CN206210614U - Composite electronic component - Google Patents
Composite electronic component Download PDFInfo
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- CN206210614U CN206210614U CN201621105334.6U CN201621105334U CN206210614U CN 206210614 U CN206210614 U CN 206210614U CN 201621105334 U CN201621105334 U CN 201621105334U CN 206210614 U CN206210614 U CN 206210614U
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Abstract
The utility model is related to a kind of composite electronic component, resistive layer is attached to the composite electronic component the first first type surface of ceramic body, first termination electrode is electrically connected with resistive layer, resistive layer is electrically connected with lateral electrode, the first side surface or the second side surface are exposed in ceramic body at first electrode layer at least, second end face is exposed at the second electrode lay at least.First electrode layer is electrically connected with lateral electrode, and the second electrode lay is electrically connected with the second termination electrode, so as to form the structure with electric capacity and resistant series.Realize an electric capacity and resistance is integrated into discrete component, size is smaller, be embodied as circuitry and save space.
Description
Technical field
The utility model is related to electronic component technology field, more particularly, to a kind of composite electronic component.
Background technology
Capacitor can be used for separated by direct communication, filtering and energy storage etc., have in the occasions such as transmission of electricity, distribution, electricity consumption extensive
Using.In many circuit applications, it is necessary to using resistance and capacitances in series structure circuit when, generally use discrete component, i.e.,
Resistance is mounted in the outside of electric capacity, less efficient, formation single resistance and single electric capacity is mounted, more circuit is so taken empty
Between, it is unfavorable for the miniaturization of whole machine.
Utility model content
Based on this, it is necessary to provide a kind of size smaller composite electronic component.
A kind of composite electronic component, including ceramic body, lateral electrode, the first termination electrode, the second termination electrode and resistive layer；
The ceramic body have the first first type surface relative to each other and the second first type surface, the first side surface relative to each other and
Second side surface and first end face and second end face relative to each other, the ceramic body are filled with ceramic dielectric, described
Multiple first electrode layers and multiple the second electrode lays, the first electrode layer and the second electrode lay are interspersed with ceramic dielectric
It is alternately laminated, and projection of the first electrode layer on the second electrode lay has overlapping portion with the second electrode lay
Point, the ceramic dielectric is also filled between the first electrode layer and the second electrode lay, the first electrode layer is at least
Have at one and expose to first side surface or second side surface, exposed at the second electrode lay at least described
Second end face；
The lateral electrode is attached on first side surface or second side surface, the first electrode layer and institute
State lateral electrode electrical connection；
The resistive layer is attached on first first type surface, and the resistive layer is electrically connected with the lateral electrode；
First termination electrode is attached in the first end face, and second termination electrode is attached to the second end face
On, first termination electrode is electrically connected with the resistive layer, and second termination electrode is electrically connected with the second electrode lay.
In one embodiment, first termination electrode first first type surface abutted with the first end face,
Second first type surface, first side surface and second side surface are respectively extended a distance on four surfaces, described
Extension of first termination electrode on first first type surface has lap with the resistive layer.
In one embodiment, the resistive layer includes first resistor portion and second resistance portion, the first resistor portion
There is angle between the second resistance portion, the first resistor portion electrically connects with the second resistance portion, first electricity
Resistance part electrically connects away from the one end in the second resistance portion with first termination electrode, and the second resistance portion that states is away from described
One end of one resistance section electrically connects with the lateral electrode.
In one embodiment, the angle between the first resistor portion and the second resistance portion is 60 °~120 °.
In one embodiment, the first resistor portion combines the resistive layer to form " L " shape with the second resistance portion.
In one embodiment, the lateral electrode includes the first connection electrode and the second connection electrode, and described first connects
Receiving electrode is attached on first side surface, and second connection electrode is attached on second side surface, and described first
Connection electrode is spaced with second connection electrode, and described first electrode layer one end is electrically connected with first connection electrode
Connect, the other end of the first electrode layer is electrically connected with second connection electrode.
In one embodiment, the resistive layer includes first resistor portion, second resistance portion and 3rd resistor portion, described
First resistor portion, so second resistance portion and the 3rd resistor portion cross to form intersectional region, it is the first resistor portion, described
Second resistance portion and the 3rd resistor portion are electrically connected to each other, the first resistor portion away from the intersectional region one end with
The first termination electrode electrical connection, the one end and second connection electrode electricity of the second resistance portion away from the intersectional region
Connection, the 3rd resistor portion electrically connects away from one end of the intersectional region with first connection electrode.
In one embodiment, the lateral electrode is extended a distance on first first type surface, the lateral electrode
Extension on first first type surface has lap with the resistive layer.
In one embodiment, second termination electrode first first type surface abutted with the second end face,
Second first type surface, first side surface and second side surface are respectively extended a distance on four surfaces.
In one embodiment, the first electrode layer and the second electrode lay are relative and be arranged in parallel.
Above-mentioned composite electronic component, resistive layer is attached to the first first type surface of ceramic body, the first termination electrode and resistive layer electricity
Connection, resistive layer is electrically connected with lateral electrode, and the first side surface or second are exposed at first electrode layer at least in ceramic body
Side surface, second end face is exposed at the second electrode lay at least.First electrode layer is electrically connected with lateral electrode, the second electrode lay
Electrically connected with the second termination electrode, so as to form the structure with electric capacity and resistant series, realize an electric capacity and resistance is integrated into
In discrete component, size is smaller, can easily be obtained by adjusting the resistivity of resistive layer and the shape of resistive layer and thickness
Different resistance values are obtained, by between the dielectric constant or regulation first electrode layer and the second electrode lay that adjust ceramic dielectric
Spacing and facing area can easily obtain different capacitances, and space is saved so as to be embodied as circuitry.
Brief description of the drawings
Fig. 1 is the structural representation of the composite electronic component of an implementation method；
Fig. 2 is the structural representation of the ceramic body of composite electronic component as shown in Figure 1；
Fig. 3 is the profile of composite electronic component as shown in Figure 1 parallel to the first side surface；
Fig. 4 is the top view of composite electronic component as shown in Figure 1；
Fig. 5 is the profile of composite electronic component as shown in Figure 1 parallel to the first first type surface；
Fig. 6 is another profile of composite electronic component as shown in Figure 1 parallel to the first first type surface；
Fig. 7 is the equivalent circuit diagram of composite electronic component as shown in Figure 1；
Fig. 8 is the structural representation of the composite electronic component of another implementation method；
Fig. 9 is the profile of composite electronic component as shown in Figure 8 parallel to the first side surface；
Figure 10 is the top view of composite electronic component as shown in Figure 8；
Figure 11 is the profile of composite electronic component as shown in Figure 8 parallel to the first first type surface；
Figure 12 is another profile of composite electronic component as shown in Figure 8 parallel to the first first type surface；
Figure 13 is the equivalent circuit diagram of composite electronic component as shown in Figure 8；
Figure 14 is the flow chart of the preparation method of the composite electronic component of an implementation method；
Figure 15 is the silk-screen patterns of the resistive layer of composite electronic component as shown in Figure 1；
Figure 16 is the silk-screen patterns of the resistive layer of composite electronic component as shown in Figure 8；
Figure 17 is the flow chart of the preparation method of the ceramic body of an implementation method；
Figure 18 is the silk screen figure of the first electrode layer and the second electrode lay such as Fig. 1 and composite electronic component as shown in Figure 8
Case.
Specific embodiment
To enable above-mentioned purpose of the present utility model, feature and advantage more obvious understandable, below in conjunction with the accompanying drawings to this
The specific embodiment of utility model is described in detail.Elaborate many details in order to abundant in the following description
Understand the utility model.But the utility model can be implemented with being much different from other manner described here, this area
Technical staff can do similar improvement in the case of without prejudice to the utility model intension, therefore the utility model does not receive following public affairs
The limitation of the specific implementation opened.
Refer to Fig. 1, the composite electronic component 100 of an implementation method, including ceramic body 10, lateral electrode 201, first end electricity
Pole 221, the second termination electrode 222 and resistive layer 20.
The shape of ceramic body 10 can be the stereochemical structure with apparent surface two-by-two, for example, cuboid, prismatoid or rib
Cylinder etc..In present embodiment, the structure of ceramic body 10 refers to Fig. 2, and the substantially cuboid of ceramic body 10, ceramic body 10 has
Have the first first type surface 01 relative to each other and the second first type surface 02, the first side surface 03 relative to each other and the second side surface 04 with
And first end face 05 and second end face 06 relative to each other.
It should be noted that herein, the first first type surface 01, the second first type surface 02, the first side surface 03, the second side surface
04th, the name of first end face 05 and second end face 06 and numbering are merely to the convenience of description, is not to space structure
Limit.Ceramic body 10 is cuboid, and cuboid is made up of six faces, and relative face area equation can have two in six faces
Individual face, four faces or six faces are rectangular for that can have two faces, four faces or six faces in square, or six faces
Shape.
Specifically, the first first type surface 01 is relative and parallel with the second first type surface 02, the first side surface 03 and the second side surface
04 is relative and parallel, and first end face 05 is relative and parallel with second end face 06.
Refer to Fig. 3, composite electronic component 100 parallel to the first side surface 03 a profile, inside ceramic body 10
Filled with ceramic dielectric 11, multiple first electrode layers 101 and multiple the second electrode lays 102, first are interspersed with ceramic dielectric 11
Electrode layer 101 is alternately laminated with the second electrode lay 102, and projection of the first electrode layer 101 on the second electrode lay 102 and the
Two electrode layers 102 have lap, and ceramic dielectric 11 is filled between first electrode layer 101 and the second electrode lay 102.First
The first side surface 03 or the second side surface 04 are exposed at electrode layer 101 at least, at the second electrode lay 102 at least outside
It is exposed to second end face 06.
Specifically, ceramic dielectric 11 can be the state and integrated each other so that adjacent ceramic medium 11 cannot be confirmed of sintering
Between border.First electrode layer 101 and the second electrode lay 102 are interspersed between ceramic dielectric 11, and first electrode layer 101
Ceramic dielectric 11 is filled between the second electrode lay 102, so as to form multiple electric capacity.
Specifically, the material of ceramic dielectric 11 mainly has barium titanate ceramics.Barium titanate ceramics have dielectric constant higher,
So that the capacitance swing of the composite component 100 that can be prepared is wider.
Specifically, first electrode layer 101 and the second electrode lay 102 are relative and be arranged in parallel.Further, first electrode layer
101 and the second electrode lay 102 parallel to the first first type surface 01 and the second first type surface 02.It is arranged in parallel and is conducive to increasing first electrode
The facing area of layer 101 and the second electrode lay 102, improves capacitance.
Lateral electrode 201 is attached on the first side surface 03 or the second side surface 04, first electrode layer 101 and lateral electrode
201 electrical connections.Specifically, can be that each first electrode layer 101 is electrically connected with the formation of lateral electrode 201 respectively.
Specifically, lateral electrode 201 can be attached on the first side surface 03, it is also possible to be attached on the second side surface 04,
Or lateral electrode 201 can be attached on the first side surface 03 with a part, another part is attached on the second side surface 04.
Specifically, lateral electrode 201 can also be extended a distance on the first first type surface 01, lateral electrode 201 is in the first master
Extension on surface 01 with so as to the forming part lap of resistive layer 20 so that lateral electrode 201 and resistive layer 20
The effect of electrical contact is good.
In present embodiment, lateral electrode 201 includes the first connection electrode 2011 and the second connection electrode 2012.First connection
Electrode 2011 is attached on the first side surface 03, and the second connection electrode 2012 is attached on the second side surface 04.First connection electricity
Pole 2011 is spaced with the second connection electrode 2012.The one end of first electrode layer 101 electrically connects with the first connection electrode 2011, the
The other end of one electrode layer 101 is electrically connected with the second connection electrode 2012.On the first side surface 03 and the second side surface 04
Lateral electrode is respectively provided with, is easy to position lateral electrode, while first electrode layer 101 can be selected freely at one or many places and lateral electrode
201 form electrical connection, so as to adjust the resistance value for meeting electronic component 100.
In present embodiment, the first connection electrode 2011 is relative and parallel with the second connection electrode 2012.
Specifically, resistive layer 20 is attached on the first first type surface 01 of ceramic body 10, resistive layer 20 is electrically connected with lateral electrode 201
Connect.First termination electrode 221 is attached in first end face 05, and the second termination electrode 222 is attached in second end face 06, the first termination electrode
221 are electrically connected with resistive layer 20, and the second termination electrode 222 is electrically connected with the second electrode lay 202.
First termination electrode 221 is electrically connected with resistive layer 20, and resistive layer 20 is electrically connected with lateral electrode 201, equivalent to first end
There is electric resistance structure between electrode 221 and lateral electrode 201.Lateral electrode 201 is electrically connected with first electrode layer 101, the second electrode lay
1022 electrically connect with the second termination electrode 222.After connection when the first termination electrode 221 and the second termination electrode 222 and with external power source, pottery
Multiple first electrode layers 101 of porcelain body 10 and multiple the second electrode lays 102 form multiple electric capacity being connected in parallel, i.e. multi-layer ceramics
Capacitor arrangement.Resistive layer 20 is constituted with multilayer ceramic capacitor to the part between lateral electrode 201 in the first termination electrode 221 and gone here and there
It is coupled structure.Therefore composite electronic component 100 realizes an electric capacity and resistance is integrated into discrete component, and size is smaller, Neng Gouwei
Circuitry saves space.By the facing area, the first electrode layer 101 that adjust first electrode layer 101 and the second electrode lay 102
Different capacitances, and group can be easily obtained with the dielectric constant of the spacing of the second electrode lay 102 and ceramic body 10
Multilayer ceramic capacitor into composite electronic component 100 can provide capacitance higher.By the resistance for adjusting resistive layer 20
The shape and thickness of rate and resistive layer 20 can easily obtain different resistance values.
Specifically, the top view of composite electronic component 100 refers to Fig. 4, resistive layer 20 includes first resistor portion 21 and the
, there is angle, first resistor portion 21 and second resistance portion 22 between first resistor portion 21 and second resistance portion 22 in two resistance sections 22
Electrical connection, first resistor portion 21 electrically connects away from the one end in second resistance portion 22 with the first termination electrode 221, and second resistance portion 22 is remote
One end from first resistor portion 21 electrically connects with lateral electrode 201.The resistance value in first resistor portion 21 and second resistance portion 22 can be with
Identical or difference.By setting first resistor portion 21 and second resistance portion 22, can more flexible adjusting resistance value so that
The scope of application of composite electronic component 10 is wider.
Further, the angle between first resistor portion 21 and second resistance portion 22 is 60 °~120 °.First resistor portion 21
There is certain angle between second resistance portion 22, be easy to the length corresponding with second resistance portion 22 of regulation first resistor portion 21
Degree, flexible modulation resistance value.
Further, the angle between first resistor portion 21 and second resistance portion 22 is 90 °.First resistor portion 21 and
The combination of two resistance section 22 forms the resistive layer 20 of " L " shape.The resistive layer 20 of " L " shape is covered on the first first type surface 01, the first electricity
Resistance part 21 electrically connects with the first termination electrode 221, and second resistance portion 22 electrically connects with lateral electrode 201.Further, second resistance portion
22 electrically connect with the second connection electrode 2012.
Further, the first termination electrode 221 the first first type surface 01, the second first type surface 02 abutted with first end face 05,
First side surface 03 and the second side surface are respectively extended a distance on 04 4 surfaces, and the distance of extension is expressed as in Fig. 1
D1.Extension of first termination electrode 221 on the first first type surface 01 has lap with resistive layer 20.First termination electrode 221
Part covering resistive layer 20, the first termination electrode 221 is larger with the contact area of resistive layer 20, so as to by the first termination electrode 221 and
Resistive layer 20 is electrically connected, and the effect of electrical contact is good.
In one embodiment, width of the width of lateral electrode 201 more than second resistance portion 22 so that lateral electrode 201
Positioning is more convenient, and is easy to adjusting resistance value.
Second termination electrode 222 is in the first first type surface 01, the second first type surface 02, the first side surface abutted with second end face 06
03 and 04 4 surfaces of the second side surface on respectively extend a distance into, the distance of extension is expressed as D2 in Fig. 1.Second end electricity
Pole 222 respectively extends a distance on the four surfaces at one, is easy to coat second end face 06 completely, so that the second termination electrode 222
Formed between the second electrode lay 102 and electrically connected.
It is a profile of the composite electronic component 100 parallel to the first first type surface 01, Fig. 6 to refer to Fig. 5 and Fig. 6, Fig. 5
It is composite electronic component 100 parallel to another profile of the first first type surface 01.In present embodiment, first electrode layer 101
One end electrically connected with the first connection electrode 2011, the other end of first electrode layer 101 is electrically connected with the second connection electrode 2012.
First electrode layer 101 also includes the small electrode layer 103 near the first termination electrode 221, and small electrode layer 103 is the product of allowance
Thing, be when being cut to ceramic body, in order that one end of the second electrode lay 102 can expose to second end face 06, so that
The small electrode layer 103 of a remaining part is in another ceramic body.It is appreciated that small electrode layer 103 is for whole compound electric
Subcomponent 100 functionally for be not necessary, and influence is not produced on the performance of composite electronic component 100, but set
Put small electrode layer 103 and be easy to cutting processing, realize industrialized batch production.The electricity of 102 and second termination electrode of the second electrode lay 222
Connection.Specifically, the equivalent circuit diagram of the composite electronic component 100 of present embodiment is as shown in fig. 7, the resistive layer 20 of " L " shape
It is equivalent that into two resistance of series connection, the first termination electrode (V1) is connected in series with electric capacity (C) again after being connected with two resistance (R), and two
The resistance value of individual resistance (R) can with it is equal can also be different.Electric capacity (C) is connected with the second termination electrode (V2), and electric capacity (C) includes many
Individual sub- electric capacity in parallel.I.e. first electrode layer 101 is electrically connected with the second connection electrode 2012, the second connection electrode 2012 and resistance
Layer 20 is electrically connected, and resistive layer 20 is electrically connected with the first termination electrode 221, so that the structure with electric capacity and resistant series is formed, it is real
Show and electric capacity and resistance have been integrated into discrete component, size is smaller.Resistance value can be adjusted flexibly, make composite electronic component
100 adapt to different applied environments.
In another embodiment, Fig. 8~Figure 12, the structure of composite electronic component 100 and answering shown in Fig. 1 are referred to
Close electronic component 100 similar, unlike, resistive layer 20 includes first resistor portion 21, second resistance portion 22 and 3rd resistor portion
23, first resistor portion 21, second resistance portion 22 and 3rd resistor portion 23 cross to form intersectional region, first resistor portion 21, second
Resistance section 22 and 3rd resistor portion 23 are electrically connected to each other.The one end and the first termination electrode of first resistor portion 21 away from intersectional region
221 electrical connections, second resistance portion 22 electrically connects away from one end of intersectional region with the second connection electrode 2012,3rd resistor portion 23
One end away from intersectional region electrically connects with the first connection electrode 2011.
Specifically, there is angle between first resistor portion 21 and second resistance portion 22, first resistor portion 21 and 3rd resistor
There is angle between portion 23, angle can be drawn a straight line or existed between second resistance portion 22 and 3rd resistor portion 23.
In present embodiment, the combination of first resistor portion 21, second resistance portion 22 and 3rd resistor portion 23 forms "T"-shaped electricity
Resistance layer 20."T"-shaped resistive layer 20 is covered on the first first type surface 01, and first resistor portion 21 electrically connects with the first termination electrode 221,
Second resistance portion 22 electrically connects with the second connection electrode 2012, and 3rd resistor portion 23 electrically connects with the first connection electrode 2011.It is logical
Setting first resistor portion 21, second resistance portion 22 and 3rd resistor portion 23 are crossed, can more flexible adjusting resistance value so that multiple
The scope of application for closing electronic component 100 is wider.Equivalent circuit diagram such as Figure 13 institutes of the composite electronic component 100 of the implementation method
Show.It is connected with a resistance (R) equivalent to the first termination electrode (V1), then resistance in parallel with two again (R) is connected in series, it
It is connected in series with electric capacity (C) afterwards, electric capacity (C) is connected with the second termination electrode (V2), electric capacity (C) includes multiple sub- electric capacity in parallel,
The resistance value of multiple resistance (R) can with it is equal can also be different.The composite electronic component 100 of this structure, by one layer of resistance
Layer 20, realizes connecting multiple resistance between the first termination electrode 221 and lateral electrode 201, can flexible resistance value so that compound electric
Subcomponent 100 is more widely applied.
Above-mentioned composite electronic component 100, resistive layer 20 is attached to the first first type surface 01 of ceramic body, the first termination electrode 221
Electrically connected with resistive layer 20, resistive layer 20 is electrically connected with lateral electrode 201, in ceramic body at first electrode layer 101 at least outside
The first side surface 03 or the second side surface 04 are exposed to, second end face 06 is exposed at the second electrode lay 102 at least.First electricity
Pole layer 101 is electrically connected with lateral electrode 201, and the second electrode lay 102 is electrically connected with the second termination electrode 222, so as to be formed with electric capacity
With the structure of resistant series, realize an electric capacity and resistance is integrated into discrete component, size is smaller, by adjusting resistive layer 20
Resistivity and the shape and thickness of resistive layer 20 can easily obtain different resistance values, by adjusting ceramic dielectric
Spacing and facing area between dielectric constant or regulation first electrode layer 101 and the second electrode lay 102 can be easily
Different capacitances are obtained, space is saved so as to be embodied as circuitry.
Additionally, the utility model also provides the preparation method of above-mentioned composite electronic component 100.
The flow chart of the preparation method of the composite electronic component of one implementation method as shown in figure 14, comprises the following steps S110
~S140.
S110, offer ceramic body.
Wherein, the shape of ceramic body can be the stereochemical structure with apparent surface two-by-two, for example, cuboid, prismatoid
Or prism etc..In present embodiment, the ceramic body is cuboid, and ceramic body has the first first type surface relative to each other and the
Two first type surfaces, the first side surface relative to each other and the second side surface and first end face and second end face relative to each other.Pottery
Porcelain body inside is filled with ceramic dielectric, and multiple first electrode layers and multiple the second electrode lays, the first electricity are interspersed with ceramic dielectric
Pole layer is alternately laminated with the second electrode lay, and first electrode layer projection on the second electrode layer has weight with the second electrode lay
Folded part.Ceramic dielectric is filled between first electrode layer and the second electrode lay, the is exposed at first electrode layer at least
One side surface or the second side surface, second end face is exposed at the second electrode lay at least.
The first side surface or the second side surface are exposed at first electrode layer at least, at the second electrode lay at least
Second end face is exposed to, is easy to first electrode layer to be formed with the second termination electrode with lateral electrode and the second electrode lay and is electrically connected.
S120, the covering resistance slurry formation resistive layer on the first first type surface of ceramic body.
Specifically, resistance slurry can be ruthenium system resistance slurry.
Resistance slurry can be covered on the first major surface by modes such as dipping, coating or printings.
In present embodiment, by way of by silk-screen printing by resistance slurry covering on the first major surface.
Further, the silk-screen patterns of the resistive layer of composite electronic component as shown in Figure 1 are as shown in figure 15, dash area
Represent at printed resistor slurry.Specifically can in length and breadth be cut along a plurality of line of cut in Figure 15, so as to obtain preset shape
Resistive layer.As shown in figure 16, dash area represents printing electricity to the silk-screen patterns of the resistive layer of composite electronic component as shown in Figure 8
Resistance paste.Specifically can in length and breadth be cut along a plurality of line of cut in Figure 16, so as to obtain the resistive layer of preset shape.
S130, the covering electrode slurry formation lateral electrode on first side surface or the second side surface of ceramic body.
Wherein, first electrode layer is electrically connected with lateral electrode, and lateral electrode is electrically connected with resistive layer.
Specifically, electrode slurry can be covered in into the first side surface or second by modes such as dipping, coating or printings
On side surface, so as to form lateral electrode.
The electrode slurry for forming lateral electrode can be metal paste, be specifically as follows silver metal slurry etc..
In present embodiment, electrode slurry is coated on the first side surface and the second side surface, formation is attached to first
The first connection electrode and the second connection electrode being attached on the second side surface on side surface, the first connection electrode and second connect
The spaced insulation of receiving electrode.
S140, covering electrode slurry the first termination electrode of formation in the first end face of ceramic body, at the second end of ceramic body
Electrode slurry is covered on face and forms the second termination electrode, the first termination electrode electrically connects with resistive layer, the second termination electrode and second electrode
Layer electrical connection, obtains the composite electronic component.
Electrode slurry can be covered in first end face and second end face by modes such as dipping, coating or printings.
The electrode slurry for forming the first termination electrode and the second termination electrode can be metal paste, be specifically as follows silver metal slurry
Material etc..
Specifically, can be by first end electrode-covering portions resistive layer, so as to the first termination electrode and resistive layer are formed into electricity
Connection.
In present embodiment, first end face is immersed in electrode slurry so as to form the first termination electrode, by second end face
It is immersed in electrode slurry so as to form the second termination electrode.
Further, after covering resistance slurry and electrode slurry on ceramic body, by resistance slurry and electrode slurry
Sintering, the operation of sintering be specially under air atmosphere and 840 DEG C~850 DEG C at sinter silver metal slurry and resistance slurry.
Specifically, the flow chart of the preparation method of the ceramic body of an implementation method is as shown in figure 17, comprise the following steps
S210~S240.
S210, will ceramic powder, adhesive and organic solvent mix after obtain ceramic size, be raw material stream with ceramic size
Prolong to form multiple ceramic dielectric films.
Specifically, the consumption of adhesive is the consumption for making ceramic powder have enough plasticity, the consumption of organic solvent is foot
Ceramic powder is enough set to moisten the consumption for mixing.
In present embodiment, it is by the operation that ceramic powder, adhesive and organic solvent are well mixed：Will using ball-milling method
Ceramic powder, adhesive and organic solvent are well mixed.
Specifically, Ball-milling Time is 12h~16h.
Specifically, ceramic size has including 10 parts of ceramic powders, 3 parts~5 parts adhesives and 4 parts~6 parts according to the mass fraction
Machine solvent.
Ceramic powder can be barium titanate ceramics, and barium titanate ceramics have dielectric constant higher so that what can be prepared is compound
The capacitance swing of electronic component is wider.
Further, adhesive is polyvinyl butyral resin, and organic solvent is that quality parts ratio is 1:1~1.5:1 first
The mixed solvent of benzene and ethanol.
In the operation for preparing ceramic dielectric films as raw material with ceramic size, the tape casting can be used by ceramic size shape
Into ceramic dielectric films.
S220, print electrode slurry in the ceramic dielectric films of predetermined number, respectively obtains and is printed with first electrode layer
Ceramic dielectric films and the ceramic dielectric films for being printed with the second electrode lay.
After obtaining ceramic dielectric films, a part is selected to carry out the slurry that prints electrode as needed, so as to respectively obtain printing
The ceramic dielectric films for having first electrode layer and the ceramic dielectric films for being printed with the second electrode lay.
Specifically, the electrode slurry for forming first electrode layer and the second electrode lay can be silver palladium alloy metal paste.
Specifically, can be printed electrode in ceramic dielectric films slurry by silk-screen printing technique.
Further, the silk screen figure of the first electrode layer of composite electronic component as illustrated in figures 1 and 8 and the second electrode lay
As shown in figure 18, dash area represents the slurry that prints electrode to case.Specifically can in length and breadth be cut along a plurality of line of cut in Figure 18,
So as to obtain the first electrode layer and the second electrode lay of preset shape.
Print electrode after slurry, electrode pattern is formed on ceramic membrane, can obtain being printed with first electrode layer after drying
Ceramic dielectric films and be printed with the ceramic dielectric films of the second electrode lay.
S230, by ceramic dielectric films, be printed with the ceramic dielectric films of first electrode layer and be printed with the pottery of the second electrode lay
Ceramic dielectric film is alternately laminated to obtain layered product.
Wherein, first electrode layer is alternately laminated with the second electrode lay in layered product, and first electrode layer is in second electrode
Projection on layer has lap with the second electrode lay, and ceramic dielectric is filled between first electrode layer and the second electrode lay
Film.
Specifically, the ceramic dielectric films of first electrode layer will be printed with and the ceramic dielectric films friendship of the second electrode lay is printed with
For stacking, so as to form multilayer laminated capacitance structure.As needed, the ceramic dielectric of first electrode layer can also be printed with
At least one ceramic dielectric films are laminated between film and the ceramic dielectric films for being printed with the second electrode lay, to adjust capacitance.
Further, can also respectively be laminated multiple ceramic dielectric films to form difference on two relative surfaces of layered product
Two relative protective layers of side of covering layered product.
S240, layered product is pressed, ceramic body is obtained after sintering.
General, layered product isostatic pressing method can be pressed, closely bond each film layer in layered product；Then pre- scale is pressed
It is very little to cut layered product in length and breadth, obtain the layered product of multiple cuboids.
Specifically, also including the viscous operation of row after layered product pressing, the viscous detailed process of row is：Under air atmosphere, will
Layered product is heated to 350 DEG C~450 DEG C and is incubated 1 hour~3 hours to exclude adhesive.
The detailed process of sintering is：Under air atmosphere, the layered product that will be arranged after gluing is heated to 900 DEG C~1320 DEG C and protects
Temperature is sintered for 2 hours~3 hours, and ceramic body is obtained after the completion of sintering.
Ceramic body capacitance prepared by this method is high, and strong adaptability, energy storage effect is good.It will be appreciated, of course, that at other
In implementation method, it would however also be possible to employ different method prepares ceramic body, as long as ensureing that the structure and performance of ceramic body are conformed to
Ask.
Operation is simple for the preparation method of above-mentioned composite electronic component, can be used for large-scale industrial production.It is prepared into
The composite electronic component size for arriving is smaller, and can easily obtain different resistance values and capacitance, can be circuitry
Save space.
It is below specific embodiment part.
Embodiment 1
Prepare composite electronic component
1) ceramic body is prepared：Ceramic size is obtained after ceramic powder, adhesive and organic solvent are mixed, with ceramic size
Multiple ceramic dielectric films are formed for raw material is cast.Wherein, ceramic size includes 10 parts of ceramic powders, 4 parts of bondings according to the mass fraction
Agent and 5 parts of organic solvents.Ceramic powder is barium titanate ceramics, and adhesive is polyvinyl butyral resin, and organic solvent is mass fraction
Than being 1:1 toluene and the mixed solvent of ethanol.Print electrode slurry in multiple ceramic dielectric films, respectively obtains and is printed with
The ceramic dielectric films of one electrode layer and the ceramic dielectric films for being printed with the second electrode lay.The silk of first electrode layer and the second electrode lay
As shown in figure 18, dash area is represented at the slurry that prints electrode net pattern.To be printed with first electrode layer ceramic dielectric films and
The ceramic dielectric films for being printed with the second electrode lay alternately laminated obtain layered product.Every layer of two ends of first electrode layer are caused after cutting
The first side surface and the second side surface are respectively exposed to, one end of every layer of the second electrode lay exposes to second end face.By layered product
Pressing, obtains ceramic body after sintering.
2) resistive layer is formed on ceramic body, on the first major surface so as to obtain resistance in silk-screen printing resistance slurry
Layer, as shown in figure 15, the resistive layer for obtaining includes first resistor portion and second resistance portion, first to the screen printed pattern of resistive layer
Resistance section and second resistance portion connect to form " L " shape.
3) lateral electrode is formed on ceramic body：Electrode is respectively coated with first side surface and the second side surface of ceramic body
Slurry, forms the first connection electrode and the second connection electrode.Wherein, the connection electrode of first electrode layer one end first electrical connection, the
The other end of one electrode layer is electrically connected with the second connection electrode.Second connection electrode is electrically connected with one end of resistive layer.
4) termination electrode is formed on ceramic body：First end face is immersed in electrode slurry so as to form the first termination electrode,
First end electrode is partially covered on resistive layer.Second end face is immersed in electrode slurry so as to form the second termination electrode.
The composite electronic component concrete structure of the embodiment as shown in Fig. 1 and Fig. 3~Fig. 6, equivalent circuit such as Fig. 7 institutes
Show.
Embodiment 2
The method of the preparation of the present embodiment composite electronic component is similar to Example 1, unlike, formed on ceramic body
In the operation of resistive layer, as shown in figure 16, the resistive layer for obtaining includes first resistor portion, second to the screen printed pattern of resistive layer
Resistance section and 3rd resistor portion, first resistor portion, second resistance portion and 3rd resistor portion connect to form "T"-shaped.
The composite electronic component concrete structure of the embodiment is as shown in Fig. 8~Figure 12, and equivalent circuit is as shown in figure 13.
The capacitance and resistance value of the composite electronic component of test above-described embodiment 1 and embodiment 2, tester use peace
Prompt human relations E4980A precisions LCR tables, test frequency is 1.0KHz, and test voltage is 1.0Vrms.Test result is as shown in table 1.
Table 1：Test result
| Rated capacitance | Actual measurement capacitance | Normal resistance | Actual measurement resistance value | |
| Embodiment 1 | 100nF | 94.3nF | 33Ω | 31.9Ω |
| Embodiment 2 | 100nF | 102.8nF | 22Ω | 21.7Ω |
As shown in Table 1, the composite electronic component static capacity of embodiment 1 and embodiment 2 is high, can be obtained by the change of structure
Obtain the composite electronic component of different resistance values.
Embodiment described above only expresses several embodiments of the present utility model, and its description is more specific and detailed,
But therefore can not be interpreted as the limitation to the utility model the scope of the claims.It should be pointed out that common for this area
For technical staff, without departing from the concept of the premise utility, various modifications and improvements can be made, these all belong to
In protection domain of the present utility model.Therefore, the protection domain of the utility model patent should be determined by the appended claims.
Claims (10)
1. a kind of composite electronic component, it is characterised in that including ceramic body, lateral electrode, the first termination electrode, the second termination electrode and
Resistive layer；
The ceramic body has the first first type surface and the second first type surface, the first side surface and second relative to each other relative to each other
Side surface and first end face and second end face relative to each other, the ceramic body are filled with ceramic dielectric, the ceramics
Multiple first electrode layers and multiple the second electrode lays are interspersed with medium, the first electrode layer replaces with the second electrode lay
Stacking, and projection of the first electrode layer on the second electrode lay has lap with the second electrode lay,
The ceramic dielectric, the first electrode layer at least are also filled between the first electrode layer and the second electrode lay
Place exposes to first side surface or second side surface, and described second is exposed at the second electrode lay at least
End face；
The lateral electrode is attached on first side surface or second side surface, the first electrode layer and the side
Electrode is electrically connected；
The resistive layer is attached on first first type surface, and the resistive layer is electrically connected with the lateral electrode；
First termination electrode is attached in the first end face, and second termination electrode is attached in the second end face, institute
State the first termination electrode to be electrically connected with the resistive layer, second termination electrode is electrically connected with the second electrode lay.
2. composite electronic component according to claim 1, it is characterised in that first termination electrode with the first end
First first type surface, second first type surface, four tables of first side surface and second side surface of face adjoining
Respectively extended a distance on face, extension of first termination electrode on first first type surface has weight with the resistive layer
Folded part.
3. composite electronic component according to claim 1, it is characterised in that the resistive layer includes first resistor portion and the
, there is angle, the first resistor portion and described second between the first resistor portion and the second resistance portion in two resistance sections
Resistance section is electrically connected, and the first resistor portion electrically connects away from the one end in the second resistance portion with first termination electrode, institute
One end that second resistance portion is stated away from the first resistor portion electrically connects with the lateral electrode.
4. composite electronic component according to claim 3, it is characterised in that the first resistor portion and the second resistance
Angle between portion is 60 °~120 °.
5. composite electronic component according to claim 3, it is characterised in that the first resistor portion and the second resistance
Combine the resistive layer to form " L " shape in portion.
6. composite electronic component according to claim 1, it is characterised in that the lateral electrode include the first connection electrode and
Second connection electrode, first connection electrode is attached on first side surface, and second connection electrode is attached to institute
State on the second side surface, first connection electrode is spaced with second connection electrode, described first electrode layer one end
Electrically connected with first connection electrode, the other end of the first electrode layer is electrically connected with second connection electrode.
7. composite electronic component according to claim 6, it is characterised in that the resistive layer includes first resistor portion, the
Two resistance sections and 3rd resistor portion, the first resistor portion, so second resistance portion and the 3rd resistor portion cross to form friendship
Remittance region, the first resistor portion, the second resistance portion and the 3rd resistor portion are electrically connected to each other, the first resistor
Portion electrically connects away from one end of the intersectional region with first termination electrode, and the second resistance portion is away from the intersectional region
One end electrically connected with second connection electrode, the one end and described first of the 3rd resistor portion away from the intersectional region
Connection electrode is electrically connected.
8. composite electronic component according to claim 1, it is characterised in that the lateral electrode is on first first type surface
Extend a distance into, extension of the lateral electrode on first first type surface has lap with the resistive layer.
9. composite electronic component according to claim 1, it is characterised in that second termination electrode with second end
First first type surface, second first type surface, four tables of first side surface and second side surface of face adjoining
Respectively extended a distance on face.
10. composite electronic component according to claim 1, it is characterised in that the first electrode layer and second electricity
Pole layer is relative and be arranged in parallel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621105334.6U CN206210614U (en) | 2016-09-30 | 2016-09-30 | Composite electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621105334.6U CN206210614U (en) | 2016-09-30 | 2016-09-30 | Composite electronic component |
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| Publication Number | Publication Date |
|---|---|
| CN206210614U true CN206210614U (en) | 2017-05-31 |
Family
ID=58762083
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621105334.6U Active CN206210614U (en) | 2016-09-30 | 2016-09-30 | Composite electronic component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206210614U (en) |
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2016
- 2016-09-30 CN CN201621105334.6U patent/CN206210614U/en active Active
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