CN113838991A - Display panel and display device - Google Patents

Display panel and display device Download PDF

Info

Publication number
CN113838991A
CN113838991A CN202010511671.XA CN202010511671A CN113838991A CN 113838991 A CN113838991 A CN 113838991A CN 202010511671 A CN202010511671 A CN 202010511671A CN 113838991 A CN113838991 A CN 113838991A
Authority
CN
China
Prior art keywords
light
layer
display panel
packaging layer
encapsulation layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN202010511671.XA
Other languages
Chinese (zh)
Other versions
CN113838991B (en
Inventor
郭恩卿
姜博
王程功
黄秀颀
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chengdu Vistar Optoelectronics Co Ltd
Original Assignee
Chengdu Vistar Optoelectronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chengdu Vistar Optoelectronics Co Ltd filed Critical Chengdu Vistar Optoelectronics Co Ltd
Priority to CN202010511671.XA priority Critical patent/CN113838991B/en
Publication of CN113838991A publication Critical patent/CN113838991A/en
Application granted granted Critical
Publication of CN113838991B publication Critical patent/CN113838991B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/85—Arrangements for extracting light from the devices
    • H10K50/856—Arrangements for extracting light from the devices comprising reflective means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Theoretical Computer Science (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

The present application relates to a display panel and a display device. The display panel comprises a driving substrate, a reflecting cup structure, a light emitting unit, a first packaging layer and a second packaging layer. The reflection cup structure comprises a plurality of receiving cavities which are arranged at intervals. The light emitting unit is arranged in the accommodating cavity. The first encapsulation layer and the second encapsulation layer are used for encapsulating the light emitting unit. The reflecting cup structure can form an important barrier for spacing the light-emitting units with different colors, and light cross and color cross of the light-emitting units are inhibited. Because the refractive index of the first packaging layer is smaller than that of the second packaging layer, the emergence angle of the light entering the second packaging layer from the first packaging layer through the contact interface of the first packaging layer and the second packaging layer is smaller than the critical angle, the proportion of the light rays which transversely propagate to other structures and are absorbed is reduced, and the light extraction efficiency of the display panel is improved.

Description

Display panel and display device
Technical Field
The present application relates to the field of display technologies, and in particular, to a display panel and a display device.
Background
The phenomenon that light emitted by a light source cannot be fully utilized generally exists in the current light-emitting device. Due to design defects of the light emitting device, a great deal of loss of light exists in the transmission process. For example, the side wall of the light emitting device emits more light, which causes optical crosstalk, and affects the overall light emitting efficiency of the light emitting device.
Disclosure of Invention
Therefore, it is necessary to provide a display panel and a display apparatus for solving the problem that the light emitting efficiency of the light emitting device is affected by the occurrence of optical crosstalk due to a large amount of loss of light in the transmission process of the conventional light emitting device.
The application provides a display panel, including:
a drive substrate;
the reflecting cup structure covers the driving substrate and comprises a plurality of receiving cavities which are arranged at intervals;
a plurality of light emitting units respectively received in the plurality of receiving cavities and fixed to the driving substrate;
the first packaging layer coats the light-emitting unit; and
and the second packaging layer covers the surface of the first packaging layer far away from the light-emitting unit, and the refractive index of the first packaging layer is smaller than that of the second packaging layer.
In one embodiment, the surface of the first packaging layer far away from the driving substrate is not higher than the surface of the reflection cup structure far away from the driving substrate.
In one embodiment, the display panel further includes:
and the third packaging layer is arranged between the light-emitting unit and the first packaging layer, and the refractive index of the third packaging layer is greater than that of the first packaging layer.
In one embodiment, the refractive index of the first encapsulation layer is 1 to 1.4.
In one embodiment, the refractive index of the second encapsulation layer and/or the refractive index of the third encapsulation layer is 0.1 to 1 greater than the refractive index of the first encapsulation layer.
In one embodiment, the display panel further includes:
and the packaging adhesive layer is arranged between the light-emitting unit and the third packaging layer.
In one embodiment, the surface of the light emitting unit away from the driving substrate is a roughened surface; and/or the surface of the third packaging layer far away from the light-emitting unit is a roughened surface; and/or the surface of the packaging adhesive layer far away from the light-emitting unit is a roughened surface.
In one embodiment, the reflector cup structure comprises a support surface and a receiving surface; the supporting surface and the receiving surface are intersected to form a first intersection line;
the display panel further includes:
and the distance from the projection edge of the black matrix in the stacking direction of the first packaging layer and the second packaging layer to the first intersection line is a first distance.
In one embodiment, the material of the first encapsulation layer and the second encapsulation layer is an organic polymer material doped with metal oxide particles, and the organic polymer material comprises one or more of acrylic resin, epoxy resin, silicone resin, polyimide and polyethylene; the metal oxide particles comprise any one or more of titanium oxide, hafnium oxide, tin oxide, tantalum oxide, silicon oxide, zirconium oxide, zinc oxide and aluminum oxide.
A display device comprising the display panel of any one of the above.
The application provides a display panel and a display device. The display panel comprises a driving substrate, a reflecting cup structure, a light emitting unit, a first packaging layer and a second packaging layer. The reflection cup structure comprises a plurality of receiving cavities which are arranged at intervals. The light emitting unit is arranged in the accommodating cavity. The first encapsulation layer and the second encapsulation layer are used for encapsulating the light emitting unit. The reflecting cup structure can form an important barrier for spacing the light-emitting units with different colors, and light cross and color cross of the light-emitting units are inhibited. Because the refractive index of the first packaging layer is smaller than that of the second packaging layer, the exit angle of light entering the second packaging layer from the first packaging layer through the contact interface of the first packaging layer and the second packaging layer is smaller than the critical angle, the proportion that the light rays transversely propagate to other structures to be absorbed is reduced, and the luminous efficiency of the display panel is improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments or the conventional technologies of the present application, the drawings used in the descriptions of the embodiments or the conventional technologies will be briefly introduced below, it is obvious that the drawings in the following descriptions are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a display panel provided in an embodiment of the present application;
fig. 2 is a schematic view of a partial structure of a display panel provided in an embodiment of the present application;
fig. 3 is a schematic diagram of a structure and an optical path of a display panel provided in an embodiment of the present application;
fig. 4 is a schematic structural diagram of a display panel including a third encapsulation layer according to an embodiment of the present application;
fig. 5 is a schematic diagram of a light path structure of an LED chip when emitting light based on the structure of fig. 4 provided in an embodiment of the present application;
fig. 6 is a schematic structural diagram of a display panel provided in an embodiment of the present application;
FIG. 7 is a schematic diagram of a planar projection structure of a single sub-pixel in a display panel according to an embodiment of the present application;
fig. 8 is a schematic structural diagram of a display panel provided in an embodiment of the present application;
fig. 9 is a schematic structural diagram of a display panel provided in an embodiment of the present application.
The reference numbers illustrate:
display panel 100
Drive substrate 10 carrier substrate 11 drive circuit layer 12
The support surface 210 of the reflector cup structure 21 has a receiving surface 220
Storage cavity 22 reflective layer 23
Light emitting unit 30
First encapsulation layer 41 second encapsulation layer 42
Third encapsulation layer 43 encapsulation glue layer 44
Black matrix 50 cover plate 60
Detailed Description
To facilitate an understanding of the present application, the present application will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present application are given in the accompanying drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
Currently, there are many Light Emitting devices on the market, such as Cathode Ray Tube (CRT), Plasma Display Panel (PDP), Liquid Crystal Display (LCD), Organic Light-Emitting Diode (OLED), and Micro Light-Emitting Diode (Micro LED or μ LED). Due to the different structures of the light emitting devices, the light emitting devices have the problem of optical crosstalk. The inventors have found that in order to improve the problem of crosstalk (cross talk, color cross talk) of the light emitting device, it is necessary to appropriately adjust the package structure of the light emitting device.
For example, the conventional package structure for Micro LED display is optimized based on the package structure for liquid crystal display and organic light emitting diode. The traditional packaging structure of the Micro LED display does not really solve the problems of crosstalk, color crosstalk and low light-emitting efficiency. Based on this, the application provides a display panel and a display device which can improve optical crosstalk in the device and enhance the overall light extraction efficiency of the light-emitting device.
Referring to fig. 1 to fig. 3, fig. 1 is a schematic structural diagram of a display panel 100 according to an embodiment of the present application. The display panel 100 includes a driving substrate 10, a reflective cup structure 21, a plurality of light emitting cells 30, a first encapsulation layer 41, and a second encapsulation layer 42. The plurality of light emitting units 30 may be light emitting units 30 emitting different colors of light. The light emitting unit 30 may be an LED chip, or may also be a Micro LED chip, an OLED light emitting device, or other structures.
The driving substrate 10 is used to generate a driving signal. The driving substrate 10 includes a carrier substrate 11 and a driving circuit layer 12. The carrier substrate 11 may be a glass substrate or a flexible substrate. The flexible substrate may be a single crystalline silicon film layer of a doped polymer. The material of the doped polymer may be one or more of polysulfone, polyethylene terephthalate (PET), polyethylene naphthalate (PEN), and Polyimide (PI). The driving circuit layer 12 includes a pixel driving circuit for driving the light emitting unit 30 to emit light. The specific structure of the driving circuit layer 12 is not limited as long as the light emitting unit 30 can be driven to perform display.
Referring to fig. 2, fig. 2 is a schematic view of a partial structure of a display panel according to an embodiment of the present application. The reflective cup structure 21 is disposed on the driving substrate 10. The reflector cup structure 21 forms a plurality of receiving cavities 22 arranged at intervals. Two receiving cavities 22 are included in fig. 2, and two light emitting units 30 may be provided. Specifically, the reflector cup structure 21 has a bowl-like shape. The receiving cavity 22 is a bowl-like cavity. The receiving cavity 22 may be a truncated cone-shaped cavity structure with a smaller radius of the bottom surface and a larger radius of the top surface. The housing chamber 22 exposes the drive substrate 10. The receiving cavity 22 is used for receiving the light emitting unit 30. One receiving chamber 22 is for receiving one light emitting unit 30. It will be appreciated that the number of receiving cavities 22 may be set as desired for different uses of the display panel 100. The arrangement of the reflective cup structure 21 can change the light emitting direction of the light emitting unit 30 appropriately. The reflective cup structure 21 can form an important barrier for spacing the light emitting cells 30 of different colors, thereby suppressing crosstalk and color crosstalk of the light emitting cells 30. The shape of the reflector cup structure 21 can be varied in many ways, and can be a polygonal frustum of a square, a truncated cone or an elliptical frustum. Specifically, the polygon may be a quadrangle, a pentagon, a hexagon, or a heptagon.
The connection of the light emitting unit 30 to the driving substrate 10 is used to realize the electrical connection and driving control of the pixel driving circuit and the light emitting unit 30. The display panel 100 may include one light emitting unit 30. The display panel 100 may also include a plurality of light emitting units 30. When the display panel 100 includes a plurality of light emitting units 30, such as a plurality of LED chips, the plurality of LED chips are spaced apart by the reflective cup structure 21. For example, when the display panel 100 includes 3 LED chips, the 3 LED chips are respectively located in the 3 receiving cavities 22. The LED chip may be any one of a red light emitting chip (R), a green light emitting chip (G), and a blue light emitting chip (B). The upper surface (the surface away from the driving substrate 10) of the reflecting cup structure 21 is higher than the top plane of the LED chip away from the driving substrate 10, so as to ensure that the light emitted from the LED chip can be transmitted out with less loss.
The display panel 100 further includes a first encapsulation layer 41 and a second encapsulation layer 42. The first encapsulation layer 41 is disposed in the receiving cavity 22. The first encapsulation layer 41 encapsulates the light emitting unit 30. Or first encapsulant layer 41 encapsulates the LED chip.
The second encapsulation layer 42 covers a surface of the first encapsulation layer 41 away from the light emitting unit 30. The refractive index of the first encapsulation layer 41 is smaller than the refractive index of the second encapsulation layer 42.
According to the law of refraction n1 sinθ1＝n2 sinθ2N1 and n2 are refractive indexes of the incident medium and the exit medium, respectively, and θ1、θ2Respectively, an incident angle and an exit angle. Transmission interface of light in two media: when the incident angle is greater than or equal to the critical angle, the light is not refracted. When the incident angle is less than the critical angle, the light is refracted.
Referring to fig. 2 again, the reflector cup structure 21 includes a supporting surface 210 and a receiving surface 220. The supporting surface 210 is parallel to the driving substrate 10. The angle between the receiving surface 220 and the driving substrate 10 is greater than 0 ° and less than 180 °. The supporting surface 210 and the receiving surface 220 intersect to form a first intersection line (not shown). In one embodiment, the display panel 100 mentioned in the above embodiments further includes the black matrix 50. The black matrix 50 is disposed on the supporting surface 210. The orthographic projection of the black matrix 50 on the drive substrate 10 partially covers the support surface 210. The distance from the orthographic projection edge of the black matrix 50 in the stacking direction of the first and second encapsulating layers 41 and 42 to the first intersection line is a first distance. In general, the first distance may be set to 5um-100 um.
In this embodiment, a distance from an orthographic projection edge of the black matrix 50 in the stacking direction of the first and second encapsulation layers 41 and 42 to the first intersection line is a first distance. A reflective layer is provided on the surface of the support surface 210 where the black matrix 50 is not provided. The reflective layer can dissipate the light of different colors that cannot be transmitted out of the light-emitting units 30 by reflection once and again, thereby avoiding crosstalk and color crosstalk between adjacent light-emitting units 30.
Please refer to the display panel 100 illustrated in fig. 3, which further includes a cover plate 60. As can be seen in fig. 3, the cover sheet 60 covers the black matrix 50 and the second encapsulation layer 42. In this embodiment, the cover plate 60 may be a transparent cover plate having no refraction. The cover plate 60 serves to protect the display panel from external impact while displaying for obtaining a front and/or side surface of the display panel 100. The specific material of the cover plate 60 is not limited. The cover 60 is typically a transparent or light transmissive cover. For example, in some embodiments, an OCA optical glue layer may be selected. The cover plate 60 is required to cover the front surface of the display panel and has better light transmittance. For example, in some embodiments, the cover plate 60 may comprise at least one of sapphire glass, gorilla glass. In other embodiments, the cover plate 60 may further include one of polyethylene terephthalate, polycarbonate, polyethersulfone, polynaphthalene, and polynorbornene.
Referring specifically to fig. 3, since the refractive index of the first encapsulation layer 41 is smaller than that of the second encapsulation layer 42, the exit angle of light entering the second encapsulation layer 42 and the cover plate 60 (if the refractive indexes of the cover plate 60 and the second encapsulation layer 42 are close, the interface reflection and refraction between them are small and can be ignored) through the contact interface (i.e., the second interface shown in fig. 5) of the first encapsulation layer 41 and the second encapsulation layer 42 is smaller than the critical angle, the proportion of light that laterally propagates to reach other structures, such as the black matrix 50, and is absorbed is reduced, thereby improving the light extraction efficiency of the display panel 100.
In this embodiment, the display panel 100 includes a driving substrate 10, a reflective cup structure 21, a light emitting unit 30, a first encapsulation layer 41, and a second encapsulation layer 42. The reflector cup structure 21 forms a plurality of receiving cavities 22 arranged at intervals. The light emitting unit 30 is disposed in the receiving chamber 22. The first and second encapsulation layers 41 and 42 are used to encapsulate the light emitting unit 30. The reflective cup structure 21 can form an important barrier for spacing the light emitting units of different colors, thereby suppressing crosstalk and color crosstalk of the light emitting units. Since the refractive index of the first encapsulation layer 41 is smaller than the refractive index of the second encapsulation layer 42, the exit angle of light entering the second encapsulation layer 42 from the first encapsulation layer 41 through the contact interface of the first encapsulation layer 41 and the second encapsulation layer 42 is smaller than the critical angle, the problems of light cross-talk and color cross-talk caused by light rays laterally propagating to reach other structures are reduced, the proportion of light rays laterally propagating to reach other structures to be absorbed is also avoided, and the light extraction efficiency of the display panel 100 is improved.
In one embodiment, in the lamination direction of the driving substrate 10, the light emitting unit 30 and the first encapsulation layer 41, a surface of the first encapsulation layer 41 away from the driving substrate 10 is not higher than a surface of the reflective cup structure 21 away from the driving substrate 10.
In this embodiment, the surface of the first encapsulation layer 41 away from the driving substrate 10 is lower than or equal to the surface of the reflective cup structure 21 away from the driving substrate 100, so that the light loss caused by the transmission of the light emitted from the first encapsulation layer 41 to the black matrix 50 can be reduced. The surface of the first encapsulation layer 41 away from the driving substrate 10 is not higher than the surface of the reflective cup structure 21 away from the driving substrate 100, so that the overall light-emitting efficiency of the display panel 100 can be improved.
Referring to fig. 4 and 5, the display panel 100 further includes a third encapsulation layer 43. The third encapsulation layer 43 is disposed between the light emitting unit 30 and the first encapsulation layer 41. The refractive index of the third encapsulation layer 43 is greater than the refractive index of the first encapsulation layer 41.
In one embodiment, referring to fig. 6, the third encapsulant layer 43 protrudes away from the driving substrate 10 to facilitate adjusting the propagation direction of the light. The third encapsulation layer 43 may ensure that light emitted from the LED chip enters the first encapsulation layer 41 at a small incident angle. While light of a large incident angle cannot enter the first encapsulation layer 41. Light of a large angle of incidence continues to propagate in the third encapsulation layer 43, which changes direction by multiple reflections before it is possible to enter the first encapsulation layer 41 at a small angle of incidence. As shown in fig. 1, 3, 4 and 6, the side walls of the reflector cup structure 21 are provided with a reflective layer 23. In one embodiment, the reflective layer 23 is disposed on the inner sidewalls of the reflective cup structure 21 and a portion of the surface of the driving substrate 10. The material of the reflective layer 23 is a highly reflective metal. When light emitted from the LED chip is irradiated to the reflective layer 23, the reflective layer 23 may reflect the light to the light emitting side of the LED chip, and the reflective layer 23 having a high reflectivity may reduce light loss. Specifically, the reflective layer 23 serves to reflect light of a large incident angle, which cannot enter the first encapsulation layer 41, multiple times.
The display panel 100 provided in the present embodiment includes a driving substrate 10, a reflective cup structure 21, a light emitting unit 30, a third encapsulation layer 43, a first encapsulation layer 41, and a second encapsulation layer 42. The refractive index of the first encapsulant layer 41 is smaller than the refractive index of the third encapsulant layer 43, and when light is emitted from the third encapsulant layer 43 to the first interface in the light emitting process of the light emitting unit 30 (as shown in fig. 5, the contact interface of the light emitted from the third encapsulant layer 43 to the first encapsulant layer 41 is the first interface), since the refractive index of the first encapsulant layer 41 is smaller than the refractive index of the third encapsulant layer 43, the light with the incident angle larger than the first critical angle is totally reflected and cannot enter the first encapsulant layer 41. The light with the incident angle larger than the first critical angle continues to propagate in the third encapsulation layer 43, and generates a certain loss, and when the light reaches the first interface again after multiple reflections, the incident angle may be smaller than the first critical angle, and the light can enter the first encapsulation layer 41. In the technical solution of this embodiment, when the light is emitted from the third encapsulation layer 43 to the first interface, the light with the incident angle larger than the first critical angle is finally utilized through multiple reflections. The exit angle of light entering the second encapsulant layer 42 and the cover plate 60 from the first encapsulant layer 41 through the second interface (if the refractive indices of the glass cover plate and the second encapsulant layer 42 are close, the reflection and refraction at the interface therebetween are negligible) is smaller than the second critical angle, reducing the proportion of light rays that propagate laterally to reach the black matrix 50 to be absorbed, thereby improving the light extraction efficiency of the display panel.
In one embodiment, the surface of the third encapsulation layer 43 remote from the driving substrate 10 is provided with a plurality of protrusions. In this embodiment, the protrusion disposed on the surface of the third encapsulation layer 43 may be formed by performing surface roughening treatment on the encapsulation layer. The surface of the third encapsulating layer 43 is roughened, so that light can be conveniently scattered, and discretization of an incident angle or change of the propagation direction of light can be facilitated, so that light emitted by the LED chip can be transmitted to the first encapsulating layer 41 to the maximum extent.
In one embodiment, the refractive index of the first encapsulation layer 41 is 1 to 1.4. That is, the refractive index of the first encapsulating layer 41 is greater than 1 and equal to or less than 1.4. In some embodiments, the refractive index of the first encapsulation layer 41 is greater than 1 and equal to or less than 1.25. In a specific embodiment, the refractive index of the first encapsulation layer 41 is 1.1. In another specific embodiment, the refractive index of the first encapsulation layer 41 is 1.2.
In one embodiment, the refractive index of the third encapsulation layer 43 and/or the refractive index of the second encapsulation layer 42 is 0.1 to 1 greater than the refractive index of the first encapsulation layer 41. In this embodiment, the refractive index of the third encapsulation layer 43 and/or the refractive index of the second encapsulation layer 42 are both greater than the refractive index of the first encapsulation layer 41. The relationship between the refractive index of the specific third encapsulating layer 43 and the refractive index of the second encapsulating layer 42 can be arbitrarily determined. For example, the refractive index of the third encapsulation layer 43 may be greater than, less than, or equal to the refractive index of the second encapsulation layer 42.
In one embodiment, the refractive index of third encapsulation layer 43 is 0.5 greater than the refractive index of first encapsulation layer 41. The refractive index of the second encapsulation layer 42 is greater than the refractive index of the first encapsulation layer 41 by 0.3. In one embodiment, the refractive index of the third encapsulation layer 43 and the refractive index of the second encapsulation layer 42 are between 1.35-2.0. For example, the refractive index of the third encapsulation layer 43 is 1.35, the refractive index of the first encapsulation layer 41 is 1.15, and the refractive index of the second encapsulation layer 42 is 1.5. In another specific embodiment, the refractive index of the third encapsulation layer 43 is 1.65; the refractive index of the first encapsulation layer 41 is 1.25 and the refractive index of the second encapsulation layer 42 is 1.45.
In this embodiment, the light emitted from the LED chip can be smoothly and fully guided and utilized by the high-low multilayer light-transmitting medium composed of the third encapsulating layer 43, the first encapsulating layer 41 and the second encapsulating layer 42. The multi-layer light-transmitting medium with high height inhibits the absorption loss of light, prevents the crosstalk of light, avoids the color crosstalk of different colors, and improves the overall light-emitting efficiency of the display panel 100.
Referring to fig. 7, fig. 7 is a schematic view of a single sub-pixel plane projection structure. In the middle is a light emitting unit 30(LED chip). The area of the outer periphery of the LED chip is a reflective layer 23. The further outer ring structure is the contour of the reflector cup structure 21. The outermost black region is a black matrix 50.
Referring to fig. 8, fig. 8 is a diagram illustrating that an encapsulant layer 44 is disposed between the LED chip and the third encapsulant layer 43 on the basis of fig. 6 in which a plurality of layers of high-low light-transmitting media are disposed. The encapsulant layer 44 has a refractive index difference with the third encapsulant layer 43. The contact interface of the encapsulating glue layer 44 and the third encapsulating layer 43 may be a roughened surface.
In this embodiment, the encapsulant layer 44 has high transparency. The material of the encapsulating adhesive layer 44 may be any one of an ultraviolet photosensitive adhesive material, a polymer adhesive material, an organic adhesive material, a resin adhesive material, and an organic silicon adhesive material. The arrangement of the packaging adhesive layer 44 can increase the transmission path of the light emitted by the LED chip, which is beneficial to breaking the total reflection mode of light propagation.
In one embodiment, the surface of the light emitting unit 30 away from the driving substrate 10 is a roughened surface. In one embodiment, the surface of the third encapsulation layer 43 away from the light emitting unit 30 is a roughened surface. In one embodiment, referring to fig. 9, the surface of the encapsulant layer 44 away from the light emitting unit 30 is a roughened surface.
In this embodiment, the roughened surface may be mechanically or chemically treated to provide a micro-rough texture on the surface. In this embodiment, the roughened surface is provided in the path of the light emitted from the LED chip, so that the original path of the light can be disturbed, and the light can be uniformly distributed.
In one embodiment, in the display panel 100, the surfaces of the LED chip, the third encapsulation layer 43 and the encapsulation adhesive layer 44 can be made into rough surfaces, which helps to disturb the original path of light, can make the light uniformly distributed, and is beneficial to improving the light extraction efficiency.
In one embodiment, the light emitting unit 30(LED chip), the third encapsulation layer 43, and the reflective layer 23 may each have an uneven (roughened) surface or sidewall. The unevenness of the surfaces or the sidewalls of the light emitting unit 30, the third encapsulant layer 43, and the reflective layer 23 can have a good diffuse reflection effect, so that the propagation direction of the reflected light has a certain randomness. In one embodiment, the third encapsulation layer 43 may have a flat surface, a convex surface in a direction away from the driving substrate 10, or a roughened surface.
In one embodiment, the encapsulation layer material in the first, second and third encapsulation layers 41, 42, 43 is an organic polymer material doped with metal oxide particles. The organic polymer material comprises one or more of acrylic resin, epoxy resin, organic silicon resin, polyimide and polyethylene. In one embodiment, the doped metal oxide particles comprise any one or more of titanium oxide, hafnium oxide, tin oxide, tantalum oxide, silicon oxide, zirconium oxide, zinc oxide, aluminum oxide.
In this embodiment, the first encapsulation layer 41 is made of an epoxy resin doped with titanium oxide nanoparticles. The second packaging layer 42 is made of polyimide doped with tin oxide nanoparticles. The third encapsulating layer 43 is made of titanium oxide nanoparticle-doped zirconium polyethylene. In another embodiment, the first encapsulating layer 41 is made of silicone resin doped with silicon oxide nanoparticles. The second packaging layer 42 is made of acrylic resin doped with zinc oxide nanoparticles. The third packaging layer 43 is made of epoxy resin doped with alumina nanoparticles. The refractive index of the first encapsulation layer 41, the refractive index of the second encapsulation layer 42, and the refractive index of the third encapsulation layer 43 can be selectively set by changing the amount of the doped particles according to actual needs.
In one embodiment, the present application further includes a method of manufacturing a display panel. The preparation method of the display panel comprises the following steps:
a carrier substrate 11 is provided, and a drive circuit layer 12 is formed on the surface of the carrier substrate 11.
A reflective cup structure 21 is formed on the surface of the driver circuit layer 12. The reflector cup structure 21 forms a plurality of receiving cavities 22 arranged at intervals. A reflective layer 23 is formed on the side surface of the storage cavity 22 and the cup stand (support surface) of the reflective cup structure 21.
The light emitting units 30 are provided in the plurality of housing chambers 22, respectively. The light emitting unit 30 may be LED chips of different colors.
The surface of the light emitting unit 30 is covered with a third encapsulation layer 43. The third encapsulation layer 43 covers the whole light emitting unit 30 to realize a precise encapsulation process, so as to prevent the LED chip from being damaged by external water and oxygen and mechanical vibration.
The third encapsulation layer 43 covers the first encapsulation layer 41, and the height of the first encapsulation layer 41 is lower than or equal to the mesa height of the reflective cup structure 21. A second encapsulation layer 42 of a first thickness is provided on the first encapsulation layer 41 and the mesa of the reflector cup structure 21.
A cover plate 60 is provided and a black matrix 50 is disposed on a first surface of the cover plate 60. The second encapsulation layer 42 is disposed at a second thickness on the first surface on which the black matrix 50 is disposed.
The second encapsulation layer 42 with the first thickness and the second encapsulation layer 42 with the second thickness are aligned to form the display panel 100. Wherein the first surface of the cover plate 60 is disposed adjacent to the driving substrate 10.
Based on the same inventive concept, the present embodiment further provides a display device (not shown), which includes the display panel 100 in the above embodiments.
It can be understood that the display device in the embodiment of the present application may be any product or component having a display function, such as electronic paper, a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator, a wearable device, and an internet of things device, and the embodiment disclosed in the present application is not limited thereto.
In the description herein, references to the description of "some embodiments," "other embodiments," "desired embodiments," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, a schematic description of the above terminology may not necessarily refer to the same embodiment or example.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (10)

1. A display panel, comprising:
a drive substrate;
the reflecting cup structure covers the driving substrate and comprises a plurality of receiving cavities which are arranged at intervals;
a plurality of light emitting units respectively received in the plurality of receiving cavities and fixed to the driving substrate;
the first packaging layer coats the light-emitting unit; and
and the second packaging layer covers the surface of the first packaging layer far away from the light-emitting unit, and the refractive index of the first packaging layer is smaller than that of the second packaging layer.
2. The display panel according to claim 1, wherein a surface of the first encapsulation layer away from the driving substrate is not higher than a surface of the reflective cup structure away from the driving substrate.
3. The display panel according to claim 2, further comprising:
and the third packaging layer is arranged between the light-emitting unit and the first packaging layer, and the refractive index of the third packaging layer is greater than that of the first packaging layer.
4. The display panel of claim 3, wherein the first encapsulation layer has a refractive index of 1 to 1.4.
5. The display panel according to claim 4, wherein the refractive index of the second encapsulation layer and/or the refractive index of the third encapsulation layer is 0.1 to 1 greater than the refractive index of the first encapsulation layer.
6. The display panel according to claim 3, further comprising:
and the packaging adhesive layer is arranged between the light-emitting unit and the third packaging layer.
7. The display panel according to claim 6, wherein a surface of the light emitting unit away from the driving substrate is a roughened surface; and/or the surface of the third packaging layer far away from the light-emitting unit is a roughened surface; and/or the surface of the packaging adhesive layer far away from the light-emitting unit is a roughened surface.
8. The display panel of claim 7, wherein the reflective cup structure comprises a support surface and a receiving surface; the supporting surface and the receiving surface are intersected to form a first intersection line;
the display panel further includes:
and the distance from the projection edge of the black matrix in the stacking direction of the first packaging layer and the second packaging layer to the first intersection line is a first distance.
9. The display panel according to any one of claims 1 to 8, wherein the material of the first and second encapsulating layers is an organic polymer material doped with metal oxide particles, the organic polymer material comprising one or more of acrylic resin, epoxy resin, silicone resin, polyimide, polyethylene; the metal oxide particles comprise any one or more of titanium oxide, hafnium oxide, tin oxide, tantalum oxide, silicon oxide, zirconium oxide, zinc oxide and aluminum oxide.
10. A display device characterized by comprising the display panel according to any one of claims 1 to 9.
CN202010511671.XA 2020-06-08 2020-06-08 Display panel and display device Active CN113838991B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010511671.XA CN113838991B (en) 2020-06-08 2020-06-08 Display panel and display device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010511671.XA CN113838991B (en) 2020-06-08 2020-06-08 Display panel and display device

Publications (2)

Publication Number Publication Date
CN113838991A true CN113838991A (en) 2021-12-24
CN113838991B CN113838991B (en) 2024-02-23

Family

ID=78963372

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010511671.XA Active CN113838991B (en) 2020-06-08 2020-06-08 Display panel and display device

Country Status (1)

Country Link
CN (1) CN113838991B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116322146A (en) * 2023-03-22 2023-06-23 惠科股份有限公司 Display panel and display device
WO2023133762A1 (en) * 2022-01-13 2023-07-20 厦门市芯颖显示科技有限公司 Micro led display panel and fabricating method therefor
CN116565102A (en) * 2023-06-21 2023-08-08 惠科股份有限公司 Light-emitting substrate, preparation method thereof and display device

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060261366A1 (en) * 2005-05-19 2006-11-23 Pi-Fu Yang Integrated light-emitting device
CN101630710A (en) * 2008-07-18 2010-01-20 富准精密工业(深圳)有限公司 Light-emitting diode
CN102074641A (en) * 2010-07-23 2011-05-25 宁波市瑞康光电有限公司 LED packaging method, LED and LED illuminating device
CN103178165A (en) * 2011-12-21 2013-06-26 展晶科技(深圳)有限公司 Light-emitting diode and manufacture method thereof
CN104409659A (en) * 2014-12-18 2015-03-11 上海天马有机发光显示技术有限公司 Organic light emitting diode and manufacturing method thereof
CN107546338A (en) * 2017-08-29 2018-01-05 上海天马微电子有限公司 Organic electroluminescence display panel and organic light-emitting display device
CN207398175U (en) * 2017-07-03 2018-05-22 浙江瑞丰光电有限公司 A kind of LED encapsulation structure of high light-emitting efficiency
CN109638055A (en) * 2018-12-18 2019-04-16 武汉天马微电子有限公司 A kind of organic light emitting display panel, preparation method and display device
CN109873069A (en) * 2019-03-08 2019-06-11 佛山市国星光电股份有限公司 A kind of LED component

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060261366A1 (en) * 2005-05-19 2006-11-23 Pi-Fu Yang Integrated light-emitting device
CN101630710A (en) * 2008-07-18 2010-01-20 富准精密工业(深圳)有限公司 Light-emitting diode
CN102074641A (en) * 2010-07-23 2011-05-25 宁波市瑞康光电有限公司 LED packaging method, LED and LED illuminating device
CN103178165A (en) * 2011-12-21 2013-06-26 展晶科技(深圳)有限公司 Light-emitting diode and manufacture method thereof
CN104409659A (en) * 2014-12-18 2015-03-11 上海天马有机发光显示技术有限公司 Organic light emitting diode and manufacturing method thereof
CN207398175U (en) * 2017-07-03 2018-05-22 浙江瑞丰光电有限公司 A kind of LED encapsulation structure of high light-emitting efficiency
CN107546338A (en) * 2017-08-29 2018-01-05 上海天马微电子有限公司 Organic electroluminescence display panel and organic light-emitting display device
CN109638055A (en) * 2018-12-18 2019-04-16 武汉天马微电子有限公司 A kind of organic light emitting display panel, preparation method and display device
CN109873069A (en) * 2019-03-08 2019-06-11 佛山市国星光电股份有限公司 A kind of LED component

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023133762A1 (en) * 2022-01-13 2023-07-20 厦门市芯颖显示科技有限公司 Micro led display panel and fabricating method therefor
CN116322146A (en) * 2023-03-22 2023-06-23 惠科股份有限公司 Display panel and display device
CN116322146B (en) * 2023-03-22 2024-05-24 惠科股份有限公司 Display panel and display device
CN116565102A (en) * 2023-06-21 2023-08-08 惠科股份有限公司 Light-emitting substrate, preparation method thereof and display device

Also Published As

Publication number Publication date
CN113838991B (en) 2024-02-23

Similar Documents

Publication Publication Date Title
CN113838991B (en) Display panel and display device
CN109782492B (en) Light source module and display device
CN110323354B (en) Display panel and display device
US10139545B2 (en) Front light display device and manufacturing thereof
CN110928038A (en) Backlight module, display device and liquid crystal television
JP6912748B1 (en) Light emitting module and planar light source
CN113193151B (en) Display panel and display device
US11320696B2 (en) Backlight module, display, and mobile terminal
WO2021190414A1 (en) Display device
JP4282344B2 (en) Light emitting diode
WO2023246492A1 (en) Display panel, display device, and vehicle-mounted display system
CN110828645A (en) Light-emitting element, backlight module and display device
US20240040912A1 (en) Display panel and display device
CN115407551B (en) Display device
TWI750935B (en) Diffusion plate and backlight module having the diffusion plate
CN111933626B (en) Flexible mini-LED backlight lamp plate and flexible electronic equipment thereof
CN113534536A (en) Backlight module, preparation method thereof and display device
US10551548B2 (en) Backlight unit and display apparatus including the same
US20210349251A1 (en) Display device and mobile device
CN114512505A (en) Display backboard and display device
JP6863505B2 (en) Diffusing member, laminate, set of diffusing member, LED backlight and display device
CN114355657A (en) Splicing display panel and splicing display device
JP2011187239A (en) Lighting system equipped with surface light source element and it
CN213814205U (en) Backlight module for realizing uniform light emission and electronic equipment
CN114063346A (en) Display device

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant