CN103915132A - Inner electrode silver paste for laminated inductor and preparation method thereof - Google Patents
Inner electrode silver paste for laminated inductor and preparation method thereof Download PDFInfo
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- CN103915132A CN103915132A CN201410060020.8A CN201410060020A CN103915132A CN 103915132 A CN103915132 A CN 103915132A CN 201410060020 A CN201410060020 A CN 201410060020A CN 103915132 A CN103915132 A CN 103915132A
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Abstract
The invention relates to inner electrode silver paste for a laminated inductor and a preparation method of the inner electrode silver paste. The inner electrode silver paste is characterized by comprising, by weight, 0.5%-3.5% of resin, 5%-10% of solvents and 0.2%-5% of assistants, the balance of silver powder. The inner electrode silver paste for the laminated inductor has good printability, has good fluidity when printed, can be quickly formed when printing is stopped and can be printed into high-precision strips with the width ranging from 40 micrometers to 50 micrometers; the silver paste is high in silver content, good in electrical conductivity and small in shrinkage rate, and the inductor manufactured through the silver paste has a small Q value and high frequency characteristics. Meanwhile, the inner electrode silver paste solves the problems that when the silver content is higher than 85%, the content of other constituents is low, the constituents can not be mixed into paste easily and printing is difficult to carry out consequently; furthermore, when the silver content is improved, the inner electrode silver paste is larger in resistivity decrease amplitude and shrinkage rate decrease amplitude.
Description
Technical field
The present invention relates to a kind of laminated chip inductor silver paste of inner electrode and preparation method thereof.
Background technology
The structure of laminated inductive is made up of the ferrite layer superposeing alternately and inner conductor layer, that ferrite powder is made to slurry, make the ferrite membrane of thick approximately 10 μ m～30 μ m by curtain coating or wet printing method, and thereon with silver slurry printing conductive coil, through alternately printing, overlap together, perforation is communicated with each layer of conductive coil, form a helical winding, repeat above-mentioned steps and just can be made into the laminated construction that reaches tens of layers, make the laminated inductive with monolithic structure, when inductance work, electric current is to flow in the conductor material printing.
Laminated chip inductor has adopted the multi-sheet printed technology of advanced thick film and laminated process, realize the subminaturization of chip inductor, and its miniaturization speed is constantly accelerated along with the progress of stack technology, progressively replace traditional plug-in mounting inductance and coiling chip inductor in major applications field, become the main product of chip inductor of new generation.Because mobile phone products and satellite phone are constantly to miniaturization and high-frequency development, make high-frequency inductor in the market move towards 0402 leading type from 0603 leading type rapidly, even 0201.The subminaturization of chip inductor and high frequency have higher requirement for chip inductor silver paste of inner electrode, conductivity aspect requires low resistance and obtains high Q value, from 0402 to 0201, the tolerance simultaneously requiring is more and more less, and requirement printing lines are thinner, shrinkage is lower.
Summary of the invention
One of object of the present invention is to provide a kind of low laminated chip inductor silver paste of inner electrode of inductance Q value that good printing and conductivity, shrinkage are little and make that has;
Two of object of the present invention is to provide a kind of preparation method of above-mentioned silver paste of inner electrode.
A kind of laminated chip inductor silver paste of inner electrode, its special feature is, percentage composition calculating consists of by weight: resin 0.5-3.5%, solvent 5-10%, auxiliary agent 0.2-5%, surplus is silver powder.
Wherein silver powder employing average grain diameter is 0.2-2 μ m, tap density>=5g/cm
3spherical or class ball shape silver powder.
Wherein resin is at least one in ethyl cellulose, polyvinyl butyral resin PVB and celluloid.
Wherein solvent is at least one in terpinol, ethyl carbitol acetate, butyl carbitol acetate, butyl carbitol and dibasic ester solvent RPDE.
Wherein auxiliary agent is at least one in levelling agent, thixotropic agent, anti-settling agent, coupling agent and dispersant.
Wherein levelling agent adopts BYK-322, and thixotropic agent adopts A200, and anti-settling agent adopts platform polyamide wax 229, and coupling agent adopts silane coupler KH560, and dispersant adopts BYK-W980.
A preparation method for silver paste of inner electrode for laminated chip inductor, its special feature is, comprises the steps:
1) choosing average grain diameter is 0.2-2 μ m, tap density>=5g/cm
3spherical or class ball shape silver powder is for subsequent use;
2) by the proportioning of recording in claim 1, take respectively 40-60 ℃ of resin heating and be dissolved in solvent and add auxiliary agent, formation organic carrier stirs;
3) by the proportioning of recording in claim 1, the silver powder that takes step 1) stirs in the organic carrier obtaining;
4) till using three-roll grinder to be ground to fineness and to be no more than 10 μ m;
5) after vacuum degassing, obtain silver paste of inner electrode.
In step 4), grind 8-15 time.
The invention provides a kind of silver paste of inner electrode for laminated chip inductor, there is good printing, in the time of printing, there is good mobility, stopping printing can rapid shaping, can the high-precision lines of printing width 40-50um, silver slurry silver content is high, and good conductivity, shrinkage are little, the inductance Q value of making is low, has high frequency characteristics.Simultaneously by the invention solves when silver content is higher than 85% time, other components are relatively on the low side and be difficult for being modulated into slurry, and then are difficult to the problem of printing.And in the time that silver content improves, it is larger that the silver of invention is starched resistivity, shrinkage reduces amplitude.
Embodiment
Laminated chip inductor provided by the present invention is made up of silver powder, resin, solvent and auxiliary agent with silver paste of inner electrode, its formula consists of silver powder: 85-92%, high polymer binder: 0.5-3.5%, solvent: 5-10%, auxiliary agent: 0.2-5%, in above-mentioned raw materials, silver powder is that average grain diameter is 0.2-2 μ m, tap density>=5g/cm
3spherical or class ball shape silver powder, high polymer binder is ethyl cellulose, PVB(polyvinyl butyral resin), one or more in celluloid, solvent is one or more in terpinol, ethyl carbitol acetate, butyl carbitol acetate, butyl carbitol, RPDE, and auxiliary agent is one or more in levelling agent, thixotropic agent, anti-settling agent, coupling agent, dispersant.
Its process of preparing is: 1) choosing average grain diameter is 0.2-2 μ m, vibration density>=3.5g/cm
3spherical or class ball shape silver powder is for subsequent use; 2) take the heating for dissolving such as ethyl cellulose, PVB, celluloid by formula in mixed solvent and add various auxiliary agents, formation organic carrier stirs; 3) take silver powder for subsequent use by formula stirs in organic carrier; 4) use three-roll grinder to grind 8-15 all over (till using fineness tester test fineness to be less than 10 μ m); 5) vacuum degassing, detects qualified the present invention's silver slurry that obtains.
Embodiment 1:
Prepare silver paste of inner electrode for chip inductor (counting by weight percentage) according to following formula: ethyl cellulose 1%, celluloid 0.5%, polyvinyl butyral resin 1%, terpinol 7%, ethyl carbitol acetate 1%, butyl carbitol acetate 2%, levelling agent BYK-322 is 1%, and thixotropic agent A200 is 1%, and coupling agent KH560 is 0.5%, surplus is that average grain diameter is 1-2 μ m, tap density>=5.3g/cm
3ball shape silver powder (lower with).
Take ethyl cellulose, celluloid, polyvinyl butyral resin by above-mentioned formula is dissolved in terpinol, ethyl carbitol acetate, butyl carbitol acetate mixed solvent at 50 ℃ of temperature; Add levelling agent BYK-322, thixotropic agent A200, tri-kinds of auxiliary agents of coupling agent KH560 to stir to become organic carrier for subsequent use; Take ball shape silver powder by above-mentioned formula stirs in this organic carrier; Using three-roll grinder to grind 10 times (or uses fineness tester test fineness to be less than 10 μ m); Employing vacuum degassing machine is degassed, obtains the present invention's silver slurry.
Embodiment 2:
Prepare silver paste of inner electrode for chip inductor according to following formula: ball shape silver powder 88%, ethyl cellulose 1%, polyvinyl butyral resin 0.5%, terpinol 6%, butyl carbitol 1.5%, RDBE(dibasic ester solvent) 1%, levelling agent (BYK-322) 1%, thixotropic agent (A200) 0.5%, coupling agent (KH560) 0.5%.
By formula take ethyl cellulose, polyvinyl butyral resin in 60 ℃ of heating for dissolving in terpinol, butyl carbitol, RDBE(dibasic ester solvent) in solvent; Add levelling agent (BYK-322), thixotropic agent (A200), coupling agent (KH560) auxiliary agent to stir to become organic carrier for subsequent use; Take silver powder for subsequent use by formula stirs in organic carrier; Use three-roll grinder rolling 8 times (to use fineness tester test fineness to be less than 10 μ m); Adopt vacuum degassing machine vacuum degassing, detect qualified the present invention's silver slurry that obtains.
Embodiment 3:
Prepare silver paste of inner electrode for chip inductor according to following formula: ball shape silver powder 92%, ethyl cellulose 1%, terpinol 2%, butyl carbitol 1.5%, RDBE(dibasic ester solvent) 2%, levelling agent (BYK-322) 0.5%, thixotropic agent (A200) 0.5%, coupling agent (KH560) 0.5%.
Take ethyl cellulose in 60 ℃ of terpinols, butyl carbitol, RDBE(dibasic ester solvent by formula) in solvent; Add the auxiliary agents such as levelling agent (BYK-322), thixotropic agent (A200), coupling agent (KH560) to stir to become organic carrier for subsequent use; Take silver powder for subsequent use by formula stirs in organic carrier; Using three-roll grinder to grind 15 times (uses fineness tester test fineness to be less than 10 μ m); Adopt vacuum degassing machine vacuum degassing, detect qualified the present invention's silver slurry that obtains.
Correction data the following table is above-described embodiment with the clear flourish ML-4019L slurry of Japan that occupation rate is higher in the market.
Remarks: shrinkage method of testing: the circle of printing diameter 15mm, thickness 25 μ m, after drying, measure diameter and thickness, volume calculated V1, measures diameter and thickness, volume calculated V again after sintering
2, shrinkage=V
2-V
1/ V
1/ 100.
Visible the present invention silver slurry conductivity is better, shrinkage lower (its good conductivity, the Q value of inductance is low, high frequency characteristics is good).
Claims (8)
1. a laminated chip inductor silver paste of inner electrode, is characterized in that, percentage composition calculates and consists of by weight: resin 0.5-3.5%, and solvent 5-10%, auxiliary agent 0.2-5%, surplus is silver powder.
2. a kind of laminated chip inductor silver paste of inner electrode as claimed in claim 1, is characterized in that: wherein silver powder employing average grain diameter is 0.2-2 μ m, tap density>=5g/cm
3spherical or class ball shape silver powder.
3. a kind of laminated chip inductor silver paste of inner electrode as claimed in claim 1, is characterized in that: wherein resin is at least one in ethyl cellulose, polyvinyl butyral resin PVB and celluloid.
4. a kind of laminated chip inductor silver paste of inner electrode as claimed in claim 1, is characterized in that: wherein solvent is at least one in terpinol, ethyl carbitol acetate, butyl carbitol acetate, butyl carbitol and dibasic ester solvent RPDE.
5. a kind of laminated chip inductor silver paste of inner electrode as claimed in claim 1, is characterized in that: wherein auxiliary agent is at least one in levelling agent, thixotropic agent, anti-settling agent, coupling agent and dispersant.
6. a kind of laminated chip inductor silver paste of inner electrode as claimed in claim 5, it is characterized in that: wherein levelling agent adopts BYK-322, thixotropic agent adopts A200, and anti-settling agent adopts platform polyamide wax 229, coupling agent adopts silane coupler KH560, and dispersant adopts BYK-W980.
7. a preparation method for silver paste of inner electrode for laminated chip inductor, is characterized in that, comprises the steps:
1) choosing average grain diameter is 0.2-2 μ m, tap density>=5g/cm
3spherical or class ball shape silver powder is for subsequent use;
2) by the proportioning of recording in claim 1, take respectively 40-60 ℃ of resin heating and be dissolved in solvent and add auxiliary agent, formation organic carrier stirs;
3) by the proportioning of recording in claim 1, the silver powder that takes step 1) stirs in the organic carrier obtaining;
4) till using three-roll grinder to be ground to fineness and to be no more than 10 μ m;
5) after vacuum degassing, obtain silver paste of inner electrode.
8. the preparation method of silver paste of inner electrode for a kind of laminated chip inductor as claimed in claim 7, is characterized in that: in step 4), grind 8-15 time.
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| CN201410060020.8A CN103915132A (en) | 2014-02-24 | 2014-02-24 | Inner electrode silver paste for laminated inductor and preparation method thereof |
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| CN201410060020.8A CN103915132A (en) | 2014-02-24 | 2014-02-24 | Inner electrode silver paste for laminated inductor and preparation method thereof |
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Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104157329A (en) * | 2014-07-30 | 2014-11-19 | 安徽状元郎电子科技有限公司 | Conductive silver paste compounded by calcium carbide sludge/wollastonite and preparation method for conductive silver paste |
| CN104637571A (en) * | 2015-02-05 | 2015-05-20 | 合肥圣达电子科技实业公司 | Silver paste for ceramic capacitor and preparation method thereof |
| CN105006271A (en) * | 2015-08-06 | 2015-10-28 | 中国振华集团云科电子有限公司 | Inner electrode silver paste and preparation method thereof |
| CN105551712A (en) * | 2016-03-11 | 2016-05-04 | 深圳市固电电子有限公司 | Chip ceramic inductor and manufacturing method thereof |
| CN105761775A (en) * | 2014-12-18 | 2016-07-13 | 上海宝银电子材料有限公司 | Conductive silver paste for on-chip inductor external electrode and preparation method of conductive silver paste |
| CN105825911A (en) * | 2016-05-13 | 2016-08-03 | 浙江光达电子科技有限公司 | Multi-layer chip inductor inner electrode silver paste and preparation method thereof |
| CN105895258A (en) * | 2014-11-14 | 2016-08-24 | 中国振华集团云科电子有限公司 | Preparation method of multilayer co-fired inner electrode silver paste |
| CN109979734A (en) * | 2017-12-28 | 2019-07-05 | 株式会社村田制作所 | Coil component |
| CN110164585A (en) * | 2018-11-27 | 2019-08-23 | 上海应用技术大学 | The preparation method of FERRITE CORE inductance high conductivity high adhesion force electrocondution slurry |
| US10403770B2 (en) | 2015-02-04 | 2019-09-03 | E I Du Pont De Nemours And Company | Conductive paste composition and semiconductor devices made therewith |
| US10593439B2 (en) | 2016-10-21 | 2020-03-17 | Dupont Electronics, Inc. | Conductive paste composition and semiconductor devices made therewith |
| US10741300B2 (en) | 2016-10-07 | 2020-08-11 | E I Du Pont De Nemours And Company | Conductive paste composition and semiconductor devices made therewith |
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Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104157329A (en) * | 2014-07-30 | 2014-11-19 | 安徽状元郎电子科技有限公司 | Conductive silver paste compounded by calcium carbide sludge/wollastonite and preparation method for conductive silver paste |
| CN105895258A (en) * | 2014-11-14 | 2016-08-24 | 中国振华集团云科电子有限公司 | Preparation method of multilayer co-fired inner electrode silver paste |
| CN105895258B (en) * | 2014-11-14 | 2018-01-09 | 中国振华集团云科电子有限公司 | A kind of preparation method of multilayer co-firing silver paste of inner electrode |
| CN105761775B (en) * | 2014-12-18 | 2017-07-21 | 上海宝银电子材料有限公司 | A kind of chip inductor external electrode conductive silver paste and preparation method thereof |
| CN105761775A (en) * | 2014-12-18 | 2016-07-13 | 上海宝银电子材料有限公司 | Conductive silver paste for on-chip inductor external electrode and preparation method of conductive silver paste |
| US10403770B2 (en) | 2015-02-04 | 2019-09-03 | E I Du Pont De Nemours And Company | Conductive paste composition and semiconductor devices made therewith |
| CN104637571A (en) * | 2015-02-05 | 2015-05-20 | 合肥圣达电子科技实业公司 | Silver paste for ceramic capacitor and preparation method thereof |
| CN105006271A (en) * | 2015-08-06 | 2015-10-28 | 中国振华集团云科电子有限公司 | Inner electrode silver paste and preparation method thereof |
| CN105551712A (en) * | 2016-03-11 | 2016-05-04 | 深圳市固电电子有限公司 | Chip ceramic inductor and manufacturing method thereof |
| CN105825911A (en) * | 2016-05-13 | 2016-08-03 | 浙江光达电子科技有限公司 | Multi-layer chip inductor inner electrode silver paste and preparation method thereof |
| CN105825911B (en) * | 2016-05-13 | 2017-05-31 | 浙江光达电子科技有限公司 | A kind of laminated inductive silver paste of inner electrode and preparation method thereof |
| US10741300B2 (en) | 2016-10-07 | 2020-08-11 | E I Du Pont De Nemours And Company | Conductive paste composition and semiconductor devices made therewith |
| US10593439B2 (en) | 2016-10-21 | 2020-03-17 | Dupont Electronics, Inc. | Conductive paste composition and semiconductor devices made therewith |
| US10825575B2 (en) | 2016-10-21 | 2020-11-03 | Dupont Electronics, Inc. | Conductive paste composition and semiconductor devices made therewith |
| CN109979734A (en) * | 2017-12-28 | 2019-07-05 | 株式会社村田制作所 | Coil component |
| CN109979734B (en) * | 2017-12-28 | 2021-06-29 | 株式会社村田制作所 | Coil component |
| CN110164585A (en) * | 2018-11-27 | 2019-08-23 | 上海应用技术大学 | The preparation method of FERRITE CORE inductance high conductivity high adhesion force electrocondution slurry |
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Application publication date: 20140709 |