CN207398175U

CN207398175U - A kind of LED encapsulation structure of high light-emitting efficiency

Info

Publication number: CN207398175U
Application number: CN201720795809.7U
Authority: CN
Inventors: 王晓凤
Original assignee: Zhejiang Refond Optoelectronics Co Ltd
Current assignee: Zhejiang Refond Optoelectronics Co Ltd
Priority date: 2017-07-03
Filing date: 2017-07-03
Publication date: 2018-05-22
Anticipated expiration: 2027-07-03

Abstract

The utility model is related to a kind of LED encapsulation structures of high light-emitting efficiency, and including packaging cup, the packaging cup bottom is placed with luminescence chip, the packaging plastic being superimposed on the luminescence chip covered with several layers of gapless.The utility model passes through multilayer encapsulation glue that gapless is set to be superimposed on the luminescence chip placed in packaging cup, reduce total reflection of the light in interface interlayer, it reduces between light and each material and the light extraction efficiency of luminescence chip because optical energy loss caused by phenomena such as reflecting, scattering, is maximized in limited cost-range.

Description

A kind of LED encapsulation structure of high light-emitting efficiency

Technical field

The utility model is related to LED encapsulation fields more particularly to a kind of LED encapsulation structures of high light-emitting efficiency.

Background technology

In illumination market, the promotion of light extraction efficiency can bring the reduction of illumination cost, therefore promote the light extraction efficiency of lamps and lanterns Always crucial market orientation.The existing mode for promoting LED light light extraction efficiency is typically that raw material are optimized, such as Using more good fluorescent powder and highlighted chip, but such mode will certainly increase with cost.

Utility model content

Technical problem to be solved in the utility model is to provide a kind of LED encapsulation structure of high light-emitting efficiency, utilize The device of the utility model can be sent out in the light as much as possible for extracting luminescence chip and sending, raising in limited cost-range The light extraction efficiency of optical chip.

Technical solution is used by the utility model solves above-mentioned technical problem：

A kind of LED encapsulation structure of high light-emitting efficiency, including：Packaging cup, the packaging cup bottom are placed with luminescence chip, Packaging plastic covered with several layers of gapless superposition on the luminescence chip.

In a preferred embodiment, the material of the packaging plastic is transparent and is closed with heat cured high dimerization Object.

In a preferred embodiment, if the packaging plastic of dried layer gapless superposition, the refraction of bottom package glue Rate is maximum, and the refractive index of each layer of packaging plastic reduces with the incremental of the superposition number of plies, and the refractive index of top encapsulation glue is minimum.

In a preferred embodiment, the packaging plastic of the gapless superposition has two layers up and down, lower floor's packaging plastic Refractive index is more than the refractive index of upper strata packaging plastic, i.e., described lower floor's packaging plastic is high folding packaging plastic, and the upper strata packaging plastic is low Roll over packaging plastic.

In a preferred embodiment, do not add in packaging plastic added with fluorescent powder, low roll in the high folding packaging plastic Add fluorescent powder.

In a preferred embodiment, the thickness of the high folding packaging plastic for total cup it is deep 3/4 and within.

In a preferred embodiment, the section of the packaging cup is isosceles trapezoid wide at the top and narrow at the bottom.

In a preferred embodiment, roughening treatment is passed through in the upper surface of the packaging plastic top layer.

The beneficial effects of the utility model are：

If the utility model by packaging plastic that dried layer gapless is set to be superimposed on the luminescence chip placed in packaging cup, Total reflection of the light in interface interlayer is reduced, is reduced between light and each material because luminous energy caused by phenomena such as reflecting, scattering Loss maximizes the light extraction efficiency of chip in limited cost-range.

In the preferred embodiment of the utility model, the advantageous effect brought has：

The material selection of packaging plastic is transparent and with heat cured high polymeric compound, is conducive to the light that luminescence chip is sent It projects；Packaging plastic Refractive Index of Material is successively decreased by bottom to top layer, can reduce luminous energy because the loss that refraction generates；Bilayer encapsulation Glue can be with simplification of flowsheet while improving extraction efficiency；In bilayer encapsulation plastic structure, lower floor's packaging plastic thickness is limited in encapsulation Within the 3/4 of the total cup depth of cup, it is ensured that have adequate thickness for the upper strata packaging plastic of low-refraction；Lower floor's addition fluorescent powder can be with Promote the light extraction efficiency of luminescence chip；Section is the packaging cup of isosceles trapezoid wide at the top and narrow at the bottom, is conducive to light unobstructedly from envelope It is projected in dress cup；Roughening treatment is passed through in the upper surface of top layer's packaging plastic, reduces the light losing caused by reflection, scattering.

Description of the drawings

The utility model is described further with reference to the accompanying drawings and examples.

Fig. 1 is the composition structure diagram of the utility model one embodiment semi-finished product；

Fig. 2 is the composition structure diagram of the utility model Fig. 1 embodiment semi-finished product；

Fig. 3 is the utility model Fig. 1 embodiments composition structure diagram；

Fig. 4 is the treated composition structure diagram of the utility model Fig. 1 embodiments.

Specific embodiment

The technique effect of the design of the utility model, concrete structure and generation is carried out below with reference to embodiment and attached drawing Clear, complete description, to be completely understood by the purpose of this utility model, scheme and effect.It should be noted that do not conflicting In the case of, the feature in embodiment and embodiment in the application can be mutually combined.

It should be noted that unless otherwise specified, when a certain feature is referred to as " fixing ", " connection " is in another feature, It can directly fix, be connected in another feature, can also fix, be connected in another feature indirectly.In addition, this The descriptions such as the upper and lower, left and right used in utility model are only the phase compared with each component of the utility model in attached drawing For mutual position relationship.

In addition, unless otherwise defined, the technology of all of technologies and scientific terms used here by the article and the art The normally understood meaning of personnel is identical.Term used in the description is intended merely to description specific embodiment herein, without It is to limit the utility model.Term as used herein " and/or " include appointing for one or more relevant Listed Items The combination of meaning.

Fig. 1 to Fig. 4 is the composition structure diagram under different conditions in the utility model one embodiment process, ginseng According to Fig. 1 to Fig. 4, the LED encapsulation structure of the high light-emitting efficiency includes：

Packaging cup 1, luminescence chip 2, height folding packaging plastic 3 and low folding packaging plastic 4.

As shown in this embodiment, luminescence chip 2, the envelope being superimposed on luminescence chip 2 covered with gapless are arranged at 1 bottom of packaging cup Fill glue.

The packaging plastic material of gapless superposition is not restricted herein, can be silica gel or epoxy resin etc., as long as thoroughly It is bright and with heat cured high polymeric compound, do not stop that the light that chip is sent projects seriously.

The superposition number of plies of packaging plastic is not also restricted herein, as long as the depth difference of the packaging plastic thickness of superposition and packaging cup Different little, packaging plastic can be with nick, flat cup or dimpling with respect to packaging cup.Also, the refractive index of bottom package glue is maximum, The refractive index of each layer of packaging plastic reduces with the incremental of the superposition number of plies, and the refractive index of top encapsulation glue is minimum.

It is preferably double-deck packaging plastic in the present embodiment, the refractive index of lower floor's packaging plastic is more than the refractive index of upper strata packaging plastic, I.e. lower floor's packaging plastic is high folding packaging plastic, and upper strata packaging plastic is low folding packaging plastic.

The processing technology of double-deck packaging plastic is simple, can layer by layer will by techniques such as dispensing, molding, injection, hot pressing Packaging plastic is routed to above luminescence chip, and the light extraction efficiency of luminescence chip is improved with simple double-layer structure amplitude peak. Also, height folding packaging plastic in the structure setting on upper strata, effectively reduces light and is damaged caused by refraction in lower floor, low folding packaging plastic It loses.Stringent limitation can not be done to the thickness of each layer packaging plastic herein, if the thickness of high folding packaging plastic for total cup it is deep 3/4 and with It is interior and cover chip.

After Fig. 1 places luminescence chip 2 for 1 bottom of packaging cup, floor height folding packaging plastic 3 is covered on luminescence chip 2 State.Fig. 2 is to cover the state that one layer of low folding packaging plastic 4 forms double-deck packaging plastic again on high folding packaging plastic 3, is superimposed at this time Packaging plastic is flat cup-shaped state.

Preferably, in the present embodiment, fluorescence is not added added with fluorescent powder, low roll in packaging plastic 4 in height folding packaging plastic 3 Powder.Addition fluorescent powder can promote the light extraction efficiency of luminescence chip 2 in height folding packaging plastic 3, but fluorescent powder has storage light simultaneously The effect of energy, is less prone in the low folding packaging plastic 4 on upper strata.

Preferably, the section of packaging cup 1 is isosceles trapezoid wide at the top and narrow at the bottom in the present embodiment, and open type packaging cup is conducive to The light that bottom of a cup luminescence chip 2 is sent projects.

It preferably, can be by way of cutting, pressing to envelope as shown in figure 3, roughening mold 5 has multiple protrusions The upper surface for filling glue top layer carries out roughening treatment, and the various shapes such as pointed shape or cone may be selected in protrusion.

Herein, except mold roughening method, the other methods such as plasma roughening can also be used to be roughened, as long as table can be increased Surface roughness reduces the light losing caused by reflection, scattering.

The above are implementing to be illustrated to the preferable of the utility model, but the invention is not limited to the reality Example is applied, those skilled in the art can also make a variety of equivalent variations on the premise of without prejudice to the utility model spirit Or replace, these equivalent deformations or replacement are all contained in the application claim limited range.

Claims

1. a kind of LED encapsulation structure of high light-emitting efficiency, which is characterized in that including：Packaging cup, the packaging cup bottom are placed with Luminescence chip, the packaging plastic covered with several layers of gaplesss superposition on the luminescence chip, the refractive index of bottom package glue is maximum, The refractive index of each layer of packaging plastic reduces with the incremental of the superposition number of plies, and the refractive index of top encapsulation glue is minimum.

2. a kind of LED encapsulation structure of high light-emitting efficiency according to claim 1, it is characterised in that：The packaging plastic is It is transparent and with heat cured high polymeric compound material.

3. the LED encapsulation structure of high light-emitting efficiency according to claim 2, it is characterised in that：The gapless superposition Packaging plastic has two layers up and down, and the refractive index of lower floor's packaging plastic is more than the refractive index of upper strata packaging plastic, i.e., described lower floor's packaging plastic is Height folding packaging plastic, the upper strata packaging plastic are low folding packaging plastic.

4. the LED encapsulation structure of high light-emitting efficiency according to claim 3, it is characterised in that：In the high folding packaging plastic Added with fluorescent powder, fluorescent powder is not added in low folding packaging plastic.

5. the LED encapsulation structure of the high light-emitting efficiency according to claim 3 or 4, it is characterised in that：The high folding packaging plastic Thickness for total cup it is deep 3/4 and within.

6. the LED encapsulation structure of high light-emitting efficiency according to any one of claim 1 to 4, it is characterised in that：The envelope The section for filling cup is isosceles trapezoid wide at the top and narrow at the bottom.

7. the LED encapsulation structure of high light-emitting efficiency according to any one of claim 1 to 4, it is characterised in that：The envelope Roughening treatment is passed through in the upper surface of Zhuan Jiao top layers.