first electrode layer on the second electrode lay and the second electrode
Layer have lap, between the first electrode layer and the second electrode lay be filled with the ceramic dielectric, described first
The first end face of the ceramic body is exposed at electrode layer at least one, is exposed at the second electrode lay at least one described
The second end face of ceramic body；
Electrode slurry is covered in the first end face of the ceramic body and forms the first connection electrode, wherein described first connects
Receiving electrode is electrically connected with the first electrode layer；
Electrode slurry forming face electrode is covered on the side of the ceramic body；
Resistance slurry is covered in first connection electrode forms first resistor layer, the first resistor layer and the face
Electrode is electrically connected；And
Electrode slurry is covered on the first resistor layer and forms the first termination electrode, and electrode is covered in the second end face
Slurry forms the second termination electrode, wherein second termination electrode is electrically connected respectively with the second electrode lay and face electricity
Pole is electrically connected, and obtains the composite electronic component.
In one embodiment, the operation that electrode slurry forms second termination electrode is covered in the second end face
Before, further include first covering electrode slurry in the second end face to form the second connection electrode, and electricity is connected described second
Extremely upper covering resistance slurry forms second resistance layer.
In one embodiment, the ceramic body is prepared with the following method：
Ceramic slurry is obtained after ceramic powder, adhesive and organic solvent are mixed, using the ceramic slurry as raw material flow
Prolong to form multiple ceramic dielectric films；
Print electrode slurry in the ceramic dielectric films of preset quantity, respectively obtains the pottery for being printed with first electrode layer
Ceramic dielectric film and the ceramic dielectric films for being printed with the second electrode lay；
The ceramic dielectric films for being printed with first electrode layer and the ceramic dielectric films for being printed with the second electrode lay are alternately laminated
Laminated body is obtained, wherein first electrode layer described in the laminated body and the second electrode lay are alternately laminated, and described
Projection of one electrode layer on the second electrode lay and the second electrode lay have a lap, the first electrode layer with
The ceramic dielectric films are filled between the second electrode lay；And
The laminated body is pressed, the ceramic body is obtained after sintering.
Above-mentioned composite electronic component, first electrode layer and the alternately laminated formation multilayer electricity of the second electrode lay of ceramic body
Hold structure.The setting face electrode on the side of ceramic body, face electrode one end are electrically connected with first resistor layer, first resistor layer and
One termination electrode is electrically connected, and the other end of face electrode is electrically connected with the second termination electrode, by face electrode in the first termination electrode and second
A resistance in parallel with capacitance is formed between termination electrode.Resistance in parallel can prevent putting for capacitance with the electric energy of Absorption Capacitance
Electric current is excessive, avoids damaging other devices, can also protect personal safety.Face electrode makes the technique for preparing resistance
Simply, adjustment resistance is convenient.Above-mentioned composite electronic component realizes a capacitance and resistance is integrated into discrete component, passes through
Spacing and facing area between the dielectric constant or adjusting first electrode layer and the second electrode lay of adjusting ceramic dielectric can
Easily to obtain different capacitances, the resistivity of adjusting first resistor layer and the first termination electrode and the second termination electrode and face
Spacing between electrode can easily obtain different resistance values so that composite electronic component it is applied widely, size compared with
It is small, can be that circuitry saves space.
Description of the drawings
Fig. 1 is the structural schematic diagram of the composite electronic component of an embodiment；
Fig. 2 is the structural schematic diagram of the ceramic body of composite electronic component as shown in Figure 1；
Fig. 3 is the sectional view that composite electronic component as shown in Figure 1 is parallel to the first side surface；
Fig. 4 is the sectional view that composite electronic component as shown in Figure 1 is parallel to the first main surface；
Fig. 5 is another sectional view that composite electronic component as shown in Figure 1 is parallel to the first main surface；
Fig. 6 is the equivalent circuit diagram of composite electronic component as shown in Figure 1；
Fig. 7 is the structural schematic diagram of the composite electronic component of another embodiment；
Fig. 8 is the sectional view that composite electronic component as shown in Figure 7 is parallel to the first side surface；
Fig. 9 is the sectional view that composite electronic component as shown in Figure 7 is parallel to the first main surface；
Figure 10 is another sectional view that composite electronic component as shown in Figure 7 is parallel to the first main surface；
Figure 11 is the equivalent circuit diagram of composite electronic component as shown in Figure 7；
Figure 12 is the flow chart of the preparation method of the composite electronic component of an embodiment；
Figure 13 is the silk-screen patterns of the face electrode such as Fig. 1 and composite electronic component as shown in Figure 7；
Figure 14 is the flow chart of the preparation method of the ceramic body of an embodiment；
Figure 15 is such as Fig. 1 and the first electrode layer of composite electronic component as shown in Figure 7 and the silk screen figure of the second electrode lay
Case.
Specific implementation mode
In order to make the foregoing objectives, features and advantages of the present invention clearer and more comprehensible, below in conjunction with the accompanying drawings to the present invention
Specific implementation mode be described in detail.Many details are elaborated in the following description in order to fully understand this hair
It is bright.But the invention can be embodied in many other ways as described herein, those skilled in the art can be not
Similar improvement is done in the case of violating intension of the present invention, therefore the present invention is not limited to the specific embodiments disclosed below.
Referring to Fig. 1, the composite electronic component 100 of an embodiment, including ceramic body 10, the first connection electrode 201,
One resistive layer 31, the first termination electrode 221, the second termination electrode 222 and face electrode 40.
Ceramic body 10 is cuboid, and ceramic body 10 has first end face and second end face relative to each other, and connection the
Four sides of end face and second end face.In present embodiment, the structure of ceramic body 10 is referring to Fig. 2, ceramic body 10 has
First main surface 01 and the second main surface 02 relative to each other, the first side surface 03 relative to each other and the second side surface 04 and
First end face 05 and second end face 06 relative to each other.First main surface 01, the second main surface 02, the first side surface 03 and second
Side surface 04 can also be referred to as side.
It should be noted that herein, the first main surface 01, the second main surface 02, the first side surface 03, the second side surface
04, the name of first end face 05 and second end face 06 and number are merely to the convenience described, is not to space structure
It limits.Ceramic body 10 is cuboid, and cuboid is made of six faces, opposite face area equation, can have two in six faces
A face, four faces or six faces are square, and can also be in six faces can be rectangular there are two face, four faces or six faces
Shape.
Specifically, the first main surface 01 and the second main surface 02 opposite and parallel, the first side surface 03 and the second side surface
04 is opposite and parallel, and first end face 05 is opposite and parallel with second end face 06.
Referring to Fig. 3, composite electronic component 100 is parallel to a sectional view of the first side surface 03, inside ceramic body 10
Filled with ceramic dielectric 11, it is interspersed with multiple first electrode layers 101 and multiple the second electrode lays 102 in ceramic dielectric 11, first
Electrode layer 101 and the second electrode lay 102 are alternately laminated, and projection of the first electrode layer 101 on the second electrode lay 102 and the
Two electrode layers 102 have lap, and ceramic dielectric 11 is filled between first electrode layer 101 and the second electrode lay 102.First
First end face 05 is exposed at electrode layer 101 at least one, and second end face 06 is exposed at the second electrode lay 102 at least one.
Specifically, ceramic dielectric 11 can be the state of sintering and integrate each other so that can not confirm adjacent ceramic medium 11
Between boundary.First electrode layer 101 and the second electrode lay 102 are interspersed between ceramic dielectric 11, and first electrode layer 101
Ceramic dielectric 11 is filled between the second electrode lay 102, to form multiple capacitances.
Specifically, the material of ceramic dielectric 11 mainly has barium titanate ceramics.Barium titanate ceramics have higher dielectric constant,
So that the capacitance swing for the composite electronic component 100 that can be prepared is wider.
Specifically, first electrode layer 101 and the second electrode lay 102 are opposite and are arranged in parallel.First electrode layer 101 perpendicular to
First end face 05, for 102 layers of second electrode perpendicular to second end face 06, first electrode layer 101 and the second electrode lay 102 are opposite and flat
Row setting.Further, first electrode layer 101 and the second electrode lay 102 are parallel to the first main surface 01 and the second main surface 02.
The facing area for being conducive to increase first electrode layer 101 and the second electrode lay 102 is arranged in parallel, improves capacitance.
First connection electrode 201 is attached in the first end face 05 of ceramic body 10, the first connection electrode 201 and first electrode
Layer 101 is electrically connected.Specifically, can be that each first electrode layer 101 is electrically connected with the formation of the first connection electrode 201 respectively.
First resistor layer 31 is attached in the first connection electrode 201, and the first termination electrode 221 is attached on first resistor layer 31.
Second termination electrode 222 is attached in second end face 06, and the second termination electrode 222 is electrically connected with the second electrode lay 102.Tool
Body, can be that each the second electrode lay 102 is electrically connected with the formation of the second termination electrode 222 respectively.Face electrode 40 is attached to pottery
On the side of porcelain body 10, one end of face electrode 40 is electrically connected with first resistor layer 31, the other end and the second end electricity of face electrode 40
Pole 222 is electrically connected.
Specifically, face electrode 40 can be attached on any one or more sides of ceramic body 10.In present embodiment,
Face electrode 40 is attached in the first main surface 01 of ceramic body 10.
After the first termination electrode 221 and the second termination electrode 222 are connect with external power, due to first resistor layer 31 thickness very
It is small and conductive area is larger between the first termination electrode 221 and the first connection electrode 201, therefore the first termination electrode 221 and first connects
Resistance very little between receiving electrode 201, can be ignored.Multiple first electrode layers 101 of ceramic body 10 and multiple second electricity
Pole layer 102 forms multiple complex capacitances being connected in parallel, as multilayer ceramic capacitor.Further, in the side of ceramic body 10
One end of setting face electrode 40 on face, face electrode 40 is electrically connected with first resistor layer 31, the other end and second end of face electrode 40
Electrode 222 is electrically connected, and forms between the first termination electrode 221 and the second termination electrode 222 one and capacitance by face electrode 40 simultaneously
The resistance of connection, realizes a capacitance and resistance is integrated into discrete component.
Specifically, first resistor layer 31 extends a distance on the side where face electrode 40, the first extension is formed.
The extended distance of first extension is indicated with D1 in Fig. 1.First extension has lap with face electrode 40.By the first electricity
Resistance layer 31 extends and has lap with face electrode 40, is conducive to be formed between first resistor layer 31 and face electrode 40 preferable
Electrical contact.
In present embodiment, first resistor layer 31 is in four sides (first main surface 01, adjacent with first end face 05
Two main surfaces 02, the first side surface 03 and the second side surface 04) respectively extend a distance into, and in the first main surface 01
Face electrode 40 has lap.First resistor layer 31 has an extension on four sides, it is easy to produce on positioning.
Specifically, the first termination electrode 221 extends a distance on the side where face electrode 40, forms third and extend
Portion, the development length of third extension are less than the development length of the first extension.The extended distance of third extension is used in Fig. 1
D3 is indicated.D3 is less than D1, between the first termination electrode 221 and face electrode 40 at least between alternating floor first resistor layer 31, avoid the
One termination electrode 221 is in direct contact with face electrode 40.The other end of face electrode 40 is electrically connected with the second termination electrode 222 again, forms one
A resistance in parallel with capacitance.In present embodiment, the first termination electrode 221 is in four sides (adjacent with first end face 05
One main surface 01, the second main surface 02, the first side surface 03 and the second side surface 04) respectively extend a distance into, to by the
End face 05 coats completely.
Specifically, the second termination electrode 222 is in four sides adjacent with second end face 06, (the first main surface 01, second is led
Surface 02, the first side surface 03 and the second side surface 04) respectively extend a distance into, to which second end face 06 be coated completely,
To be electrically connected with the formation of the second electrode lay 102.
Fig. 4 and Fig. 5 are please referred to, Fig. 4 is the sectional view that composite electronic component 100 is parallel to the first main surface 01, Fig. 5
Another sectional view of the first main surface 01 is parallel to for composite electronic component 100.In present embodiment, first electrode layer 101
One end exposes to the first end face 05 of ceramic body 10, to be electrically connected with the formation of the first connection electrode 201.First termination electrode 221
Resistance very little between the first connection electrode 201 is negligible, to may be regarded as first electrode layer 101 and the first termination electrode
221 are directly electrically connected.First resistor layer 31 extends one end distance in the first main surface 01 and has overlapping portion with face electrode 40
Point, face electrode 40 is electrically connected with the second termination electrode 222 again, forms a resistance in parallel with capacitance.Specifically, present embodiment
Composite electronic component 100 equivalent circuit diagram as shown in fig. 6, the first termination electrode (V1) is connect with capacitance (C), capacitance (C) with
Second termination electrode (V2) connects, and capacitance (C) includes the sub- capacitance of multiple parallel connections.There are one the resistance in parallel with capacitance (C)
(R), it to form the composite construction with capacitance and resistance, realizes a capacitance and resistance is integrated into discrete component, size
It is smaller.The resistance (R) in parallel with capacitance (C) can be prevented the discharge current of capacitance (C) excessive, kept away with the electric energy of Absorption Capacitance (C)
Exempt to damage other devices, protects personal safety.Face electrode to prepare resistance (R) more convenient, adjusts resistance value more
Flexibly, the application environment for making the adaptation of composite electronic component 100 different.
In another embodiment, please refer to Fig. 7~Figure 10, the structure of composite electronic component 100 with it is shown in FIG. 1 multiple
It is similar to close electronic component 100, unlike, the second connection electrode 202 is additionally provided between the second termination electrode 221 and second end face 06
And second resistance layer 32, the second connection electrode 202 are attached in second end face 06, the second connection electrode 202 and second electrode
Layer 102 is electrically connected, and second resistance layer 32 is attached in the second connection electrode 202, and the second termination electrode 222 is attached to second resistance layer
On 32.
Further, second resistance layer 32 extends a distance on the side where face electrode 40, forms second and extends
Portion, the second extension have lap with face electrode 40.The extended distance of second extension is indicated with D2 in Fig. 1.Second
Extension has lap with the one end of face electrode 40 far from first resistor layer 31.Second resistance layer 32 is extended and electric with face
Pole 40 has lap, is conducive to form preferable electrical contact between second resistance layer 32 and face electrode 40.Face electrode 40 1
End connection first resistor layer 31, the other end connects second resistance layer 32, to form two series resistances, after the two resistors are connected in series
Parallel-connection structure is formed with capacitance.
In present embodiment, second resistance layer 32 is in four sides (first main surface 01, adjacent with second end face 06
Two main surfaces 02, the first side surface 03 and the second side surface 04) respectively extend a distance into, and in the first main surface 01
Face electrode 40 has lap.Second resistance layer 32 has an extension on four sides, it is easy to produce on positioning.
Specifically, the second termination electrode 222 extends a distance on the side where face electrode 40, forms the 4th and extend
Portion, the development length of the 4th extension are less than the development length of the second extension.The extended distance of 4th extension is used in the figure 7
D4 is indicated.D4 is less than D2, between the second termination electrode 222 and face electrode 40 at least between alternating floor second resistance layer 32, avoid the
Two termination electrodes 222 are in direct contact with face electrode 40.The other end of face electrode 40 is electrically connected with first resistor layer 31 again, to make pottery
The resistance in parallel with capacitance is formed above porcelain body.
Specifically, the second termination electrode 222 is attached on second resistance layer 32, and in four sides adjacent with second end face 06
Face (the first main surface 01, the second main surface 02, the first side surface 03 and the second side surface 04) respectively extends a distance into, to
Second end face 06 is coated completely.
First resistor layer 31 extend in the first main surface 01 one end distance and with face electrode 40 have lap, second
Resistive layer 32 extend in the first main surface 01 one end distance and with face electrode 40 have lap, one end of face electrode 40 with
First resistor layer 31 is electrically connected, and the other end of face electrode 40 is electrically connected with second resistance layer 32, to be formed above ceramic body
The resistance in parallel with capacitance.Specifically, the equivalent circuit diagram of the composite electronic component 100 of present embodiment is as shown in figure 11, the
One termination electrode (V1) is connect with capacitance (C), and the other side of capacitance (C) is connect with the second termination electrode (V2).Capacitance (C) includes multiple
Sub- capacitance in parallel.Two series resistances (R) are in parallel with capacitance (C), form the composite construction with capacitance and resistance, realize
Capacitance and resistance are integrated into discrete component, size is smaller.The resistance value of multiple resistance (R) can it is equal can not also be equal,
Resistance value can be adjusted flexibly.Resistance (R) can prevent the discharge current of capacitance excessive with the electric energy of Absorption Capacitance, avoid pair
Other devices damage, and can also protect personal safety.The advantageous effect of face electrode：1, so as to prepare resistance more convenient,
When forming resistance using infusion process, can use smaller impregnating depth that can connect two resistance (R), difficulty of processing compared with
It is low.2, more flexible adjusting resistance value can be with if resistance value does not reach target zone after one end of face electrode forms resistance
Resistance is formed in the other end of face electrode again, that is, obtains the chance for adjusting resistance value again.Composite electronic component 100 is set to adapt to difference
Application environment.
Capacitance and resistance are integrated in discrete component by above-mentioned composite electronic component 100, and size is smaller, can be complete machine
Circuit saves space.
In addition, the present invention also provides the preparation methods of above-mentioned composite electronic component 100.
The flow chart of the preparation method of the composite electronic component of one embodiment is as shown in figure 12, includes the following steps S110
~S150.
S110, ceramic body is provided.
Wherein, which is cuboid, and ceramic body has first end face and second end face relative to each other, and connection
Four sides of first end face and second end face.Ceramic body is filled with ceramic dielectric, and multiple the are interspersed in ceramic dielectric
One electrode layer and multiple the second electrode lays, first electrode layer is alternately laminated with the second electrode lay, and first electrode layer is second
Projection on electrode layer has lap with the second electrode lay, is situated between filled with ceramics between first electrode layer and the second electrode lay
Matter.The first end face of ceramic body is exposed at first electrode layer at least one, and ceramics are exposed at the second electrode lay at least one
The second end face of body.
Further, first electrode layer and the second electrode lay are opposite and are arranged in parallel.First electrode layer is perpendicular to first end
Face, for the second electrode lay perpendicular to second end face, first electrode layer and the second electrode lay are opposite and be arranged in parallel.It is arranged in parallel advantageous
In the facing area for increasing first electrode layer and the second electrode lay, capacitance is improved.
S120, electrode slurry the first connection electrode of formation is covered in the first end face of ceramic body, wherein the first connection electricity
Pole is electrically connected with first electrode layer.
Specifically, electrode slurry can be covered in first end face by modes such as dipping, coating or printings, to be formed
First connection electrode.
The electrode slurry for forming the first connection electrode can be metal paste, be specifically as follows silver metal slurry etc..
When preparing composite electronic component as shown in Figure 1, electrode slurry is coated in first end face, formation is attached to the
The first connection electrode on end face.When preparing composite electronic component as shown in Figure 7, further, in second end face
It covers electrode slurry and forms the second connection electrode.
S130, electrode slurry forming face electrode is covered on the side of ceramic body.
Specifically, electrode slurry can be covered on the side of ceramic body by modes such as dipping, coating or printings, to
Forming face electrode.
The electrode slurry of forming face electrode can be metal paste, be specifically as follows silver metal slurry, palladium metal slurry or
The silver palladium alloy metal paste of the arbitrarily silver-colored palladium ratio of person.Preferably, the electrode slurry of forming face electrode is the mass parts of silver and palladium
Number is than being 85:15~70:The electric conductivity of 30 silver palladium alloy slurry, such face electrode is preferable, and material cost is relatively low.
In present embodiment, by way of silk-screen printing on the first major surface by electrode slurry covering.
Further, the silk-screen patterns of face electrode are as shown in figure 13, and dash area expression is printed electrode at slurry.Specifically may be used
A plurality of cutting line in Figure 13 is cut in length and breadth, to obtain the face electrode of preset shape.
In one embodiment, first the electrode slurry of forming face electrode can be covered on the side of laminated body, the layer
Stack after being sintered for forming ceramic body.The electrode slurry of forming face electrode is sintered together with laminated body, at this point, the material of face electrode
The material identical of material and first electrode layer, convenient for being sintered with identical sintering temperature, electrode is firmly pasted below for sintering
On ceramic body.
The advantageous effect of preparation face electrode has：1, so as to prepare resistance more convenient, when forming resistance using infusion process,
It can use smaller impregnating depth that can connect two resistance, difficulty of processing is relatively low.2, more flexible adjusting resistance value, in face
If resistance value does not reach target zone after one end of electrode forms resistance, can also resistance be formed in the other end of face electrode again,
Obtain the chance for adjusting resistance value again.Composite electronic component is set to adapt to different application environments.
S140, resistance slurry formation first resistor layer is covered in the first connection electrode, wherein first resistor layer and face electricity
Pole is electrically connected.
Specifically, resistance slurry can be ruthenium system resistance slurry.
Resistance slurry can be covered in the first connection electrode by modes such as dipping, coating or printings.
In present embodiment, resistance slurry is immersed in by will be covered with the first end face of ceramic body of the first connection electrode
In, to form first resistor layer, the mode of dipping can make resistance slurry simultaneously in four tables abutted with first end face
Face is respectively formed on extension, improves production efficiency.The extension can be partially covered face electrode on the first major surface.
Further, when preparing composite electronic component as shown in Figure 7, resistance slurry can be covered in the second connection electrode
Form second resistance layer.Second resistance layer forms part in the one end of face electrode far from first resistor layer and covers.
S150, electrode slurry the first termination electrode of formation is covered on first resistor layer, electrode slurry is covered in second end face
Material forms the second termination electrode, wherein the second termination electrode is electrically connected respectively with the second electrode lay and the electrical connection of face electrode, is answered
Close electronic component.
Electrode slurry can be covered on first resistor layer or second end face by modes such as dipping, coating or printings.
The electrode slurry for forming the first termination electrode and the second termination electrode can be metal paste, be specifically as follows silver metal slurry
Material etc..
Specifically, when preparing composite electronic component as shown in Figure 1, electrode slurry is covered on first resistor layer and forms the
Then one termination electrode covers electrode slurry directly in second end face and forms the second termination electrode, and the second termination electrode is first
In main surface directly electrical connection is contacted with face electrode.
When preparing composite electronic component as shown in Figure 7, the second connection electrode and second resistance layer are being had been covered with
Second end face on covering electrode slurry form the second termination electrode, i.e. electrode slurry is covered on second resistance layer.Specifically, the
Two termination electrodes are not contacted with face electrode directly on the first major surface, but are electrically connected again with face electrode by second resistance layer
It connects.
Further, after covering resistance slurry and electrode slurry on ceramic body, by resistance slurry and electrode slurry
The operation of sintering, sintering is specially sintering silver metal slurry and resistance slurry under air atmosphere and at 840 DEG C~850 DEG C.
It should be noted that the preparation method of above-mentioned composite electronic component and not only limiting above-mentioned flow, also may be used between step
Make corresponding exchange, such as step S120 and S130 can be exchanged mutually.
The flow chart of the preparation method of the ceramic body of one embodiment is as shown in figure 14, include the following steps S210~
S240。
S210, ceramic slurry is obtained after mixing ceramic powder, adhesive and organic solvent, using ceramic slurry as raw material flow
Prolong to form multiple ceramic dielectric films.
Specifically, the dosage of adhesive is the dosage for making ceramic powder have enough plasticity, the dosage of organic solvent is foot
Enough make the dosage of ceramic powder moistening mixing.
In present embodiment, it is by the operation that ceramic powder, adhesive and organic solvent are uniformly mixed：It will using ball-milling method
Ceramic powder, adhesive and organic solvent are uniformly mixed.
Specifically, Ball-milling Time is 12h~16h.
Specifically, ceramic slurry has including 10 parts of ceramic powders, 3 parts~5 parts adhesives and 4 parts~6 parts according to the mass fraction
Solvent.
Ceramic powder can be barium titanate ceramics, and barium titanate ceramics have higher dielectric constant so that can be prepared is compound
The capacitance swing of electronic component is wider.
Further, adhesive is polyvinyl butyral, and organic solvent is that quality parts ratio is 1:1~1.5:1 first
The mixed solvent of benzene and ethyl alcohol.
It is prepared in the operation of ceramic dielectric films by raw material of ceramic slurry, the tape casting may be used by ceramic slurry shape
At ceramic dielectric films.
S220, print electrode slurry in the ceramic dielectric films of preset quantity, respectively obtains and is printed with first electrode layer
Ceramic dielectric films and the ceramic dielectric films for being printed with the second electrode lay.
After obtaining ceramic dielectric films, a part is selected to carry out the slurry that prints electrode as needed, to respectively obtain printing
There are the ceramic dielectric films of first electrode layer and is printed with the ceramic dielectric films of the second electrode lay.
Specifically, the electrode slurry for forming first electrode layer and the second electrode lay can be silver metal slurry, palladium metal slurry
The silver palladium alloy metal paste of material or arbitrary silver-colored palladium ratio.Preferably, the electrode of first electrode layer and the second electrode lay is formed
Slurry is that the quality parts ratio of silver and palladium is 85:15~70:30 silver palladium alloy slurry, such first electrode layer and second electrode
The electric conductivity of layer is preferable, and material cost is relatively low.
Specifically, the slurry that can be printed electrode in ceramic dielectric films by silk-screen printing technique.
Further, the silk screen figure of the first electrode layer of composite electronic component as shown in Figure 1 and Figure 7 and the second electrode lay
Case is as shown in figure 15, and dash area expression is printed electrode at slurry, and blank parts indicate cut place.Specifically can be in Figure 15 it is more
Cutting line is cut in length and breadth, to obtain the first electrode layer and the second electrode lay of preset shape.
It prints electrode after slurry, forms electrode pattern on ceramic membrane, can be obtained after drying and be printed with first electrode layer
Ceramic dielectric films and be printed with the ceramic dielectric films of the second electrode lay.
S230, the ceramic dielectric films for being printed with first electrode layer and the ceramic dielectric films for being printed with the second electrode lay are replaced
Stacking obtains laminated body.
Wherein, first electrode layer and the second electrode lay are alternately laminated in laminated body, and first electrode layer is in second electrode
Projection on layer has lap with the second electrode lay, and ceramic dielectric is filled between first electrode layer and the second electrode lay
Film.
Specifically, the ceramic dielectric films for being printed with first electrode layer and the ceramic dielectric films for being printed with the second electrode lay are handed over
For stacking, to form multilayer laminated capacitance structure.It as needed, can also be in the ceramic dielectric for being printed with first electrode layer
At least one ceramic dielectric films are laminated between film and the ceramic dielectric films for being printed with the second electrode lay, to adjust capacitance.
S240, laminated body is pressed, ceramic body is obtained after sintering.
In general, can press laminated body with isostatic pressing method, each film layer in laminated body is made to closely bond；Then pre- scale is pressed
It is very little to cut multilayer board in length and breadth, obtain the laminated body of multiple cuboids.
Specifically, further including the viscous operation of row after laminated body pressing, arranging viscous detailed process is：It, will under air atmosphere
Laminated body is heated to 350 DEG C~450 DEG C and keeps the temperature 1 hour~3 hours to exclude adhesive.
The detailed process of sintering is：Under air atmosphere, laminated body of the row after viscous is heated to 900 DEG C~1320 DEG C and is protected
Temperature is sintered for 2 hours~3 hours, and ceramic body is obtained after the completion of sintering.
Ceramic body capacitance prepared by this method is high, and adaptable, energy storage effect is good.It will be appreciated, of course, that at other
In embodiment, can also ceramic body be prepared using different methods, as long as ensureing that the structure of ceramic body and performance conform to
It asks.
Operation is simple for the preparation method of above-mentioned composite electronic component, can be used for large-scale industrial production.It is prepared into
The composite electronic component size arrived is smaller, by adjusting the dielectric constant of ceramic dielectric or adjusting first electrode layer and the second electricity
Spacing and facing area between the layer of pole can easily obtain different capacitances, the resistivity of regulation resistance layer and the
Spacing between one termination electrode and the second termination electrode and face electrode can obtain different resistance values, realize a capacitance and resistance
It is integrated into discrete component, can be that circuitry saves space.Resistance in the composite electronic component being prepared can be inhaled
The electric energy for receiving capacitance, prevents the discharge current of capacitance excessive, avoids damaging other devices, can also protect personal peace
Entirely.Face electrode makes the difficulty of processing for preparing resistance relatively low, the resistance of readily available difference resistance value.
It is specific embodiment part below.
Embodiment 1
Prepare composite electronic component
1) ceramic body is prepared：Ceramic slurry is obtained after ceramic powder, adhesive and organic solvent are mixed, with ceramic slurry
It is cast to form multiple ceramic dielectric films for raw material.Wherein, ceramic slurry includes 10 parts of ceramic powders, 4 parts of bondings according to the mass fraction
Agent and 5 parts of organic solvents.Ceramic powder is barium titanate ceramics, and adhesive is polyvinyl butyral, and organic solvent is mass fraction
Than being 1:1 toluene and the mixed solvent of ethyl alcohol.Print electrode slurry in multiple ceramic dielectric films, respectively obtains and is printed with
The ceramic dielectric films of one electrode layer and the ceramic dielectric films for being printed with the second electrode lay.The silk of first electrode layer and the second electrode lay
Net pattern is as shown in figure 15, and dash area expression is printed electrode at slurry.By be printed with first electrode layer ceramic dielectric films and
The ceramic dielectric films for being printed with the second electrode lay alternately laminated obtain laminated body.After cutting so that one end of every layer of first electrode layer
First end face is exposed to, one end of every layer of the second electrode lay exposes to second end face.Laminated body is pressed, ceramics are obtained after sintering
Body.
2) the first connection electrode is formed on ceramic body：The electrode coated slurry in the first end face of ceramic body forms the
One connection electrode.Wherein, one end of first electrode layer is electrically connected with the first connection electrode.
3) electrode slurry forming face electrode is covered on the side of ceramic body, face electrode is rectangular, is covered in ceramic body
The first main surface on.
4) first resistor layer is formed on ceramic body, impregnates resistance in the first end face for being covered with the first connection electrode
Slurry, obtains first resistor layer, and first resistor layer has overlapped part with face electrode.
5) termination electrode is formed on ceramic body：Electrode slurry is covered on first resistor layer and forms the first termination electrode, the
On biend cover electrode slurry formed the second termination electrode, wherein the second termination electrode face electrode far from first resistor layer one
End forms part and covers, and obtains composite electronic component.
The composite electronic component concrete structure of the embodiment is as shown in Fig. 1 and Fig. 3~Fig. 5, equivalent circuit such as Fig. 6 institutes
Show.
Embodiment 2
The preparation method of the composite electronic component of the present embodiment is similar to Example 1, unlike, further include in ceramic body
Second end face on electrode coated slurry, formed the second connection electrode.Then in the second end for being covered with the second connection electrode
Resistance slurry is impregnated on face, obtains second resistance layer, and second resistance layer has overlapped part with face electrode.Later
Electrode slurry is covered on two resistive layers forms the second termination electrode.
For the composite electronic component concrete structure of the embodiment as shown in Fig. 7~Figure 10, equivalent circuit is as shown in figure 11.
The capacitance and resistance value of above-described embodiment 1 and the composite electronic component of embodiment 2 are tested, test equipment uses peace
Prompt human relations E4980A precisions LCR tables, test frequency 1.0KHz, test voltage 1.0Vrms.Test result is as shown in table 1.
Table 1：Test result
| Rated capacitance | Survey capacitance | Normal resistance | Survey resistance value | |
| Embodiment 1 | 0.15μF | 0.160μF | 510Ω | 545Ω |
| Embodiment 2 | 0.15μF | 0.145μF | 270Ω | 282Ω |
As shown in Table 1, the composite electronic component capacitance of embodiment 1 and embodiment 2 is high, can get by the change of structure
The composite electronic component of different resistance values.
Several embodiments of the invention above described embodiment only expresses, the description thereof is more specific and detailed, but simultaneously
Cannot the limitation to the scope of the claims of the present invention therefore be interpreted as.It should be pointed out that for those of ordinary skill in the art
For, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the guarantor of the present invention
Protect range.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (10)
1. a kind of composite electronic component, which is characterized in that including ceramic body, the first connection electrode, first resistor layer, first end electricity
Pole, the second termination electrode and face electrode；
The ceramic body is cuboid, and the ceramic body has first end face and second end face relative to each other, and connection institute
State four sides of first end face and the second end face；The ceramic body is filled with ceramic dielectric, the ceramic dielectric
In be interspersed with multiple first electrode layers and multiple the second electrode lays, the first electrode layer and the second electrode lay alternating layer
It is folded, and projection of the first electrode layer on the second electrode lay has lap, institute with the second electrode lay
It states and is also filled with the ceramic dielectric between first electrode layer and the second electrode lay, at the first electrode layer at least one
The first end face of the ceramic body is exposed to, the second end of the ceramic body is exposed at the second electrode lay at least one
Face；
First connection electrode is attached in the first end face of the ceramic body, first connection electrode and first electricity
Pole layer electrical connection, the first resistor layer is attached in first connection electrode, and first termination electrode is attached to described the
On one resistive layer；
Second termination electrode is attached in the second end face of the ceramic body, second termination electrode and the second electrode lay
Electrical connection；
The face electrode is attached on the side of the ceramic body, and one end of the face electrode is electrically connected with the first resistor layer
It connects, the other end of the face electrode is electrically connected with second termination electrode.
2. composite electronic component according to claim 1, which is characterized in that second termination electrode and the second end face
Between be additionally provided with the second connection electrode and second resistance layer, second connection electrode is attached in the second end face, institute
The second connection electrode to be stated to be electrically connected with the second electrode lay, the second resistance layer is attached in second connection electrode,
Second termination electrode is attached on the second resistance layer.
3. composite electronic component according to claim 1, which is characterized in that the first resistor layer is in the face electrode institute
Side on extend a distance into, form the first extension, first extension and the face electrode have lap.
4. composite electronic component according to claim 2, which is characterized in that the second resistance layer is in the face electrode institute
Side on extend a distance into, form the second extension, second extension and the face electrode are far from described first
One end of resistive layer has lap.
5. composite electronic component according to claim 3, which is characterized in that first termination electrode is in the face electrode institute
Side on extend a distance into, form third extension, the development length of the third extension prolongs less than described first
The development length of extending portion.
6. composite electronic component according to claim 4, which is characterized in that second termination electrode is in the face electrode institute
Side on extend a distance into, form the 4th extension, the development length of the 4th extension prolongs less than described second
The development length of extending portion.
7. composite electronic component according to claim 1, which is characterized in that the first electrode layer is perpendicular to described first
End face, for the second electrode lay perpendicular to the second end face, the first electrode layer and the second electrode lay are opposite and flat
Row setting.
8. such as the preparation method of composite electronic component according to any one of claims 1 to 7, which is characterized in that including following
Step：
Ceramic body is provided, the ceramic body is cuboid, wherein the ceramic body has first end face relative to each other and second
End face, and connect four sides of the first end face and the second end face；The ceramic body is situated between filled with ceramics
Matter, is interspersed with multiple first electrode layers and multiple the second electrode lays in the ceramic dielectric, the first electrode layer and described the
Two electrode layers are alternately laminated, and projection of the first electrode layer on the second electrode lay has with the second electrode lay
There is lap, the ceramic dielectric, the first electrode are filled between the first electrode layer and the second electrode lay
The first end face of the ceramic body is exposed at layer at least one, and the ceramics are exposed at the second electrode lay at least one
The second end face of body；
Electrode slurry is covered in the first end face of the ceramic body and forms the first connection electrode, wherein the first connection electricity
Pole is electrically connected with the first electrode layer；
Electrode slurry forming face electrode is covered on the side of the ceramic body；
Resistance slurry is covered in first connection electrode forms first resistor layer, the first resistor layer and the face electrode
Electrical connection；And
Electrode slurry is covered on the first resistor layer and forms the first termination electrode, and electrode slurry is covered in the second end face
Form the second termination electrode, wherein second termination electrode is electrically connected respectively with the second electrode lay and face electrode electricity
Connection, obtains the composite electronic component.
9. the preparation method of composite electronic component according to claim 8, which is characterized in that in the second end face overlying
Lid electrode slurry is formed before the operation of second termination electrode, further includes that electrode slurry shape is first covered in the second end face
At the second connection electrode, and covers resistance slurry in second connection electrode and form second resistance layer.
10. the preparation method of composite electronic component according to claim 8, which is characterized in that the ceramic body is using such as
It is prepared by lower section method：
Ceramic slurry is obtained after ceramic powder, adhesive and organic solvent are mixed, shape is cast by raw material of the ceramic slurry
At multiple ceramic dielectric films；
Print electrode slurry in the ceramic dielectric films of preset quantity, respectively obtains ceramics Jie for being printed with first electrode layer
Plasma membrane and the ceramic dielectric films for being printed with the second electrode lay；
The ceramic dielectric films for being printed with first electrode layer and the ceramic dielectric films for being printed with the second electrode lay alternately laminated are obtained
Laminated body, wherein first electrode layer described in the laminated body and the second electrode lay are alternately laminated, and first electricity
Pole projection of the layer on the second electrode lay and the second electrode lay have a lap, the first electrode layer with it is described
The ceramic dielectric films are filled between the second electrode lay；And
The laminated body is pressed, the ceramic body is obtained after sintering.
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