CN206757681U - Double-interface smart card - Google Patents
Double-interface smart card Download PDFInfo
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- CN206757681U CN206757681U CN201720362870.2U CN201720362870U CN206757681U CN 206757681 U CN206757681 U CN 206757681U CN 201720362870 U CN201720362870 U CN 201720362870U CN 206757681 U CN206757681 U CN 206757681U
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Abstract
The utility model provides a kind of double-interface smart card, including card body, and card body includes plastic layer and the rigid material layer positioned at plastic layer side, and antenna is embedded with plastic layer；Wherein, plastic layer is provided with mounting seat, and mounting groove is provided with mounting seat, and IC chip is arranged in mounting groove；The first mounting hole is provided with rigid material layer, the first mounting hole is the through hole of the upper and lower surface through rigid material layer, and mounting seat is located in the first mounting hole, and the inwall of the perisporium of mounting seat and the first mounting hole abuts；The electric contact of IC chip is exposed on the surface of smart card.The utility model can improve the production efficiency and product qualification rate of smart card, and effectively avoid the damage of IC chip.
Description
Technical field
Field of intelligent cards is the utility model is related to, more particularly, to a kind of double-interface smart card.
Background technology
Smart card is also known as chip, IC-card or CPU card, and a chip is generally integrated in smart card, and chip can be run
The operating system COS of smart card, and various application modules can be run in the operating system of smart card, such as pay
Application module so that smart card possesses payment function.The common smart card with payment function includes bank card, public affairs
Hand over card etc..
Smart card generally includes the card body of sheet, is packaged with IC chip on card body, and the card body of traditional smart card
Mainly make it is made of plastic, so, encapsulate IC chip when technique it is simple, also be very easy to realize.However, as science and technology is sent out
Exhibition, people it is also proposed higher requirement to the material of smart card, for example, it is desirable to using made of the rigid materials such as metal
Smart card, people attempt with various metal materials go to make high-end bank card, consumption card, daily use various cards.By
Seem air, luxurious, high-grade and have feel in the card of metal material, it is very popular.
Existing smart card develops into double-interface card from traditional single interface card, and double-interface card refers to that smart card has
The smart card that contact communicates with two kinds of communication modes of contactless communication.When realizing contact communication, it is necessary on smart card
Multiple electric contacts are set, and smart card is communicated by multiple electric contacts with the electric contact on terminal device.Therefore, smart card
The upper electrical contact of IC chip needs to be exposed on the surface of smart card.When realizing contactless function, it is necessary in smart card
Antenna is set, the antenna for transmission signal is also provided with terminal device, therefore when smart card is close to terminal device, passes through intelligence
Antenna in card sends, receives data, so as to complete the communication with terminal device.
Contactless communication is realized on smart card as made of in metal, due to needing that antenna is set in smart card, but
Metal has the characteristic of shielding electromagnetic wave, allows the antenna of the interior encapsulation of smart card can not receive the transmission of the terminal devices such as card reader
Signal, so that contactless communication function can not be realized.Therefore, current metal smart card is realizing contactless communication function
When, smart card is made using mixing material.
As shown in Figure 1, existing smart card is provided with plastic layer 10 and the metal level 15 positioned at the side of plastic layer 10,
It is embedded into antenna 11 in plastic layer 10, and IC chip 17 is encapsulated in metal level 15.Therefore, an installation is set in metal level 15
Seat 16, IC chip 17 is encapsulated in mounting seat 16.
When manufacturing this smart card, antenna 11 is embedded in plastic layer 10 first, then the plastics that antenna 11 will be embedded with
Layer 10 is adhered to the side of metal level 15, forms one piece of smooth card.Then, using process equipment, if milling device is to viscous
The card of conjunction is processed, i.e., a groove for being used to encapsulate IC chip 17 is milled out in metal level 15, and form mounting seat 16.
Then, it is also necessary to milling is carried out to the regional area of plastic layer 10 and finds out the termination of antenna 11, and allows the end of antenna 11
Head exposes outside plastic layer 10., it is necessary to which antenna 11 to be connected to the bottom of IC chip 17 when IC chip 17 is encapsulated in into mounting seat 16
Portion, so as to realize the electrical connection of IC chip 17 and antenna 11, and it also requires IC chip 17 is encapsulated in mounting seat 16, it is such as logical
Cross glue etc. IC chip 17 is bonded in mounting seat 16.
But the processing technology of existing smart card is extremely complex, and problems be present：It is conventional card system first
Making business's equipment directly can not process and make metal card, also, in milling metal, metal will produce substantial amounts of heat, these
Heat will cause the damage of plastic layer 10 and antenna 11, therefore, when carrying out Milling Process to metal level 15, it is necessary to card
Coolant is irrigated, and coolant can destroy plastic layer 10 speciality of itself, cause the scrappage of smart card very high.Furthermore to gold
When belonging to the progress Milling Process of layer 15, caused chip can pollute the color of the plastic layer 10 at the back side.Finally, existing processing technology
In the smart card produced, the bonding force between mounting seat 16 in IC chip 17 and metal level 15 can be excessively poor, causes IC cores
Piece 17 easily comes off from mounting seat 16.
The content of the invention
Above-mentioned in order to solve the problems, such as, main purpose of the present utility model is to provide a kind of double interfaces of simple production process
Smart card.
To realize above-mentioned main purpose, double-interface smart card provided by the utility model includes card body, and card body includes modeling
The bed of material and the rigid material layer positioned at plastic layer side, and antenna is embedded with plastic layer；Wherein, plastic layer is provided with installation
Seat, mounting seat is interior to be provided with mounting groove, and IC chip is arranged in mounting groove；It is provided with the first mounting hole in rigid material layer, first
Mounting hole is the through hole of the upper and lower surface through rigid material layer, and mounting seat is located in the first mounting hole, and the perisporium of mounting seat
Abutted with the inwall of the first mounting hole；The electric contact of IC chip is exposed on the surface of smart card.
From such scheme, due to the mounting seat for encapsulating IC chip is arranged on plastic layer, therefore on the double boundaries of manufacture
During the smart card of face, after IC chip being encapsulated in into plastic layer in advance, then the metal level bonding by milling the first mounting hole of formation
On plastic layer, it can so avoid plastic layer being adhered to after metal level again to metal level progress milling, avoid to plastic layer
Cause to damage, and the production efficiency of double-interface smart card can be improved, while IC chip can also be avoided to be taken off from mounting seat
Fall, improve the performance of smart card.
One preferable scheme is that rigid material includes metal material, glass fiber material, carbon fibre material or wooden
Material.
As can be seen here, using the higher material of hardness, double interfaces intelligence is made in such as metal, glass fibre, carbon fiber material
The card body that can block, improves the feel of smart card, meets people to the increasingly increased requirement of smart card.
Further scheme is that rigid material layer is conductive material layer, is provided between rigid material layer and plastic layer
Screen layer, screen layer are provided with the second mounting hole, and the second mounting hole is the through hole through screen layer upper and lower surface, and second installs
The shape in hole is identical with the shape of the first mounting hole, in the projection of the plane where plastic layer, the first mounting hole and the second peace
It is overlapping to fill hole.
It can be seen that in order to avoid influence of the metal level to Antenna Operation, screen layer is set between metal level and plastic layer, can
Absorbed with the radiofrequency signal for effectively avoiding metal level from sending the terminal devices such as card reader by metal level, it is ensured that double interface intelligence
The contactless communication of card.
Further scheme is that screen layer is made up of permeability magnetic material, and screen layer is at least covered in plastic layer and is provided with
On the region of antenna.
As can be seen here, screen layer is made using permeability magnetic material, it can be ensured that the radiofrequency signal that terminal device is sent being capable of day
Line is received, and then ensures that double-interface smart card can be communicated using contactless mode.
Brief description of the drawings
Fig. 1 is a kind of partial sectional view of existing double-interface smart card.
Fig. 2 is the structure decomposition figure of the utility model double-interface smart card embodiment.
Fig. 3 is the structure decomposition figure of plastic layer and IC chip in the utility model double-interface smart card embodiment.
Fig. 4 is the partial sectional view of the utility model double-interface smart card embodiment.
Fig. 5 is the flow chart for manufacturing the utility model smartcard embodiment.
Below in conjunction with drawings and Examples, the utility model is described in further detail.
Embodiment
Smart card of the present utility model is double-interface smart card, i.e., an IC chip, and IC cores are provided with smart card
Piece can realize contact communication and contactless communication, therefore IC chip needs to set and multiple is used to realize that contact communicates
Electric contact, and also need to be provided for the antenna for realizing contactless communication in smart card.In addition, in order to lift smart card
Texture, the card body of smart card includes the rigid material layer made of rigid material, and the signified rigid material of the utility model is
For PVC material, PET material, PC materials, PET-G material plastics, therefore hardness is equal more than the material of the plastics such as PVC
Can be non-plastic material as the making material of the card body of smart card of the present utility model, i.e., rigid material of the present utility model
Material, such as metal, glass fibre, carbon fiber or the larger material of wood materials hardness.Rigid material is used as using metal below
Exemplified by scheme of the present utility model is described in detail.
Smartcard embodiment：
Referring to Fig. 2, the double-interface smart card of the present embodiment includes plastic layer 20, and the side of plastic layer 20 is provided with metal
Layer 50, and screen layer 40 is provided between plastic layer 20 and metal level 50.In the present embodiment, plastic layer 20, screen layer 40
And metal level 50 forms the card body of smart card, and card body is generally rectangular shaped, and is provided with chamfering on four angles.Certainly, card body
Shape can particularly be customized according to being actually needed, therefore card body is not limited to rectangle, can also be circular or ellipse
The shapes such as circle.
Plastic layer 20 is made of plastics, and as PVC material, PET material, PC materials, PET-G materials are made, plastic layer 20 has
There are insulating properties, and the thickness of plastic layer 20 is smaller, between 0.2 millimeter to 0.4 millimeter, it is preferred that the thickness of plastic layer is only
There is 0.3 millimeter.Referring to Fig. 3, be provided with a mounting seat 22 on plastic layer 20, mounting seat 22 from the upper table of plastic layer 20 towards
Upper extension, and a mounting groove 23 is provided with mounting seat 22, IC chip 30 is arranged in mounting groove 23.
As shown in figure 4, antenna 21 is embedded with plastic layer 20, it is preferred that antenna 21 is flexible antennas, can be with plastics
The bending of layer 20 and bend, and will not be damaged because of the bending of plastic layer 20.And antenna 21 needs to electrically connect with IC chip 30,
Therefore the upper end of antenna 21 electrically connects with the lower end of IC chip 30.Therefore antenna 21 extends upwardly to the lower section of mounting seat 22, and
And the lower end of IC chip 30 is provided with the terminal being connected with antenna 21.
In the present embodiment, the upper surface of IC chip 30 is provided with multiple electric contacts 32, multiple electric contacts of IC chip 30 32
In the outer surface of smart card, i.e., multiple electric contacts 32 need to be exposed at the outer surface of smart card, in order to smart card and card reader
Connection, so as to realize the communication between smart card and card reader.Also, IC chip 30 is provided with wafer close to the side of mounting seat 22
31, wafer 31 extends to the side of mounting seat 22.Also, in order to which IC chip 30 is fixed in mounting seat 22, the shape of mounting groove 23
Shape is consistent with the shape of the lower surface of IC chip 30, i.e., mounting groove 23 is step trough.Also, IC chip 30 can be viscous by glue etc.
Agent 35 is connect to be bonded in mounting seat 22.
Metal level 50 is made up of metal material, for example, by metal materials such as aluminium alloy, almag, stainless steel, copper alloys
It is made, and the surface of metal level 50 can also be painted or the processing such as coating pigment, so as to improve the aesthetic property of smart card.
A mounting hole 51 is provided with metal level 50, as it is clear from fig. 2 that mounting hole 51 is generally rectangular shaped, and four angles are provided with
Chamfering.In the present embodiment, mounting hole 51 is the through hole through the upper and lower surface of metal level 50, and the Internal periphery of mounting hole 51 should be with
The outline of mounting seat 22 is consistent, and to ensure on the finished product of double-interface smart card, the outer wall of mounting seat 22 is interior with mounting hole 51
Wall abuts.
Due to the conductive energy of metal level 50, therefore metal level 50 is actually what is be made of an electrically conducting material.Although my god
Line 21 is simultaneously not arranged on metal level 50, but if plastic layer 20 and metal level 50 are directly bonded, then double-interface smart card leans on
During nearly card reader, the radiofrequency signal that card reader is sent can be absorbed by metal level 50 and lead to not realize contactless lead to
Letter, therefore, it is necessary to screen layer 40 is set between metal level 50 and plastic layer 20.
In the present embodiment, the shape of screen layer 40 is identical with the shape of metal level 50, and one also is provided with screen layer 40
Mounting hole 41, mounting hole 41 are the through hole through the upper and lower surface of screen layer 40, and on the shape of mounting hole 41 and metal level 50
The shape of through hole is identical.Specifically, in the projection of the plane where plastic layer 20, mounting hole 51 and the weight of mounting hole 41
It is folded, it so may insure mounting seat 22 through mounting hole 41 and in mounting hole 41.
In order to realize function of shielding, screen layer can be made of permeability magnetic material in the present embodiment, such as use ferrite
Sheet material is made.Also, the thickness of screen layer 40 is less than the thickness of metal level 50, for example, the thickness of metal level 50 is 0.5 millimeter,
And the thickness of screen layer 40 only has 0.04 millimeter.
Certainly, the shape of screen layer is not necessarily to identical with the shape of metal level, and the area of screen layer can be with small
In the area of metal level, as long as screen layer can block the antenna on plastic layer completely, that is, screen layer needs at least
The region where antenna on plastic covering layer.
After metal level 50 is adhered into plastic layer 20, metal level 50 will abut with mounting seat 22, in order to avoid IC cores
Piece 30 directly abutted with metal level 50 and cause IC chip 30 can not normal work, therefore the side wall of mounting seat 22 should be located at IC
It can't directly be contacted between the outside of chip 30, the i.e. perisporium of IC chip 30 and metal level 50, but be separated with mounting seat 22
Side wall.Due to mounting seat 22 and it is made of plastics, there are insulating properties, therefore can protect IC chip 30 will not be by gold
Belong to the influence of layer 50.
Manufacture method of intelligent cards embodiment：
The manufacture method of double-interface smart card is introduced with reference to Fig. 5.First, plastic layer of the manufacture with antenna, that is, hold
Row step S1.For example, it is embedded into antenna in plastic plate, because plastic plate can be molded, therefore can be in injection by day
Line is placed in mould, and plastics wrap up antenna after injection molding, so as to form the plastic plate for being embedded with antenna.
Need to carry out milling machine operation to plastic plate due to follow-up, in order to avoid antenna is milled away during milling, therefore antenna
The side of plastic plate should be arranged on, such as close to the lower end of plastic plate.For example, the gross thickness of double-interface smart card is in 0.8 milli
Rice is between 0.9 millimeter, then being molded the plastic plate to form thickness in 0.8 millimeter, but because subsequent handling is by milling
Fall 0.5 millimeter of thickness, therefore antenna should be arranged on the region within 0.3 millimeter of the one of side of plastic plate, with
Avoid being milled away,
Then, mounting seat is set on plastic plate, for example, milling forms mounting seat on plastic plate, and performs step
S2, IC chip is encapsulated in mounting seat.For example, dripping glue in mounting seat, then IC chip is bonded in mounting seat.When
So, it is necessary to which IC chip is connected with the antenna in plastic plate when IC chip is encapsulated, it is therefore desirable to which the end of antenna is prolonged upwards
Reach the lower end of mounting seat, mill out by the end of antenna when milling forms mounting seat, so as to by the end of IC chip and antenna
Portion is welded or the electrical connection of other modes.
Then, step S3 is performed, milling processing is carried out to plastic plate, i.e., obtained the thickness milling of plastic plate thinner.Due to
The thickness of the plastic plate formed is molded at 0.8 millimeter, and the thickness of metal level is at 0.5 millimeter, in order to avoid the thickness of smart card
It is excessive, it is therefore desirable to plastic plate to be milled away 0.5 millimeter, the thickness of the plastic plate after milling only has 0.3 millimeter.Certainly, milling
Shi Buneng falls the area milling where mounting seat, therefore the plastic plate after milling is not one block of smooth sheet material, but in
Between there is the sheet material of raised mounting seat.
While plastic plate is made, it is also necessary to manufacture metallic plate and barricade, that is, perform step S4 and step S5.
When making metallic plate, the mode of punching press can be used to be stamped and formed out the metallic plate of required shape, it is preferred that the thickness of metallic plate
It is stamped to form a mounting hole in 0.5 millimeter, and on metallic plate, the mounting hole is the first mounting hole, and first pacifies
The shape for filling the mounting seat in the shape and plastic plate in hole matches.
Barricade is also that can be made by the way of punching press, can be in the larger iron oxygen of one piece of area in the present embodiment
The barricade of shape required for being stamped and formed out on body sheet material, and need to be stamped and formed out the second mounting hole, and the second peace on barricade
Size, the shape needs for filling hole are identical with size, the shape of the first mounting hole on metallic plate.
Finally, step S6 is performed, metallic plate, barricade are bonded in the side of plastic plate, so as to form complete intelligence
Card.During bonding, bonding agent can be coated between metallic plate and barricade, and coating is Nian Jie between barricade and plastic plate
Agent, metallic plate, barricade and plastic plate are bonded using bonding agent.Due to being provided with mounting seat, IC chip envelope on plastic plate
In mounting seat, therefore in step S6, metallic plate and barricade are arranged on into plastic plate has the side of mounting seat, and installs
Through the mounting hole on metallic plate and barricade, the outer wall of the inwalls of two mounting holes with mounting seat abuts seat, so that it is guaranteed that
IC chip is firmly fixed on smart card.
It should be noted that what above-mentioned steps S4 and S5 were not necessarily performed successively, the making of plastic plate, metallic plate
Make and the making of barricade can be carried out independently, that is, can first make metallic plate, barricade, make plastics afterwards
Plate, finished as long as making plastic plate, metallic plate and barricade before performing step S6.
In addition, scheme of the present utility model is not limited to the card body for using metal as smart card, such as using carbon fiber, glass
Card body made of the larger material of the hardness such as glass fiber, can also realize the purpose of this utility model.
Because double-interface smart card of the present utility model can't be harder to being provided with the material of antenna in manufacturing process
Rigid material layer carry out milling, milling be only plastic plate, because the hardness of plastic plate is smaller, heat caused by milling
Also it is smaller, antenna will not be impacted, and the bad of product is greatly reduced also without addition coolant in milling process
Rate, and the production efficiency of smart card can also be heightened.Further, since it is broken to produce metal in the milling process of plastic plate
Piece, the pigment of plastics back would not also be impacted, and IC chip is fixed on plastic layer, the encapsulation of IC chip is very
It is firm.
Certainly, above-described embodiment is only the utility model preferred embodiment, and during practical application, the utility model is also
There are more changes, for example, the thickness of IC chip can be actually needed adjustment, also, adjusted and insulated according to the thickness of IC chip
Thickness of lamellar body etc., such change can also realize the purpose of this utility model.
Claims (5)
1. double-interface smart card, including：
Card body, the card body include plastic layer and the rigid material layer positioned at the plastic layer side, and in the plastic layer
It is embedded with antenna；
It is characterized in that：
The plastic layer is provided with mounting seat, and mounting groove is provided with the mounting seat, and IC chip is arranged in the mounting groove；
The first mounting hole is provided with the rigid material layer, first mounting hole is above and below the rigid material layer
The through hole on surface, the mounting seat are located in first mounting hole, and the perisporium of the mounting seat and first mounting hole
Inwall adjoining；
The electric contact of the IC chip is exposed on the surface of the smart card.
2. double-interface smart card according to claim 1, it is characterised in that：
The rigid material layer is metal material layer, glass fiber layer, layer of carbon fiber material or wood materials layer.
3. double-interface smart card according to claim 2, it is characterised in that：
The rigid material layer is conductive material layer, and screen layer is provided between the rigid material layer and the plastic layer,
The screen layer is provided with the second mounting hole, and second mounting hole is the through hole through the screen layer upper and lower surface, and institute
It is identical with the shape of first mounting hole to state the shape of the second mounting hole, in the projection of the plane where the plastic layer,
First mounting hole is overlapping with second mounting hole.
4. double-interface smart card according to claim 3, it is characterised in that：
The screen layer is made up of permeability magnetic material.
5. the double-interface smart card according to claim 3 or 4, it is characterised in that：
The screen layer is at least covered in the plastic layer and is provided with the region of the antenna.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720362870.2U CN206757681U (en) | 2017-04-07 | 2017-04-07 | Double-interface smart card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720362870.2U CN206757681U (en) | 2017-04-07 | 2017-04-07 | Double-interface smart card |
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| Publication Number | Publication Date |
|---|---|
| CN206757681U true CN206757681U (en) | 2017-12-15 |
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ID=60613261
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN201720362870.2U Active CN206757681U (en) | 2017-04-07 | 2017-04-07 | Double-interface smart card |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106991466A (en) * | 2017-04-07 | 2017-07-28 | 金邦达有限公司 | Double-interface smart card and its manufacture method |
| CN112334912A (en) * | 2018-06-20 | 2021-02-05 | 卡诺爱股份有限公司 | Method for manufacturing metal card |
| CN112352246A (en) * | 2018-06-20 | 2021-02-09 | 卡诺爱股份有限公司 | Method for manufacturing metal card |
| US20220184931A1 (en) * | 2019-07-26 | 2022-06-16 | Kona I Co., Ltd. | Card including wood sheet, and method of manufacturing the same |
| WO2023284616A1 (en) * | 2021-07-16 | 2023-01-19 | Act Identity Technology Limited | Chip module and method of forming same |
-
2017
- 2017-04-07 CN CN201720362870.2U patent/CN206757681U/en active Active
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106991466A (en) * | 2017-04-07 | 2017-07-28 | 金邦达有限公司 | Double-interface smart card and its manufacture method |
| CN112334912A (en) * | 2018-06-20 | 2021-02-05 | 卡诺爱股份有限公司 | Method for manufacturing metal card |
| CN112352246A (en) * | 2018-06-20 | 2021-02-09 | 卡诺爱股份有限公司 | Method for manufacturing metal card |
| US11993065B2 (en) | 2018-06-20 | 2024-05-28 | Kona I Co., Ltd. | Metal card manufacturing method |
| CN112334912B (en) * | 2018-06-20 | 2024-07-19 | 卡诺爱股份有限公司 | Method for manufacturing metal card |
| CN112352246B (en) * | 2018-06-20 | 2024-08-02 | 卡诺爱股份有限公司 | Method for manufacturing metal card |
| US20220184931A1 (en) * | 2019-07-26 | 2022-06-16 | Kona I Co., Ltd. | Card including wood sheet, and method of manufacturing the same |
| WO2023284616A1 (en) * | 2021-07-16 | 2023-01-19 | Act Identity Technology Limited | Chip module and method of forming same |
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