CN207897215U - 一种可拼接的柔性电路板装置 - Google Patents
一种可拼接的柔性电路板装置 Download PDFInfo
- Publication number
- CN207897215U CN207897215U CN201820318198.1U CN201820318198U CN207897215U CN 207897215 U CN207897215 U CN 207897215U CN 201820318198 U CN201820318198 U CN 201820318198U CN 207897215 U CN207897215 U CN 207897215U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- connector
- main body
- board main
- soft
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000010408 film Substances 0.000 claims abstract description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 15
- 229910052802 copper Inorganic materials 0.000 claims abstract description 15
- 239000010949 copper Substances 0.000 claims abstract description 15
- 239000013039 cover film Substances 0.000 claims abstract description 14
- 230000005540 biological transmission Effects 0.000 claims description 25
- 238000003466 welding Methods 0.000 claims description 4
- 238000009434 installation Methods 0.000 abstract description 8
- 230000001788 irregular Effects 0.000 abstract description 2
- 230000000712 assembly Effects 0.000 abstract 1
- 238000000429 assembly Methods 0.000 abstract 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 5
- 238000005452 bending Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229920006267 polyester film Polymers 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 210000002469 basement membrane Anatomy 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201820318198.1U CN207897215U (zh) | 2018-03-07 | 2018-03-07 | 一种可拼接的柔性电路板装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201820318198.1U CN207897215U (zh) | 2018-03-07 | 2018-03-07 | 一种可拼接的柔性电路板装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN207897215U true CN207897215U (zh) | 2018-09-21 |
Family
ID=63541524
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201820318198.1U Expired - Fee Related CN207897215U (zh) | 2018-03-07 | 2018-03-07 | 一种可拼接的柔性电路板装置 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN207897215U (zh) |
-
2018
- 2018-03-07 CN CN201820318198.1U patent/CN207897215U/zh not_active Expired - Fee Related
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20191127 Address after: No.73 Harbin Road, Heping District, Tianjin 300041 Patentee after: Hua Yanbin Address before: 362000 Fujian province Quanzhou city Quangang district after the town of long dragon village pit head No. 369 Patentee before: Chen Yihong |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20211102 Address after: Room 202, building 5, Hongshun Road, Huaming street, Dongli District, Tianjin 300300 Patentee after: Tianjin Huiying Huachuang Technology Development Co.,Ltd. Address before: 300041 No. 73, Harbin Road, Heping District, Tianjin Patentee before: Hua Yanbin |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180921 |