CN206388703U - A kind of LED component and LED - Google Patents
A kind of LED component and LED Download PDFInfo
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- CN206388703U CN206388703U CN201621446854.3U CN201621446854U CN206388703U CN 206388703 U CN206388703 U CN 206388703U CN 201621446854 U CN201621446854 U CN 201621446854U CN 206388703 U CN206388703 U CN 206388703U
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48095—Kinked
- H01L2224/48096—Kinked the kinked part being in proximity to the bonding area on the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48475—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball
- H01L2224/48476—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area
- H01L2224/48477—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area being a pre-ball (i.e. a ball formed by capillary bonding)
- H01L2224/48478—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area being a pre-ball (i.e. a ball formed by capillary bonding) the connecting portion being a wedge bond, i.e. wedge on pre-ball
- H01L2224/48479—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area being a pre-ball (i.e. a ball formed by capillary bonding) the connecting portion being a wedge bond, i.e. wedge on pre-ball on the semiconductor or solid-state body
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- Led Device Packages (AREA)
Abstract
The utility model discloses a kind of LED component, including multiple LED chips, support, for the conductive bonding wire and the packing colloid of the covering LED chip and conductive bonding wire connected between LED chip, the LED chip for being connected to conductive bonding wire two ends is respectively the first LED chip and the second LED chip, conductive bonding wire includes vertical section, first bending segment and the second bending segment, the lower end of vertical section is connected with the first chip electrode, upper end is connected with one end of the first bending segment, the other end of first bending segment is connected with one end of the second bending segment and set to the direction of first LED chip another electrode, the other end of second bending segment is connected with the second chip electrode.The invention also discloses a kind of LED.The conductive bonding wire of the utility model LED component improves the stress ability to bear of conductive bonding wire by combining the three-dimensional structure of vertical section, the first bending segment and the formation of the second bending segment, so as to improve the whole service life of conductive bonding wire.
Description
Technical field
The utility model is related to LED component technical field, more particularly to a kind of LED component and LED.
Background technology
Referring to shown in accompanying drawing 1, LED component of the prior art includes support 1a, support 1a include insulating regions 12a and
Positioned at the first electrical connection area 11a and the second electrical connection area 13a of insulating regions 12a both sides and mutually insulated, wherein LED component
LED chip is located at the first electrical connection area 11a, when the first electrical connection area 11a sets multiple LED chips, passes through between LED chip
LED chip in first conductive bonding wire 2a connections, and the first electrical connection area 11a electrically connects area 13a with second and led by second
Electric welding wire is electrically connected to form loop, it is necessary to cover packing colloid, wherein LED core on support 1a after each part installation
The conductive bonding wire of piece, the first conduction bonding wire 2a and second is in packing colloid.
But, LED component can produce heat in use, and packing colloid can expand with heat and contract with cold because thermal shock is produced
Phenomenon, now, the first conductive bonding wire 2a can be led by stress impact when being expanded with heat and contract with cold from packing colloid, and due to first
Electric welding wire 2a is overall packed colloid parcel, and expanding with heat and contract with cold for packing colloid can produce stress to the whole first conduction bonding wire 2a
Impact, in addition, stress impact is without fixed-direction, i.e., the first conductive bonding wire 2a can by from upper and lower, left and right or other do not advise
The then stress impact in direction, the first conductive bonding wire that prior art is used to connect between LED chip 3a is two-dimensional structure, in accompanying drawing
Straight line is shown as in 1, it can not alleviate the stress impact from all directions, if these stress cannot be buffered, or
Person is the buffering for obtaining part, and the conductive bonding wire 2a meetings premature deterioration in other parts first that cannot get stress buffer, so that
The first conductive bonding wire 2a whole service life is substantially reduced, it is inevitable also to reduce the whole service life of LED component.
The content of the invention
Technical problem to be solved in the utility model is there is provided a kind of LED component, is welded by the conduction of three-dimensional structure
Line improves it and bears the ability from all directions stress.
Technical problem to be solved in the utility model is also resided in there is provided a kind of LED component, improves the reliable of conductive bonding wire
Property.
In order to solve the above-mentioned technical problem, the utility model provides a kind of LED component, including multiple LED chips, is used for
Carry the support of LED chip, for the conductive bonding wire and the covering LED chip that are connected between LED chip and conductive bonding wire
Packing colloid, the LED chip for being connected to conductive bonding wire two ends is respectively the first LED chip and the second LED chip, described first
LED chip is provided with the first chip electrode being connected with conductive bonding wire one end, and second LED chip is provided with another with conductive bonding wire
Hold the second chip electrode of connection, it is characterised in that the conductive bonding wire includes vertical section, the first bending segment and the second bending
Section, one end of the vertical section is connected with the first chip electrode, and the other end is connected with one end of the first bending segment, the first bending segment
The other end be connected and set to the direction of first LED chip another electrode with one end of the second bending segment, described second is curved
The other end of trisection is connected with the second chip electrode, and the vertical section, the first bending segment are with second bending segment in adjacent institute
State and form three-dimensional structure between LED chip.
As the improvement of such scheme, first bending segment is entirely located in the surface of first LED chip, described
The other end of first bending segment be connected with one end of the second bending segment and to the direction of first LED chip another electrode obliquely
Set, the other end of second bending segment sets and is connected with the second chip electrode obliquely.
As the improvement of such scheme, support includes insulating regions and positioned at the insulating regions both sides and mutually insulated
The first electrical connection area and the second electrical connection area, the LED chip is located at the first electrical connection area, residing for first bending segment
Vertical plane is parallel with the edge line of the insulating regions of the support.
As the improvement of such scheme, the vertical section, the first bending segment and the second bending segment are sequentially connected composition curve
Part, the curved portion is projected as curve horizontal plane.
As the improvement of such scheme, the height of the vertical section is H1, and the H1 is 30 μm -70 μm；
The distance between the conductive bonding wire peak and the first LED chip upper surface are H2, and the H2 is 70 μm of -130 μ
m。
As the improvement of such scheme, the length of the projection of first bending segment in the horizontal plane is L1, and the L1 is
100μm-350μm。
As the improvement of such scheme, acute angle formed by the tangent line and vertical curve of the first bending segment starting point is
A1, the A1 are 10 ° -70 °
As the improvement of such scheme, the angle of the projection of first bending segment and the second bending segment in the horizontal plane is
A2, the A2 are 100 ° -160 °.
As the improvement of such scheme, end points and second bending segment that the vertical section is connected with the first chip electrode
The end points being connected with second chip electrode is not in the same horizontal line.
Accordingly, the invention also discloses a kind of LED, including LED component described in the utility model.
Implement embodiment of the present utility model, have the advantages that：
The conductive bonding wire of LED component described in the utility model includes being located between the first chip electrode and the second chip electrode
Vertical section, the first bending segment and the second bending segment, this three sections formation conductive bonding wire in the first chip electrode and the second chip
Three-dimensional structure is formed between electrode, now, even if conductive bonding wire is also had by the stress impact from multiple irregular directions
Corresponding stress buffer ability, relative to the conductive bonding wire of two dimension of prior art, conductive bonding wire of the present utility model can be eliminated
Stress impact from all directions, is prevented effectively from conductive bonding wire and is pulled off, so as to improve the service life of conductive bonding wire, it is ensured that
The bulk life time of LED component will not be shortened the life-span by the premature breakdown of conductive bonding wire.
Brief description of the drawings
Fig. 1 is the structural representation of prior art LED component；
Fig. 2 is the top view of the utility model LED component；
Fig. 3 is the partial enlarged drawing at A in Fig. 2；
Fig. 4 is sectional views of the Fig. 2 along BB directions；
Fig. 5 is sectional views of the Fig. 2 along CC directions；
Fig. 6 is the partial enlarged drawing at D in Fig. 5；
Fig. 7 is the partial enlarged drawing at E in Fig. 5.
Embodiment
It is new to this practicality below in conjunction with accompanying drawing to make the purpose of this utility model, technical scheme and advantage clearer
Type is described in further detail.Only this state, the utility model occur in the text or will appear from upper and lower, left and right, it is preceding,
Afterwards, the orientation such as inside and outside word, only on the basis of accompanying drawing of the present utility model, it is not to specific restriction of the present utility model.
Embodiment one
Referring to accompanying drawing 2 to accompanying drawing 7, the utility model discloses a kind of LED component, including multiple LED chips, for carrying
The support 1 of LED chip, for the conductive bonding wire 2 that is connected between LED chip and the covering LED chip and conductive bonding wire 2
Packing colloid, the LED chip for being connected to the conductive two ends of bonding wire 2 is respectively the first LED chip 11 and the second LED chip 12, described
First LED chip 11 is provided with the first chip electrode 110 for be connected with conductive one end of bonding wire 2, second LED chip 12 provided with
Second chip electrode 120 of the conductive other end of bonding wire 2 connection.
The support includes insulating regions and positioned at the insulating regions both sides and the first electrical connection area of mutually insulated
With the second electrical connection area, the LED chip is located at the first electrical connection area.
Wherein, the LED chip is blue chip, red light chips or green glow chip, can be selected according to demand, when first
When electrically connecting area provided with multiple LED chips, multiple LED chips can also select the LED chip do not shared the same light according to demand.
As LED chip and the preferred scheme of packing colloid, the LED chip is blue chip, and the packing colloid is
Fluorescent material and organosilicon mixture.
In order to realize the purpose of this utility model, the conductive bonding wire 2 includes vertical section 21, the first bending segment 22 and second
Bending segment 23, each section is described in detail below.
Wherein, one end of the vertical section 21 is connected with the first chip electrode 110, and the one of the other end and the first bending segment 22
End connection, projection of shape of the vertical section 21 in the first LED chip 11 is the radial cross-sectional shape of conductive bonding wire 2.Conductive bonding wire 2
The end being connected with the first chip electrode 110 needs to form through oversintering, so its stress ability to bear is small, it is of the invention by this portion
Set up separately and be set to vertical section 21, the reliability for the part that conductive bonding wire 2 is connected with the first chip electrode 110 can be improved.
Further, the other end of first bending segment 22（One end away from vertical section 21）With the second bending segment 23
One end connects and set to the direction of the first LED chip 11 another electrode, it is specific for can to the first LED chip another
The direction of electrode is set obliquely.In the present embodiment, if the first LED chip is rectangle, edge and the first LED can have both been selected
The parallel direction of the length direction of chip 11 obliquely, can also select the direction for offseting certain angle to the second LED chip 12 oblique
Upwards, the vertical section, the first bending segment and second bending segment form three-dimensional structure between the adjacent LED chip.
It should be noted that the limitation of the position due to adjacent LED chip, so the first bending segment 22 and the second bending
The horizontal space of section 23 is restricted, and the space between two LED chips is packing colloid most thick part, so should be by the
The two ends of one bending segment 22（Two flex point portions）Avoid, and the position meeting of the second chip electrode 120 due to the second LED chip 12
The position of second bending segment 23 is had certain limitations, in order to solve this problem, the first bending segment 22 described in the utility model is preferred
Positioned at the surface of the first LED chip 11 and the space that is limited between two electrodes of the first LED chip 11, i.e., described first
Bending segment 22 is entirely located in the surface of first LED chip 11, and two flex point portions of so conductive bonding wire 2 are in encapsulation
The relatively thin position of colloid, the stress impact that flex point portion is subject to reaches minimum, so that the service life in flex point portion is improved, so that conductive
The bulk life time of bonding wire 2 is more average.As preferred scheme, vertical plane and the branch residing for first bending segment 22
The edge line of the insulating regions of frame 1 is parallel, now, and the upper end of conductive bonding wire 2 is farthest from the edge of the first LED chip 11, to this
End reaches optimal guard mode, and can increase the horizontal segment distance of the second bending segment 23, so as to improve the first bending segment
22 and second bending segment 23 stress buffer ability.
Further, the other end of second bending segment 23（Lower end）It is connected with the second chip electrode 120, specifically
It can obliquely set and be connected with the second chip electrode for the other end of the second bending segment.When the upper end of the first bending segment 22 is determined
Afterwards, the upper end of the second bending segment 23 is determined accordingly, and the lower end of the second bending segment 23 is directly welded with the second chip electrode 120,
Second bending segment 23 is structure obliquely.
Wherein, in the present embodiment, end points and second bending that preferably described vertical section is connected with the first chip electrode
The end points that is connected with second chip electrode of section not in the same horizontal line, in other embodiments, the vertical section and the
The end points and second bending segment of one chip electrode connection can also be same with the end points that second chip electrode is connected
On horizontal line.Not situation in the same horizontal line, i.e., it is adjacent need to be parallel to each other by the LED chip of conductive bonding wire connection sets
Put, and the orientation of the positive and negative electrode of two LED chips is identical, conductive bonding wire connection be the first LED chip positive pole and the
The negative pole of two LED chips, or conductive bonding wire connection is the negative pole of the first LED chip and the positive pole of the second LED chip.So
The benefit of placement is that the length of conductive bonding wire can be longer than length in the same horizontal line so that conductive bonding wire better reliability.
Referring to shown in accompanying drawing 6, the vertical section 21, the first bending segment 22 and the second bending segment 23 are sequentially connected composition curve
Part, the curved portion is in the curve that is projected as of horizontal plane, and the first bending segment 22 and the bending segment of vertical section 21 and second
23 be smooth curves transition connection, and answering for conductive bonding wire 2 can be further improved by smooth curves transition connected mode
Power ability to bear, it is to avoid the damage of weak transition portion too early.In addition, the vertical section 21, the first bending segment 22 and second
Bending segment 23 is formed in one structure, and integrally formed conductive bonding wire 2 can bear bigger stress impact.
According to the multiple experimental verification of inventor, the parameter of conductive each section of bonding wire 2 is used for the life-span and also had a major impact,
The preferably parameter selection drawn the following is inventor's test of many times.
（1）The height of the vertical section 21 is H1, and the H1 is 30 μm -70 μm, and further preferred scope is the H1
50μm-60μm；
（2）The distance between the peak of conductive bonding wire 2 and the upper surface of the first LED chip 11 are H2, and the H2 is 70 μ
M-130 μm, further preferred scope is 80 μm -120 μm to the H2；
（3）The length of the projection of first bending segment 22 in the horizontal plane is L1, and the L1 is 100 μm -350 μm, institute
Stating L1, further preferred scope is 120 μm -320 μm；
(4) angle of the projection of the bending segment 23 of the first bending segment 22 and second in the horizontal plane is A2, and the A2 is
100 ° -160 °, further preferred scope is 115 ° -150 ° to the A2.
In order to ensure that the position between the first bending segment 22 and vertical section 21 can reach stress ability to bear, the present invention is right
The starting point of first bending segment 22 has made certain restriction, the tangent line of the starting point of the first bending segment 22 and vertical curve institute into
Acute angle be A1, the A1 be 10 ° -70 °, the A1 further preferred scope be 20 ° -60 °, A1, which crosses conference, causes conductive weldering
The bending of the heat affected area of line 2 is impaired, and angle is too small, and effective buffering can not be formed for the upward stress in LED component inside, should
Power can directly pull conductive bonding wire 2 and cause the heat affected area of conductive bonding wire 2 to be broken.
When each section of conductive bonding wire 2 described in the utility model is in above-mentioned selected scope, the three-dimensional knot of the conductive formation of bonding wire 2
Structure can be eliminated preferably from all directions stress, prevent conductive bonding wire 2 to be pulled off, so as to improve the use of conductive bonding wire 2
Life-span.
Embodiment two
Accordingly, the invention also discloses a kind of LED, including the LED described in the utility model embodiment one
Device, LED uses LED component described in the utility model, and its service life increases.
Described above is preferred embodiment of the present utility model, it is noted that for the ordinary skill of the art
For personnel, on the premise of the utility model principle is not departed from, some improvements and modifications can also be made, these improve and moistened
Decorations are also considered as protection domain of the present utility model.
Claims (10)
1. a kind of LED component, including multiple LED chips, the support for carrying LED chip, for what is connected between LED chip
The packing colloid of conductive bonding wire and the covering LED chip and conductive bonding wire, is connected to the LED chip point at conductive bonding wire two ends
Not Wei the first LED chip and the second LED chip, first LED chip is provided with the first chip for being connected with conductive bonding wire one end
Electrode, second LED chip is provided with the second chip electrode being connected with the conductive bonding wire other end, it is characterised in that described to lead
Electric welding wire includes vertical section, the first bending segment and the second bending segment, and one end of the vertical section is connected with the first chip electrode, separately
One end is connected with one end of the first bending segment, and the other end of the first bending segment is connected with one end of the second bending segment and to first
The direction of another electrode of LED chip is set, and the other end of second bending segment is connected with the second chip electrode, described vertical
Section, the first bending segment and second bending segment form three-dimensional structure between the adjacent LED chip.
2. LED component according to claim 1, it is characterised in that first bending segment is entirely located in the first LED
The surface of chip, the other end of first bending segment is connected and another to the first LED chip with one end of the second bending segment
The direction of individual electrode is set obliquely, and the other end of second bending segment sets and is connected with the second chip electrode obliquely.
3. LED component according to claim 1 or 2, it is characterised in that support includes insulating regions and positioned at described exhausted
Edge region both sides and the first electrical connection area of mutually insulated and the second electrical connection area, the LED chip electrically connect area located at first,
Vertical plane residing for first bending segment is parallel with the edge line of the insulating regions of the support.
4. LED component according to claim 1, it is characterised in that the vertical section, the first bending segment and the second bending segment
Composition curved portion is sequentially connected, the curved portion is projected as curve horizontal plane.
5. LED component according to claim 1, it is characterised in that
The height of the vertical section is H1, and the H1 is 30 μm -70 μm；
The distance between the conductive bonding wire peak and the first LED chip upper surface are H2, and the H2 is 70 μm -130 μm.
6. LED component according to claim 1, it is characterised in that the projection of first bending segment in the horizontal plane
Length is L1, and the L1 is 100 μm -350 μm.
7. LED component according to claim 1, it is characterised in that the tangent line of the first bending segment starting point is with erecting
Acute angle formed by straight line is A1, and the A1 is 10 ° -70 °.
8. LED component according to claim 1, it is characterised in that first bending segment and the second bending segment are in level
The angle of projection on face is A2, and the A2 is 100 ° -160 °.
9. LED component according to claim 1, it is characterised in that the end that the vertical section is connected with the first chip electrode
Point and the end points that is connected with second chip electrode of second bending segment are not in the same horizontal line.
10. a kind of LED, it is characterised in that including the LED component described in any one of claim 1 to 9.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621446854.3U CN206388703U (en) | 2016-12-27 | 2016-12-27 | A kind of LED component and LED |
| PCT/CN2017/109198 WO2018082629A1 (en) | 2016-11-03 | 2017-11-02 | Led device, led lamp and method for machining bonding wire of led device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621446854.3U CN206388703U (en) | 2016-12-27 | 2016-12-27 | A kind of LED component and LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206388703U true CN206388703U (en) | 2017-08-08 |
Family
ID=59489868
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621446854.3U Active CN206388703U (en) | 2016-11-03 | 2016-12-27 | A kind of LED component and LED |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206388703U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018082629A1 (en) * | 2016-11-03 | 2018-05-11 | 佛山市国星光电股份有限公司 | Led device, led lamp and method for machining bonding wire of led device |
| CN108493164A (en) * | 2018-04-10 | 2018-09-04 | 同源微（北京）半导体技术有限公司 | A kind of encapsulating structure and preparation method thereof |
| WO2019105075A1 (en) * | 2017-11-28 | 2019-06-06 | 佛山市国星光电股份有限公司 | Led device, led light and method for processing conductor wire of led device |
| CN110473954A (en) * | 2018-05-09 | 2019-11-19 | 江西鸿利光电有限公司 | A kind of LED chip connection structure of low cost and high reliability |
-
2016
- 2016-12-27 CN CN201621446854.3U patent/CN206388703U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018082629A1 (en) * | 2016-11-03 | 2018-05-11 | 佛山市国星光电股份有限公司 | Led device, led lamp and method for machining bonding wire of led device |
| WO2019105075A1 (en) * | 2017-11-28 | 2019-06-06 | 佛山市国星光电股份有限公司 | Led device, led light and method for processing conductor wire of led device |
| US11502231B2 (en) | 2017-11-28 | 2022-11-15 | Foshan Nationstar Optoelectronics Co., Ltd | Light-emitting diode device, LED lamp and method for machining conductive wire of LED device |
| CN108493164A (en) * | 2018-04-10 | 2018-09-04 | 同源微（北京）半导体技术有限公司 | A kind of encapsulating structure and preparation method thereof |
| CN110473954A (en) * | 2018-05-09 | 2019-11-19 | 江西鸿利光电有限公司 | A kind of LED chip connection structure of low cost and high reliability |
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