CN101303935A - Very low profile multilayer components - Google Patents

Abstract

The invention discloses a multilayer electronic apparatus and making method thereof, a low-inductance controllable ESR multilayer capacitor. The method of making the multilayer electronic apparatus includes the steps of: providing at least two layers of support materials; providing a single screen painting mask; depositing the mask on a first layer of at least two layers of support materials; printing a first conductive pattern on the first layer of support material through the mask; depositing a second layer of the at least two layers of support materials through the mask; printing a second conductive pattern on the second layer of support material; and combining the first and the second layers of support materials to make an adjacent printing layer with an upper and a lower surface, a front and a back edge.

Description

Multilayer electronic device and preparation method thereof, the low controlled ESR multi-layer capacity of inductance

Technical field

Theme of the present invention relates to the improved parts of multilayer electronic component basically and forms.More specifically, theme of the present invention relates to the method that the extremely thin capacitance structure that is applicable to smart card techniques is provided.This correlation technique utilizes the selectivity of unitary electrode mask to place and special termination (termination) method prepares extremely thin parts.

Background technology

Modern many electronic units are encapsulated as individual devices, can comprise one or more parts in single Chip Packaging.A concrete situation of this individual devices is exactly multi-layer capacity or capacitor array, and the disclosed technology that especially merits attention is the multi-layer capacity with staggered interior electrode layer and respective electrode small pieces (tab).Comprise staggered electric capacity (Interdigitated Capacitor, IDC) situation of the multi-layer capacity of feature can be at United States Patent (USP) 4,831,494 (people such as Arnold), 5,880,925 (people such as Dupr é) and 6,243 find among the 253B1 (people such as Dupr é).Other single electronic unit is corresponding to the device that a plurality of passive components is integrated in the one chip structure.Integrated passive component like this can provide the selectable combination in resistance, electric capacity, inductance and/or other the passive component that is formed in the multi-ply construction, and is encapsulated as single electronic device.

In the known assembly manufacture method, multi-layer capacity is by providing the single thin layer of cutting from the ceramic dielectric material of the band of the ceramic material of pre-prepd development length or ceramic material to form.Use electrode ink by these single thin layers of multi-group electrode pattern silk screen printing.Thin layer with printing is stacked as multilayer then, and laminates into the solid layer of so-called pad (pad).The further operation for preparing multi-layer capacity according to this known method comprises to the sintering of pad with to single parts terminationization (terminate).The terminationization of parts comprises the use metallic paint, so that contact with the electrode of the previous silk screen printing of selecting, and then carries out another time and fires and make this metallic paint termination material be fixed to this electric capacity.

The different layers that uses many cocainines reticulated printing mask to prepare multilayer device produces sizable cost in the preparation of multilayer device.And the termination that is generally used for this multilayer device has occupied a large portion in the vertical height of final finished.

Usually needing optionally to different individual layers, termination forms electrical connection.May need a plurality of terminations to be electrically connected to the different internal electrical components of integrated individual devices.Common a plurality of termination is also often used to reduce undesirable inductance level in conjunction with IDC and other multiple tier arrays together.A kind of exemplary method that forms a plurality of terminations in the multi-layer part be by holed in the selection zone of chip structure and in the hole filled conductive material, make to be electrically connected to be formed between electrode part that device selects divides.

A kind of optional method that forms the outside termination of multilayer device is to be applied to the expose portion of the thick film bar of silver in the glass basis (galssmatrix) or copper to interior electrode layer, sclerosis or fire this material plates extra metal level then so that a part is solderable for substrate on this terminal strip.A kind of situation with the electronic unit by firing termination and the plating film formed outer electrode of metal thereon is disclosed in United States Patent (USP) 5,021,921 (people such as Sano).The application of this termination is difficult to control usually, and can chip size dwindle or feature near the time problem that becomes heavy.United States Patent (USP) 6,232,144B1 (Mcloughlin) and 6,214,685B1 people such as () Clinton has related to the method that forms termination on the choose of electronic parts zone.

The size that electronic unit constantly dwindles makes and must print the terminal strip difficulty that becomes quite on predeterminable area with required precision.But the thick film terminal strip apply the machine that utilizes a grab chips usually and apply the termination pattern with specially designed wheel.United States Patent (USP) 5,944,897 (Braden), 5,863,331 (people such as Braden), 5,753,299 (people such as Garcia) and 5,226,382 (Braden) disclose with terminal strip and have been applied to relevant machine characteristic of this chip structure and step.The number of the termination contact that is used for the electronic chip device of more and more littler spacing of being brought by the part dimension that dwindles or increase can make the resolution limit of typical termination machine become the limiting factor that size is in the future dwindled.

Issuable problem comprises when attempting to use thick-film technique to apply the termination of patterning: the terminal pads skew, the termination dislocation causes the internal electrode small pieces to expose or loses fully, and the termination portion of missing parcel.When yet a part of crossing thin or termination coating when the lacquer shape termination material coating that applies spreads to and causes the terminal pads short circuit in another, also may have problems.Another problem of thick film systems is that only (for example on vertical surface) formation termination portion is often very difficult on the side that device is selected.The needs that more cheap and effective termination feature has been provided providing for electronic chip element round these or other consideration that electric termination is provided for individual devices.

Another known selection relevant with the termination application relates to aligns a plurality of single substrate parts with shade.Parts can be packed in the specially designed anchor clamps, such as United States Patent (USP) 4,919, among 076 people such as () Lutz disclosed like that, then by the mask element sputter.This is a kind of typical very expensive preparation technology, thereby need provide other effectively and more cheap termination.

United States Patent (USP) 5,880,011 people such as () Zablotny, 5,770,476 (Stone), 6,141,846 (Miki) and 3,258,898 (Garibotti) relate separately to the various aspects of the termination that forms different electronic units.

Other background technologies that relate to the method that forms multilayer device also have United States Patent (USP) 6,757,152 (people such as Galvagni), 4,811,164 (people such as Ling), 4,266,265 (Maher), 4,241,378 (Dorrian) and 3,988,498 (Maher).

Though, do not occur a kind of design as yet and can solve all problems discussed here generally in multi-layered electronic parts and known different aspect in corresponding termination field and optional feature.The various purposes of aforesaid all U.S. Patent Publications are quoted in full is incorporated into this.

Summary of the invention

Consider run in the prior art and by the related feature of theme of the present invention, developed the improved method of making multilayer electronic device and this multilayer electronic device electrical termination corresponding aspect, and the device that obtains thus.Thereby theme of the present invention had both related to improved device and device, also related to corresponding correlation technique.

In exemplary structure, can use single silk screen printing mask to prepare multilayer device.Some aspect according to the inventive subject matter prepares the multilayer device with different electrical characteristics by single silk screen printing mask optionally is set on the selectable location of alternating layer that can be in multilayer device.

Other aspects of some embodiment according to the inventive subject matter, when on selected support material, printing continuous layer, the structure of multilayer device be can make, single multilayer device or the effective two devices of connecting produced based on the amount of the lateral shift that single silk screen printing mask is applied specially obtained.

Other aspects of some embodiment according to the inventive subject matter can be suitable for single static silk screen, and cutting and stacked independent pantostrat are constructed thereby prepare multilayer device then.

Another aspect according to the inventive subject matter provides the method for termination, this method can with this single method for printing screen together, preparation is than the little a lot of multilayer device of previously possible vertical height.

Aspect other of the embodiment of this example, a kind of method for preparing the multilayer electronic device is provided, this method may further comprise the steps: two-layer at least support material is provided; Single silk screen printing mask is provided; This mask is placed on the ground floor of this two-layer at least support material; On this ground floor support material, print first conductive pattern by this mask; This mask is placed on the second layer of this two-layer at least support material; On this second layer support material, print second conductive pattern by this mask; Have upper surface, lower surface, leading edge and antemarginal adjacent printed layers with combination ground floor and second layer support material with preparation.

In the variation of aforementioned exemplary embodiment, on the position of the position deviation that is arranged on the ground floor support material from mask, mask is placed on the second layer support material, with ground floor and the second layer combination time, the complementary electrode of preparation on the adjacent layer of support material.

In the variation and selection of aforementioned exemplary embodiment, preferably this provides the step of at least two supporting layers to comprise provides at least two dielectric layers, at least two resistive layers or at least two variable resistance layers.

In some aforesaid embodiment, can also carry out extra step with repair transfer this stacked ground floor and the second layer the lateral ends part to expose the conductive pattern of selection; Again the termination material is applied to and repaiies at least on the lateral ends part of transferring.In the different examples of this method, this step that applies the termination material can also comprise the termination material is applied on the electrode part of at least one selection of the upper surface of the ground floor of combination and the second layer or lower surface at least.

More at large, some examples of this exemplary method can also may further comprise the steps: this mask is placed on the 3rd layer of support material; Printing the 3rd conductive pattern on the 3rd layer of support material; With the 3rd layer is combined on ground floor and the second layer support material.In this embodiment, it is identical with the position that it is placed on the second layer support material that mask is placed on the 3rd layer of position on the support material, and the 3rd layer of combination on the ground floor and the second layer time, a plurality of identical electrode layers of preparation on the adjacent layer of one support material in closing on upper surface or lower surface.

Can also add exemplary embodiment on the basis of the above, the method for other embodiment can also may further comprise the steps like this: this mask is placed on the 3rd layer of support material; On the 3rd layer of support material, print the 3rd conductive pattern by this mask; This mask is placed on the 4th layer of support material; Printing the 4th conductive pattern on the 4th layer of support material; This mask is placed on the layer 5 support material; Printing the 5th conductive pattern on this layer 5 support material; With the 3rd, the 4th, thereby layer 5 is combined to the combination of the printed layers that obtains having upper surface and lower surface on ground floor and the second layer support material successively; And repair transfer this combination layer first and second lateral ends part to expose the conductive pattern of selection.In this exemplary arrangement, mask place the position of second and the 4th layer of support material place first with it, the 3rd and the position of layer 5 support material certain deviation is arranged, wherein when repairing this combination layer of accent, the conductive electrode part is selecting layer and selection lateral ends partly to expose at least.

Though aforementioned description is intended to the inner electric capacity of creating low profile, yet should be understood that needed termination also helps the gross thickness of this device.The thick film termination of use standard, for example at United States Patent (USP) 5,021, as described in 921 (people such as Sano), this termination will make thickness increase by 5 mils (mil) or more.If expection electric capacity itself typically is 9 mils or still less, can imagine that then the thick film termination will become huge shortcoming.Therefore, expect preferably film of termination described herein, it can adopt suitable mask such as United States Patent (USP) 7,152,291 and 6,972,942 (people such as Ritter) are described carry out like that plating or, as United States Patent (USP) 5,565,838 (Chan) carry out sputter or evaporation like that.This termination typically has the thickness less than 1/10th mils (mil).If carry out end cut at a certain angle, just can use United States Patent (USP) 5,388, the technology of describing among 024 (Galvagni).

In another exemplary embodiment, disclose and a kind ofly used single silk screen printing mask to prepare the method for multilayer electronic device.Generally speaking, the establishment of this multilayer device is that shared mask is positioned over alternate position on the alternating layer of support material, thereby when stacked this multilayer, prepares complementation electrode structure on alternating layer.Can change support material to prepare different devices, this comprises electric capacity, resistance and variable resistor.

The current exemplary embodiment that another relates to the multilayer electronic device comprises two-layer at least support material, and it has first and second conductive patterns.Preferably, this first conductive pattern is printed on this ground floor electric conducting material, and second conductive pattern is printed on this second layer support material.And, preferably, this ground floor and second layer support material are combined the adjacent printing complementation electrode layer that has upper and lower surface and forward and backward edge with preparation, thereby the lateral ends of the ground floor of this combination and second layer part is repaiied the conductive pattern that accent exposes selection.Then, preferably apply the termination material to repairing the lateral ends part of transferring at least.

In the variation and variant of this exemplary embodiment, according to theme of the present invention, some embodiment of this device has the small size less than 10 mils (mil), and this termination material is less than 1 mil (mil).In other the variant, some embodiment, termination material can plating, sputter or evaporation be to repairing on the lateral ends part of transferring.In other variants, the device of some embodiment has the thickness less than 10 mils (mil), and the termination that has less than 5 sides covers.

In other current exemplary embodiment, the controlled equivalent serial resistance of low inductance (ESR) multi-layer capacity is provided, it has at least the first and second pairs of electrodes, also has a plurality of virtual small pieces.Preferably, at least the first pair of electrode can comprise staggered electrode, and it has separately end small pieces reducing inductance and resistance on opposite end, and makes test easier in preparation process.In addition, this first pair of electrode also preferably has and the staggered side small pieces separately of other staggered electrodes.This at least the second pair of electrode preferably has end small pieces separately on opposite end.The formation of these virtual small pieces preferably closes on these electrodes but is not electrically connected with it, thereby provides support and nucleating point (nucleation point) for the electroless copper termination.

In the variation of the embodiment of the controlled ESR multi-layer capacity of low inductance of above-mentioned example, second group of this first pair of electrode can be set in the upper end of these multilayer devices, and this first group of first pair of electrode is arranged at its underpart or bottom end, is convenient to install with the device of creating symmetry.

In the another kind of the embodiment of the controlled ESR multi-layer capacity of low inductance of above-mentioned example changes, second pair of extra electrode can be provided in stacked pattern, and apply the termination material to create circuit in parallel with this second pair of electrode and that connect with the relative separately end of first pair of electrode.In some above-mentioned exemplary embodiment, this termination material comprises the electroless copper termination.

Yet another relates to this exemplary embodiment of the low controlled equivalent serial resistance of inductance (ESR) multi-layer capacity, comprise at least the first pair of electrode, it has the staggered electrode that has the end small pieces on opposite ends respectively, to reduce inductance and resistance, and in preparation process, make test easier, also have and the staggered end small pieces separately of other staggered electrodes, and the second pair of electrode that has end small pieces separately in opposite end.These exemplary embodiments preferably also comprise the termination material that optionally connects these electrodes.

Here set forth other targets and the advantage of theme of the present invention, perhaps they will be tangible from describing in detail here for those skilled in the art.In addition, also will understand, the feature that elaborates here, mentions and discuss, element and step can be applied in the use of different embodiment and theme of the present invention, and do not deviate from the spirit and scope of theme of the present invention.Variation can include but not limited to substituting of those means of equal value of setting forth, mention or discussing, feature, step, and function, the operation or out of position of different piece, feature, step etc.

And, should also be clear that the different embodiment of theme of the present invention, can comprise the various combination or the structure of current disclosed feature, step or element and equivalent feature (comprising feature, part or step and the structure mentioned in the detailed description of not shown in the diagram or these figure) thereof with different currently preferred embodiments.The embodiment of other of theme of the present invention, not necessarily mention at overview section, can also comprise or be included in the combination of different characteristic, component or the step aspect mentioned in the target of summarizing previously, and/or in other other features, component or the step of setting forth of the application.

In addition, should be appreciated that, though situation given here all be relate generally to prepare extremely thin, wherein electrode layer is printed on the structure and the preparation method of the electric capacity on the support material of corresponding different dielectric material, but be not limited to the disclosure, this theme disclosed herein also can be used it for other extremely thin devices of preparation by selection alternately is provided in the dielectric material of selecting in the electric capacity example of setting forth and discussing.For example, by selecting suitable interior electrode support material to use the method for theme of the present invention just can prepare variable resistor or resistance device.Those skilled in the art can better understand feature and the aspect of these or other embodiment by reading following detailed.

Description of drawings

Complete and feasible the disclosing at those skilled in the art of theme of the present invention comprises preferred Implementation Modes, in detailed description, set forth, its with appended figure as a reference, wherein:

Fig. 1 a and 1b illustrate the first of continuous preparation process of first exemplary embodiment of electronic device according to the inventive subject matter respectively, and Fig. 1 c has described the perspective view of the theme of the present invention of partially transparent;

Fig. 2 a-2d has shown the second portion and the optional top layer electrode structure of continuous preparation process of first exemplary embodiment of electronic device according to the inventive subject matter respectively, and Fig. 2 a` represents the part of current optional structure;

Fig. 3 a has represented the existing structure of the as a comparison purpose relevant with theme of the present invention respectively with 3b, and Fig. 3 c has described the part end view of this existing theme;

Fig. 4 a-4d illustrates the continuous preparation process of second exemplary embodiment of electronic device according to the inventive subject matter respectively;

Fig. 5 a-5e and 5g illustrate the continuous preparation process of the 3rd exemplary embodiment of electronic device according to the inventive subject matter and the preparation of feedthrough capacitor and Pi filtering device respectively;

Fig. 5 f and 5h show the equivalent circuit of the device of describing among Fig. 5 e and the 5g respectively;

Fig. 6 a-6e and 6g illustrate the continuous preparation process of the 4th exemplary embodiment of electronic device according to the inventive subject matter and the preparation of feedthrough capacitor and Pi filtering device respectively;

Fig. 6 f and 6h show the equivalent circuit of the device of describing among Fig. 6 e and the 6g respectively;

Fig. 7 a-7e and 7g illustrate the continuous preparation process of the 5th exemplary embodiment of electronic device according to the inventive subject matter and the preparation of feedthrough capacitor and Pi filtering device respectively;

Fig. 7 f and 7h show the equivalent circuit of the device of describing among Fig. 7 e and the 7g respectively;

Fig. 8 shows the exemplary embodiment of the theme of the present invention of using end termination feature;

Fig. 9 a-9c illustrates another exemplary embodiment of electronic device according to the inventive subject matter respectively, comprises " T " electrode and the virtual small pieces of auxiliary termination;

Fig. 9 d shows the single silk-screen patterns of the electrode layer of the example device that shows among preparation Fig. 9 a-9c;

Figure 10 a-10c illustrates another exemplary embodiment of electronic device according to the inventive subject matter respectively, and it provides better erectility by 90 degree symmetries;

Figure 11 shows the single silk-screen patterns of the electrode layer of the example device that shows among preparation Figure 10 c;

Figure 12 a-12d has shown another embodiment of theme of the present invention respectively continuously, adopt with the similar mode of Fig. 2 a-2d and describe, but its aspect ratio changes allowing being attached to long edge, thereby low relatively inductance and strong bonding are provided;

Figure 13 a-13e shows the optional embodiment of this technology respectively, and wherein all layers all are active, and wherein corner edge provides and helps alternately adherence method;

Figure 14 a-14e shows the aspect of other exemplary embodiments according to the inventive subject matter respectively, and wherein a plurality of parts are formed together to save area and to reduce number partly as array;

The employing via hole that Figure 15 a-15f shows respectively according to this technology to provide some a contact or a ball grid array (BGA) for the outside connects, and reduces the schematic diagram of the method for construction of ESL;

Figure 16 a-16e shows the schematic diagram with thin lid (thin-cap) structure that has five side terminations in each end that is similar to standard multi-layer capacity (MLC) structure respectively;

Figure 17 a-17e shows the step of preparation of another embodiment of theme of the present invention respectively;

Figure 18 a-18h illustrates the step of the employing low inductance capacitance of via hole preparation according to the inventive subject matter respectively;

Figure 19 a-19c shows the known configuration that relatively low inductive part can be provided respectively, and it adopts staggered electrode to obtain low inductance, generally as United States Patent (USP) 5,880, and 925 people such as () Dupr é and 6,243, demonstration is such among 253B1 people such as () Dupr é;

Figure 19 d-19g has shown the technology that anchor or virtual small pieces come to provide for electroless copper termination self-structure of using respectively, in the United States Patent (USP) 7152291 of general as Ritter etc. the demonstration; With

Figure 20 a-20d has shown another this exemplary embodiment, not only has low inductance feature, also has controlled equivalent serial resistance (ESR) feature.

Reusable Reference numeral is represented the identical or similar feature of theme of the present invention, element or step in this specification and the accompanying drawing.

Embodiment

As described in the summary of the invention part, improved method and the corresponding aspect of electronics termination for preparing the multilayer electronic device paid close attention to especially in theme of the present invention, and the relevant device that obtains.The combination of the disclosed choice of technology is related with a plurality of different embodiment of theme of the present invention.Should be noted that the exemplary embodiment that provides and discuss should not be considered as the restriction to theme of the present invention here.Thereby can produce another embodiment with the each side combination of another embodiment as feature or the step that the part of an embodiment is described or set forth.In addition, some feature can be with similar device or is not mentioned especially but the feature of carrying out same or similar function is exchanged.

Now will detailed currently preferred embodiments with reference to this multilayer device.With reference now to accompanying drawing,, Fig. 1 a and 1b show the first of consecutive steps of first exemplary embodiment of preparation electronic device according to the inventive subject matter respectively; And Fig. 1 c has described the perspective view of this theme, has the feature of partially transparent.As shown in Figure 1a, the first silk screen printing mask 100 comprises three openings 110,112,114, and each opening has identical length and width.

Should be noted that in the description in following various silk screen printing masks that the part mask is shown as clearly that other parts of element then are shown as shade.In these two kinds of situations, exemplary mask is all passed through to allow printing material by opening, as the those of ordinary skill in the silk screen printing field know.If silk screen is shown as shade, then show it is like this in order to cause that to those regional special concerns, those zones are typically corresponding to the electrode in the final products.

Further, can notice five continuous layer 120-128, on support material between five layers of electrode, carry out five times continuous silk screen printings with reference to figure 1a, not shown for simplicity and in the drawings.Be prepared as in the situation of electric capacity at this electronic device, the layer that can use silk screen printing mask 100 to print electrode in the above can be a dielectric layer.Just as noted, if prepare when including but not limited to resistance, thermistor and variable-resistance other devices, can select other support material.

Before the ground floor 120 in the silk screen printing pantostrat, with respect to more center or the position intermediate shown in the layer 5 128, silk screen printing mask 100 is offset predetermined distance to the right, as shown in Figure 1a.After printing ground floor 120, material between deposit one deck electrode, with respect to more center or the position intermediate shown in the layer 5 128, silk screen printing mask 100 is offset predetermined distance left, as shown in Figure 1a.To the 3rd layer 124 and the 4th layers 126 processes that repeat this skew and printing that show.Last silk screen printing mask 100 places the centre position, as layer 128 demonstration, carries out last printing then.

Should be expressly understood that five printed layers altogether described herein are exemplary.In the actual fabrication, can provide the electric and physical characteristic of more or less several target zone to satisfy the demand.Being seen as reference 2a and 2b, also can repeat some layer, that is to say, printing and do not make 100 skews of this silk screen printing mask once more, its reason is discussed later.

With reference to figure 1a, 1b and 1c, can notice to have shown three lines of cut 130,132 and 134 together.After target zone is counted in the selection that prints multilayer device (remembeing can be more more or less than shown number), obtain independent device from stacked layer cutting along line of cut 130,132 and 134.This cutting obtains two kinds of possible type of device products in the situation of the device that Fig. 1 b shows, one between line of cut 130 and 132, another are between line of cut 132 and 134.Fig. 1 c is except being the demonstration feature identical with 1b with Fig. 1 a the perspective view.Line of cut 130,132 and 134 has become cut surface now, is shown as 130-130`, 132-132` and 134-134` respectively.

An aspect of this specific embodiment of theme of the present invention is exactly that if adopt common termination, this technology will be prepared wittingly and be regarded as parts defective or " short circuit ".Look back Fig. 1 b, be appreciated that on the edge that is exposed to the electrode on line of cut 130 and 132 and use termination owing between the electrode layer of top layer 128, have the gap, with the device for preparing.And on the other hand, the top layer 128 of the device of preparation is continuous between line of cut 132 and 134.Along line of cut 132 and 134 termination being placed on the exposed edge of electrode to be continuous and cause the product short circuit because of top layer 128.

Yet the potential bad method of this embodiment of present technique is the compensation on two-layer at least.The first, element that should " good " (between line of cut 130 and 132 those) can have higher capacitance in this this theme of usefulness prepares the situation of electric capacity.The second, based on the less space of compensation that adopts single silk screen printing mask 100 fabricate devices the product loss that causes because of short-circuiting effect.After product was finished, the sorting of the product of " good " and " bad " can adopt the high speed electrical testing easily to carry out.

With reference now to Fig. 2 a-2d,, shown the second portion of the preparation process of first exemplary embodiment according to the inventive subject matter successively.Show that top electrode layer 128 can optionally be provided as multilayer as previously mentioned and with reference to figure 2a and 2b are special.Here exemplary demonstration three layers, but the understanding that should be understood that can provide more or less several target zone.

Behind the different layers 120-128 that has printed as Fig. 2 a and 2b demonstration, the device of cutting adopts technology well known by persons skilled in the art to fire.This fires the device 150 that obtains as Fig. 2 c demonstration.Shown in Fig. 2 c, the top layer of layer 128 that may be a plurality of provides electrode part 140 and 142 on the upper surface 152 of device 150, and the end sections 154 of device 150 exposes thereon the electrode layer 120 of right-hand member termination and 124 end sections and virtual small pieces 128, and they typically are shown as electrode tip 144 and 146.Though be appreciated that in Fig. 2 c invisiblely, electrode 122 and similar electrode tip part and their corresponding virtual small pieces 128 of 126 are exposed on the end opposite 156 of device 150.

After initial firing, termination material 160,162,164 and 166 is applied to exposing on the zone 140,142 of top layer 128, and contacts with every layer 120,124 remaining electrode tips respectively along end sections 154 by termination portion 164.Be to be understood that termination portion 162 and 164 covers top electrode virtual level 128 continuously, comprises their top section 142 and the electrode part of exposing on the edge 154 of device 150.Though should also be clear that invisible in the front view at device 150, on the edge 156 of device 150, also covered the electrode tip 166 that exposes similarly, the virtual small pieces 128 on the left side and internal electrode 122 and 126 are linked together on electric.

At last, should recognize that termination portion 160 and 162 will increase the thickness of entire portion, therefore will preferably use for example thin film technique of plating, evaporation, sputter or organic metal reduction (organo-metallic reduction).

View 2a` with reference to current has also partly provided a kind of alternative embodiment, to solve other issuable difference in firing contraction power.More specifically, if balanced arrangement or design in situation shown in current Fig. 2 a` then has been found that the additional benefit that can obtain to prevent the possible warpage of part (for example owing to fire contraction power difference).Go out as shown, be the balance of wishing like this, electrode layer 128` repeats electrode layer 128 on the opposite flank as shown.This is optional and can understand from remaining open part of this paper to those skilled in the art corresponding to the otherwise further feature of Fig. 2 b, 2c and 2d, just no longer repeat here to all of this optional Fig. 2 a` with reference to the concrete relevant figure of characteristic.

With reference now to Figure 12 a-12d,, provided each step of another exemplary embodiment preparation of electronic device according to the inventive subject matter continuously.Can see relatively that as the exemplary embodiment of this technology of from Fig. 2 a-2d and 12a-12d, showing this embodiment is skew 90 degree mutually on electrode arrangement always.The electrode orientation that shows among Figure 12 a-12d provides a longer adjoining edge, compares the description with reference to Fig. 2 a-2d, for device provides low relatively inductance, lower ESR and stronger physics and electric connection.Should be appreciated that with reference to mentioned similar of figure 2a and 2b, top electrode virtual level 1228 and their complete exposed portions 1240 and 1242 can be according to using and needs optionally adjusting on number of contraction power.Here only three layers have exemplarily been shown, but should clearly understand that can select to provide the number of plies of more or less number according to the concrete application of implementing, all these change open the containing that all should be considered as by current.In addition, the number that will also be understood that inner active electrode 1220-1226 can change according to special needs electric or physically.

Should also be clear that, because the embodiment that Figure 12 a-12d shows is to adopt the single mask preparation with the similar mode of the embodiment of Fig. 2 a-2d, so will produce the element of " good " and " bad " simultaneously, and make and have only those elements to produce the element of " good " along line of cut 1230,1232 (just as the line of cut in the exemplary embodiment of Fig. 2 a 130,132) cutting.Be to be understood that, the element of " good " that employed here term is relative with " bad " is used in reference to the structure part that has realized the object component of the final structure of wishing or application for those, and is not the defective that indication in addition or reflection any part or element have any essence for the situation that is called " bad ".Exist equally in the exemplary embodiment that the advantage of describing among the embodiment of Fig. 2 a-2d about high capacitance and product saving shows in Figure 12 a-12d.

Behind the different layers 1220-1228 that has printed as Figure 12 a and 12b demonstration, the device of cutting adopts technology well known by persons skilled in the art to fire.This burning process obtains the device 1250 as Figure 12 c demonstration.Shown in Figure 12 c, the top layer of layer 1228 that may be a plurality of provides electrode part 1240 and 1242 on the upper surface 1252 of device 1250, and the lateral section 1254 and 1256 of device 1250 exposes all electrode layer 1220-1228 end sections separately thereon, and they typically are shown as electrode tip 1244 and 1246.Should be appreciated that, though invisible in Figure 12 c, Figure 12 c still like the representation class electrode tip part will expose in the end opposite 1256 of device 1250.

After initial firing, termination material 1260,1262 and 1264 just as illustratedly is applied to the exposing on the zone 1240,1242 of top layer 1228, and contacts every layer of 1220-1226 remaining electrode tip and internal virtual small pieces 1228 by termination portion 1264 respectively along lateral section 1254.Should be appreciated that termination portion 1262 and 1264 exposed electrodes part on the part 1242 of the top layer electrode layer 1228 of covering device 1250 and the end 1254 continuously.What should also be clear that is, though invisible in front view at device 1250 also providing similar covering on the exposed electrodes end on the edge 1256 of device 1250.

Together with reference to figure 3a, 3b and 3c, for theme of the present invention purpose relatively, shown a kind of known structure.As showing among Fig. 3 a, a plurality of ceramic layers 300,310,312,314 and 316 each provide independent electrode layer 320,322,324,326 and 328 respectively.Electrode layer alternately makes when termination layer 360,362 (Fig. 3 b) is applied in this known device that along the lateral edge setting that replaces of each ceramic layer 300-316 the electrode layer that replaces is coupled to make electric capacity.In this existing structure, electrode layer prepares by silk screen printing mask independently usually, and as clearer demonstration among Fig. 3 c, this top layer 364 and the bottom 365 must be chosen as blank ceramic layer to prevent the final products short circuit.The requirement of the layer that this increase is extra can be avoided in theme of the present invention, thereby helps to reduce the total height of final products.

Current Fig. 3 c shows another feature or the aspect that should have structure that these those skilled in the art understand.Particularly, owing in the prior art device, use thick relatively termination thickener, each termination 360 and 362 of the existing structure of this example has increased by 2 to 3 mils (mil) on each surface the product height, causes total height to increase by 4 to 6 mils again and apart from plate 366 and its pad 367 spacing of 2 to 3 mils again.This spacing is by 368 expressions of the gap that shows among Fig. 3 c, and this is not only for unnecessary height, and all may have problems for the aspect, position, and such position amount of residual solder residue in addition also cause electric and environmental problem.

With reference to figure 4a-4d, show the consecutive steps in the preparation of second embodiment of electronic device according to the inventive subject matter.Second embodiment of this theme of the present invention has adopted the identical silk screen printing mask 100 that uses among first embodiment with this theme of discussing in Fig. 1 a and 1b.Be the quantity and the type of the mask skew carried out with the difference of the exemplary embodiment of front.

Prepare in the others mode identical though second exemplary embodiment of this theme of the present invention adopts except the type of mask skew and number, yet the device of the device that this technology is prepared and first embodiment is different aspect two with first embodiment.The first, the device of this preparation adopts the form (in the electric capacity situation that adopts theme preparation of the present invention) of the electric capacity of a plurality of series coupled.The second, unlike first embodiment, because the placement of top electrode layer 128`, then there is not the viewpoint of short circuit from the device of preparing, all devices of preparing all are " good ".

With reference to figure 4a, can see, adopt the silk screen printing mask 100 in centre or centre position on unshowned dielectric material, to print the first electrode layer 120`.Be offset back printing the second electrode lay 122` at silk screen printing mask 100 left with respect to layer 120` centre position.Print behind identical center that ensuing electrode layer 124` uses when silk screen printing mask 100 is turned back to printed layers 120` or the centre position.Preparation electrode layer 126` after silk screen printing mask 100 is displaced to the identical position of using when printing electrode layer 122` left.At last, silk screen printing mask 100 turns back to previous once behind identical center or centre position that layer 120` that print electrode uses during with 124` again, and electrode layer 128` is printed.The same with first embodiment of theme of the present invention, should be noted that the actual electrode number of plies that provides can be than exemplary illustrate more or less here.

Further with reference to figure 4a and 4b, can see, when cutting when preparing independent device along 430,432 and 434 couples of different layers 120`-128` of line of cut to be similar to the mode that adopts in first exemplary embodiment, position based on top layer 128` is provided with, never the viewpoint of device short circuit be it seems, all individual devices all are " good ".

Printed behind the different layers 120`-128` as Fig. 4 a and 4b demonstration, the device of cutting adopts technology well known by persons skilled in the art to fire.This burning process obtains the device 450 as Fig. 4 c demonstration.Shown in Fig. 4 c, the top layer (similar with arranging of Fig. 2 a and 2b) of layer 128` that may be a plurality of provides electrode part 440 and 442 on the upper surface 452 of device 450, and the end sections 454 of device 450 exposes the end sections of all electrode layer 120`-128` thereon, and they are described as electrode tip 444 and 446 respectively.Should be appreciated that equally the end sections 456 of device 450 also has sightless exposed electrodes part in Fig. 4 c similarly.

After initial firing, termination material 460,462 and 464 is applied on the part of exposing 440,442 of top layer 128`, and contacts with the electrode tip that every layer of 120`-126` is left along end sections 454 by termination portion 464.Should be appreciated that termination portion 462 and 464 has covered the part 442 of top electrode layer 128` continuously and exposed electrodes part on the end 454 of device 450.Though should also be understood that in working as in the front view of device 450 to be hidden, also providing similar covering on the exposed electrodes end on the edge 456 of device 450.

Equally, should recognize that termination portion 460 and 462 will increase the thickness of total body portion, the therefore preferred thin film technique that adopts as plating, evaporation, sputter or organic metal reduction.

With reference now to Fig. 5 a-5h,, will the 3rd embodiment of theme of the present invention be discussed.The 3rd embodiment of this theme of the present invention also adopts by a plurality of identical printing openings 510,512 and the single silk screen printing mask 500 of 514 definition, and some part wherein shows to clearly illustrate that those parts are corresponding to electrode layer with shade equally.Similar with the mode of before describing in second exemplary embodiment, the 3rd embodiment is positioned over mask 500 only that one of two ad-hoc locations prepare required device.In this situation, the device of preparing is compared with the device of describing in first and second exemplary embodiments has different electric and physical propertys, as will with reference to figure 5f and 5h set forth, can obtain feed-through capacitor and Pi filter structure.

Shown in Fig. 5 a, on first lateral attitude of electrode layer 520 and 524 expressions, the placement of mask 500 makes along the resulting block letter of line of cut 530,532 cutting the time, and masks area 510 and 512 central cross portion 516 and 518 separately is cut in the position at center basically.On second lateral attitude, shown as electrode layer 522 and 526, the placement of electrode layer makes line of cut 530,532 not intersect with this electrode layer, and has in fact reserved little gap between the regional end of line of cut and definition electrode.As observe that Fig. 5 a is seen and with previous Fig. 4 b in discuss similarly, the extension of cutting process will all be the device of " good ", that is, do not have the device can short circuit in final products as the situation of first embodiment.

Corresponding electrode partly is not cut in central cross portion 542 by noticing electrode layer 540 in layer 522 and 526 and the layer 522, can observe second feature of this embodiment of the theme of the present invention that is shown by Fig. 5 a.When with different when stacking layer by layer, this uncut cross portion will become the part that the ground plane with respect to resulting devices connects, and this point will be described below.

With reference now to Fig. 5 b and 5c,, the ground plane connection performance of cross portion 542 can more be clear that.Fig. 5 b and 5c are respectively the top and bottom perspective views of inclination of assembled layers of the device 502 of this exemplary embodiment preparation according to the inventive subject matter.Can see that in these two figure the end of the cross portion 542 of electrode layer 540 appears at lateral edge 552 places of the device 502 of part assembling.Though be appreciated that in this figure invisiblely, similarly the cross portion end member will occur along the lateral edge 562 of device 502.

After having printed the different layer 520-528 that shows as Fig. 5 a, as the front described, the device of cutting adopts technology well known by persons skilled in the art to fire.This burning process obtains the device 502 as Fig. 5 b and 5c demonstration.Shown in Fig. 5 b, top electrode layer provides electrode part 544 and 546 on the upper surface 560 of device 502, simultaneously the end sections 554,556 of device 502 exposed electrode layer 520 and 524 end sections thereon.

After initial firing, termination material 563,564,566,567,568 and 570 (Fig. 5 e) is applied on the electrode zone 544,546 that upper surface 560 exposes, and contact with every layer 520,524 remaining electrode tips along end sections 554,556 and lateral section 552,562 by termination portion 568, also pass through termination portion 570 and contact with base section 558.Should be appreciated that termination portion 563 and 564 has covered top electrode part 546,544 respectively continuously and exposed electrodes part on the edge 554,556 of device 502.Though should also be clear that in front view, having hidden, also provide similar covering on the exposed electrodes end on the edge 556 of device 502.

After having observed Fig. 5 e, be appreciated that this termination operation preferably will be accurately.For this purpose, can use at United States Patent (USP) 6,972, that describes among 942 people such as () Ritter determines the termination operation certainly.

That describes in the above applies after the termination material, and device 502 can be represented with the equivalent circuit figure on the electricity of Fig. 5 f.As what show here, device 502 can be expressed as a pair of electric capacity with shared grounding electrode 590, and this shared grounding electrode 590 typically with corresponding to the termination material of describing among Fig. 5 e 568 is connected with 570 earth terminal 586.Similarly, first capacitor plate 592 is illustrated as and is connected with 566 termination 582 corresponding to termination material 564, and second capacitor plate 594 is illustrated as and is connected with 567 termination 584 corresponding to termination material 563.

About this embodiment of theme of the present invention, can utilize device 503 to form the Pi filters as Fig. 5 g and 5h demonstration.With reference now to Fig. 5 g,, shown device 503 basically can with the equivalence figure correspondence that provides among Fig. 5 f (parametric device 502), except increasing the end of patch of resistive material 580 with each electrode termination material layer 563 of bridge joint and 564.Increase this patch of resistive material 580 and just the device of Fig. 5 d-5f is changed into as the Pi filter as shown in Fig. 5 h, wherein resistance 580` is corresponding to the resistance that is formed by the patch of resistive material 580 that increases.

With reference now to Fig. 6 a-6h,, will the 4th embodiment of theme of the present invention be discussed.The 4th embodiment of this theme of the present invention also adopts the single silk screen printing mask 600 that is defined by a plurality of identical printing openings 610,612, and some part wherein shows with clearer those zones that show corresponding to electrode layer with shade equally.Being similar to the mode of before describing in second exemplary embodiment, the 4th embodiment is positioned over mask 600 only that one of two ad-hoc locations prepare required device.Yet, two mask positions among this embodiment and previously described embodiment is slightly different is, these two mask positions obtain in translation laterally and on vertical simultaneously by mask.

In this situation, the device of preparing is compared with the device of describing in first and second exemplary embodiments to have different electric and physical propertys and is, not only equally can obtain feedthrough capacitor and Pi filter structure with the 3rd exemplary embodiment, as setting forth with reference to figure 6f and 6h, and also obtained extra conducting element simultaneously, and provide extra favourable architectural characteristic for the device of final form.

Shown in Fig. 6 a, on the primary importance that is provided by electrode layer 620 and 624, mask 600 is placed and is made along line of cut 630,632 cuttings the time, and the central cross portion part 618 of masks area 610 is cut in the position at center basically.On the second place shown as electrode layer 622,626 and 628, place by the electrode layer of masks area 610 definition and to make line of cut 630,632 intersect, and in fact between the end of the masks area of line of cut and definition electrode, reserve little gap with this cross portion part 618.

On the other hand, line of cut 630,632 has cut the part 618 of the mask position of placed adjacent really, make the electrodes part of determining by line of cut 630,634 and 636 on layer 622,626 and 628, to obtain current-carrying part, the little conductive region 649 that it provides a discord main electrode partly to be connected in electrode layer 622,626 and each end of 628.The termination material that this conductive region 649 helps to put on device to the back provides anchor point (anchoring point).In a similar fashion, line of cut 632,636 and 638 has prepared "T"-shaped electrode part 644 (Fig. 6 b) in electrode layer 620 and 624, wherein when different electrode layers is stacked together, the top of the "T"-shaped part of electrode 644 will with aforesaid conductive region 649 except that as hereinafter will be more complete as described in for the electrode layer that replaces provides the tie point, also together as the anchor point of termination material.

Further with reference to figure 6a, will notice that layer 620 and 624 will obtain having the electrode layer of "T"-shaped electrode 644,646 when along line of cut 636,638 cuttings, "T"-shaped top will become respectively on the end sections 654,656 of device 602 (Fig. 6 b).Importantly, except these "T"-shaped electrodes 644,646, also prepared the current-carrying part 648 that the center that is arranged on is provided with, it helps to provide intactly earth strip around the middle body of finishing device with the end sections 642 (Fig. 6 b) of other layers and current-carrying part 640 (Fig. 6 c).

As observe that Fig. 6 a is seen and with previous Fig. 4 b and 5b in the similar mode discussed, the extension of cutting process will all be the device of " good ", that is, do not have the device can short circuit in final products as the situation of first embodiment.

With reference now to Fig. 6 b and 6c,, cross portion 642, the ground plane connection performance of current-carrying part 648 and conductive layer 640 can be more clearly visible.Fig. 6 b and 6c are respectively the top and bottom perspective views of inclination of assembled layers of the device 602 of this exemplary embodiment preparation according to the inventive subject matter.Can see that in these two figure the end of the cross portion 642 of electrode layer 640 appears at lateral edge 652 places of the device 602 of part assembling.Though be appreciated that in this figure invisiblely, similarly the cross portion edge member will occur along the lateral edge 662 of device 602.

After having printed the different layers 620-628 that shows as Fig. 6 a, as previously discussed, the device of cutting and stacked layer adopt technology well known by persons skilled in the art to fire.This burning process obtains the device 602 as Fig. 6 b and 6c demonstration.Shown in Fig. 6 b, top electrode layer provides electrode part 644 and 646 on the upper surface 660 of device 602, and the end sections 654,656 of device 602 exposed electrode layer 620 and 624 end sections thereon.

After initial firing, termination material 662,663,664,666,668 and 670 (Fig. 6 e) is applied on the electrode zone 644,646 that upper surface 660 exposes, and contact with every layer 620,624 remaining electrode tips along end sections 654,656 and lateral section 652,662, and pass through termination portion 670 and contact with base section 640 by termination portion 668.Should be appreciated that termination portion 662 and 666 has covered top electrode part 644,646 respectively continuously and in the end of device 602 654,656 exposed electrodes parts.Though should also be clear that in front view, having hidden, also provide similar covering on the exposed electrodes end on the end 656 of device 602.

After having applied the termination material of firm description, device 602 can be represented with the equivalent circuit figure on Fig. 6 f electric.As what show here, device 602 can be expressed as a pair of electric capacity with shared grounding electrode 690, and this shared grounding electrode 690 typically is connected with 670 earth terminal 686 with electric going up corresponding to the termination material of describing among Fig. 6 e 668.In a similar fashion, first capacitor plate 692 is shown as with electric going up corresponding to termination material 663 and is connected with 666 termination 682, second capacitor plate 694 be shown as with electric on be connected with 664 termination 684 corresponding to termination material 662.

Further consider this embodiment of theme of the present invention, can use device 603 to form the Pi filters as Fig. 6 g and 6h demonstration.With reference now to Fig. 6 g,, shown device 603 is corresponding with the equivalence figure that Fig. 6 f (parametric device 602) provides basically, except the patch of resistive material 680 and insulating barrier 688 of the end that increased each electrode termination material layer 662 of bridge joint and 663.Resistance material 680 is electrically connected with electrode termination layer 662,663, contacts with the following covering conductive region 648 and the termination material 668 of end sections 642 yet insulating barrier 688 prevents resistance material 680.Increase this patch of resistive material 680 and change the device of Fig. 6 d-6f into show as Fig. 6 h Pi filter, wherein resistance 680` is corresponding to by the patch of resistive material 680 formed resistance that increase.

With reference now to Fig. 7 a-7h,, will the 5th embodiment of theme of the present invention be discussed.The 5th embodiment of this theme of the present invention has also adopted the single silk screen printing mask 700 that is defined by a plurality of identical printing openings 710,712, and some part wherein shows with clearer those zones that show corresponding to electrode layer with shade equally.With with the similar fashion of before in the 4th exemplary embodiment, describing, the 5th embodiment is positioned over mask 700 only that one of two ad-hoc locations prepare required device.Similar among two mask positions of among this embodiment this and the previously described embodiment, simultaneously obtain this two mask positions by mask in translation laterally and on vertical.

In this case, the same with the device of the 4th embodiment preparation, the device of preparing is compared with the device of describing in first and second exemplary embodiments has different electric and physical propertys.Adopt this embodiment of theme of the present invention not only can obtain the feedthrough capacitor and the Pi filter construction of setting forth, and also obtained extra conducting element simultaneously, and provide additionally favourable architectural characteristic for the final device of form with reference to figure 7f and 7h.

Shown in Fig. 7 a, on the primary importances by electrode layer 720 and 724 expressions, mask 700 is placed and is made along line of cut 730,732 cuttings the time, and the central cross portion part 718 of mask part 710 is cut in the position at center basically.On the second place as shown in electrode layer 722,726 and 728, place by the electrode layer of mask part 710 definition and to make line of cut 730,732 intersect, and in fact between the end of the masks area of line of cut and definition electrode, reserved little gap with this cross portion part 718.

On the other hand, line of cut 730,732 has cut the part 718 of the mask position of placed adjacent really, make the electrodes part of being determined by line of cut 730,734 and 736 to obtain current-carrying part on layer 722,726 and 728, it is provided as little conductive region 749a, the 749b that right discord main electrode partly is connected at electrode layer 722,726 with each end of 728.As described in hereinafter will be more complete, the termination material that conductive region 749a, 749b help to put on device for the back provides anchor point.

In a similar fashion, line of cut 730,736,734`, 738 and 736` in electrode layer 720 and 724, prepared "T"-shaped electrode part 744 (Fig. 7 b), wherein when different electrode layers is stacked together, the top of the "T"-shaped part of electrode 744 will with aforesaid conductive region 749a, 749b together except as hereinafter will be more complete as described in for the electrode layer that replaces provides the tie point, also as the anchor point of termination material.

Further with reference to figure 7a, to notice when along line of cut 730,732,736,734`, 738 and during the 736` cutting, layer 720 and 724 will obtain the paired electrode layer with "T"-shaped electrode 744,746, and the end sections 754,756 (Fig. 7 b) that becomes device 702 is respectively being located at "T"-shaped top.Importantly, except these "T"-shaped electrodes 744,746, prepared current-carrying part 748a, 748b that paired center is provided with, they help to provide the earth strip of part around the middle body of finishing device with the end sections 742 (Fig. 7 b) and the current-carrying part 740 (Fig. 7 c) of other layers.

As watch that Fig. 7 a is seen and with previous Fig. 4 b and 5b in the similar fashion discussed, the extension of cutting process will all be the device of " good ", that is, do not have the device can short circuit in final products as the situation of first embodiment.

With reference now to Fig. 7 b and 7c,, the ground plane connection performance of cross portion 742, current-carrying part 748a, 748b and conductive layer 740 can be more clearly visible.Fig. 7 b and 7c are respectively the top and bottom perspective views of inclination of assembled layers of the device 702 of this exemplary embodiment preparation according to the inventive subject matter.Can see that in these two figure the end of the cross portion 742 of electrode layer 740 appears at lateral edge 752 places of the device 702 of part assembling.Though be appreciated that in this figure invisiblely, edge member will be similar to cross portion and occur along the lateral edge 762 of device 702.

After having printed the different layer 720-728 that shows as Fig. 7 a, as previously discussed, the device of cutting and stacked layer adopt technology well known by persons skilled in the art to fire.This burning process obtains the device 702 as Fig. 7 b and 7c demonstration.Shown in Fig. 7 b, top electrode layer provides electrode part 744 and 746 on the upper surface 760 of device 702, and the end sections 754,756 of device 702 exposed electrode layer 720 and 724 end sections thereon.

Fig. 7 d and 7e illustrate the top and the bottom of device 702 respectively with the part side perspective.After initial firing, termination material 762,763,764,766,768 and 770 (Fig. 7 e) is applied on the electrode part 744,746 that upper surface 760 exposes, and contact with every layer 720,724 remaining electrode tips along end sections 754,756 and lateral section 752,762, and pass through termination portion 770 and contact with base section 740 by termination portion 768.Should be appreciated that termination portion 762 and 766 covers top electrode part 744,746 respectively continuously and exposed electrodes part on the end 754,756 of device 702.Though should also be clear that in front view, having hidden, also provide similar covering on the exposed electrodes end on the edge 756 of device 702.

After having applied the termination material of firm description, device 702 can be represented with the equivalent circuit figure on Fig. 7 f electric.As what show here, device 702 can be expressed as the paired electric capacity with shared grounding electrode 790, and this shared grounding electrode 790 typically is connected with 770 earth terminal 786 with electric going up corresponding to the termination material of describing among Fig. 7 e 768.In a similar fashion, first capacitor plate 792 is shown as with electric going up corresponding to termination material 763 and is connected with 766 termination 782, second capacitor plate 794 be shown as with electric on be connected with 764 termination 784 corresponding to termination material 762.

Further consider this embodiment of theme of the present invention, can use device 703 to form the Pi filters as Fig. 7 g and 7h demonstration.With reference now to Fig. 7 g,, device 703 is corresponding with the equivalence figure that Fig. 7 f (parametric device 702) provides basically, except increasing bridge joint the patch of resistive material 780 of the end of each electrode termination material layer 762 and 763.Patch of resistive material 780 is electrically connected with electrode termination layer 762,763, and owing between conductive layer 748a on the upper surface 760 of device 702 and 748b, have aperture position, so do not need the insulating barrier as layer 688 (Fig. 6 g) that use previously.Increase this patch of resistive material 780 and change the device of Fig. 7 d-7f into show as Fig. 7 h Pi filter, wherein resistance 780` is corresponding to by the patch of resistive material 780 formed resistance that increase.

With reference now to Fig. 8,, show another exemplary embodiment of the device 800 of preparation according to the inventive subject matter, it has end termination 810.Device 800 can image pattern 1a and 1b as described in prepare, preferably as described in Fig. 2 a-2d, prepare, thereby can prepare end termination 810 and need not the top termination of 160,162 among Fig. 2 d except increase by an insulating barrier in top and lower surface.Should be appreciated that also provides on the end 812 of device 800 and termination layer 810 similar termination layer.

Fig. 9 a-9c has described another exemplary embodiment of electronic device 900 according to the inventive subject matter, and it has " T " electrode and assists termination to be connected with virtual small pieces.Shown in Fig. 9 a, device 900 has "T"-shaped substantially electrode 910 and the current-carrying part 920 of " U " shape substantially.A plurality of kind electrode layers are provided shown in Fig. 9 b, wherein these the layer each all put upside down from its adjoining course.Shown in Fig. 9 c apply the termination material time, on the part 924,926 of end sections 920,922 (termination material hide) and side 930, cover the termination material in this view.Should be clipped between the "T"-shaped electrode 910, by " U " shape current-carrying part 920 as the anchor point of termination material.It will be appreciated by those skilled in the art that on the side 932 of device 900 provides current-carrying part (invisible in Fig. 9 c), is providing visible part 924,926 in Fig. 9 c on the side 930 similarly.

Fig. 9 d has shown the single silk-screen patterns of the electrode layer that is used for preparing the exemplary means 900 that Fig. 9 a-9c shows.The silk-screen patterns of crossing just as described previously and explaining, the silk-screen patterns theme of description illustrates with the selection zone 942,944 of shadowed, as previously mentioned, to clearly illustrate that electrode position partly in the resulting devices.

For silk-screen patterns 940, will notice that cutting pattern 962 shows with dotted line in layer 950, and similarly cutting pattern 964 is presented in the layer 952.When the gap between those dotted outlines is represented with saw various piece to be separated with the otch that removes.Openly and previous describe among the embodiment of theme of the present invention and discussed from existing, those skilled in the art can obviously know, single printing screen 940 is offset from a side to opposite side between different layers and prepares the pattern that shows Fig. 9 d.And, disclosed such cutting pattern with the electrode pattern paired observation cutting pattern 962,964 that in Fig. 9 b, shows and provide illustrated "T"-shaped and " U " shape pattern for the device layer that replaces.

Figure 10 a-10c has shown another exemplary embodiment of electronic device according to the inventive subject matter, and it provides improved erectility by 90 degree symmetries.Shown in Figure 10 a, device 1000 provides termination material 1010,1012 on the top 1002 of this device 1000.Termination material 1012 on the top 1002 of device 1000 can be connected on the side termination material 1014 on the side 1016 of device 1000 continuously.In a similar fashion, the termination material is provided on the side 1018 of device 1000, though it is invisible in Figure 10 a, is connected to continuously on the termination material 1010 on the top 1002 of device 1000.As what see from the bi-directional symmetrical of device 1000, attentiveness need only be placed on the installing of one 90 ° of rotations, thereby the trace material of guaranteeing the appropriate location on termination material and the corresponding circuit board is aimed at.

Figure 10 b has also shown another device 1020 of preparation according to the inventive subject matter and corresponding to the device that can be placed by half-twist arbitrarily.What show among device 1020 and Figure 10 a is similar, except termination material 1030,1032,1034 and 1036 along on the monolateral upper surface 1021 that is arranged at device 1020 of all four of device 1020.In addition, termination material 1044 and termination material 1032 on the side 1022 of device 1020 are continuous coupled, and the termination material 1036 on the top 1021 of termination material 1046 on the side 1025 of device 1020 and device 1020 is continuous coupled.Should understand, though invisible in Figure 10 b, also provide on the side 1023,1024 of device 1020 with side 1022,1025 at device 1020 on termination material 1044,1046 respectively similar side contact the termination material.

With reference now to Figure 10 c,, another device 1060 of preparation according to the inventive subject matter is provided, it has many internal characteristicses of the device 1020 that shows among Figure 10 b.First similarly be characterised in that device 1060 also can with and Figure 10 b in device 1020 similar modes with any 90 degree directions installations.Device 1060 and 1020 main difference can be easier to find out by the ratio of two width of cloth figure (Figure 10 b and 10c).For example, can notice, on the top 1062 of device 1060, not provide the termination material.Simultaneously, on all four single limits 1070,1072,1074 and 1076 of device 1060, provide the termination material more widely, but not the device 1020 in Figure 10 b, though have only 1064 on termination material 1062 on the side 1070 and the side 1072 in Figure 10 c as seen.

With reference now to Figure 11,, it shows the single silk-screen patterns 1100 that electrode layer adopted for the exemplary embodiment that shows among preparation Figure 10 c.This silk-screen patterns 1100 in some aspects with Fig. 9 d in similar, wherein except complementation in the horizontal, those in the layer 1170 in the electrode pattern of printing and layers 1172 are identical.Once more with Fig. 9 d in similar mode, prepare electrode structure according to cutting pattern 1162,1164, this electrode structure provides the main electrode part 1150 that comprises two small pieces parts 1152,1154 and two current-carrying parts that separate 1156,1158 on every layer when stacked, these parts are in the mode of " U " shape part 920 (Fig. 9 b) of being similar to device 900, provide anchor point along the lateral section of resulting devices for the termination material.

To notice that also small pieces part 1152 is directly relative with the current-carrying part 1158 that separates, and small pieces part 1154 is directly relative with independent current-carrying part 1156.Except phase phasic difference 90 degree, in layer 1170, have identical like this arranging and make that the direction of tube device is not how, all occurs the small pieces and the current-carrying part that separates that replace in each layer when stacked multilayer 1170 and 1172 during with fabricate devices 1060.This just makes device 1160 to turn 90 degrees partially arbitrarily and is arranged on the circuit board.In fact, device 1060 even can put upside down fully is provided with and still provides correct conductive path for relevant board vias.

With reference now to Figure 13 a-13e,, it shows another exemplary embodiment of theme of the present invention.The internal electrode of this embodiment pile up with Fig. 2 a show similar, be identical except making all electrode patterns in this case so that all these electrodes all are the active electrode.In Figure 13 a, electrode 1320-1327 is printed successively with stacked, and wherein the odd number electrode extends at edge 1330 to the left, and even number electrode edge 1332 to the right extends, as shown in the figure.Similar electrode arrangement has also been described on section among Figure 13 b.

Stacked and laminate after, parts 1350 on both sides at least with an angle cutting, shown in the part perspective view of Figure 13 c.The edge 1354 of inclined cut exposes the edge of even number internal electrode now, and electrode 1320 is on top surface 1352.Similarly, the edge 1356 of inclined cut exposes the odd number electrode now, and electrode 1327 is on basal surface.

Parts 1350 are fired, adopted common technology termination then, make electrode termination surface 1362 connect the even number electrode, and termination surface 1360 connects the odd number electrode, has the termination surface that is suitable for bonding.

Can be by having one to understand more completely to the structure of this example with reference to figure 13e, Figure 13 e shows along the profile of the transversal 13-13 cutting that shows among Figure 13 d.Electrode termination surface 1360,1362 is shown as with internal electrode and is connected, and at the edge or top and/or bottom a plurality of tie points to circuit are provided.

Current Figure 14 a-14e also shows another exemplary embodiment according to the inventive subject matter.It will be apparent to those skilled in the art that the parts that prepare according to the disclosure can be used as the part in the bigger pattern for preparing simultaneously with a plurality of unit usually.In Figure 14 a, shown different layers according to the array of this exemplary embodiment of theme of the present invention.The layer 1428 corresponding to cover layer and comprise " virtual small pieces " layer, and the layer 1420-1425 corresponding to active electrode." virtual small pieces " provide to assist the small pieces of termination technology, usually corresponding to providing additional nucleating point for thin copper termination (FTC) technology.When being placed on outer surface, they also provide bonding welding pad.Vertically being illustrated among Figure 14 b of this electrode layer shows, corresponding Reference numeral among its corresponding employing and Figure 14 a.

Figure 14 c has described the exemplary arrays of three part 1450A, 1450B and 1450C.Preparation together to those skilled in the art will know that more parts often can be arranged in preparation (general or even several thousand).Be positioned at six positions (though for describe only representational for the purpose of clear pointed out a position) in the tectal part that shows among Figure 14 c corresponding to the virtual small pieces 1428 on the face 1452.The lower surface (not shown) of array preferably has similar pattern, and therefore this theme has also been represented in current description.Representational electrode 1420,1422 and 1424 exposes on same edge surface 1454.

Often, according to this theme, this array preferably cuts along line of cut (for example at representational line of cut 2-2 and the 3-3 shown in exemplary Figure 14 c).Yet, equally according to this theme, sometimes for obtaining a given array implement mode, make a plurality of unit together, as in exemplary Figure 14 d, representing, wherein a part is 1450A by independent separately (singulated) (that is, separating), and makes exemplary parts 1450B and 1450C form dyadic array continuously.In the application of many reality, more common practice is to have more element in array, and modal is four, but the disclosure is not limited to any such given number, according to current theme, can provide more or still less element alternatively.

According to specific purpose or embodiment may thousands of after parts (may be simultaneously or common preparation widely) are separated into a plurality of element arrays of independent parts or different numbers, thereby each parts can use suitable plating technic to be terminated to be connected and prepares final parts.Figure 14 e has shown representational final parts, wherein termination 1460 and 1462 and electrically continuous ends part 1464 allow to electrically contact.

Figure 15 a-15f also shows the exemplary embodiment of another theme of the present invention.In some cases, being preferably parts provides circular or spherical installation constitution but not previously described small pieces structure.For so exemplary optional structure, Figure 15 a has provided exemplary electrode lay-out, and wherein overlay pattern for example is provided as the circular pattern by element 1529 expressions.The embodiment that interior electrode layer and front are described and discussed is similar, and adopts similar label, and 1520,1522 and 1524 is the electrodes on right side, and 1521,1523 and 1525 are the electrodes in left side.Figure 15 b has provided the profile of the current optional embodiment of example, its have with Figure 15 a in the identical Reference numeral that shows.Stacked, laminate and cut after, this element shows with perspective view in Figure 15 c, makes this exemplary circular electrode 1529 appear on the top surface 1552.Though only shown two spherical characteristic, be appreciated that if used spherical option, often need three at least, need more ball to guarantee the physical stability of installation process sometimes, and reduce resistance and the inductance that is connected.Yet, for example, suppose this product bond pads that just goes between, general two just much of that.

When still being raw cook (also promptly not firing), obtaining via hole 1580 and 1582 (referring to Figure 15 d, 15e) in boring of the middle part of circular electrode or punching, and fill and the similar electric conducting material of electrode print media therein.Figure 15 e has provided along the profile of the line of cut 4-4 cutting that shows among Figure 15 d.Fire then, these parts of plating can weld the contact surface of bonding that maybe can go between to provide on 1588 and 1589, thereby the parts that obtain finishing generally are 1590.Alternatively, on this position, can also adhere to soldered ball.

In some situation or execution mode, installation method that need or preferred makes that termination is the needs of five limits (five-sided) with the MLC electric capacity of suitable current techniques.In this case, can adopt electrode design shown in Figure 16 a according to present technique.Dummy electrodes 1628a, 1628b at the layout two ends will become the top and the bottom land of final electric capacity.According to the disclosure, the electric capacity on five limits is defined by the stacked shape of T substantially pattern 1620,1621,1622,1623,1624 and 1625 in parts and between dummy electrodes 1628a and the 1628b.The internal electrode pattern 1620,1622 and 1624 of even number comes right side 1632, and the internal electrode pattern 1621,1623 and 1625 of odd number comes left side 1630.Figure 16 b has at length shown this exemplary internal electrode, has emphasized small pieces 1626 and 1627.Figure 16 c has represented that with vertical form the assembling of the example feature that this is current is stacked, and it adopts the Reference numeral identical with Figure 16 a.

After each is folded layer by layer, laminates and cuts, just obtained the structure that Figure 16 d shows, wherein even number electrode 1620,1622 and 1624 exposes at front surface 1654, and the odd number electrode 1656 exposes (invisible in the drawings but otherwise represented) in the rear surface.Dummy electrodes 1628a is also similarly along leading edge 1654 alignment, thereby and partly extends on top surface or basal surface with side small pieces (normally 1626) and conform to.In a similar fashion, the small pieces 1627 that expose of the odd number electrode on the virtual small pieces 1628b of back and the side align.

When after termination area is by plating, just prepared the example structure shown in Figure 16 e, it can use technique of backflow known in the art that parts are carried out mounted on surface, thereby does not need further discussion.Comprise 1664 of 1662a on the top, the 1663b of 1663a, forward right side of 1662b, front left side on the bottom and front end according to all terminations surface in this exemplary arrangement of theme of the present invention, its rear surface in the structure of finishing also has similar structure.

Figure 17 a-17e has described another embodiment of theme of the present invention respectively.Embodiment shown in this has the feature that can advantageously reduce inductance.Can provide opposite polarity small pieces to eliminate the inductance that the stray inductance effect obtains to reduce.More specifically shown in Figure 17 c, each can provide small pieces 1742,1742` and 1743,1743` respectively electrode 1720,1721, when a plurality of alternating layer 1720-1725 are stacked as Figure 17 a and 17b, prepares opposite polarity small pieces like this.

More specifically, Figure 17 a has shown an electrode stack sequence, and wherein dummy electrodes 1728 has the surface characteristics that can allow the termination of reeling.Describe in detail like that as Figure 17 c, exemplary current electrode design when assembling is stacked, have staggered polarity, to such an extent as to electrode 1720,1722 and 1724 and layers 1721,1723 and 1725 is interlocking.

The line of cut of Reference numeral 1730 and 1732 expressions and aforementioned similar example, for example, 130,132 among Fig. 1 a.In this case, electrode pattern not with cuts intersect.Thereby electrode does not expose at side.

Figure 17 b shows the profile by small pieces.The electrode 1721,1723 and 1725 of odd number appears at the left side of figure, and even number 1720,1722,1724 appears at the right of figure.Electrode 1720-1725 is corresponding to active electrode and overlapping active region is provided.The active region of 1728 pairs of electric capacity of the virtual small pieces in surface is not contributed, but is used for the purpose of termination, and this will further discuss hereinafter.

Figure 17 c shows the active electrode 1720 of example and the details of 1721 amplification.Each kind electrode 1720,1721 all comprises small pieces 1742,1742` and 1743,1743` respectively.Such electrode pair has been represented the odd and even number electrode group of same preparation.

Stacked behind the alternating electrode layer enough and/or that need number, the low inductance capacitance of finishing basically (normally 1750) has just been made, shown in Figure 17 d.The small pieces of electrode 1720-1725 appear on the front surface 1752 and rear surface 1762 of indication now simultaneously.By these small pieces, electrode 1720-1725 is at top surface and basal surface forms and the interface of surperficial virtual small pieces 1728.The understanding that it should be apparent to those skilled in the art that and understanding can provide six more numbers of active electrode layer than the example of current demonstration in the specific electric capacity of preparation according to the inventive subject matter.Usually, the number of electrode layer is in hundred or more, and can optionally carry out stacked or unite the capacitance of wanting up to obtaining with the mode that provides.

After layer stacked and/or associating being fired,, thereby obtain normally 1790 the parts of Figure 17 e demonstration to processings that be terminated of the intermediate products of these parts with means well known to those skilled in the art and/or technology.Termination 1768 and 1769 is connection electrode small pieces and surperficial virtual level in continuous surface, and physics and the electric ground of going up are with termination and internal electrode gang.Though be appreciated that in this view and can not directly find out, Figure 17 e has also described at the rear side of these parts can be according to the similar structure of theme existence of the present invention.

Figure 18 a-18h has shown another embodiment of theme of the present invention, and the embodiment of this example is provided with and prepares low inductance capacitance.In this exemplary embodiment, the electrode that outside small pieces is not provided or exposes, but come the favourable all connections of carrying out by the surperficial via hole of electrode in connecting.Figure 18 a and 18b show respectively exemplary electrical stacks or associating the plane and profile, wherein electrode 1820,1822 and 1824 is as a utmost point, and electrode 1821,1823 and 1825 is as an opposite utmost point.Representational line of cut 1830 and 1832 and the edge of electrode pattern electrode or the small pieces that (as the exemplary embodiment of front) so just do not expose that are spaced apart produce.

Figure 18 c, 18d describe the different electrode design that can be used for finishing similar purpose respectively in detail with 18e.Electrode 1820,1820` and the 1820`` that shows in Figure 18 c, 18d and 18e respectively is first polar electric pole, and 1821,1821` and 1821`` be shown as second polar electric pole.In the first electrode group 1881, in 1881` and the 1881`` and the second electrode group 1882, each electrode of describing respectively of 1882` and 1882`` is positioned at such position, make via hole can be in the assembling sequence stage of back be used for through each electrode.In the situation of the structure shown in Figure 18 e example, design one " forbidding " (keep-out) zone 1883, in this zone, forbid conductive electrode material, thereby resulting devices can short circuit.

Figure 18 b has provided the profile of this exemplary embodiment, and wherein a plurality of electrodes are by suitably stacked or assembling.Will be appreciated that equally, do not have small pieces to extend to line of cut 1830 and 1832 with the embodiment of front.Electrode group 1820-1825 is shown as them respectively and will occurs in by the cross section in the middle of the device, shows the scutellate zone that shows to realize, the overlapping region is represented by dotted lines.

Figure 18 f has provided the perspective view of the device 1850 after the assembling.The point that this product is such, holing or penetrating this device obtains via hole 1880,1882.In via hole 1880,1882, fill the metal thickener of similar preparation internal electrode.Except the via hole of filling, top surface 1852 and edge 1856 do not have feature.

Figure 18 g has provided along the profile of the line of cut 18g-18g cutting of Figure 18 f, has also shown the relation of via hole 1880,1882 and internal electrode 1820-1825 respectively.

After firing, device 1890 is shown in Figure 18 h.Soldered ball 1888,1889 can be housed on through-hole surfaces help ensuing electrical connection.

During some is used, need or preferably low inductance capacitance.Figure 19 a has shown low inductance capacitance useful in many situations respectively to 19c, and it uses crossed electrode to obtain low inductance, generally as United States Patent (USP) 5,880, as described in 925 people such as () the Dupr é and 6,243,253B1 people such as () Dupr é.

Figure 19 a shows two kinds of staggered electrodes 1920 and 1921 that are used for this situation.Such electrode begins to be printed on the pottery of not firing, and then with a plurality of folded layer by layer, that describes among this and the exemplary Figure 19 b is similar.Figure 19 b has described and has almost finished like this and do not have the top substantially of exemplary means 1990 of termination and a perspective view of side.Figure 19 c shows along the profile of the example device 1990 of the line of cut 19c-19c cutting that shows among Figure 19 b.Different polarities of electrode is represented with the line of the different depths.

Figure 19 d has provided a kind of similar in some aspects but structure that other aspects are more advanced.With the similar of describing in people's such as Ritter the United States Patent (USP) 7,152,291, virtual small pieces 1926 and 1926` provide support and nucleating point for the electroless copper termination.Electrode 1922 and 1923 in some aspects with Figure 19 a in electrode 1920 and 1921 similar, except they provide end small pieces 1925 and 1925`., describe in 925 at United States Patent (USP) 5,880 as people such as Dupr é, the effect of these small pieces is to reduce inductance and resistance, for the test in the preparation process facilitates.

Similar in some aspects with aforesaid mode, the electrode layer of patterning is stacked vertically so that device 1991 to be provided as showing among Figure 19 e.Figure 19 f has provided the profile of the theme of Figure 19 e along line of cut 19f-19f cutting.Equally, the electrode 1922 of opposed polarity is represented with the line of the different depths of 1923 usefulness, shows small pieces 1926 and 1926` and provides anchor point along the end for ensuing termination.

Though this design is useful to its specific purpose, it has potential defective in some cases recent findings.This defective may take place to provide under extremely low-resistance situation in electrode in parallel and their corresponding parallel resistance combinations in the relatively large number amount.In some situation, in the final circuit that uses, have been found that some undesired effects, comprise that impedance does not match and the phenomenon of " ring (ringing) ".

As (having showed some aspect of exemplary means 1990 and 1991) that Figure 19 g shows, electrode small structure and electrode itself provide certain resistance.Representative value can be about 1 ohm.Shown in Figure 19 g, it is relevant with first polar electric pole 1920 that such resistance 1966 is shown as, resistance (resistor) 1967 relevant with second polarity (it is applied to mark in the electrode 1921).

In typical electric capacity, have a lot of layers (up to a hundred sometimes).For simple convenient, next consider to have 6 right situations of electrode-electric resistance of one group of parallel connection with narration.For this example furthermore, the all-in resistance of each electric capacity is thought 1 ohm, and the capacitance of each electric capacity is 1 nano farad (nano-farad).Adopt analysis tool well known to those skilled in the art, the electric capacity in the structure of Figure 19 g will superpose, and for example be total up to six nano farads.The rule combination reciprocal that this resistance is all known by everybody, its all-in resistance is 0.166 ohm, or 166 milliohms.This is the resistance of measuring on the termination 1987 and 1988 of the representative configuration in Figure 19 g.Can understand, for the electric capacity with up to a hundred layers, resistance value can be very little, for example is so small to have only several milliohms.

United States Patent (USP) 7,054,136 (people such as Ritter) have provided a kind of method of controlling these parameters.Disclosed theme is attempted by using via hole to control these parameters in the U.S. Patent Application Publication 2006/0152886 people such as () Togashi, but their preparations are expensive, and can cause other electrical problems, for example short circuit easily, and active electrode partly reduces.

Figure 20 a has provided the improved Apparatus and method for of effectively controlling these parameters in force to 20d.Be not the structure that only adopts two electrodes, current Figure 20 a has used four to the exemplary embodiment of 20d theme.As shown in Figure 20 a, first group of two electrode 2022 and 2023 and Figure 19 a in electrode 1922 and 1923 in the prior art device that shows similar in some aspects.Yet, behind these two electrodes, also increased the multilayer of design with current exemplary electrode 2042 and 2043.These electrodes have only a connection to lead to the external world, promptly by end small pieces 2025 or 2025`.The virtual small pieces 2026 of example and 2026` have nine, and they are not connected with electrode body according to definition.

This pattern is stacked shown in Figure 20 b, and its profile is shown in Figure 20 c.Another feature of this exemplary embodiment is that staggered electrode small pieces 2029 only are connected with two electrode surfaces of bottom.Because inductance is mainly by determining that with respect to the immediate plane of circuit board this device 2091 remains a low inductance capacitance.The other parts of electrode stacked (comprising electrode design 2042 and 2043) are connected in parallel, but connect with 2023 end with electrode 2022 respectively.

The different advantage of this exemplary embodiment will be considered to illustrate with reference to the roughly equivalent circuit of figure 20d.For example, suppose that resistance value is the same with example values in the situation of front with capacitance, resistance 2066` that gets in touch with electrode 2023 and resistance (resistor) 2067` that gets in touch with electrode layer 2022 are in parallel.Otherwise, electrode 2042 and 2043 and their resistance 2066 and 2067 major part in parallel mutually separately, thereby 2042-2043 is the electric capacity of 4 nano farads and 0.25 ohm resistance to the clean parameter of combination.2022-2023 is 2 nano farads and 0.5 ohm to the parameter of combination.Because capacitance remains stack, so the total capacitance of all devices 2091 is 6 nano farads, but because they are connected, two-part clean resistance value is 0.5 ohm and adds 0.25 ohm (i.e. 750 milliohms).Compare with 166 milliohms of front device, just can understand the advantage of the device of preparing like this.

Those skilled in the art will understand 2 points from the disclosure.The first, along with 2042-2043 becomes very big to the quantity that makes up, the difference that the clean resistance value of this structure is compared with the prior art structure among Figure 19 a-19c also becomes big.Second is, device of the present disclosure can be made symmetry for the purpose of installing, as long as in the upper end of lamination similar pair of electrodes 2022 and 2023 are set, this causes relatively little resistance value sacrifice, during especially for a lot of layers.

Though at length disclose theme of the present invention with reference to specific embodiment, can understand those skilled in the art under the situation of the content of understanding the front, can be easy to obtain the change of present embodiment, change and equivalent feature.Therefore, the scope of the present disclosure is used for example and non-limiting purpose, and the disclosure is not got rid of those adjustment to theme of the present invention that it will be apparent to those skilled in the art, variation and/or increase.

Claims (53)

1, a kind of method for preparing the multilayer electronic device comprises:

At least two-layer support material is provided;

Single silk screen printing mask is provided;

Described mask is placed on the ground floor of described two-layer at least support material;

By described mask first conductive pattern is printed on the described ground floor support material;

Described mask is placed on the second layer of described two-layer at least support material;

Printing second conductive pattern on described second layer support material; With

Make up described ground floor and second layer support material prepare have upper surface, the printed layers of lower surface, leading edge and antemarginal adjacency.

2, according to the described method of claim 1, wherein, on the position of the position deviation that is arranged on described ground floor support material from described mask, described mask is placed on the described second layer support material, make described combination step on the adjacent layer of support material, prepare complementary electrode layer.

3, method according to claim 1 wherein provides the step of two-layer at least supporting layer to comprise at least two dielectric layers is provided, a kind of at least two resistive layers or at least two variable resistance layers.

4, method according to claim 1 also comprises:

The lateral ends part of repairing the ground floor of transferring combination and the second layer is to expose the conductive pattern of selection; With

The termination material is applied at least the lateral ends part of repairing accent.

5, as method as described in the claim 4, the step that wherein applies the termination material comprises the termination material is applied at least a portion of the electrode of the selection of exposing on the upper surface at least of the ground floor of combination and the second layer or the lower surface.

6, as method as described in the claim 5, also comprise:

Before applying the termination material, fire the ground floor and the second layer of combination.

7, method according to claim 1 also comprises:

Described mask is placed on the 3rd layer of support material;

Printing the 3rd conductive pattern on described the 3rd layer of support material; With

Make up described the 3rd layer and described ground floor and second layer support material;

Wherein, the same position on described second layer support material, described mask is placed on described the 3rd layer of support material, and

Wherein, when combination described the 3rd layer and described ground floor and the second layer, a plurality of identical electrode layers of preparation on the adjacent layer of the support material of closing on upper surface or lower surface.

8, method according to claim 1 also comprises:

Described mask is placed on the 3rd layer of support material;

On described the 3rd layer of support material, print the 3rd conductive pattern by described mask;

Described mask is placed on the 4th layer of support material;

Printing the 4th conductive pattern on described the 4th layer of support material;

Described mask is placed on the layer 5 support material;

Printing the 5th conductive pattern on described layer 5 support material;

Described the 3rd, the 4th, layer 5 are combined on described ground floor and the second layer support material combination with the printed layers that obtains having upper surface and lower surface successively; And

First and second lateral ends part of repairing the layer of transferring described combination is to expose the conductive pattern of selecting;

Wherein, place from described mask described first, the 3rd and the layer 5 support material on the position of position deviation, described mask is placed on described second and the 4th layer of support material; With

Wherein when repairing the layer of transferring described combination, conductive electrode portion partly exposes in layer of selecting and the lateral ends of selecting at least.

9, a kind of method that adopts single silk screen printing mask to prepare the multilayer electronic device comprises:

Place shared mask on the alternate position in a plurality of alternating layers of support material;

Screen printing electrode material on a plurality of alternating layers of described support material;

Stacked a plurality of alternating layer, thus in described alternating layer, prepare complementation electrode structure.

10, as method as described in the claim 9, also comprise:

From by dielectric material, select described support material in the group that resistance material and variable-resistance material constitute.

11, as method as described in the claim 9, also comprise:

The lateral ends part of repairing the stacked ground floor of accent and the second layer is to expose the conductive pattern of selection; With

The termination material is applied at least the lateral ends part of repairing accent.

12, as method as described in the claim 11, the step that wherein applies the termination material comprises the termination material is applied at least a portion of the electrode of the selection of exposing on the upper surface at least of the stacked ground floor and the second layer or the lower surface.

13,, also be included in and fire the stacked ground floor and the second layer before applying the termination material as method as described in the claim 11.

14, as method as described in the claim 11, wherein said shared mask is placed on the alternate position of described a plurality of alternating layers of described support material, makes by applying the electronic device of a plurality of parallel connections of described termination material preparation.

15, as method as described in the claim 11, wherein said shared mask is placed on the alternate position of described a plurality of alternating layers of described support material, makes by applying the electronic device of a plurality of series connection of described termination material preparation.

16, as method as described in the claim 9, also comprise:

For described shared mask provides central cross portion part, make described step on the alternate position of described a plurality of alternating layers of will described shared mask being placed on described support material prepare central space on the top layer and the central small pieces in the bottom, thereby prepare paired electronic device with common electrode.

17, as method as described in the claim 16, wherein said support material comprises the dielectric material of selection, makes described paired electronic device form feedthrough capacitor.

18, as method as described in the claim 16, also comprise:

Select dielectric material as described support material; With

The resistive layer of the described central space of bridge joint is provided, makes described paired electronic device form the Pi filter.

19, as method as described in the claim 16, also comprise:

Repair the lateral ends of transferring the stacked ground floor and the second layer and middle body to expose the conductive pattern of selection; With

Apply the termination material on the conductive pattern to the selection of exposing, making provides the electrode part of T shape and the virtual small pieces part of U-shaped for each alternating layer.

20, as method as described in the claim 11, wherein:

Described repair to stealthily substitute to draw together with an angle lateral ends is partly repaiied accent;

Described applying comprises that described termination material is applied to first of described device to be repaiied and transfer on lateral ends part and the upper surface, and is applied to second of described device discretely and repaiies and transfer lateral ends partly and on the lower surface.

21, as method as described in the claim 9, also comprise:

Top layer and the bottom of overlay pattern electrode layer as stacked a plurality of alternating layers are provided, and each overlay pattern layer has the current-carrying part of at least two separation.

22, as method as described in the claim 21, also comprise:

Repair and transfer stacked first, second and tectal lateral ends part to expose the conductive pattern of selection; With

The termination material is applied to lateral ends part and the overlay pattern layer of repairing accent at least, makes independent the top and lowermost conductive region in described device, be electrically coupled on the layer laminate alternately.

23, as method as described in the claim 21, also comprise:

At least two via holes that extend through two separated portions each from top layer to the bottom are provided; With

Fill described at least two via holes with electric conducting material, make independent the top and lowermost conductive region in described device with the layer laminate electric coupling that replaces.

24,, comprise that also the described overlay pattern electrode layer to selecting carries out plating, evaporation, sputter or organic metal reduction by electric conducting material, thereby cohesible contact surface is provided as method as described in the claim 23.

25, as method as described in the claim 23, wherein:

Described overlay pattern electrode layer is provided as circular pattern; With

Wherein said method also comprises soldered ball is adhered to described overlay pattern electrode.

26,, also comprise described shared mask is provided as L shaped substantially zone, U-shaped zone or square region substantially as method as described in the claim 23.

27,, comprise also repairing and transfer stacked first, second and tectal lateral parts that making does not have conductive pattern to be exposed as method as described in the claim 26.

28, as method as described in the claim 9, also comprise:

At least two opposed ends of described shared mask are provided, have respectively the relative extension small pieces part of extending along the front and rear of described stacked a plurality of alternating layers;

Provide the overlay pattern electrode layer as the top layer and the bottom on described stacked a plurality of alternating layers, each overlay pattern layer has the current-carrying part of at least two separation;

Repair and transfer stacked first, second and tectal lateral ends part, making does not have conductive pattern to be exposed;

Repair and transfer stacked a plurality of alternating layers and tectal front and rear, to expose the selection part of described relative extension small pieces part and overlay pattern electrode layer; With

With the termination coated materials to the small pieces that expose part and conductive pattern electrode layer.

29, a kind of multilayer electronic device comprises:

At least two-layer support material;

First conductive pattern is printed on the described ground floor support material;

Second conductive pattern, be printed on the described second layer support material, the printing complementation electrode layer that the combination of described ground floor and second layer support material has upper surface, lower surface, leading edge and antemarginal adjacency with preparation, thereby and the lateral ends of the ground floor of described combination and second layer part repaiied to transfer and exposed the conductive pattern of selection; With

The termination material is applied to the lateral ends part of repairing accent at least.

30, as multilayer electronic device as described in the claim 29, wherein said device has the small size less than 10 mils, and wherein said termination material is less than 1 mil.

31, as multilayer electronic device as described in the claim 29, on described lateral ends part of repairing behind the accent, or the position thereon by the organic metal reduction with plating, sputter or evaporation for wherein said termination material.

32, as multilayer electronic device as described in the claim 29, wherein said device is less than 10 mil thick, and has and covering less than the termination on five sides.

33, as multilayer electronic device as described in the claim 29, wherein said at least two supporting layers comprise one of at least two dielectric layers, at least two resistive layers or at least two variable resistance layers.

34, as multilayer electronic device as described in the claim 29, also comprise the termination material, it is coated at least a portion of electrode of the selection of exposing on the upper surface at least of the ground floor of combination and the second layer or the lower surface.

35, as multilayer electronic device as described in the claim 29, also comprise:

The 3rd layer of support material;

The 3rd conductive pattern is printed on described the 3rd layer of support material, described first, second and the combination of the 3rd layer of support material, with close on described on or a plurality of identical electrode layers of preparation on the adjacent layer of the support material of lower surface.

36, as multilayer electronic device as described in the claim 29, also comprise:

The 3rd layer of support material;

The 3rd conductive pattern is printed on described the 3rd layer of support material;

The 4th layer of support material;

The 4th conductive pattern is printed on described the 4th layer of support material;

The layer 5 support material;

The 5th conductive pattern, be printed on the described layer 5 support material, described first, second, third, fourth and layer 5 support material combination have the printed layers combination of upper surface and lower surface with preparation, thereby the lateral ends of described combination layer part is repaiied and is transferred the conductive pattern that exposes selection on layer of selecting and the lateral ends part selected.

37, as multilayer electronic device as described in the claim 29, wherein said support material comprises and is selected from by dielectric material the material of the group that resistance material and variable-resistance material constitute.

38,, also be included in the central small pieces part that forms on the central space that forms on a plurality of layers of described support material the top layer and the bottom, thereby preparation has the paired electronic device of public electrode as multilayer electronic device as described in the claim 29.

39, as multilayer electronic device as described in the claim 38, wherein said support material comprises the dielectric material of selection, makes described paired electronic device form feedthrough capacitor.

40, as multilayer electronic device as described in the claim 38, also comprise the resistive layer of the described central space of bridge joint, make described paired electronic device form the Pi filter.

41, as multilayer electronic device as described in the claim 29, also comprise the termination material, described termination material is applied on the middle body of the ground floor of described combination and the second layer to expose the conductive pattern of selection, and described termination material provides T shape electrode part and the virtual small pieces part of U-shaped for described device.

42, the controlled equivalent serial resistance multi-layer capacity of a kind of low inductance comprises:

At least the first pair of electrode that comprises staggered electrode, described staggered electrode has end small pieces separately in the opposite end, reducing inductance and resistance, and provide convenience for the test in the preparation process, and the small pieces of side small pieces separately and other staggered electrode interlock;

At least the second pair of electrode has end small pieces separately in the opposite end; With

Adjacent but be not electrically connected to described electrode and the virtual small pieces that form, for the electroless copper termination provides support and nucleating point.

43, the controlled equivalent serial resistance multi-layer capacity of low inductance as claimed in claim 42, the described staggered separately side small pieces of wherein said first pair of electrode only are electrically connected to two electrode surfaces of bottom.

44, the controlled equivalent serial resistance multi-layer capacity of low inductance as claimed in claim 43 also comprises described first pair of electrode of second group, is arranged at the upper end of described multilayer device, the symmetrical device of being convenient to install with preparation.

45, the controlled equivalent serial resistance multi-layer capacity of low inductance as claimed in claim 43, also be included in extra second pair of electrode and termination material in the stacked pattern, apply the circuit that is connected in series that described termination material is created being connected in parallel of described second pair of electrode and described first pair of electrode opposed end separately.

46, the controlled equivalent serial resistance multi-layer capacity of low inductance as claimed in claim 45, wherein said termination material comprise the described termination material of plating, sputter or evaporation to the described lateral ends part of transferring of repairing, or provided thereon by the organic metal reduction.

47, the controlled equivalent serial resistance multi-layer capacity of low inductance as claimed in claim 45, wherein said termination material comprises the electroless copper termination.

48, the controlled equivalent serial resistance multi-layer capacity of a kind of low inductance comprises:

At least the first pair of electrode that comprises staggered electrode, described staggered electrode has end small pieces separately in the opposite end, reducing inductance and resistance, and provide convenience for the test in the preparation process, and the small pieces of side small pieces separately and other staggered electrode interlock;

At least the second pair of electrode has end small pieces separately in the opposite end; With

The described electrode of termination material selectivity ground interconnection.

49, the controlled equivalent serial resistance multi-layer capacity of low inductance as claimed in claim 48, the described staggered separately side small pieces of wherein said first pair of electrode only are electrically connected to two electrode surfaces of bottom.

50, the controlled equivalent serial resistance multi-layer capacity of low inductance as claimed in claim 49 also comprises described first pair of electrode of second group, is arranged at the upper end of described multilayer device, the symmetrical device of being convenient to install with preparation.

51, the controlled equivalent serial resistance multi-layer capacity of low inductance as claimed in claim 49, also be included in the second pair of extra electrode in the stacked pattern, and wherein apply the circuit that is connected in series that described termination material is created being connected in parallel of described second pair of electrode and described first pair of electrode opposed end separately.

52, the controlled equivalent serial resistance multi-layer capacity of low inductance as claimed in claim 51, wherein said termination material comprise the described termination material of plating, sputter or evaporation to the described lateral ends part of transferring of repairing, or provided thereon by the organic metal reduction.

53, the controlled equivalent serial resistance multi-layer capacity of low inductance as claimed in claim 51, also comprise adjacent but be not electrically connected to described electrode and the virtual small pieces that form, thereby for the electroless copper termination provides support and nucleating point, wherein said termination material comprises the electroless copper termination.

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