CN205900583U - Luminous components and parts of single face light -emitting - Google Patents
Luminous components and parts of single face light -emitting Download PDFInfo
- Publication number
- CN205900583U CN205900583U CN201620729982.2U CN201620729982U CN205900583U CN 205900583 U CN205900583 U CN 205900583U CN 201620729982 U CN201620729982 U CN 201620729982U CN 205900583 U CN205900583 U CN 205900583U
- Authority
- CN
- China
- Prior art keywords
- emitting diode
- light
- emitting
- light emitting
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model provides a luminous components and parts of single face light -emitting, relates to the semiconductor device packaging technique field, sets up two electrodes in emitting diode's bottom surface, sets up the phosphor powder glue film in emitting diode's front, all sets up reflection of light glue film in four sides of emitting diode. The utility model discloses be provided with the phosphor powder glue film on the play plain noodles, the utility model discloses the device is compared with five play optic components, and the product optical efficiency is high, light -emitting directive property is strong, and this structure is compared with five play optical diode, and the optical efficiency is high, light -emitting directive property is strong, very big developing the product application field, the flexibility when using has improved.
Description
Technical field
The utility model is related to semiconductor device packaging technique field, more particularly relates to white light-emitting diode chip
Packaging technology.
Background technology
In market to LED device miniaturization, under the cry of high current density, wafer-level package light emitting diode
By saving, the redundancy structures such as support and gold thread reduce volume, excellent radiation performance can bear the advantages such as high-density current, become
The nova rising up slowly for light emitting diode industry, has attracted numerous chips and the sight of encapsulation factory.
Yet with production technology route is immature, reason, the chip-scale on domestic and international market such as equipment investment is costly
Encapsulating light emitting diode product cans be counted on one's fingers.In order to seize emerging market, domestic and international Ge great producer even more racks one's brains and seizes specially
Sharp lofty perch, current part volume production technology is by the way of overall printing or module PCB.But overall printing needs using high-precision
Degree cutting equipment could obtain single chip level encapsulating light emitting diode product, and the appearance and size that module PCB obtains product is solid
Fixed, during application, flexible design degree is little and module in any one LED failure lead to the performance of module and outward appearance different
Often.
According to Moore's Law it is known that electronics, the upgrading of Packaging Industry production equipment be fast, equipment depreciation rate is high, because
This buys expensive high-precision cutting equipment becomes the road blocking tiger that wafer-level package light emitting diode product is prepared by Ge great producer.
Utility model content
The utility model purpose is to propose a kind of convenience to produce, put forward the emitting components that high-quality one side goes out light.
The emitting components that the utility model one side goes out light arrange two electrodes in the bottom surface of light emitting diode, and its feature exists
In arranging fluorescent material glue-line in the front of light emitting diode, it is respectively provided with reflective glue-line in four sides of light emitting diode.
Fluorescent material glue-line is provided with the utility model exiting surface, the utility model device goes out optic component phase with five faces
Higher than, product light efficiency, go out that light directive property is strong, compared with this structure goes out optical diode with five faces, light efficiency is high, go out light directive property
By force, greatly open up product applications, improve flexibility during use.
Further, reflective glue-line described in the utility model is closer to the thickness of thin in front in the thickness close to bottom surface.Should
Design firstly reduce the cost that reflective glue consumption reduces the utility model device, makes product have more preferable competitive advantage;Its
The secondary law of refraction according to light, this design can improve the light emission rate of the utility model device, thus lifting brightness, reducing section
Temperature, increases the service life;3rd reduces the utility model device volume, weight, beneficial to application unit area endoparticle number
Lifting and Weight control;When 4th the utility model device application is the luminous curved surface of outwardly convex, this kind of it is designed to
Effectively reduce space between particle, improve brightness uniformity, lift visual comfort.
Brief description
Fig. 1 to 6 is process flow diagram of the present utility model.
Fig. 7 is a kind of structural representation of the utility model product.
Fig. 8 is another kind of structural representation of the utility model product.
Specific embodiment
1 to 8 specific implementation process is as follows below in conjunction with the accompanying drawings:
First, example 1:
1st, multiple light emitting diodes 1 are fixed on the same face of fixing film 2 with the equal array of row, column spacing.As Fig. 1
Shown.
2nd, passing through clip 3 by fixing film 2 is in tighten shape to be positioned on microscope carrier 4, and makes each light emitting diode 1 towards upper
Side, as shown in Figure 2.
3rd, fix steel mesh 5 on fixing film 2, and so that light emitting diode 1 is in correspondingly using optical alignment part
The middle of each mesh of steel mesh 5.Note: the mesh depth of steel mesh 5 is slightly larger than the thickness of light emitting diode 1.As Fig. 3 institute
Show.
Using scraper, reflective glue 6 is filled in each mesh of steel mesh 5, as shown in Figure 4.After reflective glue 6 is dried, take off
From steel mesh 5, grind the reflective glue removing on light emitting diode 1 exiting surface, obtain semi-products as shown in Figure 5.
4th, fix steel mesh 5 again on fixing film 2, and light emitting diode 1 is made correspondingly using optical alignment part
It is in each mesh middle of steel mesh 5.Using scraper, the phosphor gel that refractive index is 1.5 is filled in each mesh of steel mesh 5
Interior, depart from steel mesh 5 grinding and polishing after drying.
Fix steel mesh 5 on fixing film 2 again, and so that light emitting diode 1 is corresponded using optical alignment part and be located in
Each mesh middle in steel mesh 5.Using scraper, the phosphor gel that refractive index is 1.4 is filled in each mesh of steel mesh 5
Interior, depart from steel mesh 5 grinding and polishing after drying.
Fix steel mesh 5 on fixing film 2 again, and so that light emitting diode 1 is corresponded using optical alignment part and be located in
Each mesh middle in steel mesh 5.Using scraper, the phosphor gel that refractive index is 1.3 is filled in each mesh of steel mesh 5
Interior, depart from steel mesh 5 grinding and polishing after drying.
The semi-products being formed are as shown in Figure 6.
5th, separate on self-retaining film 2 and obtain the light emitting diode that single one side goes out light, its structure is as shown in Figure 7:
Two electrodes 8 are set in the bottom surface of light emitting diode 1, fluorescent material glue-line 7 are set in the front of light emitting diode 1,
It is respectively provided with reflective glue-line 6 in four sides of light emitting diode 1.Fluorescent material glue-line 7 is by the first fluorescent material glue-line 7a, the second fluorescence
Arogel layer 7b and the 3rd fluorescent material glue-line 7c composition, the first fluorescent material glue-line 7a is arranged on light emitting diode 1, the second fluorescent material
Glue-line 7b is arranged on the first fluorescent material glue-line 7a, and the 3rd fluorescent material glue-line 7c is arranged on the second fluorescent material glue-line 7b.
2nd, example 2:
Other similar, simply when designing steel mesh 5, its mesh is designed to the horn mouth that top surface area is more than following table area
Shape.
Thus, the product of formation is as shown in Figure 8:
Two electrodes 8 are set in the bottom surface of light emitting diode 1, fluorescent material glue-line 7 are set in the front of light emitting diode 1,
It is respectively provided with reflective glue-line 6 in four sides of light emitting diode 1.
Reflective glue-line 6 is closer to the thickness of thin in front in the thickness close to bottom surface.
Fluorescent material glue-line 7 also can be formed by the fluorescent material glue-line of multilayer different refractivity.
Claims (2)
1. a kind of one side goes out the emitting components of light, including light emitting diode, arranges two electrodes in the bottom surface of light emitting diode,
It is characterized in that arranging fluorescent material glue-line in the front of light emitting diode, it is respectively provided with reflective glue in four sides of light emitting diode
Layer.
2. one side goes out the emitting components of light it is characterised in that described reflective glue-line is close to bottom surface according to claim 1
Thickness be closer to the thickness of thin in front.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201620729982.2U CN205900583U (en) | 2016-07-13 | 2016-07-13 | Luminous components and parts of single face light -emitting |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201620729982.2U CN205900583U (en) | 2016-07-13 | 2016-07-13 | Luminous components and parts of single face light -emitting |
Publications (1)
Publication Number | Publication Date |
---|---|
CN205900583U true CN205900583U (en) | 2017-01-18 |
Family
ID=57772261
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201620729982.2U Active CN205900583U (en) | 2016-07-13 | 2016-07-13 | Luminous components and parts of single face light -emitting |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN205900583U (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106025040A (en) * | 2016-07-13 | 2016-10-12 | 扬州中科半导体照明有限公司 | Single-sided light emission light emitting element and production method thereof |
CN110416373A (en) * | 2019-07-10 | 2019-11-05 | 瑞识科技(深圳)有限公司 | A kind of front goes out the LED light emitting device and preparation method thereof of light |
CN111162149A (en) * | 2018-11-07 | 2020-05-15 | 深圳市聚飞光电股份有限公司 | LED chip packaging method and LED lamp bead |
-
2016
- 2016-07-13 CN CN201620729982.2U patent/CN205900583U/en active Active
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106025040A (en) * | 2016-07-13 | 2016-10-12 | 扬州中科半导体照明有限公司 | Single-sided light emission light emitting element and production method thereof |
CN106025040B (en) * | 2016-07-13 | 2019-02-01 | 扬州中科半导体照明有限公司 | A kind of single side goes out the light emitting component and its production method of light |
CN111162149A (en) * | 2018-11-07 | 2020-05-15 | 深圳市聚飞光电股份有限公司 | LED chip packaging method and LED lamp bead |
CN111162149B (en) * | 2018-11-07 | 2022-06-10 | 深圳市聚飞光电股份有限公司 | LED chip packaging method and LED lamp bead |
CN110416373A (en) * | 2019-07-10 | 2019-11-05 | 瑞识科技(深圳)有限公司 | A kind of front goes out the LED light emitting device and preparation method thereof of light |
CN110416373B (en) * | 2019-07-10 | 2021-09-24 | 瑞识科技(深圳)有限公司 | LED light-emitting device emitting light from front side and manufacturing method thereof |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN106025040B (en) | A kind of single side goes out the light emitting component and its production method of light | |
JP5878305B2 (en) | Light emitting device package and lighting system | |
US20180190882A1 (en) | Flip chip light emitting diode package structure | |
CN205900583U (en) | Luminous components and parts of single face light -emitting | |
CN103872224A (en) | Novel LED (Light Emitting Diode) illuminating element | |
CN110707078A (en) | Backlight module, preparation method thereof and display device | |
US8860052B2 (en) | Light emitting device | |
CN102254907B (en) | LED (light-emitting diode) and packaging method thereof | |
US8476662B2 (en) | Light emitting device, method for manufacturing the same, and backlight unit | |
CN101859759A (en) | White LED light source package | |
JP6596410B2 (en) | Chip scale package light emitting device and manufacturing method thereof | |
CN107346801A (en) | LED integrated encapsulation structures and its method for packing | |
CN107819061A (en) | A kind of light source device for carrying the emitting led flip-chip in six faces | |
CN100414701C (en) | Light-emitting system, light-emitting device, and forming method therefor | |
CN201134439Y (en) | LED chip structure for illuminance | |
KR101926714B1 (en) | Micro light emitting diode module and its manufacturing method | |
CN206480644U (en) | A kind of multilayer gradually changed refractive index silica gel packaging light emitting diode | |
CN115663098A (en) | LED light-emitting device and manufacturing method thereof | |
CN204857777U (en) | LED packaging structure | |
CN203250781U (en) | LED encapsulation structure | |
CN108011011B (en) | LED packaging structure | |
CN208753358U (en) | A kind of novel adopting surface mounted LED illuminating source packaging structure | |
CN208352335U (en) | A kind of flip chip packaging structure of UV LED | |
CN202487662U (en) | Light-emitting diode (LED) package structure capable of improving light extraction efficiency | |
CN101494257A (en) | Light-emitting device, backlight module apparatus and lighting device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant |