CN206210613U - Composite electronic component - Google Patents
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- CN206210613U CN206210613U CN201621105333.1U CN201621105333U CN206210613U CN 206210613 U CN206210613 U CN 206210613U CN 201621105333 U CN201621105333 U CN 201621105333U CN 206210613 U CN206210613 U CN 206210613U
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Abstract
The utility model is related to a kind of composite electronic component, the composite electronic component at least one of the first end face and second end face in ceramic body surface by adhering to resistive layer, resistive layer is electrically connected with least one of the first lateral electrode and the second lateral electrode, electrically connected with the first lateral electrode at each first electrode layer at least in ceramic body, electrically connected with the second lateral electrode at each the second electrode lay at least, so as to form the structure with electric capacity and resistant series.Realize an electric capacity and resistance is integrated into discrete component, size is smaller.
Description
Technical field
The utility model is related to electronic component technology field, more particularly, to a kind of composite electronic component.
Background technology
Capacitor can be used for separated by direct communication, filtering and energy storage etc., have in the occasions such as transmission of electricity, distribution, electricity consumption extensive
Using.In many circuit applications, it is necessary to using resistance and capacitances in series structure circuit when, generally use discrete component, i.e.,
Resistance is mounted in the outside of electric capacity, less efficient, formation single resistance and single electric capacity is mounted, more circuit is so taken empty
Between, it is unfavorable for the miniaturization of whole machine.
Utility model content
Based on this, it is necessary to provide a kind of size smaller composite electronic component.
A kind of composite electronic component, including ceramic body, the first lateral electrode, the second lateral electrode, the first termination electrode, the second end electricity
Pole and resistive layer；
The ceramic body have the first first type surface relative to each other and the second first type surface, the first side surface relative to each other and
Second side surface and first end face and second end face relative to each other, the ceramic body are filled with ceramic dielectric, described
Multiple first electrode layers and multiple the second electrode lays, the first electrode layer and the second electrode lay are interspersed with ceramic dielectric
It is alternately laminated, and projection of the first electrode layer on the second electrode lay has overlapping portion with the second electrode lay
Point, the ceramic dielectric is filled between the first electrode layer and the second electrode lay；
First lateral electrode and second lateral electrode are respectively attached to first side surface or second side
On surface, first lateral electrode insulate with second lateral electrode, with described at each described first electrode layer at least one
One lateral electrode is electrically connected, and is electrically connected with second lateral electrode at each described the second electrode lay at least one；
The resistive layer is attached at least one of the first end face and the second end face surface, the resistance
Layer is electrically connected with least one of first lateral electrode and second lateral electrode；
First termination electrode is attached on the first end face or the resistive layer, and second termination electrode is attached to institute
State on second end face or the resistive layer, and at least one of first termination electrode and second termination electrode are attached to
On the resistive layer.
In one embodiment, the resistive layer is attached in the first end face, and the resistive layer with institute
State first first type surface, second first type surface, first side surface and second side table of first end face adjoining
Four, face respectively extends a distance on surface.
In one embodiment, first termination electrode is attached on the resistive layer, the resistive layer and described
One lateral electrode is electrically connected, and first termination electrode is in first first type surface abutted with the first end face, second master
Surface, first side surface and second side surface are respectively extended a distance on four surfaces.
In one embodiment, first termination electrode extended distance on the four surfaces at one exists less than the resistive layer
Extended distance on four surfaces.
In one embodiment, the resistive layer includes first resistor layer and second resistance two independent resistance of layer
Layer, wherein the first resistor layer be attached in the first end face, and the first resistor layer with the first end face
Adjacent first first type surface, second first type surface, four surfaces of first side surface and second side surface
On respectively extend a distance into, first resistor layer is electrically connected with first lateral electrode；The second resistance layer is attached to institute
State in second end face, and second resistance layer is in first first type surface, described second abutted with the second end face
First type surface, first side surface and second side surface are respectively extended a distance on four surfaces, the second resistance
Layer is electrically connected with second lateral electrode.
In one embodiment, first termination electrode is attached on the first resistor layer, first termination electrode
In first first type surface, second first type surface, first side surface abutted with the first end face and described
Respectively extended a distance on two surfaces of side surface four；Second termination electrode is attached on second resistance layer, and described the
Two termination electrodes first first type surface, second first type surface, first side surface abutted with the second end face with
And respectively extended a distance on described second side surface, four surfaces.
In one embodiment, first termination electrode extended distance on the four surfaces at one is less than the first resistor
Layer extended distance on the four surfaces at one, second termination electrode extended distance on the four surfaces at one is less than the second resistance
Layer extended distance on the four surfaces at one.
In one embodiment, first lateral electrode includes the first connection electrode and the second connection electrode, described the
One connection electrode is attached on first side surface, and second connection electrode is attached on second side surface, described
First electrode layer is electrically connected with least one of first connection electrode and second connection electrode；The second side electricity
Pole includes the 3rd connection electrode and the 4th connection electrode, and the 3rd connection electrode is attached on first side surface, described
4th connection electrode is attached on second side surface, the second electrode lay and the 3rd connection electrode and the described 4th
At least one of connection electrode is electrically connected；First connection electrode, second connection electrode, the 3rd connection electrode
And the 4th connection electrode mutually insulated.
In one embodiment, described first electrode layer one end electrically connects with first connection electrode, and described first
The other end of electrode layer is electrically connected with second connection electrode, and described the second electrode lay one end and the 3rd connection electrode are electric
Connection, the other end of the second electrode lay is electrically connected with the 4th connection electrode.
In one embodiment, the first electrode layer and the second electrode lay are relative and be arranged in parallel.
Above-mentioned composite electronic component, by attached at least one of the first end face and second end face in ceramic body surface
Resistive layer, resistive layer is electrically connected with least one of the first lateral electrode and the second lateral electrode, each in ceramic body first
Electrically connected with the first lateral electrode at electrode layer at least, electrically connected with the second lateral electrode at each the second electrode lay at least,
So as to form the structure with electric capacity and resistant series.Realize an electric capacity and resistance be integrated into discrete component, size is smaller,
By adjusting the resistivity and the first termination electrode of resistive layer and the spacing or the second termination electrode of the first lateral electrode and the second side
The spacing of electrode can easily obtain different resistance values, by the opposite face for adjusting first electrode layer and the second electrode lay
Product, first electrode layer and the spacing of the second electrode lay and the dielectric constant of ceramic dielectric can easily obtain different electric capacity
Amount, can save space for circuitry.
Brief description of the drawings
Fig. 1 is the structural representation of the composite electronic component of an implementation method；
Fig. 2 is the structural representation of the ceramic body of composite electronic component as shown in Figure 1；
Fig. 3 is the profile of composite electronic component as shown in Figure 1 parallel to the first side surface；
Fig. 4 is the profile of composite electronic component as shown in Figure 1 parallel to the first first type surface；
Fig. 5 is another profile of composite electronic component as shown in Figure 1 parallel to the first first type surface；
Fig. 6 is the equivalent circuit diagram of composite electronic component as shown in Figure 1；
Fig. 7 is the structural representation of the composite electronic component of another implementation method；
Fig. 8 is the profile of composite electronic component as shown in Figure 7 parallel to the first side surface；
Fig. 9 is the profile of composite electronic component as shown in Figure 7 parallel to the first first type surface；
Figure 10 is another profile of composite electronic component as shown in Figure 7 parallel to the first first type surface；
Figure 11 is the equivalent circuit diagram of composite electronic component as shown in Figure 7；
Figure 12 is the structural representation of the composite electronic component of a further embodiment；
Figure 13 is the profile of composite electronic component as shown in figure 12 parallel to the first side surface；
Figure 14 is the profile of composite electronic component as shown in figure 12 parallel to the first first type surface；
Figure 15 is another profile of composite electronic component as shown in figure 12 parallel to the first first type surface；
Figure 16 is the equivalent circuit diagram of composite electronic component as shown in figure 12；
Figure 17 is the flow chart of the preparation method of the composite electronic component of an implementation method；
Figure 18 is the flow chart of the preparation method of the ceramic body of an implementation method；
Figure 19 is the first electrode layer of composite electronic component as shown in Figure 1 and the silk-screen patterns of the second electrode lay；
Figure 20 is the first electrode layer of composite electronic component as shown in figures 7 and 12 and the silk screen figure of the second electrode lay
Case.
Specific embodiment
To enable above-mentioned purpose of the present utility model, feature and advantage more obvious understandable, below in conjunction with the accompanying drawings to this
The specific embodiment of utility model is described in detail.Elaborate many details in order to abundant in the following description
Understand the utility model.But the utility model can be implemented with being much different from other manner described here, this area
Technical staff can do similar improvement in the case of without prejudice to the utility model intension, therefore the utility model does not receive following public affairs
The limitation of the specific implementation opened.
Refer to Fig. 1, the composite electronic component 100 of an implementation method, including ceramic body 10, the first lateral electrode 201, second
Lateral electrode 202, the first termination electrode 221, the second termination electrode 222 and resistive layer 20.
The shape of ceramic body 10 can be the stereochemical structure with apparent surface two-by-two, for example, cuboid, prismatoid or rib
Cylinder etc..
In present embodiment, the structure of ceramic body 10 refers to Fig. 2, the substantially rectangular structure of ceramic body 10, ceramic body
10 have the first first type surface 01 and the second first type surface 02 relative to each other, the first side surface 03 and the second side surface relative to each other
04 and first end face 05 and second end face 06 relative to each other.
It should be noted that herein, the first first type surface 01, the second first type surface 02, the first side surface 03, the second side surface
04th, the name of first end face 05 and second end face 06 and numbering are merely to the convenience of description, is not to space structure
Limit.Ceramic body 10 is cuboid, and cuboid is made up of six faces, and relative face area equation can have two in six faces
Individual face, four faces or six faces are rectangular for that can have two faces, four faces or six faces in square, or six faces
Shape.
Specifically, the first first type surface 01 is relative and parallel with the second first type surface 02, the first side surface 03 and the second side surface
04 is relative and parallel, and first end face 05 is relative and parallel with second end face 06.
Refer to Fig. 3, composite electronic component 100 parallel to the first side surface 03 a profile, inside ceramic body 10
Filled with ceramic dielectric 11, multiple first electrode layers 101 and multiple the second electrode lays 102, first are interspersed with ceramic dielectric 11
Electrode layer 101 is alternately laminated with the second electrode lay 102, and projection of the first electrode layer 101 on the second electrode lay 102 and the
Two electrode layers 102 have lap, and ceramic dielectric 11 is filled between first electrode layer 101 and the second electrode lay 102.
Specifically, ceramic dielectric 11 can be the state and integrated each other so that adjacent ceramic medium 11 cannot be confirmed of sintering
Between border.First electrode layer 101 and the second electrode lay 102 are interspersed between ceramic dielectric 11, and first electrode layer 101
Ceramic dielectric 11 is filled between the second electrode lay 102, so as to form multiple electric capacity.
Specifically, the material of ceramic dielectric 11 mainly has barium titanate ceramics.Barium titanate ceramics have dielectric constant higher,
So that the capacitance swing of the composite electronic component 100 that can be prepared is wider.
Specifically, first electrode layer 101 and the second electrode lay 102 are relative and be arranged in parallel.Further, first electrode layer
101 and the second electrode lay 102 parallel to the first first type surface 01 and the second first type surface 02.It is arranged in parallel and is conducive to increasing first electrode
The relative area of layer 101 and the second electrode lay 102, improves capacitance.
First lateral electrode 201 and the second lateral electrode 202 are respectively attached on the first side surface 03 or the second side surface 04,
First lateral electrode 201 and the spacer insulator of the second lateral electrode 202, with the first lateral electrode 201 at each first electrode layer 101 at least one
Electrical connection, electrically connects at each the second electrode lay 102 at least one with the second lateral electrode 202.
Specifically, can be that the first lateral electrode 201 and the second lateral electrode 202 are attached on the first side surface 03, also may be used
Being that the first lateral electrode 201 and the second lateral electrode 202 are attached on the second side surface 04.It can also be the first lateral electrode 201
The first side surface 03 is attached to, the second lateral electrode 202 is attached on the second side surface 04.Or first lateral electrode 201 be attached to
Second side surface 04, the second lateral electrode 202 is attached on the firstth side surface 03 etc..
In present embodiment, the first lateral electrode 201 includes the first connection electrode 2011 and the second connection electrode 2012.First
Connection electrode 2011 is attached on the first side surface 03, and the second connection electrode 2012 is attached on the second side surface 04, the first electricity
Pole layer 101 is electrically connected with least one of the first connection electrode 2011 and the second connection electrode 2012.Second lateral electrode 202 is wrapped
The 3rd connection electrode 2013 and the 4th connection electrode 2014 are included, the 3rd connection electrode 2013 is attached on the first side surface 03, the
Four connection electrodes 2014 are attached on the second side surface 04, and the second electrode lay 102 is connected with the 3rd connection electrode 2013 and the 4th
At least one of electrode 2014 is electrically connected.First connection electrode 2011, the second connection electrode 2012, the 3rd connection electrode 2013
And the mutually insulated of the 4th connection electrode 2014.Lateral electrode is respectively provided with the first side surface 03 and the second side surface 04, just
In positioning lateral electrode, while first electrode layer 101 and the second electrode lay 102 can be selected freely at one or many places and lateral electrode
Electrical connection is formed, so as to adjust the resistance value for meeting electronic component 100.
In present embodiment, the first connection electrode 2011 is relative and parallel with the second connection electrode 2012, the 3rd connection electricity
Pole 2013 is relative and parallel with the 4th connection electrode 2014.The connection electrode 2013 of first connection electrode 2011 to the three is closer to
End face 05, the connection electrode 2014 of the second connection electrode 2012 to the four is closer to first end face 05.
Resistive layer 20 is attached on the part surface of ceramic body 10, and in first end face 05 and second end face 06 at least
Resistive layer 20, at least one of the lateral electrode 201 of resistive layer 20 and first and the second lateral electrode 202 electricity are attached with one surface
Connection.First termination electrode 221 is attached on first end face 05 or resistive layer 20, and the second termination electrode 222 is attached to second end face 06
Or on resistive layer 20, and at least one of the first termination electrode 221 and the second termination electrode 222 are attached on resistive layer 20.
Resistive layer 20 is attached on the part surface of ceramic body 10, and in first end face 05 and second end face 06 at least
Resistive layer 20, at least one of the lateral electrode 201 of resistive layer 20 and first and the second lateral electrode 202 electricity are attached with one surface
Connection.First termination electrode 221 is attached on first end face 05 or resistive layer 20, and the second termination electrode 222 is attached to second end face 06
Or on resistive layer 20, and at least one of the first termination electrode 221 and the second termination electrode 222 are attached on resistive layer 20.
At least one of first termination electrode 221 and the second termination electrode 222 are attached on resistive layer 20, resistive layer 20 and
At least one of one lateral electrode 201 and the second lateral electrode 202 are electrically connected, with first at each first electrode layer 101 at least one
Lateral electrode 201 is electrically connected, and is electrically connected with the second lateral electrode 202 at each the second electrode lay 102 at least one.When the first termination electrode
221 and second termination electrode 222 and after being connected with external power source, multiple first electrode layers 101 of ceramic body 10 and multiple second electricity
Pole layer 102 forms multiple complex capacitances being connected in parallel, as multilayer ceramic capacitor.Resistive layer 20 is in the first termination electrode 221
To the part between the first lateral electrode 201 and multilayer ceramic capacitor composition cascaded structure or in the second termination electrode 222 to the
Part between two lateral electrodes 202 constitutes cascaded structure with multilayer ceramic capacitor, equivalent in the first termination electrode 221 to the first
Resistance is connected between lateral electrode 201 or at least one between second the 222 to the second lateral electrode of termination electrode 202.Therefore it is multiple
Conjunction electronic component 100 realizes an electric capacity and resistance is integrated into discrete component, and size is smaller, can save empty for circuitry
Between.By the facing area, first electrode layer 101 and the second electrode lay that adjust first electrode layer 101 and the second electrode lay 102
102 spacing and the dielectric constant of ceramic body 10 can easily obtain different capacitances, and constitute composite electron unit
The multilayer ceramic capacitor of part 100 can provide capacitance higher.By the resistivity and first end that adjust resistive layer 20
The spacing of the lateral electrode 201 of electrode 221 and first can easily obtain different resistance values.
Further, resistive layer 20 is attached in first end face 05, and in the first first type surface abutted with first end face 05
01st, the second first type surface 02, the first side surface 03 and the second side surface are respectively extended a distance on 04 4 surfaces, extension away from
From D1 is expressed as in Fig. 1, resistive layer 20 is electrically connected with the first lateral electrode 201.Resistive layer 20 is completely covered first end face 05 just
In the first termination electrode 221 is set, the first termination electrode 221 can be covered on resistive layer 20.Resistive layer 20 is adjacent with first end face 05
Extended a distance on four surfaces, be easy to the forming part of the first lateral electrode 201 cover, so as to the shape of the first lateral electrode 201
Into electrical connection.
In present embodiment, the first termination electrode 221 is attached on resistive layer 20, the first termination electrode 221 with first end face
First first type surface 01 of 05 adjoining, the second first type surface 02, the first side surface 03 and the second side surface respectively prolong on 04 4 surfaces
A segment distance is stretched, the distance of extension is expressed as D2 in Fig. 1.First termination electrode 221 extended distance on the four surfaces at one is less than
The length of the extended distance on the four surfaces at one of resistive layer 20, the i.e. length of D2 less than D1.So it is easy to resistive layer 20 and first
Lateral electrode 201 is connected with each other and can be covered with forming part, and the first termination electrode 221 is not connected with the first lateral electrode 201.This
In implementation method, resistive layer 20 has part to cover with the first connection electrode 2011 and the second connection electrode 2012.
It is a profile of the composite electronic component 100 parallel to the first first type surface 01, Fig. 5 to refer to Fig. 4 and Fig. 5, Fig. 4
It is composite electronic component 100 parallel to another profile of the first first type surface 01.In present embodiment, first electrode layer 101
In have at one and electrically connected with the first lateral electrode 201, have in the second electrode lay 102 at one and electrically connected with the second lateral electrode 202.Specifically
, the equivalent circuit diagram of the composite electronic component 100 of present embodiment is as shown in fig. 6, equivalent to the first termination electrode (V1) and electricity
It is connected with electric capacity (C) again after resistance (R) series connection, electric capacity (C) is connected with the second termination electrode (V2), electric capacity (C) includes multiple parallel connections
Sub- electric capacity.I.e. first electrode layer 101 is electrically connected with the second connection electrode 2012, and the second connection electrode 2012 has with resistive layer 20
Lap, resistive layer 20 is electrically connected with the first termination electrode 221, so as to form the structure with electric capacity and resistant series.Realize
Electric capacity and resistance is integrated into discrete component, size is smaller.
In another embodiment, Fig. 7~Figure 10, the structure of composite electronic component 100 and answering shown in Fig. 1 are referred to
Close electronic component 100 similar, unlike, the first electrode layer 101 inside the ceramic body 10 of composite electronic component 100 has at two
Electrically connected with the first lateral electrode 201.The second electrode lay 102 has at two and is electrically connected with the second lateral electrode 202.
Specifically, first electrode layer 101 is electrically connected with the first connection electrode 2011 and the second connection electrode 2012 respectively, the
Two electrode layers 102 are electrically connected with the 3rd connection electrode 2013 and the 4th connection electrode 2014 respectively.The compound electric of the implementation method
The equivalent circuit diagram of subcomponent 100 is as shown in figure 11.It is connected with two resistance of parallel connection (R) equivalent to the first termination electrode (V1),
Then it is connected in series with electric capacity (C), electric capacity (C) is connected with the second termination electrode (V2), electric capacity (C) includes multiple son electricity in parallel
Hold.The composite electronic component 100 of this structure, by one layer of resistive layer 20, realizes the first termination electrode 221 and the first lateral electrode
Two resistance of parallel connection are connected between 201, can flexible adjusting resistance value so that the application of composite electronic component 100 is more
Extensively.
In yet another embodiment, Figure 12~Figure 15, the structure of composite electronic component 100 and answering shown in Fig. 1 are referred to
Close electronic component 100 similar, unlike, resistive layer 20 includes first resistor layer 21 and second resistance 22 two independent electricity of layer
Resistance layer, wherein first resistor layer 21 are attached in first end face 05, and first resistor layer 21 is abutted with first end face 05
First first type surface 01, the second first type surface 02, on 04 4 surfaces of the first side surface 03 and the second side surface it is each extend one section away from
From the distance of extension is expressed as D3 in fig. 12.First resistor layer 21 is electrically connected with the first lateral electrode 201.Second resistance layer 22
It is attached in second end face 06, and second resistance layer 22 is in the first first type surface 01, the second master meter abutted with second end face 06
Face 02, the first side surface 03 and the second side surface are respectively extended a distance on 04 4 surfaces, and the distance of extension is in fig. 12
It is expressed as D4.Second resistance layer 22 is electrically connected with the second lateral electrode 202.At one end on 06 two end faces in face 05 and second end face
Resistive layer 20 is formed, can more flexible adjusting resistance value.
Further, the first termination electrode 221 be attached to first resistor layer 21 on, the first termination electrode 221 with first end face
First first type surface 01 of 05 adjoining, the second first type surface 02, the first side surface 03 and the second side surface respectively prolong on 04 4 surfaces
A segment distance is stretched, the distance of extension is expressed as D5 in fig. 12.First termination electrode 221 extended distance on the four surfaces at one is less than
First resistor 21 extended distance on the four surfaces at one of layer.That is D5 is less than D3.Second termination electrode 222 is attached to second resistance layer 22
On, the second termination electrode 222 the first first type surface 01, the second first type surface 02, the first side surface 03 abutted with second end face 06 with
And the distance of extension is respectively extended a distance on 04 4 surfaces of the second side surface be expressed as D6 in fig. 12.Second termination electrode
222 extended distance on the four surfaces at one is less than D4 less than second resistance layer 22 extended distance on the four surfaces at one, i.e. D6.
Specifically, the first electrode layer 101 inside the ceramic body 10 of composite electronic component 100 has at two and the first lateral electrode
201 electrical connections.The second electrode lay 102 has at two and is electrically connected with the second lateral electrode 202.Further, one end of first electrode layer 101
Electrically connected with the first connection electrode 2011, the other end of first electrode layer 101 is electrically connected with the second connection electrode 2012, the second electricity
Pole 102 one end of layer electrically connect with the 3rd connection electrode 2013, the other end and the electricity of the 4th connection electrode 2014 of the second electrode lay 102
Connection.The equivalent circuit diagram of the composite electronic component 100 of the implementation method is as shown in figure 16.Equivalent to the first termination electrode (V1) with
Two resistance of parallel connection (R) connections, are then connected in series with electric capacity (C), and electric capacity (C) is connected with two resistance of parallel connection (R), then
It is connected with the second termination electrode (V2), electric capacity (C) includes multiple sub- electric capacity in parallel.The composite electronic component 100 of this structure, leads to
First resistor layer 21 and second resistance layer 22 are crossed, realizes connecting in parallel two between the first termination electrode 221 and the first lateral electrode 201
Individual resistance, connects two resistance in parallel between the second termination electrode 222 and the second lateral electrode 202, can more flexibly adjust
Resistance value so that composite electronic component 100 is more widely applied.
Above-mentioned composite electronic component 100, by least in the first end face 05 and second end face 06 of ceramic body 10
Adhere to resistive layer 20 on individual surface, resistive layer 20 is electrically connected with least one of the first lateral electrode 201 and the second lateral electrode 202
Connect.Electrically connected with the first lateral electrode 201 at each first electrode layer 101 at least one in ceramic body 10, each the second electrode lay
Electrically connected with the second lateral electrode 202 at 102 at least one, so as to form the structure with electric capacity and resistant series.Realize handle
Electric capacity and resistance are integrated into discrete component, and size is smaller, by the resistivity and the first termination electrode 221 that adjust resistive layer 20
Difference can be easily obtained with the spacing of the first lateral electrode 201 or the spacing of the second termination electrode 222 and the second lateral electrode 202
Resistance value, by adjusting the relative area of first electrode layer 101 and the second electrode lay 102, the electricity of first electrode layer 101 and second
Pole 102 spacing of layer and the dielectric constant of ceramic dielectric 11 can easily obtain different capacitances, can be whole electromechanics
Save space in road.
Additionally, the utility model also provides the preparation method of above-mentioned composite electronic component 100.
The flow chart of the preparation method of the composite electronic component of one implementation method as shown in figure 17, comprises the following steps S110
~S140.
S110, offer ceramic body.
Wherein, the ceramic body is cuboid, and ceramic body has the first first type surface relative to each other and the second first type surface, each other
The first relative side surface and the second side surface and first end face and second end face relative to each other.Ceramic body is filled with
Ceramic dielectric, is interspersed with multiple first electrode layers and multiple the second electrode lays, first electrode layer and second electrode in ceramic dielectric
Layer is alternately laminated, and first electrode layer projection on the second electrode layer has lap with the second electrode lay.First electricity
Pole layer and the second electrode lay between be filled with ceramic dielectric, exposed at each first electrode layer at least one first side surface or
The side surface of person second, exposes to the first side surface or the second side surface at each the second electrode lay at least.
The first side surface or the second side surface are exposed at first electrode layer at least, each the second electrode lay is at least
Have at one and expose to the first side surface or the second side surface, be easy to first electrode layer to form electricity with the second electrode lay and lateral electrode
Connection.
S120, on first side surface or the second side surface of ceramic body cover electrode slurry formed the first lateral electrode and
Second lateral electrode, wherein, the first lateral electrode is spaced with the second lateral electrode, and with the at each first electrode layer at least
One lateral electrode is electrically connected, and is electrically connected with the second lateral electrode at each the second electrode lay at least.
Specifically, electrode slurry can be covered in into the first side surface or second by modes such as dipping, coating or printings
On side surface, so as to form the first lateral electrode and the second lateral electrode.
The electrode slurry for forming the first lateral electrode and the second lateral electrode can be metal paste, be specifically as follows silver metal slurry
Material etc..
As needed, the first lateral electrode and the second lateral electrode can be distributed in the first side surface and the second side surface two sides
Upper, or the first lateral electrode and the second lateral electrode are all distributed in the first side surface or the first lateral electrode and the second lateral electrode
All it is distributed in second side surface etc..
Specifically, the first lateral electrode includes the first connection electrode being attached on the first side surface and is attached to the second side table
The second connection electrode on face.Second lateral electrode includes the 3rd connection electrode being attached on the first side surface and is attached to second
The 4th connection electrode on side surface.First connection electrode, the second connection electrode, the 3rd connection electrode and the 4th connection electrode
It is spaced.
S130, cover resistance slurry at least one of first end face and the second end face surface of ceramic body and form electricity
Resistance layer, resistive layer and at least one of the first lateral electrode and the second lateral electrode have lap.
Specifically, resistance slurry can be ruthenium system resistance slurry.Resistance slurry is covered in first end face and second end face
At least one surface on.
In electrode slurry being covered in into first end face and second end face by modes such as dipping, coating or printings at least
On one surface.
In present embodiment, it is immersed in resistance slurry by by the first end face and/or second end face of ceramic body, so that
Resistive layer is formed, the mode of dipping can cause resistance slurry simultaneously in four tables abutted with first end face or second end face
Face is respectively formed on extension, improve production efficiency.The formation of silver metal slurry is covered in first side and/or second side can side
After electrode, the depth of the dipping by adjusting resistance slurry can adjust silver metal slurry and resistance slurry in surface of ceramic body
On coverage, you can to control the area coverage of resistive layer and the first lateral electrode and/or the second lateral electrode, so as to realize electricity
Connection.
Specifically, composite electronic component as shown in Figure 1 and composite electronic component as shown in Figure 7 are by by first end
Face is immersed in resistance slurry so as to obtain resistive layer.Composite electronic component as shown in figure 12 is by by first end face and second
End face is immersed in resistance slurry so as to obtain two independent resistive layers respectively.
S140, covering electrode slurry the first termination electrode of formation in the first end face or resistive layer of ceramic body, in ceramic body
Second end face or resistive layer on cover electrode slurry formed the second termination electrode, and the first termination electrode and the second termination electrode in
At least one is attached on resistive layer, obtains composite electronic component.
Electrode slurry can be covered in by first end face, second end face or resistive layer by modes such as dipping, coating or printings.
Specifically, electrode slurry can be directly overlayed formed in first end face or second end face the first termination electrode and
Second termination electrode.When resistive layer has been attached with first end face, electrode slurry is covered on resistive layer so as to form first end
Electrode.When resistive layer has been attached with second end face, electrode slurry is covered on resistive layer so as to form the second termination electrode.
The electrode slurry for forming the first termination electrode and the second termination electrode can be metal paste, be specifically as follows silver metal slurry
Material etc..
In present embodiment, it is immersed in resistance slurry by by the first end face and/or second end face of ceramic body, so that
Resistive layer is formed, the mode of dipping can cause resistance slurry simultaneously in four tables abutted with first end face or second end face
Face is respectively formed on extension, improve production efficiency.Silver metal slurry is covered in first side and/or second side and forms side electricity
After extremely, the depth of the dipping by adjusting resistance slurry can adjust silver metal slurry and resistance slurry on surface of ceramic body
Coverage, you can to control the area coverage of resistive layer and the first lateral electrode and/or the second lateral electrode, so as to realize being electrically connected
Connect.
Specifically, composite electronic component as shown in Figure 1 and composite electronic component as shown in Figure 7 are by by first end face
It is immersed in resistance slurry so as to obtain resistive layer, the first end face that resistive layer then will be formed with again is immersed in electrode slurry
So as to form the first termination electrode, second end face is immersed in electrode slurry so as to form the second termination electrode.As shown in figure 12
Composite electronic component is immersed in resistance slurry so as to obtain two independent electricity respectively by by first end face and second end face
Resistance layer, the first end face and second end face that resistive layer then will be formed with respectively is immersed in electrode slurry so as to form respectively
One termination electrode and the second termination electrode.
Further, after covering resistance slurry and electrode slurry on ceramic body, by resistance slurry and electrode slurry
Sintering, the operation of sintering be specially under air atmosphere and 840 DEG C~850 DEG C at sinter silver metal slurry and resistance slurry.
Specifically, the flow chart of the preparation method of the ceramic body of an implementation method is as shown in figure 18, comprise the following steps
S210~S240.
S210, will ceramic powder, adhesive and organic solvent mix after obtain ceramic size, be raw material stream with ceramic size
Prolong to form multiple ceramic dielectric films.
Specifically, the consumption of adhesive is the consumption for making ceramic powder have enough plasticity, the consumption of organic solvent is foot
Ceramic powder is enough set to moisten the consumption for mixing.
In present embodiment, it is by the operation that ceramic powder, adhesive and organic solvent are well mixed：Will using ball-milling method
Ceramic powder, adhesive and organic solvent are well mixed.
Specifically, Ball-milling Time is 12h~16h.
Specifically, ceramic size has including 10 parts of ceramic powders, 3 parts~5 parts adhesives and 4 parts~6 parts according to the mass fraction
Machine solvent.
Ceramic powder can be barium titanate ceramics, and barium titanate ceramics have dielectric constant higher so that what can be prepared is compound
The capacitance swing of electronic component is wider.
Further, adhesive is polyvinyl butyral resin, and organic solvent is that quality parts ratio is 1:1~1.5:1 first
The mixed solvent of benzene and ethanol.
In the operation for preparing ceramic dielectric films as raw material with ceramic size, the tape casting can be used by ceramic size shape
Into ceramic dielectric films.
S220, print electrode slurry in the ceramic dielectric films of predetermined number, respectively obtains and is printed with first electrode layer
Ceramic dielectric films and the ceramic dielectric films for being printed with the second electrode lay.
After obtaining ceramic dielectric films, a part is selected to carry out the slurry that prints electrode as needed, so as to respectively obtain printing
The ceramic dielectric films for having first electrode layer and the ceramic dielectric films for being printed with the second electrode lay.
Specifically, the electrode slurry for forming first electrode layer and the second electrode lay can be starched for silver metal slurry, palladium metal
The silver palladium alloy metal paste of material or any silver palladium ratio.
Specifically, can be printed electrode in ceramic dielectric films slurry by silk-screen printing technique.
Further, the silk-screen patterns of the first electrode layer of composite electronic component as shown in Figure 1 and the second electrode lay are such as
Shown in Figure 19, dash area is represented at the slurry that prints electrode.Specifically can in length and breadth be cut along a plurality of line of cut in Figure 19, from
And obtain the first electrode layer and the second electrode lay of preset shape.First electricity of composite electronic component as shown in figures 7 and 12
As shown in figure 20, dash area is represented at the slurry that prints electrode the silk-screen patterns of pole layer and the second electrode lay.Specifically can be along Figure 20
In a plurality of line of cut cut in length and breadth, so as to obtain the first electrode layer and the second electrode lay of preset shape.
Print electrode after slurry, electrode pattern is formed on ceramic membrane, can obtain being printed with first electrode layer after drying
Ceramic dielectric films and be printed with the ceramic dielectric films of the second electrode lay.
S230, the ceramic dielectric films that first electrode layer will be printed with and be printed with the second electrode lay ceramic dielectric films replace
Stacking obtains layered product.
Wherein, first electrode layer is alternately laminated with the second electrode lay in layered product, and first electrode layer is in second electrode
Projection on layer has lap with the second electrode lay, and ceramic dielectric is filled between first electrode layer and the second electrode lay
Film.
Specifically, the ceramic dielectric films of first electrode layer will be printed with and the ceramic dielectric films friendship of the second electrode lay is printed with
For stacking, so as to form multilayer laminated capacitance structure.As needed, the ceramic dielectric of first electrode layer can also be printed with
At least one ceramic dielectric films are laminated between film and the ceramic dielectric films for being printed with the second electrode lay, to adjust capacitance.
Further, can also respectively be laminated multiple ceramic dielectric films to form difference on two relative surfaces of layered product
Two relative protective layers of side of covering layered product.
S240, layered product is pressed, ceramic body is obtained after sintering.
General, layered product isostatic pressing method can be pressed, closely bond each film layer in layered product；Then pre- scale is pressed
It is very little to cut layered product in length and breadth, obtain the layered product of multiple cuboids.
Specifically, also including the viscous operation of row after layered product pressing, the viscous detailed process of row is：Under air atmosphere, will
Layered product is heated to 350 DEG C~450 DEG C and is incubated 1 hour~3 hours to exclude adhesive.
The detailed process of sintering is：Under air atmosphere, the layered product that will be arranged after gluing is heated to 900 DEG C~1320 DEG C and protects
Temperature is sintered for 2 hours~3 hours, and ceramic body is obtained after the completion of sintering.
Ceramic body capacitance prepared by this method is high, and strong adaptability, energy storage effect is good.It will be appreciated, of course, that at other
In implementation method, it would however also be possible to employ different method prepares ceramic body, as long as ensureing that the structure and performance of ceramic body are conformed to
Ask.
Operation is simple for the preparation method of above-mentioned composite electronic component, can be used for large-scale industrial production.It is prepared into
The composite electronic component size for arriving is smaller, and can easily obtain different resistance values and capacitance, can be circuitry
Save space.
It is below specific embodiment part.
Embodiment 1
Prepare composite electronic component
1) ceramic body is prepared：Ceramic size is obtained after ceramic powder, adhesive and organic solvent are mixed, with ceramic size
Multiple ceramic dielectric films are formed for raw material is cast.Wherein, glued including 10 parts of ceramic powders, 4 parts according to the mass fraction in ceramic size
Mixture and 5 parts of organic solvents.Ceramic powder is barium titanate ceramics, and adhesive is polyvinyl butyral resin, and organic solvent is mass parts
Number is than being 1:1 toluene and the mixed solvent of ethanol.Print electrode slurry in multiple ceramic dielectric films, respectively obtains and is printed with
The ceramic dielectric films of first electrode layer and the ceramic dielectric films for being printed with the second electrode lay.First electrode layer and the second electrode lay
As shown in figure 19, dash area is represented at the slurry that prints electrode silk-screen patterns.The ceramic dielectric films of first electrode layer will be printed with
It is alternately laminated with the ceramic dielectric films for being printed with the second electrode lay to obtain layered product.Layered product is pressed, ceramics are obtained after sintering
Body.
2) lateral electrode is formed on ceramic body：Electrode is respectively coated with first side surface and the second side surface of ceramic body
Slurry, forms the first connection electrode, the second connection electrode, the 3rd connection electrode and the 4th connection electrode.Wherein, first electrode layer
In have at one and electrically connected with the first lateral electrode, have in the second electrode lay at one and electrically connected with the second lateral electrode.
3) resistive layer is formed on ceramic body：First end face is immersed in resistance slurry so as to obtain resistive layer, resistance
Layer segment covers the first connection electrode and the second connection electrode.
4) termination electrode is formed on ceramic body：The first end face of resistive layer will be formed with to be immersed in electrode slurry so as to shape
Into the first termination electrode, the first termination electrode is covered on resistive layer.Second end face is immersed in electrode slurry so as to form second
Termination electrode.
The composite electronic component concrete structure of the embodiment as shown in Fig. 1, Fig. 3, Fig. 4 and Fig. 5, equivalent circuit such as Fig. 6 institutes
Show.
Embodiment 2
The method of the preparation of the present embodiment composite electronic component is similar to Example 1, unlike, in preparing ceramic body,
Print electrode slurry in multiple ceramic dielectric films, respectively obtains the ceramic dielectric films that are printed with first electrode layer and is printed with the
In the operation of the ceramic dielectric films of two electrode layers, silk-screen patterns such as Figure 20 institutes of silk-screen printing first electrode layer and the second electrode lay
Show, dash area is represented at the slurry that prints electrode.When forming lateral electrode on ceramic body, first electrode layer is connected with first respectively
Electrode and the second connection electrode are electrically connected, and the second electrode lay is electrically connected with the 3rd connection electrode and the 4th connection electrode respectively.
The composite electronic component concrete structure of the embodiment is as shown in Fig. 7~Figure 10, and equivalent circuit is as shown in figure 11.
Embodiment 3
The method of the preparation of the present embodiment composite electronic component is similar to Example 1, unlike, in preparing ceramic body,
Print electrode slurry in multiple ceramic dielectric films, respectively obtains the ceramic dielectric films that are printed with first electrode layer and is printed with the
In the operation of the ceramic dielectric films of two electrode layers, silk-screen patterns such as Figure 20 institutes of silk-screen printing first electrode layer and the second electrode lay
Show, dash area is represented at the slurry that prints electrode.When forming lateral electrode on ceramic body, first electrode layer is connected with first respectively
Electrode and the second connection electrode are electrically connected, and the second electrode lay is electrically connected with the 3rd connection electrode and the 4th connection electrode respectively.
When forming resistive layer on ceramic body, first end face and second end face are immersed in resistance slurry so as to obtain two independences respectively
Resistive layer, the first end face of resistive layer and second end face then will be formed with respectively and be immersed in respectively in electrode slurry so as to shape
Into the first termination electrode and the second termination electrode.One resistive layer portion covers the first connection electrode and the second connection electrode.Another
Resistive layer portion covers the 3rd connection electrode and the 4th connection electrode.
The composite electronic component concrete structure of the embodiment is as shown in Figure 12~Figure 15, and equivalent circuit is as shown in figure 16.
The capacitance and resistance value of the composite electronic component of 1~embodiment of test above-described embodiment 3, tester use peace
Prompt human relations E4980A precisions LCR tables, test frequency is 1.0KHz, and test voltage is 1.0Vrms.Test result is as shown in table 1.
Table 1：Test result
| Rated capacitance | Actual measurement capacitance | Normal resistance | Actual measurement resistance value | |
| Embodiment 1 | 4.3μF | 4.67μF | 22Ω | 21.1Ω |
| Embodiment 2 | 4.3μF | 4.13μF | 10Ω | 10.8Ω |
| Embodiment 3 | 4.3μF | 4.26μF | 4.7Ω | 4.46Ω |
As shown in Table 1, the composite electronic component capacitance of 1~embodiment of embodiment 3 is high, can be obtained by the change of structure
The composite electronic component of different resistance values.
Embodiment described above only expresses several embodiments of the present utility model, and its description is more specific and detailed,
But therefore can not be interpreted as the limitation to the utility model the scope of the claims.It should be pointed out that common for this area
For technical staff, without departing from the concept of the premise utility, various modifications and improvements can be made, these all belong to
In protection domain of the present utility model.Therefore, the protection domain of the utility model patent should be determined by the appended claims.
Claims (10)
1. a kind of composite electronic component, it is characterised in that including ceramic body, the first lateral electrode, the second lateral electrode, first end electricity
Pole, the second termination electrode and resistive layer；
The ceramic body has the first first type surface and the second first type surface, the first side surface and second relative to each other relative to each other
Side surface and first end face and second end face relative to each other, the ceramic body are filled with ceramic dielectric, the ceramics
Multiple first electrode layers and multiple the second electrode lays are interspersed with medium, the first electrode layer replaces with the second electrode lay
Stacking, and projection of the first electrode layer on the second electrode lay has lap with the second electrode lay,
The ceramic dielectric is filled between the first electrode layer and the second electrode lay；
First lateral electrode and second lateral electrode are respectively attached to first side surface or second side surface
On, first lateral electrode insulate with second lateral electrode, with first side at each described first electrode layer at least one
Electrode is electrically connected, and is electrically connected with second lateral electrode at each described the second electrode lay at least one；
The resistive layer is attached at least one of the first end face and the second end face surface, the resistive layer with
At least one of first lateral electrode and second lateral electrode are electrically connected；
First termination electrode is attached on the first end face or the resistive layer, and second termination electrode is attached to described
On biend or the resistive layer, and at least one of first termination electrode and second termination electrode be attached to it is described
On resistive layer.
2. composite electronic component according to claim 1, it is characterised in that the resistive layer is attached to the first end face
On, and the resistive layer is in first first type surface, second first type surface, described first abutted with the first end face
Side surface and second side surface are respectively extended a distance on four surfaces.
3. composite electronic component according to claim 2, it is characterised in that first termination electrode is attached to the resistance
On layer, the resistive layer is electrically connected with first lateral electrode, and first termination electrode is in the institute abutted with the first end face
The first first type surface, second first type surface, first side surface and second side surface is stated respectively to extend on four surfaces
One segment distance.
4. composite electronic component according to claim 3, it is characterised in that first termination electrode is on the four surfaces at one
Extended distance is less than resistive layer extended distance on the four surfaces at one.
5. composite electronic component according to claim 1, it is characterised in that the resistive layer includes first resistor layer and the
The two independent resistive layers of resistive layer two, wherein first resistor layer is attached in the first end face, and described first
Resistive layer in first first type surface, second first type surface, first side surface abutted with the first end face and
Second side surface is respectively extended a distance on four surfaces, and the first resistor layer is electrically connected with first lateral electrode；
The second resistance layer is attached in the second end face, and second resistance layer is in the institute abutted with the second end face
The first first type surface, second first type surface, first side surface and second side surface is stated respectively to extend on four surfaces
One segment distance, the second resistance layer is electrically connected with second lateral electrode.
6. composite electronic component according to claim 5, it is characterised in that first termination electrode is attached to described first
On resistive layer, first termination electrode is in first first type surface, second first type surface, the institute abutted with the first end face
State and respectively extended a distance on four surfaces of the first side surface and second side surface；Second termination electrode is attached to institute
State on second resistance layer, second termination electrode is in first first type surface abutted with the second end face, second master
Surface, first side surface and second side surface are respectively extended a distance on four surfaces.
7. composite electronic component according to claim 6, it is characterised in that first termination electrode is on the four surfaces at one
Less than first resistor layer extended distance on the four surfaces at one, second termination electrode is on the four surfaces at one for extended distance
Extended distance of the extended distance less than second resistance layer on the four surfaces at one.
8. composite electronic component according to claim 1, it is characterised in that first lateral electrode includes the first connection electricity
Pole and the second connection electrode, first connection electrode are attached on first side surface, the second connection electrode attachment
On second side surface, in the first electrode layer and first connection electrode and second connection electrode at least
One electrical connection；Second lateral electrode includes the 3rd connection electrode and the 4th connection electrode, the 3rd connection electrode attachment
On first side surface, the 4th connection electrode is attached on second side surface, the second electrode lay and institute
State the electrical connection of at least one of the 3rd connection electrode and the 4th connection electrode；First connection electrode, described second
Connection electrode, the 3rd connection electrode and the 4th connection electrode are spaced.
9. composite electronic component according to claim 8, it is characterised in that described first electrode layer one end and described first
Connection electrode is electrically connected, and the other end of the first electrode layer is electrically connected with second connection electrode, the second electrode lay
One end is electrically connected with the 3rd connection electrode, and the other end of the second electrode lay is electrically connected with the 4th connection electrode.
10. composite electronic component according to claim 1, it is characterised in that the first electrode layer and second electricity
Pole layer is relative and be arranged in parallel.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621105333.1U CN206210613U (en) | 2016-09-30 | 2016-09-30 | Composite electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621105333.1U CN206210613U (en) | 2016-09-30 | 2016-09-30 | Composite electronic component |
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| Publication Number | Publication Date |
|---|---|
| CN206210613U true CN206210613U (en) | 2017-05-31 |
Family
ID=58762187
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| Country | Link |
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2016
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