CN208094890U - A kind of bank structure of circuit connecting wire - Google Patents
A kind of bank structure of circuit connecting wire Download PDFInfo
- Publication number
- CN208094890U CN208094890U CN201820567975.6U CN201820567975U CN208094890U CN 208094890 U CN208094890 U CN 208094890U CN 201820567975 U CN201820567975 U CN 201820567975U CN 208094890 U CN208094890 U CN 208094890U
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- contact wires
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Abstract
The utility model discloses a kind of bank structures of circuit connecting wire, including substrate, chip and circuit interface is arranged in substrate upper end, the interface of chip is connected to form circuit by metal contact wires and circuit interface, metal contact wires are node A with chip connecting points, and metal contact wires are node C with circuit interface tie point, and vertical ranges of the node C apart from substrate is less than the vertical range of node A and substrate, further include node B between node A, C, node B is located in node A and substrate vertical direction；Node D is additionally provided between node B and node C, node D makes the BD sections of metal contact wires have angle with DC sections of shapes.The utility model makes the BD sections of metal contact wires have angle with DC sections of shapes by increasing node D, the damping characteristics of bank have been effectively ensured, effectively it is greatly reduced the stress damage of metal contact wires, rosin joint fraction defective to reduce metal contact wires generates, and improves the process rate and reliability of product.
Description
Technical field
The utility model is related to circuit connection area, the bank structure of especially a kind of circuit connecting wire.
Background technology
For photoelectrical coupler as a kind of photoelectric device, main composition is the conversion of electrical-optical-electrical, and actually uses application
In the process, it needs to connect the internal circuit configuration of photoelectrical coupler by solder bonds wire rod, and in photoelectrical coupler
Transmitting terminal and primary circuit between connection be easy to happen problem of faulty soldering, and photoelectrical coupler receiving terminal side is without generation
This problem under conditions of same making technology and raw material, but generates such difference, through analysis product structure and system
Cheng Yinsu, such as Figure of description 1, discovery is after transmitting terminal does silica gel protected operation, the colloid meeting wrapping portion bank of silica gel, i.e.,
The Cushioning Design of bank A-B points is covered by silica gel, then integrally i.e. B-C sections of wire rod of bonding becomes straight line connection to bank, makes bank
Structure can not form effective buffer protection, cause be stressed the when of pullling make metal contact wires be easy to cause disconnection or by
It damages, the disconnection at especially node C or problem of faulty soldering that is impaired and being formed.
Invention content
In order to solve the above technical problems, the utility model provides a kind of bank structure of circuit connecting wire, can have
Effect avoids the problem that metal contact wires stress is pullled and causes to disconnect or be damaged and cause rosin joint.
Technical solution adopted by the utility model to solve its technical problems is：A kind of bank structure of circuit connecting wire,
Including substrate, the substrate upper end setting chip and circuit interface, the interface of the chip are connect by metal contact wires and circuit
Mouth is connected to form circuit, and the metal contact wires are node A with chip connecting points, and metal contact wires are with circuit interface tie point
The vertical range of node C, the node C apart from substrate is less than the vertical range of node A and substrate, between described node A, C also
It is located on node A and substrate vertical direction including node B, node B；Node D, institute are additionally provided between the node B and node C
Stating node D makes the BD sections of metal contact wires have angle with DC sections of shapes.
Further, the angle that the BD sections of the metal contact wires are formed with DC sections is obtuse angle.
Further, the BD sections of the metal contact wires are parallel with plane residing for substrate.
Further, the angle that the CD sections of the metal contact wires are formed with plane residing for substrate is 40 ° -50 °.
Further, the angle that the CD sections of the metal contact wires are formed with plane residing for substrate is 45 °.
Further, the metal contact wires are bonding wire rod.
The utility model has the beneficial effects that：Make the BD sections and DC sections of one folders of formation of metal contact wires by increasing node D
The damping characteristics of bank can be effectively ensured in angle, form good buffering effect, effectively damage the stress of metal contact wires
Wound is greatly reduced, and to reduce rosin joint fraction defective, improves the process rate and reliability of product.
Description of the drawings
The utility model is further illustrated with reference to the accompanying drawings and examples.
Fig. 1 is the metal contact wires structural schematic diagram of the prior art in this field.
Fig. 2 is a kind of structural schematic diagram of preferred embodiment of the utility model.
Specific implementation mode
In order to make the purpose of the utility model, technical solutions and advantages more clearly understood, below with reference to embodiment and
The technique effect of the design of the utility model, concrete structure and generation is clearly and completely described in attached drawing, with fully geographical
Solve the purpose of this utility model, feature and effect.Obviously, described embodiment is that the part of the utility model is implemented
Example, rather than whole embodiments, other realities that those skilled in the art is obtained without creative efforts
Example is applied, the range of the utility model protection is belonged to.
It is described for a kind of preferably embodiment, a kind of bank structure of circuit connecting wire, including substrate 4 with reference to Fig. 2
Chip 2 is arranged in 4 upper end of substrate and circuit interface, the interface of the chip 2 are connected to form by metal contact wires 1 with circuit interface
Circuit, the metal contact wires 1 are node A with chip connecting points, and metal contact wires 1 are node C, institute with circuit interface tie point
The vertical range that vertical ranges of the node C apart from substrate 4 is less than node A and substrate 4 is stated, further includes knot between described node A, C
Point B, node B be located at node A in 4 vertical direction of substrate；Node D, the knot are additionally provided between the node B and node C
Point D makes the BD sections of metal contact wires 1 have angle with DC sections of shapes.
In the present embodiment, in order to which metal contact wires 1 have a good damping characteristics, the BD sections of the metal contact wires 1 with
The angle of DC sections of formation need to be obtuse angle.
In the present embodiment, the chip 2 used is the infrared emission chip of photoelectrical coupler, the weldering of 1 node A of metal contact wires
The place of connecing is the electrode area of infrared emission chip, and 1 node C welds of metal contact wires are one end in primary circuit, to make light
The infrared emission chip of electric coupler connect to form primary Ioops with primary circuit, because transmitting endpoint need to carry out dispensing operation, therefore ties
Point A, B point can be covered by silica gel 3 to be wrapped up in, then it is chip 2 i.e. 1.5 times of infrared emission chip height to make the length of node A, B, and golden
The included angle of the CD sections and plane residing for substrate 4 that belong to connecting line 1 is the BD sections and substrate of 40 ° -50 ° and metal contact wires 1
Plane residing for 4 is parallel, the position of node D is can determine in turn using above-mentioned 3 parameters, so as to form specific bank shape
Structure.By extending with the height of 2 transmitting terminal of chip welding and utilizing the CD sections and substrate 4 of metal contact wires 1 in the present embodiment
The included angle of residing plane is 40 ° -50 °, is conducive to the damping characteristics for improving node A and node C pads, while will not shadow
Product pressure resistance safe insulation distance is rung, described node A, B, D, C are generally aligned in the same plane CD sections and base interior and in metal contact wires 1
When the included angle of plane residing for plate 4 is 45 °, the damping characteristics of bank are can further improve, good buffering effect is formed, from
And the stress damage that product is generated in processing procedure process is reduced to generation that is minimum, and reducing rosin joint fraction defective, improve processing procedure
Yield improves the reliability of product.
Further, in the present embodiment, metal contact wires 1 and the welding process of primary circuit one end are by metal contact wires 1
Node C forms one by thickness to thin tie point, therefore when generating stress, is easiest to the place for occurring to disconnect and be damaged
That node D is added in the present embodiment at node C, can effectively avoid stress pull cause two solder joints i.e. C nodes disconnect or it is impaired and
Rosin joint is led to the problem of, while also improving the whole damping characteristics of metal contact wires 1.
Further, the metal contact wires 1 are bonding wire rod, using bonding wire rod, because bonding wire rod is than general metal
Line has more preferably electric conductivity, solderability, reflective and thermal diffusivity, and good conductivity can guarantee the connection of circuit；It is good can
Weldering property and reflective can guarantee that welding job smoothly completes；Thermal diffusivity is good, can avoid when circuit is connected, because of Joule's law,
Metal contact wires 1 cause metal contact wires to fuse when the temperature is excessively high.
The above, the only better embodiment of the utility model, but the utility model is not limited to above-mentioned reality
Example is applied, as long as it reaches the technique effect of the utility model with any same or similar means, should all belong to the utility model
Protection domain.
Claims (6)
1. a kind of bank structure of circuit connecting wire, including substrate (4), substrate (4) the upper end setting chip (2) and circuit connect
Mouthful, the interface of the chip (2) is connected to form circuit, the metal contact wires (1) by metal contact wires (1) and circuit interface
It is node A with chip connecting points, metal contact wires (1) are node C with circuit interface tie point, and the node C is apart from substrate (4)
Vertical range be less than the vertical range of node A and substrate (4), further include node B between described node A, C, node B, which is located at, to be tied
On point A and substrate (4) vertical direction；It is characterized in that：Node D, the node D are additionally provided between the node B and node C
The BD sections and DC sections of shapes for making metal contact wires (1) have angle.
2. the bank structure of circuit connecting wire according to claim 1, it is characterised in that：The metal contact wires (1)
The BD sections of angles formed with DC sections are obtuse angle.
3. the bank structure of circuit connecting wire according to claim 1, it is characterised in that：The metal contact wires (1)
BD sections parallel with plane residing for substrate (4).
4. the bank structure of circuit connecting wire according to claim 1, it is characterised in that：The metal contact wires (1)
The CD sections of angles formed with plane residing for substrate (4) are 40 ° -50 °.
5. the bank structure of circuit connecting wire according to claim 3, it is characterised in that：The metal contact wires (1)
The CD sections of angles formed with plane residing for substrate (4) are 45 °.
6. the bank structure of circuit connecting wire according to claim 1, it is characterised in that：The metal contact wires (1) are
It is bonded wire rod.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820567975.6U CN208094890U (en) | 2018-04-19 | 2018-04-19 | A kind of bank structure of circuit connecting wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820567975.6U CN208094890U (en) | 2018-04-19 | 2018-04-19 | A kind of bank structure of circuit connecting wire |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208094890U true CN208094890U (en) | 2018-11-13 |
Family
ID=64056643
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820567975.6U Active CN208094890U (en) | 2018-04-19 | 2018-04-19 | A kind of bank structure of circuit connecting wire |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208094890U (en) |
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2018
- 2018-04-19 CN CN201820567975.6U patent/CN208094890U/en active Active
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