CN104250096B - Ferrite Material, laminated chip inductor and preparation method thereof - Google Patents
Ferrite Material, laminated chip inductor and preparation method thereof Download PDFInfo
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- CN104250096B CN104250096B CN201310263328.8A CN201310263328A CN104250096B CN 104250096 B CN104250096 B CN 104250096B CN 201310263328 A CN201310263328 A CN 201310263328A CN 104250096 B CN104250096 B CN 104250096B
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Abstract
The invention provides a kind of Ferrite Material and laminated chip inductor and preparation method thereof, described Ferrite Material comprises the component of following weight percent: ferrite powder 32 ~ 52 parts, 4 ~ 9 parts, tackiness agent, solvent 40 ~ 60 parts, 1.5 ~ 5 parts, softening agent, dispersion agent 0.5 ~ 2.5 part, emulsifying agent 0.5 ~ 3 part, defoamer 0.05 ~ 0.25 part, tackiness agent is the composite binding agent of polyvinyl alcohol or polyvinyl alcohol and water soluble acrylic acid.Ferrite Material provided by the invention adopts water-based solvent system, and by the synergy between each component, described Ferrite Material is made to have excellent rheological property and shrinkage, and the pinprick can eliminated on bubble and strip, thus and obtain the ferrite diaphragm of excellent performance and the laminated chip inductor of slimming, reduce in inducer traditional mode of production due to an organic solvent the VOC discharge caused and production cost is high, energy consumption is large shortcoming.
Description
Technical field
The present invention relates to field of electronic devices, particularly relate to a kind of Ferrite Material, laminated chip inductor and preparation method thereof.
Background technology
Along with electronic product is to miniaturization, slimming, high frequency future development, electronic devices and components are had higher requirement.Chip components and parts meet the development trend of miniaturization of electronic products, high frequency, can meet the needs of pasted on surface of circuit board (SMD) scale operation, impel components and parts chip rate progressively to improve.
Flow casting molding technology is generally adopted to prepare all kinds of chip electronic component both at home and abroad, flow casting molding technology is that the compositions such as powder and solvent, dispersion agent, binding agent, softening agent are mixed obtained being uniformly dispersed and stable slurry, then on casting machine, certain thickness biscuit film or strip is made, again through printing interior electrode, laminating, sinter, burning the operations such as end electrode, obtain chip electronic component.At present, solvent in flow casting molding technology mainly adopts organic solvent (such as polyvinyl butyral acetal), organic solvent is good to the wettability of powder, make slurry evenly, good stability, but organic solvent is volatile, there is sharp aroma, large to the physical and mental health injury of people, also can pollute living environment.Along with countries in the world government constantly strengthens the attention degree of environment protection; environmental regulation is constantly strict and sound; environmental protection concept that is green, low-carbon (LC) is praised highly; higher technical requirements is proposed to production; an urgent demand adjusts the enterprise and technique that do not meet environmental requirement; production faces the challenge that technology is changed again in the New Times; for the manufacture of chip electronic component, the organic solvent in flow casting molding technology is replaced with the inexorable trend that water-based solvent is era development.
Current countries in the world researcher has done some researchs at water-based solvent system aspects, but mainly concentrates on and utilize water-based slurry to prepare SiC, ZnO, Al
2o
3, BaTiO
3, on the material such as ceramic substrate and thermistor such as PZT, PLZT, PTC; In addition, band prepared by the aqueous tape casting forming technology reported at present is thicker, usually more than 100 μm, the need of production of slimming device can not be met, in reality, band is thinner, more easily occurs pinprick, and strip quality prepared by aqueous tape casting forming technology is difficult to guarantee.
At present, utilize aqueous tape casting forming technology industrialization to prepare chip inductor and have no report at home and abroad, the performance analysis such as impedance, sensibility reciprocal, resistance etc. of corresponding device are also less.
Summary of the invention
The object of the present invention is to provide a kind of Ferrite Material utilizing water-based solvent flow casting molding, during to overcome in prior art and to utilize organic solvent to make Ferrite Material, poison human body and the shortcoming of contaminate environment.
Another object of the present invention is to provide a kind of laminated chip inductor, overcome the shortcoming that in prior art, laminated chip inductor thickness is large.
Another object of the present invention is the manufacture method providing a kind of laminated chip inductor, overcomes in prior art and manufactures laminated chip inductor due to an organic solvent and the cost caused is high, energy consumption is large, the shortcoming of contaminate environment.
In order to realize foregoing invention object, technical scheme of the present invention is as follows:
A kind of Ferrite Material, is characterized in that, comprises the component of the following meter of number by weight percentage:
Wherein, described tackiness agent is the composite binding agent of polyvinyl alcohol or polyvinyl alcohol and water soluble acrylic acid.
And, a kind of laminated chip inductor, comprise upper cover, lower cover, be located at and laminate by several ferrite diaphragms the lamination layer formed from top to bottom between described upper cover and lower cover, at the upper surface of above-mentioned ferrite diaphragm, interior electrode is set, above-mentioned ferrite diaphragm arranges through hole, be loaded with conductor in through hole, the interior electrode on adjacent ferrite diaphragm is connected by this conductor, outside above-mentioned upper cover, lower cover, lamination layer, also arrange a protective layer; Above-mentioned ferrite diaphragm is that above-mentioned Ferrite Material carries out flow casting molding, cuts and be prepared from after drying.
And a kind of preparation method of laminated chip inductor, is the preparation method of above-mentioned laminated chip inductor, comprises following operation steps:
Take ferrite powder, tackiness agent, solvent, softening agent, dispersion agent, emulsifying agent, defoamer by the formula of above-mentioned Ferrite Material, mixing, ball milling, obtains the slurry that viscosity is 50 ~ 1500Pas;
By described slurry vacuum defoamation, sieve, flow casting molding, dry, obtain described ferrite diaphragm;
With imperforated described ferrite diaphragm for lower cover, the lower lead-in wire of printing;
Above-mentioned ferrite diaphragm arranges described through hole, in hole, injects electrocondution slurry, electrode in any surface preparation of above-mentioned ferrite diaphragm, makes interior electrode be connected with electrocondution slurry, obtains the ferrite diaphragm with interior electrode;
The face that described lower cover has printed time lead-in wire laminates the ferrite diaphragm of electrode in several above-mentioned bands successively, the ferrite membrane sheet of electrode in band is faced up, connected by electrocondution slurry between interior electrode, the electrocondution slurry attaching the ferrite diaphragm laminated with lower cover is connected with lower lead-in wire;
Again with imperforated described ferrite diaphragm for upper cover, in printing go between; The upper capping and the interior electrode that make to have printed upper lead-in wire laminate, and make lead-in wire and interior Electrode connection, obtain single chip inductor;
Also arrange a protective layer, upper end electrode at the outside surface of described single chip inductor, plating, sorting, obtains described laminated chip inductor.
Ferrite Material provided by the invention, the water-based solvent system that to adopt with polyvinyl alcohol or composite polyvinyl alcohol and water soluble acrylic acid be main binder, solves traditional employing organic solvent system flow casting molding and prepares chip electronic component and there is contaminate environment, problem that cost is high; And by the compound synergy between ferrite powder, binding agent, solvent, softening agent, dispersion agent, described Ferrite Material is made to have excellent rheological property and shrinkage, and the pinprick eliminated by adjusting viscosity and increase defoamer on bubble and strip, thus and obtain the ferrite diaphragm of excellent performance and the laminated chip inductor of slimming, reduce in the traditional production process of laminated chip inductor due to the with an organic solvent VOC(volatile organic compounds caused) discharge and production cost is high, energy consumption is large shortcoming.
Accompanying drawing explanation
Fig. 1 is the structural representation of laminated chip inductor of the present invention.
Fig. 2 is the location diagram of upper cover, lower cover and lamination layer in laminated chip inductor.
Fig. 3 is the location diagram of lower cover in laminated chip inductor, ferrite diaphragm and interior electrode.
Fig. 4 is the schematic diagram of ferrite diaphragm in laminated chip inductor.
Fig. 5 is the schematic diagram of the ferrite diaphragm arranging through hole in laminated chip inductor.
Fig. 6 is the schematic diagram of the lower cover of the lower lead-in wire of printing.
Fig. 7 is the schematic diagram of the ferrite diaphragm of electrode in printing.
In above-mentioned figure: electrode, 5-protective layer, 6-through hole in 1-upper cover, 2-lower cover, 3-ferrite diaphragm, 4-.
Embodiment
The following stated is the preferred embodiment of the present invention; it should be pointed out that for those skilled in the art, under the premise without departing from the principles of the invention; can also make some improvements and modifications, these improvements and modifications are also considered as protection scope of the present invention.
The invention provides a kind of Ferrite Material, and a kind of laminated chip inductor, comprise above-mentioned ferrite diaphragm (i.e. insulation layer), be with above-mentioned Ferrite Material for raw material carry out flow casting molding, drying after cut and prepare, and the preparation method of above-mentioned laminated chip inductor.
A kind of Ferrite Material, is characterized in that, comprises the component of the following meter of number by weight percentage:
Wherein, above-mentioned tackiness agent is the composite binding agent of polyvinyl alcohol or polyvinyl alcohol and water soluble acrylic acid.
Preferably, above-mentioned Ferrite Material comprises the component of the following meter of number by weight percentage:
Wherein, above-mentioned tackiness agent is the composite binding agent of polyvinyl alcohol or polyvinyl alcohol and water soluble acrylic acid.
Particularly, above-mentioned ferrite powder is self-produced powder, and this powder is mixed in proportion by oxide materials such as ferric oxide, nickel oxide, cupric oxide, zinc oxide, forms through manufacture technics such as ball milling, pre-burning, secondary ball millings.Ferrite powder through described manufacture technics is all applicable to the present invention, is mixed with slurry and manufactures a product through casting technique with water-based solvent system of the present invention, all can improve the performance of slurry and final inducer.
Preferably, above-mentioned tackiness agent is polyvinyl alcohol, and the molecular weight of this polyvinyl alcohol (PVA) is 180,000 ~ 200,000, and second-order transition temperature is 75 ~ 85 DEG C.More preferably, the GH-20S that produces for Japanese synthetic chemistry Co., Ltd. of this polyvinyl alcohol (PVA).Preferably, above-mentioned tackiness agent can also be the composite binding agent of above-mentioned polyvinyl alcohol and water soluble acrylic acid, and its composite weight ratio is (3.0 ~ 4.0): (1.2 ~ 1.5).When the slurry viscosity prepared with above-mentioned Ferrite Material is too high, the bubble strong adhesion in slurry, is difficult to eliminate by vacuum stirring; Although low slurry viscosity is conducive to eliminating pinprick bubble, viscosity is too low can affect curtain coating effect, causes that raw material band is rough, unfairness; Above-mentioned preferred viscosities and or the tackiness agent of weight ratio make slurry have excellent rheological property and be of value to the pinprick eliminated on bubble and strip
Particularly, above-mentioned solvent is the mixture of deionized water, alcohol ether and propyl carbinol, and the weight ratio of this deionized water, alcohol ether and propyl carbinol is (14 ~ 18): (1 ~ 4): (1 ~ 4).Wherein, the consumption of alcohol ether and propyl carbinol is lower, as solubility promoter; Described alcohol ether is more than one in butyl glycol ether or ethylene glycol ethyl ether, and preferred alcohol ether is butyl glycol ether, for increasing the solubleness at normal temperatures of adhesive polyethylene alcohol (PVA), improves polyvinyl alcohol solubleness in the slurry.
Particularly, above-mentioned softening agent is the mixture of α-amino isopropyl alcohol and 1,3-PD.More preferably, the weight ratio of this α-amino isopropyl alcohol and ammediol is (1.5 ~ 2.5): (0.8 ~ 1.2), is preferably (1.8 ~ 2.5): (0.9 ~ 1.2).
Particularly, above-mentioned dispersion agent is hexylene glycol, acrylamide or both mixtures; When this dispersion agent is the mixture of hexylene glycol and acrylamide, both weight ratios are preferably (3 ~ 4): (2 ~ 3).
Particularly, emulsifying agent and defoamer is also comprised in above-mentioned Ferrite Material.In water-based solvent system, because the surface tension of water is very large, the bubble produced after ball milling is very stable in the slurry, does not eliminate by settled process, thus needing the surface energy and the surface tension that reduce water by adding defoamer, reaching the object eliminating bubble.Preferably, mentioned emulsifier is acrylic resin emulsion.Preferably, above-mentioned defoamer is the mixture of carboxy cellulose sodium and tripoly phosphate sodium STPP, and the weight ratio of described carboxy cellulose sodium and tripoly phosphate sodium STPP is 2:(3 ~ 5).
Ferrite Material provided by the invention, the water-based solvent system that to adopt with polyvinyl alcohol or composite polyvinyl alcohol and water soluble acrylic acid be main binder, solve traditional employing organic solvent system flow casting molding to prepare chip electronic component and there is contaminate environment, the problem that cost is high, there is green, environmental protection, the outstanding advantages such as low-carbon (LC), prepare in electronic devices and components at water-based slurry and there is no sharp aroma, be conducive to the healthy of environmental protection and production line individual, be conducive to reducing energy consumption and reducing carbon emission, greatly reduce cost, improve economic benefit and the core competitiveness of enterprise, and by the compound synergy between ferrite powder, binding agent, solvent, softening agent, dispersion agent, described Ferrite Material is made to have excellent rheological property and shrinkage, and by adjusting viscosity with increase defoamer and eliminate pinprick on bubble and strip, thus and obtain the Ferrite Material of excellent performance.
The present invention further provides a kind of laminated chip inductor, it comprises upper cover, lower cover, be located at and laminate by several ferrite diaphragms (i.e. insulation layer) lamination layer formed from top to bottom between described upper cover and lower cover, above-mentioned ferrite diaphragm upper surface arranges interior electrode, above-mentioned ferrite diaphragm arranges through hole, conductor is loaded with in through hole, interior electrode on adjacent ferrite diaphragm is connected by described conductor, also arranges a protective layer at above-mentioned upper cover, lower cover, lamination layer outside surface; Above-mentioned ferrite diaphragm is that above-mentioned Ferrite Material carries out flow casting molding, cuts and be prepared from after drying.
The ferrite diaphragm that laminated chip inductor of the present invention is prepared owing to adopting above-mentioned Ferrite Material, has frivolous, atresia, good combination property advantage; Further, at above-mentioned upper cover, lower cover, lamination layer outside surface, protective layer is set, by means of only the improvement to inductor structure; effectively can improve the compressive strength of inducer; and improve insulating property and corrosion resistance, make it be applicable in various environment, and the reliability after life-time service improve.
The present invention further provides a kind of preparation method of laminated chip inductor, comprise following operation steps:
S01, obtains above-mentioned ferrite diaphragm: take ferrite powder, tackiness agent, solvent, softening agent, dispersion agent, emulsifying agent, defoamer by the formula of above-mentioned Ferrite Material, mixing, and ball milling, obtains the slurry that viscosity is 50 ~ 1500Pas; By described slurry vacuum defoamation, sieve, flow casting molding, dry, obtain described ferrite diaphragm;
S02, with imperforated described ferrite diaphragm for lower cover, the lower lead-in wire of printing; First ferrite diaphragm offers the first through hole, injects electrocondution slurry toward the first through hole, form conductor; By the wherein one side (i.e. lower surface) of this first ferrite diaphragm and print the lower capping time to go between and attach and laminate, the electrocondution slurry of the first through hole is connected with lower lead-in wire; Electrode in the upper printing first of the another side (i.e. upper surface) of this first ferrite diaphragm, makes electrode in first be connected with the electrocondution slurry of the first through hole;
S03, the second ferrite diaphragm offers the second through hole, injects electrocondution slurry toward the second through hole; One of them face (i.e. lower surface) of this second ferrite diaphragm and first ferrite membrane unilateral (i.e. upper surface) of having printed electrode in first are laminated, Electrode connection in the electrocondution slurry and first making the second through hole; Second ferrite diaphragm another side (i.e. upper surface) prints the second inner electrode, the second inner electrode is connected with the electrocondution slurry of the second through hole;
S04, electrode in the 3rd ferrite diaphragm, third through-hole, the 3rd is formed successively according to aforesaid operations flow process, until last one deck ferrite membrane sheet, through hole and interior electrode, laminate into an entirety, and make to connect between adjacent electrode unit by the electrocondution slurry in the through hole on each ferrite diaphragm;
S05, with imperforated described ferrite diaphragm for upper cover, lead-in wire in the one side printing of upper cover, makes to have printed electrode in the upper capping of upper lead-in wire and last one deck ferrite membrane sheet and laminates, make lead-in wire and interior Electrode connection;
S06; above-mentioned upper cover, lower cover, lamination layer are cut, after binder removal, sintering, chamfered; be separated into single chip inductor; after this single chip inductor upper end electrode; again one protective layer is also set at its outside surface; to improve the insulativity of laminated type inducer, obtain above-mentioned laminated type inducer.
Particularly, the preparation method of above-mentioned ferrite diaphragm, specifically comprises following operation steps:
Take ferrite powder, solvent, tackiness agent, softening agent, dispersion agent, emulsifying agent and defoamer by the formula of above-mentioned Ferrite Material, mixing, through ball milling, obtains the slurry that viscosity is 50 ~ 1500Pas;
Above-mentioned slurry is vacuumized 10 ~ 20min deaeration, cross 200 ~ 350 eye mesh screen particle-removing and bubbles, leave standstill 10 ~ 20 hours, then slurry is placed in system band bucket, PET film carrier band or steel band carry out flow casting molding, through the oven for drying 10 ~ 20min of 50 ~ 85 DEG C, obtains the ferrite diaphragm that thickness is 10 ~ 100 μm, be insulation layer, thickness is preferably 10 ~ 60 μm;
The ferrite diaphragm made is cut into 200*200mm
2tablet, as shown in Figure 4.
Further, when adopting the composite binding agent of above-mentioned polyvinyl alcohol or polyvinyl alcohol and water soluble acrylic acid to prepare slurry, ball milling 2 ~ 4 hours after first solvent being mixed with polyvinyl alcohol, polyvinyl alcohol is allowed fully to dissolve, then water soluble acrylic acid is added, then ball milling 2 hours, then add other component, can make size performance even, stable, not stratified, do not precipitate.
Further, the time of above-mentioned ball milling is 34 ~ 40 hours, and material ball ratio is 2.8 ~ 3.5:1, and rotational speed of ball-mill is 45 ~ 50rpm.
The ferrite diaphragm that above-mentioned preparation method obtains has good toughness, intensity and air penetrability, and smooth surface, without pinprick, without distortion, without unfilled corner, consistent performance is good.
Particularly, drilling on the ferrite diaphragm being used as insulation layer, obtain diaphragm with holes, described drilling can adopt ordinary method, as mechanical punching or laser beam perforation.If the aperture of described drilling is excessive, easily cause electrode adhesion, diffusion; If aperture is too small, upper/lower electrode is easily caused to connect difficulty, interior electrode open circuit; Therefore in the embodiment of the present invention, the aperture of drilling is preferably 50 ~ 150 μm.The micropore quantity of the above-mentioned raw material sheet of every sheet is 2000 ~ 30000, as shown in Figure 5.
Particularly, using imperforated above-mentioned ferrite diaphragm as lower cover, above-mentioned diaphragm with holes is laminated successively; Wherein, electrocondution slurry is injected in the hole of each diaphragm with holes, each diaphragm with holes with the stacked contrary face of lower cover is printed in electrode (see figure 7), the interior electrode laminated on rear adjacent belts pore membrane sheet is connected by electrocondution slurry, circulation like this, lamination pressurization formation entirety, can the number of turns according to actual needs and thickness make; Laminate imperforated ferrite diaphragm as upper cover, then through all pressing, cutting, binder removal, sintering, chamfering be separated, obtain single chip inductor;
By the termination top electrode of above-mentioned single chip inductor, plating and sorting, obtain laminated chip inductor.
Particularly, above-mentioned under cover the step laminating diaphragm with holes before, also comprise the step of the lower lead-in wire of printing: go between (see figure 6) under the one side printing that lower cover and diaphragm with holes laminate, go between 10 ~ 30min under the oven for drying of 50 ~ 80 DEG C, accurately locates diaphragm with holes to be laminated on printed on time lower capping of lead-in wire by computer video.
Particularly, the above-mentioned electrocondution slurry injected in micropore, links with above-mentioned lower lead-in wire.The method of micropore slip casting by the conventional means of the art, such as, can being taked syringe needle slip casting method or printing slip casting method, reaching the object by filling electrocondution slurry in micropore.
Particularly, above-mentioned laminate the step of upper cover before, also comprise the step of the upper lead-in wire of printing: the one side laminated at upper cover and diaphragm with holes is printed and gone between, go between 10 ~ 30min in the oven for drying of 50 ~ 80 DEG C, accurately located Electrode connection on upper lead-in wire and diaphragm with holes by computer video.
Further, the preferred Ag slurry of above-mentioned interior electrode.
Particularly, above-mentioned protective layer thickness be 10 ~ 100 μm, according to actual requirement, this thickness changes with the difference of protective layer material.Preferably, protective layer gauge be preferably consistent with above-mentioned ferrite diaphragm, make in protective layer, to there is not grid or other spaces, avoid introducing air.Wherein, the material forming protective layer can be the art and is used as mechanics and chemoprotectant common used material; as glass glaze, epoxy resin etc.; the method forming protective layer is different according to the difference of material; the method of the formation film layer can commonly used for this areas such as soaking technology, spraying coating process or typographies, preferably can make the preparation method that thicknesses of layers is homogeneous.
Particularly, above-mentioned pressure of all pressing is 34 ~ 42MPa, and the temperature of above-mentioned sintering is 850 ~ 900 DEG C.
Particularly, the above-mentioned step at termination top electrode is carried out on special Tu Yinji, selects suitable painting silver silica-gel plate, be coated with by end electrode and be imprinted on ceramics, then complete end electrode through silver ink firing and make according to product size.
Further, laminated chip inductor preparation method provided by the invention adopts dry process to prepare laminated chip inductor, and described Ferrite Material slurry also can be adopted in addition to carry out wet-layer preparation laminated chip inductor.
The water-based solvent system that it is main binder with water soluble acrylic acid that the preparation method of laminated chip inductor provided by the invention adopts with polyvinyl alcohol or composite polyvinyl alcohol, reduce in the traditional production process of laminated chip inductor due to an organic solvent and cause VOC(volatile organic compounds) discharge and production cost is high, energy consumption is large shortcoming.
Compared with the prior art, the present invention has following beneficial effect:
(1) the water-based solvent system that obtains using the deionized water that with the addition of solubility promoter of Ferrite Material slurry of the present invention is as solvent, the solubleness of effective raising adhesive polyethylene alcohol, the homogeneity of slurry is improved, the toughness that the diaphragm obtained has had and intensity, pinprick are few, make the lamination type electric sensor of preparation have excellent performance.
(2) Ferrite Material slurry of the present invention adopts polyvinyl alcohol to be main binder, take water-based solvent as solvent, substitute the organic solvent system that tradition take polyvinyl butyral acetal as main binder, electronic devices and components are prepared for flow casting molding, VOC(volatile organic compounds can be reduced) discharge, meet the safety in production requirement improved constantly, and reduce chip multilayer electronic devices and components energy consumption in process of production and cost, improve economic benefit and the core competitiveness of enterprise.
(3) of the present invention protective layer is set by the single inductor outside surface at laminated chip inductor, by means of only the improvement to inductor structure, effectively can improve the compressive strength of inducer, and improve insulating property and corrosion resistance, make it be applicable in various environment, and the reliability after life-time service improve;
(4) the present invention has the outstanding advantages such as green, environmental protection, low-carbon (LC), does not have sharp aroma in process of production, is conducive to environmental protection and produces the healthy of line employee individual, and is conducive to reducing energy consumption and reducing carbon emission.
Below in conjunction with specific embodiment, specific implementation of the present invention is described in detail.
Embodiment 1
(1) data as shown in table 1 below, the Ferrite Material slurry of preparation 1# ~ 5# aqueous tape casting forming and the comparative paste of 6# ~ 10#: ferrite powder, tackiness agent, solvent, softening agent, dispersion agent, emulsifying agent and defoamer are pressed the proportioning mixing in table 1, wherein, ferrite powder is 50 parts, the time of ball milling is 38 hours, and material ball ratio is 1:3, and drum's speed of rotation is 50rpm, then 18min de-bubble is vacuumized, vacuum tightness≤10
-9mPa, crosses 300 eye mesh screen particle-removing and bubbles, obtains the Ferrite Material slurry of aqueous tape casting forming.According to binder mixture, ball milling 4 hours after first being mixed with polyvinyl alcohol by solvent, allows polyvinyl alcohol fully dissolve, then adds water soluble acrylic acid, then ball milling 2 hours, then adds other component, carries out mixing and ball milling.
Wherein, the preparation method of ferrite powder is: by ferric oxide, nickel oxide, cupric oxide, zinc oxide by weight 10:3:2:5 mixing, through batch mixing, pre-burning, (temperature is 900 DEG C, time is 2h), (material ball ratio is 1:3 to ball milling, rotating speed is 45rpm, time is 30h), obtain ferrite powder.
In addition, polyvinyl alcohol is the GH-20S originating from Japan, and viscosity is 40 ~ 46, and molecular size range is 18 ~ 200,000, and second-order transition temperature is 75 ~ 85 DEG C; Water soluble acrylic acid is domestic production (Guangzhou meter Yang trade Co., Ltd agency); Emulsifying agent is acrylic resin emulsion.
Table 1
The comparative paste that the comparative paste that the comparative paste that remarks: 6# the obtains comparative paste that water of solubility promoter is not solvent to add, 7# obtains is not softening agent with α-amino isopropyl alcohol, 8# obtains is not dispersion agent with hexylene glycol, 9# obtains is not added the comparative paste that emulsifying agent and defoamer, 10# obtain and is not added defoamer.
In addition, the parameter in the preparation of Ferrite Material slurry of 1 ~ 5# aqueous tape casting forming and the preparation process of respective inductor is carried out according to the data in table 2 below, and the preparation of 6# ~ 10# comparative paste is carried out with reference to the preparation parameter of 3# slurry.
Table 2
(2) ferrite diaphragm is prepared: after the Ferrite Material slurry of aqueous tape casting forming step (1) prepared and comparative paste leave standstill, slurry is placed in system band bucket, PET film carrier band or steel band carries out flow casting molding, through oven drying, obtain film strips, film strips is cut into 200 × 200mm
2ferrite diaphragm.
The preparation parameter of the ferrite diaphragm of above-mentioned 1 ~ 5# aqueous tape casting forming carries out according to the data in table 3 below, and the ferrite diaphragm prepared of 6# ~ 10# comparative paste carries out with reference to the preparation parameter of 3# slurry.
Table 3
The ferrite diaphragm proterties of observing 6# ~ 10# comparative paste and preparing, find that 6# comparative paste is when mixing, under normal temperature, tackiness agent solubility property is poor, and in solvent, particle is more; The film strips that 7# prepares has certain toughness and good intensity, but can not pressing; The film strips that 8# slurry prepares has minority pinprick, cutting prod unfilled corner; 9#, 10# comparative paste unstable properties, long-time placement is easily precipitated.And 1 ~ 5# slurry is when preparing, under normal temperature, tackiness agent dissolves completely, and size performance is stablized, slurry viscosity is 50 ~ 1500Pas, obtained ferrite diaphragm has good toughness, intensity and air penetrability, and smooth surface, without pinprick, without being out of shape, unfilled corner, consistency of performance is good.
(3) laminated chip inductor is prepared: proceed following operation to prepare 1 ~ 5# inducer to ferrite diaphragm prepared by above-mentioned 1 ~ 5# slurry, the concrete operations parameter of this step refers to as following table 4:
Ferrite diaphragm above-mentioned steps (2) prepared is corresponding with the insulation layer in inducer, carry out mechanical punching or laser beam perforation, different according to the physical dimension of product, the aperture of diaphragm and quantity are also variant, aperture is at 50 ~ 150 μm, the micropore quantity of every sheet diaphragm, 2000 ~ 50000, obtains diaphragm with holes;
(4) with ferrite diaphragm for lower cover, laminate diaphragm with holes successively and carry out interior electrode print and electrocondution slurry injection, the interior electrode number of turns making extremely design is the thickness of 4.5 circles and 1.10mm, formed overall, wherein, in the hole of each diaphragm with holes, inject electrocondution slurry, each diaphragm with holes with the stacked contrary face of lower cover is printed in electrode, the interior electrode laminating rear adjacent two diaphragms with holes is connected by electrocondution slurry; Laminating imperforated ferrite diaphragm is upper cover, through all pressing, cutting, the separation of binder removal, sintering, chamfering, termination top electrode, plating and sorting, obtain 1 ~ 5# laminated chip inductor.
Also comprise the lower lead-in wire of printing in above preparation method, dry, drying operation parameter is shown in as following table 4.
The material forming protective layer can be the art and is used as mechanics and chemoprotectant common used material; glass glaze, epoxy resin etc.; the method forming protective layer is different according to the difference of material; the method of the formation film layer can commonly used for this areas such as soaking technology, spraying coating process or typographies, preferably can make the uniform preparation method of thicknesses of layers.
Laminating and printing or in slip casting process, accurately locate by computer video, micropore slip casting can take syringe needle slip casting method or printing slip casting method, then electrode in printing, through displacement conversion, carry out repeatedly slip casting printing, after Multi-stacking compaction, reach the total thickness that final product design requires.
The concrete operations of described upper end electrode are ceramics upper end electrode after surface treatment, and special Tu Yinji carries out, and select suitable painting silver silica-gel plate, be coated with by end electrode and be imprinted on ceramics, then complete end electrode through silver ink firing and make according to product size.
Table 4
The structure of described inducer specifically describes as follows:
Fig. 1 is the structural representation of laminated chip inductor of the present invention; Fig. 2 is the location diagram of upper cover, lower cover and lamination layer in laminated chip inductor, the corresponding ferrite diaphragm of insulation layer; Fig. 3 is the location diagram of lower cover in laminated chip inductor, ferrite diaphragm and interior electrode.Fig. 1, Fig. 2 and Fig. 3 combine the laminated chip inductor being the present embodiment, for convenience of explanation, illustrate only the part relevant to the embodiment of the present invention.
See Fig. 1 and Fig. 2; this inducer comprises upper cover 1, lower cover 2 and multiple insulation layer 3; interior electrode 4 is provided with at the upper surface of each insulation layer 3; each insulation layer 3 is provided with through hole 6; be loaded with conductor in through hole, by Electrode connection on adjacent insulation layer, thus form several complete coils; protective layer is set at single inductor outside surface, forms the basic structure of inducer.The composition that it is pointed out that the interior electrode 4 shown in Fig. 2 is not unique, can be 3/4 inner electrode, or 3/2 inner electrode, and other structures.
Comparative example
Adopt organic solvent system flow casting molding preparation contrast laminated chip inductor product, concrete operations are: by ferrite powder, polyvinyl butyral acetal, n-propyl acetate, isopropylcarbinol, tackiness agent B-98, dispersion agent (Viscotrol C), flow agent in mass ratio 100:15:80:50:5:2 carry out batch mixing ball milling, the operations such as slurrying are consistent with the 1# inducer in above-described embodiment 1.But do not comprise protective layer in the inducer of this comparative example, ferrite powder is consistent with above-described embodiment 1, obtain contrasting inductor product.
Effect example
Inductor product 5 prepared by 1-5# inducer each 5 and comparative example prepared by Example 1, test inductance value, quality factor q value and direct current resistance respectively, data are in table 5.
Wherein, the test of inductance value, Q value and direct current resistance tests according under standard atmosphere conditions under normal temperature condition, and testing tool is precision 1 × 10
-8the electric impedance analyzer of H, test frequency 10MHz, test voltage 50mV.
Table 5
Visible, the inductor product adopting water-based solvent system of the present invention to prepare and the inductor product of organic solvent system substantially do not have gap on electrical property, and it is reproducible, namely water-based solvent system of the present invention can substitute organic solvent system of the prior art completely, thus reduce VOC(volatile organic compounds in production) discharge, reduce the energy consumption in production process and cost, there is the outstanding advantages of green, environmental protection, low-carbon (LC).
The above is the preferred embodiment of the present invention; it should be pointed out that for those skilled in the art, under the premise without departing from the principles of the invention; can also make some improvements and modifications, these improvements and modifications are also considered as protection scope of the present invention.
Claims (9)
1. a Ferrite Material, is characterized in that, comprises the following component counted by weight percentage:
Wherein, described tackiness agent is the composite binding agent of polyvinyl alcohol or polyvinyl alcohol and water soluble acrylic acid, and the molecular weight of described polyvinyl alcohol is 180,000 ~ 200,000, and second-order transition temperature is 75 ~ 85 DEG C; Described polyvinyl alcohol and the composite weight ratio of water soluble acrylic acid are (3.0 ~ 4.0): (1.2 ~ 1.5).
2. Ferrite Material as claimed in claim 1, is characterized in that, comprises the component of the following meter of number by weight percentage:
Wherein, described tackiness agent is the composite binding agent of polyvinyl alcohol or polyvinyl alcohol and water soluble acrylic acid.
3. Ferrite Material as claimed in claim 1 or 2, it is characterized in that, described solvent is the mixture of deionized water, alcohol ether and propyl carbinol, and the weight ratio of described deionized water, alcohol ether and propyl carbinol is (14 ~ 18): (1 ~ 4): (1 ~ 4).
4. Ferrite Material as claimed in claim 1 or 2, it is characterized in that, described softening agent is the mixture of α-amino isopropyl alcohol and 1,3-PD, the weight ratio of described α-amino isopropyl alcohol and 1,3-PD is (1.5 ~ 2.5): (0.8 ~ 1.2).
5. Ferrite Material as claimed in claim 1 or 2, it is characterized in that, described defoamer is the mixture of carboxy cellulose sodium and tripoly phosphate sodium STPP, and the weight ratio of described carboxy cellulose sodium and tripoly phosphate sodium STPP is 2:(3 ~ 5).
6. Ferrite Material as claimed in claim 1 or 2, it is characterized in that, described dispersion agent is at least one in hexylene glycol, acrylamide, and described emulsifying agent is acrylic resin.
7. a laminated chip inductor, comprise upper cover, lower cover, be located at and laminate by several ferrite diaphragms the lamination layer formed from top to bottom between described upper cover and lower cover, it is characterized in that, at the upper surface of described ferrite diaphragm, interior electrode is set, described ferrite diaphragm arranges through hole, be loaded with conductor in through hole, the interior electrode on adjacent ferrite diaphragm is connected by described conductor, outside described upper cover, lower cover, lamination layer, also arrange a protective layer; Described ferrite diaphragm, for carrying out flow casting molding according to the Ferrite Material described in any one of claim 1 ~ 6, cuts after drying and is prepared from.
8. laminated chip inductor as claimed in claim 7, it is characterized in that, the thickness of described ferrite diaphragm is 10 ~ 100 μm, and the aperture of described through hole is 50 ~ 150 μm, and the thickness of described protective layer is 10 ~ 100 μm.
9. a preparation method for laminated chip inductor, is the preparation method of laminated chip inductor described in claim 8, comprises following operation steps:
Take described ferrite powder, tackiness agent, solvent, softening agent, dispersion agent, emulsifying agent, defoamer by the formula of described Ferrite Material, mixing, ball milling, obtains the slurry that viscosity is 50 ~ 1500Pas;
By described slurry vacuum defoamation, sieve, flow casting molding, dry, obtain described ferrite diaphragm;
With imperforated described ferrite diaphragm for lower cover, the lower lead-in wire of printing;
Described ferrite diaphragm arranges described through hole, in hole, injects electrocondution slurry, electrode in any surface preparation of described ferrite diaphragm, makes interior electrode be connected with electrocondution slurry, obtains the ferrite diaphragm with interior electrode;
The face that described lower cover has printed time lead-in wire laminates the ferrite diaphragm of electrode in band described in several successively, the ferrite membrane sheet of electrode in band is faced up, connected by electrocondution slurry between interior electrode, the electrocondution slurry attaching the ferrite diaphragm laminated with lower cover is connected with lower lead-in wire;
Again with imperforated described ferrite diaphragm for upper cover, in printing go between; Make to attach with upper cover electrode in the ferrite diaphragm that laminates to be connected with described upper lead-in wire, obtain single chip inductor;
Also arrange a protective layer, upper end electrode at the outside surface of described single chip inductor, plating, sorting, obtains described laminated chip inductor.
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| CN105152643A (en) * | 2015-08-06 | 2015-12-16 | 深圳鹏汇功能材料有限公司 | Water-based tape-casting slurry for magnetic substrate, preparation method of water-based tape-casting slurry, and magnetic substrate |
| CN108947515A (en) * | 2018-08-28 | 2018-12-07 | 江苏科技大学 | A kind of texturing Mn ferrite ceramics and preparation method |
| US12006266B2 (en) | 2019-03-13 | 2024-06-11 | Goo Chemical Co., Ltd. | Baking slurry composition, green sheet, method for manufacturing green sheet, method for manufacturing sintered product, and method for manufacturing monolithic ceramic capacitor |
| CN111936449B (en) * | 2019-03-13 | 2023-04-04 | 互应化学工业株式会社 | Binder composition for producing green sheet, firing slurry composition, method for producing green sheet, sintered product, and monolithic ceramic capacitor |
| CN112103059B (en) | 2020-09-15 | 2022-02-22 | 横店集团东磁股份有限公司 | Manufacturing method of thin film power inductor and thin film power inductor |
| CN114195512A (en) * | 2021-12-27 | 2022-03-18 | 上海材料研究所 | Barium titanate PTC ceramic diaphragm tape-casting slurry and preparation method and application thereof |
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