CN207868188U - A kind of fingerprint recognition chip-packaging structure - Google Patents
A kind of fingerprint recognition chip-packaging structure Download PDFInfo
- Publication number
- CN207868188U CN207868188U CN201721614499.0U CN201721614499U CN207868188U CN 207868188 U CN207868188 U CN 207868188U CN 201721614499 U CN201721614499 U CN 201721614499U CN 207868188 U CN207868188 U CN 207868188U
- Authority
- CN
- China
- Prior art keywords
- chip
- fingerprint recognition
- asic
- recognition chip
- packaging structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16135—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/16145—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/10155—Shape being other than a cuboid
- H01L2924/10157—Shape being other than a cuboid at the active surface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Abstract
The utility model discloses a kind of fingerprint recognition chip-packaging structures to be set to asic chip in groove, is electrically connected by RDL fingerprint recognitions chip and asic chip by the way that groove is arranged in fingerprint recognition chip first surface nonfunctional area；Fingerprint recognition chip is integrated into asic chip in a packaging body.To reduce encapsulation step, production efficiency is improved, reduces encapsulation volume, also greatly reduces manufacturing cost, meanwhile, improve the yields of final products.
Description
Technical field
The utility model belongs to fingerprint sensor package field, and in particular to a kind of fingerprint recognition chip-packaging structure.
Background technology
Fingerprint sensor can be built in electronic device, such as laptop, tablet computer, smart mobile phone, pass through reading
Take the fingerprint pattern at family so that device can by device authorized user by the certification of the fingerprint pattern of the authorized user into
Row unlock, substantially increases the safety of electronic device.
Fingerprint sensor is that there are induction region, the region extraneous thorns to be identified with it on fingerprint sensor surface
Swash and have an effect, generates the electric signal that chip can be identified and be handled.In order to realize the sensing function of fingerprint Identification sensor,
Also required to handling the dedicated IC chip of signal, i.e. asic chip.Current fingerprint Identification sensor part needs very much
Discrete assembling steps, wherein fingerprint Identification sensor chip and dedicated IC chip are respectively individual element, are passing
It is put together in the assembling of inductor component or encapsulation process, that is to say, that fingerprint Identification sensor chip and application-specific integrated circuit core
Piece is not encapsulated to together.With the increase of the quantity of discrete component, increasingly complexity, the manufacturing cost of processing step also increase,
There is adverse effect to the yield and reliability of final products simultaneously, and the assembling or encapsulation process of discrete component are time-consuming, imitate
Rate is low.
Utility model content
Purpose of the utility model is to overcome the above-mentioned shortcomings and provide a kind of fingerprint recognition chip-packaging structures, pass through
The grooving of fingerprint recognition chip is integrated with asic chip, improves integrated level, improves performance.
In order to achieve the above object, the utility model includes substrate, and fingerprint recognition chip, fingerprint recognition are fixed on substrate
The top surface of chip is first surface, and bottom surface is second surface, and fingerprint induction zone and the weldering of several first chips are arranged on first surface
Disk, opens up on first surface fluted, and recess sidewall, bottom portion of groove and first surface are provided with redistribution layer RDL, bottom portion of groove
ASIC chips are fixed with, asic chip is electrically connected with fingerprint recognition chip by redistribution layer RDL, asic chip and substrate
It is electrically connected.
The first chip bonding pad on fingerprint recognition chip is connect by the first metal wire with electrical property of substrate.
Several second chip bonding pads are arranged in bottom portion of groove, and the second chip bonding pad passes through the second metal wire and asic chip top
The first chip bonding pad be electrically connected.
Asic chip is fixed on bottom portion of groove by core technique in upside-down mounting, and asic chip passes through salient point and the second chip bonding pad
It is electrically connected.
Asic chip is fixed on bottom portion of groove by lead key closing process.
The upper surface of asic chip is less than first surface, and the height of the second metal wire is less than the height of first surface.
Plastic-sealed body is provided on substrate, plastic-sealed body is coated with fingerprint recognition chip, the first metal wire, asic chip and second
Metal wire.
The angle of recess sidewall and bottom portion of groove is more than or equal to 90 °.
Fingerprint recognition chip is fixed on by bonding agent on substrate.
Compared with prior art, the utility model by fingerprint recognition chip first surface nonfunctional area be arranged groove,
ASIC chips are set in groove, are electrically connected by RDL fingerprint recognitions chip and asic chip, the utility model will refer to
Line identification chip is integrated into asic chip in a packaging body, to reduce encapsulation step, improves production efficiency, is reduced
Encapsulation volume, also greatly reduces manufacturing cost, meanwhile, improve the yields of final products.
Description of the drawings
Fig. 1 is the structural schematic diagram of the utility model embodiment 1；
Fig. 2 is the structural schematic diagram of the utility model embodiment 2；
Wherein, 1. fingerprint recognition chip, 2. fingerprint induction zones, 3. grooves, 4. recess sidewalls, 5. bottom portion of groove, 6. first
Chip bonding pad, 7.ASIC chips, 8. substrates, 9. bonding agents, 10. plastic-sealed bodies, 11. salient points, 12. first surfaces, 13. second tables
Face, 14. first metal wires, 15. second metal wires, 16. second chip bonding pads.
Specific implementation mode
The utility model is described further with reference to the accompanying drawings and examples.
Embodiment 1：Referring to Fig. 1, the utility model includes substrate 8, and fingerprint recognition chip 1 is fixed on substrate 8, and fingerprint is known
The top surface of other chip 1 is first surface 12, and bottom surface is second surface 13, setting fingerprint induction zone 2 and several on first surface 12
First chip bonding pad 6 opens up fluted 3 on first surface 12, and recess sidewall 4, bottom portion of groove 5 and first surface 12 are provided with weight
Distribution layer RDL, 3 bottom of groove are fixed with asic chip 7, and asic chip 7 passes through redistribution layer RDL electricity with fingerprint recognition chip 1
Property connection, asic chip 7 and substrate 8 be electrically connected, and the first chip bonding pad 6 on fingerprint recognition chip 1 passes through the first metal wire
14 are electrically connected with substrate 8.Plastic-sealed body 10 is provided on substrate 8, plastic-sealed body 10 is coated with 1 first metal wire of fingerprint recognition chip
14 and asic chip 7, the angle of recess sidewall 4 and bottom portion of groove 5 is more than or equal to 90 °, and fingerprint recognition chip 1 passes through bonding agent 9
It fixes on the substrate 8.
Asic chip 7 is fixed on bottom portion of groove 5 by core technique in upside-down mounting, and asic chip 7 passes through salient point 11 and the second core
Piece pad 16 is electrically connected.
7 bottom salient point of asic chip can fill Protection glue, can not also fill.Concrete scheme according to salient point spacing or
Other factors determine.
Preferably, metal wire includes gold thread, copper wire, aluminum steel or alloy wire.
Bonding agent is DAF films or bonding die glue.
Embodiment 2：Referring to Fig. 2, the utility model includes substrate 8, and fingerprint recognition chip 1 is fixed on substrate 8, and fingerprint is known
The top surface of other chip 1 is first surface 12, and bottom surface is second surface 13, setting fingerprint induction zone 2 and several on first surface 12
First chip bonding pad 6 opens up fluted 3 on first surface 12, and recess sidewall 4, bottom portion of groove 5 and first surface 12 are provided with weight
Distribution layer RDL, 3 bottom of groove are fixed with asic chip 7, and asic chip 7 passes through redistribution layer RDL electricity with fingerprint recognition chip 1
Property connection, asic chip 7 and substrate 8 be electrically connected, and the first chip bonding pad 6 on fingerprint recognition chip 1 passes through the first metal wire
14 are electrically connected with substrate 8.Plastic-sealed body 10 is provided on substrate 8, plastic-sealed body 10 is coated with fingerprint recognition chip 1, the first metal
The angle of line 14 and asic chip 7, recess sidewall 4 and bottom portion of groove 5 is more than or equal to 90 °, and fingerprint recognition chip 1 passes through bonding agent
9 fix on the substrate 8.
Asic chip 7 is fixed on bottom portion of groove 5 by lead key closing process, and several second chip welderings are arranged in bottom portion of groove 5
Disk 16, the second chip bonding pad 16 are electrically connected by the second metal wire 15 and first chip bonding pad 6 at 7 top of asic chip,
The upper surface of ASIC chips 7 is less than first surface 12, and the height of the second metal wire 15 is less than the height of first surface 12, plastic packaging
Body 10 is coated with fingerprint recognition chip 1, the first metal wire 14, asic chip 7 and the second metal wire 15.Other structures and implementation
Example 1 is identical.
Claims (9)
1. a kind of fingerprint recognition chip-packaging structure, which is characterized in that including substrate (8), substrate is fixed with fingerprint recognition on (8)
Chip (1), the top surface of fingerprint recognition chip (1) are first surface (12), and bottom surface is second surface (13), on first surface (12)
Fingerprint induction zone (2) and several first chip bonding pads (6) are set, fluted (3), recess sidewall are opened up on first surface (12)
(4), bottom portion of groove (5) and first surface (12) are provided with redistribution layer RDL, and groove (3) bottom is fixed with asic chip (7),
Asic chip (7) is electrically connected with fingerprint recognition chip (1) by redistribution layer RDL, and asic chip (7) is electrical with substrate (8)
Connection.
2. a kind of fingerprint recognition chip-packaging structure according to claim 1, which is characterized in that fingerprint recognition chip (1)
On the first chip bonding pad (6) pass through the first metal wire (14) and substrate (8) and be electrically connected.
3. a kind of fingerprint recognition chip-packaging structure according to claim 1, which is characterized in that bottom portion of groove (5) is arranged
Several second chip bonding pads (16), the second chip bonding pad (16) pass through the at the top of the second metal wire (15) and asic chip (7)
One chip bonding pad (6) is electrically connected.
4. a kind of fingerprint recognition chip-packaging structure according to claim 1, which is characterized in that asic chip (7) passes through
Core technique is fixed on bottom portion of groove (5) in upside-down mounting, and asic chip (7) is electrically connected by salient point (11) and the second chip bonding pad (16)
It connects.
5. a kind of fingerprint recognition chip-packaging structure according to claim 1, which is characterized in that asic chip (7) passes through
Lead key closing process is fixed on bottom portion of groove (5).
6. a kind of fingerprint recognition chip-packaging structure according to claim 1, which is characterized in that asic chip (7) it is upper
Surface is less than first surface (12), and the height of the second metal wire (15) is less than the height of first surface (12).
7. a kind of fingerprint recognition chip-packaging structure according to claim 1, which is characterized in that substrate is provided on (8)
Plastic-sealed body (10), plastic-sealed body (10) are coated with fingerprint recognition chip (1), the first metal wire (14), asic chip (7) and the second gold medal
Belong to line (15).
8. a kind of fingerprint recognition chip-packaging structure according to claim 1, which is characterized in that recess sidewall (4) and recessed
The angle of trench bottom (5) is more than or equal to 90 °.
9. a kind of fingerprint recognition chip-packaging structure according to claim 1, which is characterized in that fingerprint recognition chip (1)
It is fixed on substrate (8) by bonding agent (9).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721614499.0U CN207868188U (en) | 2017-11-27 | 2017-11-27 | A kind of fingerprint recognition chip-packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721614499.0U CN207868188U (en) | 2017-11-27 | 2017-11-27 | A kind of fingerprint recognition chip-packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207868188U true CN207868188U (en) | 2018-09-14 |
Family
ID=63467957
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721614499.0U Active CN207868188U (en) | 2017-11-27 | 2017-11-27 | A kind of fingerprint recognition chip-packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207868188U (en) |
-
2017
- 2017-11-27 CN CN201721614499.0U patent/CN207868188U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Huatian Science and Technology (Nanjing) Co.,Ltd. Assignor: HUATIAN TECHNOLOGY (XI'AN) Co.,Ltd. Contract record no.: X2021610000004 Denomination of utility model: A packaging structure of fingerprint identification chip Granted publication date: 20180914 License type: Common License Record date: 20210526 |