CN103633530B - A kind of interconnecting method for coaxial adatpter and printed board transmission line - Google Patents
A kind of interconnecting method for coaxial adatpter and printed board transmission line Download PDFInfo
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- CN103633530B CN103633530B CN201310634855.5A CN201310634855A CN103633530B CN 103633530 B CN103633530 B CN 103633530B CN 201310634855 A CN201310634855 A CN 201310634855A CN 103633530 B CN103633530 B CN 103633530B
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- printed board
- inner wire
- transmission line
- plated copper
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Abstract
The invention provides a kind of interconnecting method for coaxial adatpter and printed board transmission line, step 101: provide a coaxial adatpter and a printed board and be assembled in aluminium alloy box body, described coaxial adatpter inner wire and described printed board transmission line form junction to be welded; Step 102: gold plated copper strip is squeezed into step shape; Step 103: gold plated copper strip two ends are interconnected with described inner wire and described transmission line soldering respectively; Step 104: cleaning solder joint is also checked.Adopt such scheme, enable to play cushioning effect when larger environment and temperature change between coaxial adatpter inner wire and printed board transmission line, greatly reduce the failure probability of pad, avoid in this Hard link of direct soldering because of interconnect failure that coefficient of thermal expansion mismatch causes.
Description
Technical field
The invention belongs to microwave module packaging technology field, in particular a kind of interconnecting method for coaxial adatpter and printed board transmission line.
Background technology
In microwave hybrid integrated circuit, microwave multifunction module, often run into the interconnection between coaxial adatpter and printed board transmission line, under current most cases, adopt the interconnecting method of direct soldering.This interconnection structure belongs to Hard link, when ambient temperature or working temperature acute variation, Coefficient of Thermal Expansion mismatch problem is there is between the inner wire of coaxial adatpter and printed board material, solder joint inside is caused to there is stress and strain, thus bring out the inner crack initiation of solder joint, expansion along with crackle finally causes solder joint to rupture, lost efficacy, and therefore there is long-term reliability hidden danger to the quality of product.
Number of patent application: 201110165950.6 welding methods disclosing a kind of coaxial diode and printed board, the method at diode cathode gold plated copper strip as Stress Release bridge, replace original solder Hard link, solve the stress problem that the longitudinal thermal coefficient of expansion of printed board causes.
The assembly method of number of patent application 201310187995.2 proposes a kind of high-performance broadband coaxial-micro-tape relay of ceramic dielectric substrate, in the method, the assembling of coaxial adatpter inner wire and the micro-tape relay of ceramic dielectric substrate adopts gold ribbon to wrap up the mode of also thermocompression bonding.
Welding method disclosed in number of patent application 201110165950.6, although indicate and replace original solder Hard link with gold plated copper strip as Stress Release bridge, but do not provide the bending shape of gold plated copper strip, deflection and preparation method thereof, because when gold plated copper strip is directly applied to the welding of coaxial adatpter inner wire and printed board transmission line as Stress Release bridge, the parameter such as bending shape, deflection of gold plated copper strip is very large on the impact of its microwave property.
The interconnecting method that number of patent application 201310187995.2 discloses, although indicate that coaxial adatpter inner wire and ceramic dielectric substrate transfer line interconnect to wrap up with gold ribbon and the mode that is flexible coupling of thermocompression bonding replaces original conductive adhesive or directly soldering, but, gold ribbon wraps up and the mode of thermocompression bonding has special requirement to gold plating quality on transmission line and thickness, and the hard gold that the transmission line in printed board adopts plating thinner usually, gold ribbon parcel cannot be met and the technological requirement of thermocompression bonding, the mode of solder soldering can only be adopted at present to weld, therefore, said method is not suitable for the interconnection of coaxial adatpter inner wire and printed board transmission line yet.
Therefore, prior art existing defects, needs to improve.
Summary of the invention
Technical problem to be solved by this invention is for the deficiencies in the prior art, provides a kind of interconnecting method for coaxial adatpter and printed board transmission line.
Technical scheme of the present invention is as follows: a kind of interconnecting method for coaxial adatpter and printed board transmission line, wherein, comprises the following steps:
Step a: provide a coaxial adatpter and a printed board and be assembled in aluminium alloy box body, described coaxial adatpter inner wire and described printed board transmission line form junction to be welded;
Step b: gold plated copper strip is squeezed into step shape;
Step c: gold plated copper strip two ends are interconnected with described inner wire and described transmission line soldering respectively;
Steps d: cleaning solder joint is also checked.
In described step a, the diameter of described coaxial adatpter inner wire is 0.3-0.8mm; The basis material of described inner wire is that copper maybe can cut down.
In described step a, it is 0-0.3mm that described coaxial adatpter inner wire and described printed board transmission line form the staggered distance of junction to be welded, and vertical height distance is 0.05-0.25mm.
In described step a, the dielectric material of described printed board is
6202, R04003C or R04350B.
In described step b, the basis material of described gold plated copper strip is red copper alloy, and thickness is 10-30 μm, and plating oil gidling layer thickness is 0.1-0.5 μm.
In described step b, use frock that gold plated copper strip is converted into step shape, concrete method is: adopt special concave-convex mold fixture to be carried out by gold plated copper strip extruding, Shape correction, is processed into step shape.
In described step c, the material of described scolding tin is Sn60Pb40 or Sn63Pb37.
In described step c, the gold plated copper strip total length after described soldering interconnection is by with the coaxial adatpter inner wire solder joint lap of splice, with overlap joint line horizontal extension length, upper arc length, vertical-direction length, the lower arc length of coaxial adatpter inner wire solder joint with form with the lap of splice six part of printed board transmission line solder joint; The gold plated copper strip length that described coaxial adatpter inner wire and printed board transmission line solder joint overlap is the 1-3 of gold plated copper strip width doubly, and gold plated copper strip length overlap line horizontal extension with coaxial adatpter inner wire solder joint is 0.5-1 times of inner wire top width.
In described steps d, solder joint cleans up for using cotton ball soaked in alcohol by the method for described cleaning solder joint.
Adopt such scheme, using gold plated copper strip as the transition band interconnected between the inner wire and printed board transmission line of coaxial adatpter, and gold plated copper strip is made into step, enough baffle safety distances are reserved during welding, enable to play cushioning effect when larger environment and temperature change between the inner wire of coaxial adatpter and printed board transmission line, effectively reduce the internal stress in interconnect welds, greatly reduce the failure probability of pad, to avoid between the inner wire of coaxial adatpter and printed board transmission line in this Hard link of direct soldering because of interconnect failure that coefficient of thermal expansion mismatch causes.
Accompanying drawing explanation
Fig. 1 is interconnecting method flow chart of the present invention;
Fig. 2 is the coaxial adatpter and the printed board transmission line structure schematic diagram that use interconnecting method of the present invention.
Embodiment
Below in conjunction with the drawings and specific embodiments, the present invention is described in detail.
Embodiment 1
As shown in Figure 1, Fig. 1 is a kind of interconnecting method flow chart for coaxial adatpter and printed board transmission line provided by the invention, and the method comprises the following steps:
Step 101: provide a coaxial adatpter and a printed board and be assembled in aluminium alloy box body, described coaxial adatpter inner wire and described printed board transmission line form junction to be welded;
Step 102: gold plated copper strip is squeezed into step shape;
Step 103: gold plated copper strip two ends are interconnected with described inner wire and described transmission line soldering respectively;
Step 104: cleaning solder joint is also checked.
In above-mentioned steps 101, the diameter of coaxial adatpter inner wire is 0.3-0.8mm, and basis material is that copper maybe can cut down.
In above-mentioned steps 101, the staggered distance that coaxial adatpter inner wire and printed board transmission line form solder side is 0-0.3mm, and vertical height distance is 0.05-0.25mm.
In above-mentioned steps 101, described printed board dielectric material is
6202, R04003C or R04350B.
In above-mentioned steps 102, the basis material of gold plated copper strip is red copper alloy, and thickness is 10-30 μm, and plating oil gidling layer thickness is 0.1-0.5 μm.
In above-mentioned steps 102, the method using frock gold plated copper strip to be converted into step extrudes for adopting special concave-convex mold fixture to be carried out by gold plated copper strip, Shape correction, is processed into step shape.
In above-mentioned steps 103, soldering tin material is Sn60Pb40 or Sn63Pb37.
In above-mentioned steps 103, the gold plated copper strip total length after soldering interconnection overlaps line horizontal extension length, upper arc length, vertical-direction length, lower arc length by with the inner wire solder joint lap of splice, with inner wire solder joint and forms with the printed board transmission line solder joint lap of splice six part.Be the 1-3 of gold plated copper strip width doubly with inner wire with the gold plated copper strip length that printed board transmission line solder joint overlaps, gold plated copper strip length overlap line horizontal extension with inner wire solder joint is 0.5-1 times of inner wire top width.
In above-mentioned steps 104, the method for cleaning solder joint is, uses cotton ball soaked in alcohol to be cleaned up by solder joint.
Based on the above method, a kind of specific embodiment of the interconnecting method for coaxial adatpter and printed board transmission line is provided to be described in further detail the present invention.As shown in Figure 2, there is provided a coaxial adatpter and a printed board according to circuit drawing requirement and be assembled in silver coated aluminum alloy box body, printed board 5 adopts screw to be fixed on silver coated aluminum alloy box body, coaxial adatpter adopts screw or glue to be fixed on silver coated aluminum alloy box body, the diameter of coaxial adatpter inner wire 4 is 0.3mm, basis material is for cutting down, and coating is Ni/Au, and printed board 5 dielectric material is R04350B.Coaxial adatpter inner wire 4 and printed board transmission line 7 form junction to be welded, and the staggered distance that coaxial adatpter inner wire 4 and printed board transmission line 7 form solder side is 0.1mm, and vertical height distance is 0.1mm.
A preferably gold plated copper strip, gold plated copper strip selects basis material to be 20 μm of thick red copper alloys, then on its surface successively nickel plating 1 μm and gold-plated 0.5 μm, gold plated copper strip width 0.3mm, length 1.5mm.After electronickelling, gold object be make gold plated copper strip be easy to brazing, and surfacecti proteon performance requirement can be met.Gold plated copper strip carries out extruding by the special concave-convex mold fixture of following employing, Shape correction, is processed into step shape.
Step gold plated copper strip two ends are interconnected with above-mentioned coaxial adatpter inner wire 4 and printed board transmission line 7 soldering respectively.Gold plated copper strip total length after soldering interconnection overlaps line horizontal extension length 9, upper arc length 10, vertical-direction length 11, lower arc length 12 by with the inner wire solder joint lap of splice 8, with inner wire solder joint and forms with the printed board transmission line solder joint lap of splice 13 6 part.Be 1.5 times of gold plated copper strip width with inner wire with the gold plated copper strip length that printed board transmission line solder joint overlaps, the gold plated copper strip length overlapping line horizontal extension with inner wire solder joint is 0.5 times of inner wire top width.The concrete grammar of welding gold plated copper strip is: the silver coated aluminum alloy box body being assembled with coaxial adatpter and printed board is placed on preheating 10min on 120 DEG C of heating stations, above the inner wire 4 being placed on printed board transmission line 7 and coaxial adatpter with tweezers gripping gold plated copper strip.Under the microscope of magnify 20 number, cut appropriate fusing point with medical surgical knife is 183 DEG C, and diameter is the Sn63Pb37 solder stick of 0.5mm.With the flatiron that solder horn temperature is 280 DEG C, gold plated copper strip is heated, simultaneously the solder stick cut under microscope be placed on printed board transmission line 7 with gold plated copper strip interconnection place, solder stick is fully melted, flows into the centre of gold plated copper strip and printed board transmission line 7, form good solder joint 14.With the solder horn of same temperature, the gold plated copper strip above coaxial adatpter inner wire 4 is heated again, put at the inner wire 4 of coaxial adatpter and gold plated copper strip interconnection place the solder stick cut in advance, make it fully melt, form good solder joint 15.The weld time of each solder joint controls in 1-3s.
Cleaning solder joint is also checked.With cotton ball soaked in alcohol, unnecessary for interconnection solder joint place scaling powder, scolding tin residue etc. are cleaned up.
According to correlation test method in GJB548B-2005 " microelectronic component Test Methods And Procedures ", successively the environmental tests such as temperature cycles, temperature shock and mechanical oscillation are carried out to the microwave component product using step gold plated copper strip by above-mentioned coaxial adatpter and printed board transmission line soldering interconnection.Be placed on the basis of microscopic observation of amplification 30 multiple, solder joint is intact, do not ftracture, lost efficacy, owing to there being the interconnection structure of metal transfer band, absorb and cushioned the thermal stress that solder joint inside exists, make the weld failure problem originally caused because of coefficient of thermal expansion mismatch in this Hard link obtain effective solution.
Should be understood that, for those of ordinary skills, can be improved according to the above description or convert, and all these improve and convert the protection range that all should belong to claims of the present invention.
Claims (1)
1., for an interconnecting method for coaxial adatpter and printed board transmission line, it is characterized in that, comprise the following steps:
Step 101: provide a coaxial adatpter and a printed board and be assembled in aluminium alloy box body, described coaxial adatpter inner wire and described printed board transmission line form junction to be welded;
Step 102: gold plated copper strip is squeezed into step shape;
Step 103: gold plated copper strip two ends are interconnected with described inner wire and described transmission line soldering respectively;
Step 104: cleaning solder joint is also checked,
In described step 101, the diameter of coaxial adatpter inner wire is 0.3-0.8mm, the basis material of described inner wire is that copper maybe can cut down, in described step 101, it is 0-0.3mm that described coaxial adatpter inner wire and described printed board transmission line form the staggered distance of junction to be welded, and vertical height distance is 0.05-0.25mm, in described step 101, the dielectric material of described printed board is
r04003C or R04350B, in described step 102, the basis material of described gold plated copper strip is red copper alloy, thickness is 10-30 μm, plating oil gidling layer thickness is 0.1-0.5 μm, in described step 102, use frock that gold plated copper strip is converted into step shape, concrete method is: adopt special concave-convex mold fixture to be extruded by gold plated copper strip, Shape correction, be processed into step shape, in described step 103, the material of scolding tin is Sn60Pb40 or Sn63Pb37, in described step 103, gold plated copper strip total length after described soldering interconnection by with the coaxial adatpter inner wire solder joint lap of splice, with the overlap joint line horizontal extension length of coaxial adatpter inner wire solder joint, upper arc length, vertical-direction length, lower arc length and forming with the lap of splice six part of printed board transmission line solder joint, the gold plated copper strip length that described coaxial adatpter inner wire and printed board transmission line solder joint overlap is the 1-3 of gold plated copper strip width doubly, the gold plated copper strip length overlapping line horizontal extension with coaxial adatpter inner wire solder joint be the 0.5-1 of inner wire top width doubly, in described step 104, solder joint cleans up for using cotton ball soaked in alcohol by the method for described cleaning solder joint.
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| CN201310634855.5A CN103633530B (en) | 2013-12-02 | 2013-12-02 | A kind of interconnecting method for coaxial adatpter and printed board transmission line |
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| CN103633530B true CN103633530B (en) | 2015-10-28 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111725592B (en) * | 2019-03-20 | 2022-10-18 | 华为技术有限公司 | Phase shifter, antenna and base station |
| CN114083169B (en) * | 2021-12-13 | 2023-07-04 | 上海无线电设备研究所 | Flexible connection process method and tool for radio frequency coaxial-to-microstrip |
| CN116487910A (en) * | 2023-06-25 | 2023-07-25 | 陕西华达科技股份有限公司 | Omega-shaped bonding sheet and power divider thereof |
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| CN86106553A (en) * | 1985-09-27 | 1987-04-22 | 株式会社日立制作所 | Electric component with lead end |
| GB2251344A (en) * | 1990-12-03 | 1992-07-01 | Rheinmetall Gmbh | Connecting surface mount devices to printed circuit boards. |
| US5198391A (en) * | 1991-06-15 | 1993-03-30 | Deutsche Aerospace Ag | Method for bonding llccc-components using a leadframe |
| CN1738112A (en) * | 2005-08-30 | 2006-02-22 | 中国科学院物理研究所 | A kind of flat superconducting filter joint jump wire connecting method |
| DE102004045948A1 (en) * | 2004-09-22 | 2006-04-06 | Epcos Ag | Surface mountable component |
| CN102300419A (en) * | 2011-06-20 | 2011-12-28 | 中国电子科技集团公司第十三研究所 | Welding method of coaxial diode and circuit board |
| CN103326101A (en) * | 2013-05-20 | 2013-09-25 | 中国电子科技集团公司第四十一研究所 | Method for assembling transferring of broadband high-performance coaxial-ceramic dielectric substrate micro-strip |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008060042A (en) * | 2006-09-04 | 2008-03-13 | Mitsubishi Electric Corp | High-frequency module |
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2013
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Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN86106553A (en) * | 1985-09-27 | 1987-04-22 | 株式会社日立制作所 | Electric component with lead end |
| US4739125A (en) * | 1985-09-27 | 1988-04-19 | Hitachi, Ltd. | Electric component part having lead terminals |
| GB2251344A (en) * | 1990-12-03 | 1992-07-01 | Rheinmetall Gmbh | Connecting surface mount devices to printed circuit boards. |
| US5198391A (en) * | 1991-06-15 | 1993-03-30 | Deutsche Aerospace Ag | Method for bonding llccc-components using a leadframe |
| DE102004045948A1 (en) * | 2004-09-22 | 2006-04-06 | Epcos Ag | Surface mountable component |
| CN1738112A (en) * | 2005-08-30 | 2006-02-22 | 中国科学院物理研究所 | A kind of flat superconducting filter joint jump wire connecting method |
| CN102300419A (en) * | 2011-06-20 | 2011-12-28 | 中国电子科技集团公司第十三研究所 | Welding method of coaxial diode and circuit board |
| CN103326101A (en) * | 2013-05-20 | 2013-09-25 | 中国电子科技集团公司第四十一研究所 | Method for assembling transferring of broadband high-performance coaxial-ceramic dielectric substrate micro-strip |
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Address after: No. 726, Huaguang Avenue, Bengbu, Anhui Province, Anhui Patentee after: The 41st Institute of CETC Address before: 266555 Qingdao economic and Technological Development Zone, Shandong Xiangjiang Road, No. 98 Patentee before: The 41st Institute of CETC |